SN74HCT541DWG4 [TI]
OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS; 八路缓冲器并用3态输出线路驱动器
| 型号： | SN74HCT541DWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS |
| 文件： | 总18页 (文件大小：512K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
SN54HCT541 . . . J OR W PACKAGE
SN74HCT541 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current 3-State Outputs Interface
Directly With System Bus or Can Drive Up
To 15 LSTTL Loads
OE1
A1
A2
A3
A4
A5
A6
A7
A8
V
CC
OE2
Y1
1
2
3
4
5
6
7
8
9
20
19
18
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
CC
Typical t = 12 ns
pd
6-mA Output Drive at 5 V
17 Y2
16 Y3
15 Y4
14 Y5
13 Y6
12 Y7
11 Y8
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Data Flow-Through Pinout (All Inputs on
Opposite Side From Outputs)
GND 10
description/ordering information
SN54HCT541 . . . FK PACKAGE
(TOP VIEW)
These octal buffers and line drivers are designed
to have the performance of the popular ’HC240
series devices and to offer a pinout with inputs and
outputs on opposite sides of the package. This
arrangement greatly facilitates printed circuit
board layout.
3
2
1
20 19
18
Y1
Y2
Y3
A3
A4
A5
A6
A7
4
5
6
7
8
17
16
The 3-state control gate is a 2-input NOR. If either
output-enable (OE1 or OE2) input is high, all eight
outputs are in the high-impedance state. The
’HCT541 devices provide true data at the outputs.
15 Y4
14
Y5
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT541N
SN74HCT541N
SN74HCT541DW
SN74HCT541DWR
SN74HCT541NSR
SN74HCT541DBR
SN74HCT541PW
SN74HCT541PWR
SN74HCT541PWT
SNJ54HCT541J
SOIC − DW
HCT541
SOP − NS
HCT541
HT541
−40°C to 85°C
SSOP − DB
TSSOP − PW
HT541
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT541J
SNJ54HCT541W
SNJ54HCT541W
SNJ54HCT541FK
−55°C to 125°C
SNJ54HCT541FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢊ ꢚ ꢥ ꢝ ꢜꢨ ꢣꢢ ꢠꢡ ꢢꢜ ꢞꢥ ꢧꢙ ꢟꢚ ꢠ ꢠꢜ ꢯꢓ ꢌꢗ ꢘꢑ ꢏ ꢗꢖꢰꢂ ꢖꢂꢈ ꢟꢧꢧ ꢥꢟ ꢝ ꢟ ꢞꢤ ꢠꢤꢝ ꢡ ꢟ ꢝ ꢤ ꢠꢤ ꢡꢠꢤ ꢨ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢂꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢂ ꢃ ꢇ
ꢊꢅ ꢆꢋ ꢌ ꢍ ꢎ ꢏꢏ ꢐꢑ ꢀ ꢋꢁ ꢒ ꢌꢓ ꢁ ꢐ ꢒꢑ ꢓ ꢔꢐ ꢑꢀ
ꢕꢓ ꢆ ꢄ ꢖ ꢗꢀꢆꢋꢆ ꢐ ꢊꢎꢆ ꢘꢎ ꢆꢀ
SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE1
L
OE2
L
A
L
L
H
Z
Z
L
L
H
X
X
H
X
X
H
logic diagram (positive logic)
1
OE1
OE2
19
2
18
A1
Y1
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT541
SN74HCT541
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
∆t/∆v
Input transition rise/fall time
Operating free-air temperature
500
125
500
85
ns
°C
T
A
−55
−40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT541 SN74HCT541
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −6 mA
= 20 µA
= 6 mA
4.4 4.499
OH
OH
OL
OL
V
V = V or V
IH
4.5 V
4.5 V
OH
OL
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
0.5
8
0.1
0.4
0.1
0.33
1000
5
V
V = V or V
V
I
IH
IL
I
I
I
V = V
I
or 0
5.5 V
5.5 V
5.5 V
1000
10
nA
µA
µA
I
CC
V
O
= V
or 0,
or 0,
V = V or V
0.01
OZ
CC
CC
I
IH
= 0
IL
V = V
CC
I
O
160
80
I
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
13
SN54HCT541 SN74HCT541
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
23
MIN
MAX
34
MIN
MAX
29
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
t
t
t
A
Y
Y
Y
Y
pd
en
dis
t
12
21
31
26
21
30
45
38
ns
OE
OE
19
27
41
34
19
30
45
38
ns
18
27
41
34
8
12
18
15
ns
7
11
16
14
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢂꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢂ ꢃ ꢇ
ꢊꢅ ꢆꢋ ꢌ ꢍ ꢎ ꢏꢏ ꢐꢑ ꢀ ꢋꢁ ꢒ ꢌꢓ ꢁ ꢐ ꢒꢑ ꢓ ꢔꢐ ꢑꢀ
ꢕꢓ ꢆ ꢄ ꢖ ꢗꢀꢆꢋꢆ ꢐ ꢊꢎꢆ ꢘꢎ ꢆꢀ
SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
20
SN54HCT541 SN74HCT541
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
33
MIN
MAX
49
MIN
MAX
42
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
pd
t
en
t
t
A
Y
Y
Y
19
30
45
38
26
40
60
50
ns
OE
25
36
54
45
17
42
63
53
ns
14
38
57
48
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
No load
35
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
S1
S2
L
L
50 pF
or
150 pF
t
Open
Closed
Closed
Open
PZH
S1
S2
Test
Point
t
t
t
1 kΩ
1 kΩ
en
dis
pd
R
t
t
t
L
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
L
Closed
(see Note A)
50 pF
or
or t
−−
Open
Open
t
150 pF
LOAD CIRCUIT
Input
3 V
2.7 V
2.7 V
1.3 V
0.3 V
1.3 V
0.3 V
0 V
t
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
3 V
0 V
Output
Control
(Low-Level
Enabling)
3 V
0 V
Input
1.3 V
1.3 V
1.3 V
1.3 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
V
OH
In-Phase
Output
≈V
CC
Output
Waveform 1
(See Note B)
90%
t
1.3 V
10%
1.3 V
10%
1.3 V
10%
t
OL
V
OL
OH
t
r
f
f
t
t
t
PHL
90%
PLH
PZH
PHZ
Out-of-
Phase
Output
V
V
OH
V
Output
Waveform 2
(See Note B)
90%
t
90%
1.3 V
10%
1.3 V
10%
1.3 V
OL
≈0 V
t
r
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
SSOP
Drawing
JM38510/65761BRA
SN54HCT541J
ACTIVE
ACTIVE
ACTIVE
J
J
20
20
20
1
1
TBD
TBD
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
SN74HCT541DBR
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT541DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT541DBRG4
SN74HCT541DW
ACTIVE
ACTIVE
SSOP
SOIC
DB
20
20
2000
TBD
Call TI
Call TI
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT541DWE4
SN74HCT541DWG4
SN74HCT541DWR
SN74HCT541DWRE4
SN74HCT541DWRG4
SN74HCT541N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT541N3
SN74HCT541NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT541NSR
SN74HCT541NSRE4
SN74HCT541PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
PW
PW
PW
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT541PWE4
SN74HCT541PWG4
SN74HCT541PWR
SN74HCT541PWRE4
SN74HCT541PWRG4
SN74HCT541PWT
SN74HCT541PWTE4
SN74HCT541PWTG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HCT541FK
SNJ54HCT541J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
20
1
1
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2007
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
(mm)
16
SN74HCT541DBR
SN74HCT541DWR
SN74HCT541NSR
SN74HCT541PWR
DB
DW
NS
20
20
20
20
MLA
MLA
MLA
MLA
8.2
10.8
8.2
7.5
13.0
13.0
7.1
2.5
2.7
2.5
1.6
12
12
12
8
16
24
24
16
Q1
Q1
Q1
Q1
24
24
PW
16
6.95
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74HCT541DBR
SN74HCT541DWR
SN74HCT541NSR
SN74HCT541PWR
DB
DW
NS
20
20
20
20
MLA
MLA
MLA
MLA
342.9
333.2
333.2
342.9
336.6
333.2
333.2
336.6
28.58
31.75
31.75
28.58
PW
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Amplifiers
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DSP
Applications
Audio
amplifier.ti.com
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dsp.ti.com
www.ti.com/audio
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Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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