SN74LS08DR [TI]
QUADRUPLE 2-INPUT POSITIVE-AND GATES; 四路2输入正与门
| 型号： | SN74LS08DR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE 2-INPUT POSITIVE-AND GATES |
| 文件： | 总16页 (文件大小：622K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
JM38510/08003BCA
JM38510/08003BDA
JM38510/08003BDA
JM38510/31004B2A
JM38510/31004B2A
JM38510/31004BCA
JM38510/31004BCA
JM38510/31004BDA
JM38510/31004BDA
JM38510/31004SCA
JM38510/31004SCA
JM38510/31004SDA
JM38510/31004SDA
SN54LS08J
ACTIVE
ACTIVE
J
W
W
FK
FK
J
14
14
14
20
20
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
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Call TI
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
ACTIVE
CFP
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
ACTIVE
ACTIVE
ACTIVE
J
ACTIVE
W
W
J
ACTIVE
CFP
ACTIVE
CDIP
CDIP
CFP
ACTIVE
J
ACTIVE
W
W
J
ACTIVE
CFP
ACTIVE
CDIP
CDIP
CDIP
CDIP
PDIP
PDIP
PDIP
PDIP
SOIC
SN54LS08J
ACTIVE
J
SN54S08J
ACTIVE
J
SN54S08J
ACTIVE
J
SN7408N
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
N
N
N
N
D
SN7408N
Call TI
SN7408N3
Call TI
SN7408N3
Call TI
SN74LS08D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08D
SN74LS08DBR
SN74LS08DBR
SN74LS08DBRE4
SN74LS08DBRE4
SN74LS08DE4
SN74LS08DE4
SN74LS08DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
CDIP
D
DB
DB
DB
DB
D
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DR
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DRE4
SN74LS08DRE4
SN74LS08J
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
J
TBD
Call TI
Call TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
PDIP
Drawing
SN74LS08J
SN74LS08N
OBSOLETE
ACTIVE
J
14
14
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS08N
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS08N3
SN74LS08N3
SN74LS08NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
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25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS08NE4
SN74LS08NSR
SN74LS08NSR
SN74LS08NSRE4
SN74LS08NSRE4
SN74LS08NSRG4
SN74LS08NSRG4
SN74S08D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
N
NS
NS
NS
NS
NS
NS
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DE4
SN74S08DE4
SN74S08DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DR
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DRE4
SN74S08DRE4
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08J
SN74S08J
SN74S08N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
Call TI
Call TI
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N
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S08N
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S08N3
SN74S08N3
SN74S08NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
Call TI
Call TI
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Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S08NE4
ACTIVE
PDIP
N
14
Pb-Free
CU NIPDAU Level-NC-NC-NC
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
(RoHS)
SN74S08NSR
SN74S08NSR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
SO
SO
NS
NS
NS
NS
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08NSRE4
SN74S08NSRE4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54LS08FK
SNJ54LS08FK
SNJ54LS08J
SNJ54LS08J
SNJ54LS08W
SNJ54LS08W
SNJ54S08FK
SNJ54S08FK
SNJ54S08J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
FK
J
20
20
14
14
14
14
20
20
14
14
14
14
1
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
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Call TI
Call TI
Call TI
Call TI
Call TI
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Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
J
W
W
FK
FK
J
CFP
LCCC
LCCC
CDIP
CDIP
CFP
SNJ54S08J
J
SNJ54S08W
SNJ54S08W
W
W
CFP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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solutions:
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Applications
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amplifier.ti.com
www.ti.com/audio
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dsp.ti.com
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www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated
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