SN74HCT646DWG4 [TI]

Octal Bus Transceivers And Registers With 3-State Outputs 24-SOIC -40 to 85;
SN74HCT646DWG4
型号: SN74HCT646DWG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Octal Bus Transceivers And Registers With 3-State Outputs 24-SOIC -40 to 85

光电二极管 逻辑集成电路 触发器
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SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C – MARCH 1984 – REVISED MARCH 2003  
Operating Voltage Range of 4.5 V to 5.5 V  
Low Power Consumption, 80-µA Max I  
Independent Registers for A and B Buses  
Multiplexed Real-Time and Stored Data  
True Data Paths  
CC  
Typical t = 12 ns  
pd  
±6-mA Output Drive at 5 V  
High-Current 3-State Outputs Can Drive Up  
To 15 LSTTL Loads  
Low Input Current of 1 µA Max  
Inputs Are TTL-Voltage Compatible  
SN54HCT646 . . . JT OR W PACKAGE  
SN74HCT646 . . . DW OR NT PACKAGE  
(TOP VIEW)  
SN54HCT646 . . . FK PACKAGE  
(TOP VIEW)  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
CLKAB  
SAB  
DIR  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
GND  
V
CC  
2
CLKBA  
SBA  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
3
4
3
2
1
28 27 26  
25  
A1  
A2  
A3  
NC  
A4  
OE  
B1  
B2  
NC  
B3  
B4  
B5  
5
6
7
8
9
4
24  
23  
22  
21  
20  
19  
5
6
7
8
A5 10  
11  
9
A6  
10  
11  
12  
12 13 14 15 16 17 18  
B8  
NC – No internal connection  
description/ordering information  
The ’HCT646 devices consist of bus-transceiver circuits with 3-state outputs, D-type flip-flops, and control  
circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers.  
Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB  
or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed  
with the ’HCT646 devices.  
Output-enable (OE) and direction-control (DIR) inputs control the transceiver functions. In the transceiver  
mode, data present at the high-impedance port can be stored in either or both registers.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP – NT  
SOIC – DW  
Tube  
SN74HCT646NT  
SN74HCT646DW  
SN74HCT646DWR  
SNJ54HCT646JT  
SNJ54HCT646W  
SNJ54HCT646FK  
SN74HCT646NT  
–40°C to 85°C  
–55°C to 125°C  
Tube  
HCT646  
Tape and reel  
Tube  
CDIP – JT  
CFP – W  
SNJ54HCT646JT  
SNJ54HCT646W  
SNJ54HCT646FK  
Tube  
LCCC – FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
description/ordering information (continued)  
The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. DIR  
determines which bus receives data when OE is active (low). In the isolation mode (OE high), A data can be  
stored in one register and/or B data can be stored in the other register.  
When an output function is disabled, the input function still is enabled and can be used to store data. Only one  
of the two buses, A or B, can be driven at a time.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
FUNCTION TABLE  
INPUTS  
DATA I/O  
OPERATION OR FUNCTION  
DIR  
X
CLKAB  
CLKBA  
SAB  
X
SBA  
X
A1A8  
Input  
B1B8  
OE  
X
X
H
H
L
X
Unspecified  
Store A, B unspecified  
Store B, A unspecified  
Store A and B data  
X
X
X
X
Unspecified  
Input  
Input  
X
H or L  
X
H or L  
X
X
X
Input  
X
X
X
Input disabled  
Output  
Input disabled  
Input  
Isolation, hold storage  
Real-time B data to A bus  
Stored B data to A bus  
Real-time A data to B bus  
Stored A data to B bus  
L
X
L
L
L
X
H or L  
X
X
H
Output  
Input  
L
H
H
X
L
X
Input  
Output  
L
H or L  
X
H
X
Input  
Output  
The data-output functions can be enabled or disabled by various signals at OE and DIR. Data-input functions always are enabled; i.e., data at  
the bus terminals is stored on every low-to-high transition of the clock inputs.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
21  
3
1
23  
2
22  
SBA  
L
21  
3
DIR  
H
1
23  
CLKAB CLKBA SAB  
L
2
22  
SBA  
X
DIR CLKAB CLKBA SAB  
L
OE  
L
OE  
L
X
X
X
X
X
REAL-TIME TRANSFER  
BUS B TO BUS A  
REAL-TIME TRANSFER  
BUS A TO BUS B  
21  
3
1
23  
2
22  
21  
OE  
L
3
DIR  
L
1
23  
2
22  
SBA  
H
DIR CLKAB CLKBA SAB  
SBA  
X
CLKAB CLKBA SAB  
OE  
X
X
X
X
X
X
X
X
X
X
H or L  
X
X
H
X
H
X
X
L
H
H or L  
X
STORAGE FROM  
A, B, OR A AND B  
TRANSFER STORED DATA  
TO A AND/OR B  
Pin numbers shown are for the DW, JT, NT, and W packages.  
Figure 1. Bus-Management Functions  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
logic diagram (positive logic)  
21  
OE  
3
DIR  
23  
CLKBA  
22  
SBA  
1
CLKAB  
2
SAB  
One of Eight Channels  
1D  
C1  
4
A1  
20  
B1  
1D  
C1  
To Seven Other Channels  
Pin numbers shown are for the DW, JT, NT, and W packages.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
CC  
Output clamp current, I  
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA  
JA  
(see Note 3): NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
3. The package thermal impedance is calculated in accordance with JESD 51-3.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
recommended operating conditions (see Note 4)  
SN54HCT646  
MIN NOM MAX  
SN74HCT646  
MIN NOM MAX  
UNIT  
V
V
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.5  
2
5
5.5  
V
V
CC  
IH  
IL  
I
High-level input voltage  
Low-level input voltage  
Input voltage  
V
V
= 4.5 V to 5.5 V  
= 4.5 V to 5.5 V  
CC  
0.8  
0.8  
V
CC  
0
0
V
V
0
0
V
V
V
CC  
CC  
Output voltage  
V
O
CC  
CC  
t
Input transition (rise and fall) time  
Operating free-air temperature  
500  
125  
500  
85  
ns  
°C  
t
T
55  
40  
A
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54HCT646 SN74HCT646  
A
PARAMETER  
TEST CONDITIONS  
V
UNIT  
V
CC  
MIN  
TYP  
MAX  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
I
I
I
I
= 20 µA  
= 6 mA  
= 20 µA  
= 6 mA  
4.4 4.499  
OH  
OH  
OL  
OL  
V
V
V = V or V  
IH  
4.5 V  
4.5 V  
OH  
I
IL  
3.98  
4.3  
0.001  
0.17  
3.7  
3.84  
0.1  
0.26  
±100  
±0.5  
8
0.1  
0.4  
0.1  
0.33  
±1000  
±5  
V = V or V  
V
OL  
I
IH  
IL  
I
I
I
Control inputs V = V  
or 0  
5.5 V  
5.5 V  
5.5 V  
±0.1  
±1000  
±10  
nA  
µA  
µA  
I
I
CC  
A or B  
V
O
= V or 0  
CC  
±0.01  
OZ  
CC  
V = V  
I
or 0,  
I
O
= 0  
160  
80  
CC  
One input at 0.5 V or 2.4 V,  
Other inputs at 0 or V  
5.5 V  
1.4  
3
2.4  
10  
3
2.9  
10  
mA  
pF  
I  
CC  
CC  
4.5 V  
to 5.5 V  
C
Control inputs  
10  
i
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V  
CC  
.
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted)  
T
= 25°C  
SN54HCT646 SN74HCT646  
A
V
UNIT  
MHz  
ns  
CC  
MIN  
MAX  
31  
MIN  
MAX  
22  
MIN  
MAX  
27  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
f
t
t
t
Clock frequency  
clock  
36  
24  
29  
16  
14  
20  
18  
5
23  
21  
30  
27  
5
19  
17  
25  
23  
5
Pulse duration, CLKBA or CLKAB high or low  
w
ns  
Setup time, A before CLKABor B before CLKBA↑  
Hold time, A after CLKABor B after CLKBA↑  
su  
h
ns  
5
5
5
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 2)  
T
A
= 25°C  
TYP  
54  
64  
18  
16  
14  
12  
20  
17  
25  
22  
25  
22  
25  
22  
25  
22  
9
SN54HCT646 SN74HCT646  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
V
UNIT  
CC  
MIN  
31  
MAX  
MIN  
22  
MAX  
MIN  
27  
MAX  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
f
MHz  
max  
pd  
36  
24  
29  
36  
32  
27  
24  
38  
34  
49  
44  
49  
44  
49  
44  
49  
44  
12  
11  
54  
49  
41  
37  
57  
51  
74  
67  
74  
67  
74  
67  
74  
67  
18  
16  
45  
41  
34  
31  
48  
43  
61  
55  
61  
55  
61  
55  
61  
55  
15  
14  
CLKBA or CLKAB  
A or B  
A or B  
B or A  
A or B  
A or B  
A or B  
A or B  
A or B  
Any  
t
ns  
SBA or SAB  
t
t
t
t
t
ns  
ns  
ns  
ns  
ns  
OE  
OE  
en  
dis  
en  
dis  
t
DIR  
DIR  
7
These parameters are measured with the internal output state of the storage register opposite that of the bus input.  
switching characteristics over recommended operating free-air temperature range, C = 150 pF  
L
(unless otherwise noted) (see Figure 2)  
T
A
= 25°C  
TYP  
24  
SN54HCT646 SN74HCT646  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
V
UNIT  
CC  
MIN  
MAX  
53  
47  
44  
39  
55  
49  
66  
59  
66  
59  
42  
38  
MIN  
MAX  
80  
MIN  
MAX  
66  
60  
55  
50  
69  
62  
87  
74  
87  
74  
53  
48  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
CLKBA or CLKAB  
A or B  
A or B  
B or A  
A or B  
A or B  
A or B  
Any  
22  
52  
22  
67  
t
pd  
ns  
20  
60  
26  
83  
SBA or SAB  
24  
74  
33  
100  
90  
OE  
22  
t
t
ns  
ns  
en  
33  
100  
90  
DIR  
22  
17  
63  
t
14  
57  
These parameters are measured with the internal output state of the storage register opposite that of the bus input.  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
TYP  
UNIT  
C
Power dissipation capacitance  
No load  
50  
pF  
pd  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54HCT646, SN74HCT646  
OCTAL BUS TRANSCEIVERS AND REGISTERS  
WITH 3-STATE OUTPUTS  
SCLS178C MARCH 1984 REVISED MARCH 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
PARAMETER  
R
C
S1  
S2  
L
L
50 pF  
or  
150 pF  
t
t
Open  
Closed  
Closed  
Open  
PZH  
S1  
S2  
Test  
Point  
t
t
1 kΩ  
1 kΩ  
en  
R
PZL  
L
From Output  
Under Test  
t
t
Open  
Closed  
Open  
PHZ  
PLZ  
50 pF  
dis  
C
L
Closed  
(see Note A)  
50 pF  
or  
150 pF  
t
or t  
––  
Open  
Open  
pd  
t
LOAD CIRCUIT  
3 V  
Reference  
Input  
1.3 V  
3 V  
0 V  
High-Level  
0 V  
1.3 V  
1.3 V  
1.3 V  
Pulse  
t
t
h
su  
3 V  
0 V  
t
Data  
Input  
w
2.7 V  
2.7 V  
1.3 V  
0.3 V  
1.3 V  
0.3 V  
3 V  
0 V  
Low-Level  
Pulse  
1.3 V  
t
t
r
f
VOLTAGE WAVEFORMS  
SETUP AND HOLD AND INPUT RISE AND FALL TIMES  
VOLTAGE WAVEFORMS  
PULSE DURATIONS  
Output  
Control  
(Low-Level  
Enabling)  
3 V  
0 V  
3 V  
0 V  
Input  
1.3 V  
1.3 V  
1.3 V  
1.3 V  
t
t
PLH  
PHL  
90%  
t
t
PLZ  
PZL  
V
V
OH  
V  
CC  
In-Phase  
Output  
Output  
Waveform 1  
(See Note B)  
90%  
t
1.3 V  
10%  
1.3 V  
10%  
1.3 V  
1.3 V  
10%  
t
OL  
V
OL  
OH  
t
r
f
f
t
t
t
PHL  
90%  
PLH  
PZH  
PHZ  
Out-of-  
Phase  
Output  
V
V
OH  
V
Output  
Waveform 2  
(See Note B)  
90%  
t
90%  
1.3 V  
10%  
1.3 V  
10%  
OL  
0 V  
t
r
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES  
NOTES: A.  
C includes probe and test-fixture capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following  
characteristics: PRR 1 MHz, Z = 50 , t = 6 ns, t = 6 ns.  
O
r
f
D. For clock inputs, f  
is measured when the input duty cycle is 50%.  
max  
E. The outputs are measured one at a time with one input transition per measurement.  
F.  
G.  
H.  
t
t
t
and t  
and t  
and t  
are the same as t  
are the same as t  
are the same as t  
.
dis  
en  
.
pd  
PLZ  
PZL  
PLH  
PHZ  
PZH  
PHL  
.
Figure 2. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-May-2014  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN74HCT646DW  
ACTIVE  
SOIC  
DW  
24  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
HCT646  
SN74HCT646DWE4  
SN74HCT646DWG4  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
24  
24  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
HCT646  
HCT646  
SN74HCT646DWR  
ACTIVE  
SOIC  
DW  
24  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
SN74HCT646DWRE4  
SN74HCT646DWRG4  
SN74HCT646NT  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
PDIP  
DW  
DW  
NT  
24  
24  
24  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
TBD  
15  
15  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74HCT646NT  
SN74HCT646NT  
SN74HCT646NT3  
SN74HCT646NTE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
NT  
NT  
24  
24  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-May-2014  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74HCT646DWR  
SOIC  
DW  
24  
2000  
330.0  
24.4  
10.75 15.7  
2.7  
12.0  
24.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC DW 24  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 45.0  
SN74HCT646DWR  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
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Copyright © 2014, Texas Instruments Incorporated  

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