SN74LS109ADRG4
更新时间：2024-09-18 18:44:05
品牌：TI
描述：LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, GREEN, PLASTIC, SOIC-16
概述
规格参数
数据手册
替代型号SN74LS109ADRG4 概述
LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, GREEN, PLASTIC, SOIC-16 触发器 触发器/锁存器
SN74LS109ADRG4 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Obsolete | 零件包装代码： | SOIC |
| 包装说明： | SOP, SOP16,.25 | 针数： | 16 |
| Reach Compliance Code： | compliant | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.15 | 其他特性： | INVERTED K INPUT |
| 系列： | LS | JESD-30 代码： | R-PDSO-G16 |
| JESD-609代码： | e4 | 长度： | 9.9 mm |
| 逻辑集成电路类型： | J-KBAR FLIP-FLOP | 最大频率@ Nom-Sup： | 25000000 Hz |
| 最大I（ol）： | 0.008 A | 湿度敏感等级： | 1 |
| 位数： | 2 | 功能数量： | 2 |
| 端子数量： | 16 | 最高工作温度： | 70 °C |
| 最低工作温度： | 输出极性： | COMPLEMENTARY | |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | SOP |
| 封装等效代码： | SOP16,.25 | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE | 包装方法： | TAPE AND REEL |
| 峰值回流温度（摄氏度）： | 260 | 电源： | 5 V |
| 最大电源电流（ICC）： | 8 mA | Prop。Delay @ Nom-Sup： | 40 ns |
| 传播延迟（tpd）： | 40 ns | 认证状态： | Not Qualified |
| 座面最大高度： | 1.75 mm | 子类别： | FF/Latches |
| 最大供电电压 (Vsup)： | 5.25 V | 最小供电电压 (Vsup)： | 4.75 V |
| 标称供电电压 (Vsup)： | 5 V | 表面贴装： | YES |
| 技术： | TTL | 温度等级： | COMMERCIAL |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式： | GULL WING |
| 端子节距： | 1.27 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 触发器类型： | POSITIVE EDGE |
| 宽度： | 3.9 mm | 最小 fmax： | 25 MHz |
| Base Number Matches： | 1 |
SN74LS109ADRG4 数据手册
通过下载SN74LS109ADRG4数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CFP
Drawing
JM38510/30109B2A
JM38510/30109BEA
JM38510/30109BEA
JM38510/30109BFA
JM38510/30109BFA
JM38510/30109SEA
JM38510/30109SEA
JM38510/30109SFA
JM38510/30109SFA
SN54LS109AJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
FK
J
20
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
J
W
W
J
A42
CFP
A42
CDIP
CDIP
CFP
A42
J
A42
W
W
J
A42
CFP
A42
CDIP
CDIP
PDIP
PDIP
SOIC
A42
SN54LS109AJ
J
A42
SN74109N
N
N
D
Call TI
Call TI
SN74109N
Call TI
SN74LS109AD
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS109AD
SN74LS109ADE4
SN74LS109ADE4
SN74LS109ADG4
SN74LS109ADG4
SN74LS109ADR
SN74LS109ADR
SN74LS109ADRE4
SN74LS109ADRE4
SN74LS109ADRG4
SN74LS109ADRG4
SN74LS109AN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
D
D
D
D
D
N
N
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109AN
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109AN3
SN74LS109AN3
SN74LS109ANE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109ANE4
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74LS109ANSR
SN74LS109ANSR
SO
NS
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
SO
SO
SO
SO
NS
NS
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS109ANSRE4
SN74LS109ANSRE4
SN74LS109ANSRG4
SN74LS109ANSRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54LS109AFK
SNJ54LS109AFK
SNJ54LS109AJ
SNJ54LS109AJ
SNJ54LS109AW
SNJ54LS109AW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
FK
J
20
20
16
16
16
16
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
CFP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74LS109ADR
SN74LS109ANSR
SOIC
SO
D
16
16
2500
2000
330.0
330.0
16.4
16.4
6.5
8.2
10.3
10.5
2.1
2.5
8.0
16.0
16.0
Q1
Q1
NS
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS109ADR
SN74LS109ANSR
SOIC
SO
D
16
16
2500
2000
333.2
346.0
345.9
346.0
28.6
33.0
NS
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CFP
Drawing
JM38510/30109B2A
JM38510/30109BEA
JM38510/30109BEA
JM38510/30109BFA
JM38510/30109BFA
JM38510/30109SEA
JM38510/30109SEA
JM38510/30109SFA
JM38510/30109SFA
SN54LS109AJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
FK
J
20
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
J
W
W
J
A42
CFP
A42
CDIP
CDIP
CFP
A42
J
A42
W
W
J
A42
CFP
A42
CDIP
CDIP
PDIP
PDIP
SOIC
A42
SN54LS109AJ
J
A42
SN74109N
N
N
D
Call TI
Call TI
SN74109N
Call TI
SN74LS109AD
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS109AD
SN74LS109ADE4
SN74LS109ADE4
SN74LS109ADG4
SN74LS109ADG4
SN74LS109ADR
SN74LS109ADR
SN74LS109ADRE4
SN74LS109ADRE4
SN74LS109ADRG4
SN74LS109ADRG4
SN74LS109AN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
D
D
D
D
D
N
N
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109AN
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109AN3
SN74LS109AN3
SN74LS109ANE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109ANE4
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74LS109ANSR
SN74LS109ANSR
SO
NS
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
SO
SO
SO
SO
NS
NS
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS109ANSRE4
SN74LS109ANSRE4
SN74LS109ANSRG4
SN74LS109ANSRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54LS109AFK
SNJ54LS109AFK
SNJ54LS109AJ
SNJ54LS109AJ
SNJ54LS109AW
SNJ54LS109AW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
FK
J
20
20
16
16
16
16
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
CFP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74LS109ADR
SN74LS109ANSR
SOIC
SO
D
16
16
2500
2000
330.0
330.0
16.4
16.4
6.5
8.2
10.3
10.5
2.1
2.5
8.0
16.0
16.0
Q1
Q1
NS
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS109ADR
SN74LS109ANSR
SOIC
SO
D
16
16
2500
2000
333.2
346.0
345.9
346.0
28.6
33.0
NS
Pack Materials-Page 2
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
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SN74LS109ADRG4 CAD模型
引脚图
封装焊盘图
SN74LS109ADRG4 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| SN74LS109ADE4 | TI | LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, GR | 完全替代 |
|
| SN74LS109ADRE4 | TI | DUAL J.K POSITVE.EDGE.TRIGGERED FLIP.FLOPS WITH PRESET AND CLEAR | 完全替代 |
|
SN74LS109ADRG4 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| SN74LS109AJ | MOTOROLA | J-K Flip-Flop, 2-Func, Positive Edge Triggered, TTL, CDIP16 | 获取价格 |
|
| SN74LS109AJ-00 | ROCHESTER | LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP16 | 获取价格 |
|
| SN74LS109AJ4 | ROCHESTER | J-Kbar Flip-Flop | 获取价格 |
|
| SN74LS109AJD | MOTOROLA | J-Kbar Flip-Flop, LS Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | 获取价格 |
|
| SN74LS109AJDS | MOTOROLA | 暂无描述 | 获取价格 |
|
| SN74LS109AJS | MOTOROLA | LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16 | 获取价格 |
|
| SN74LS109AN | TI | DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR | 获取价格 |
|
| SN74LS109AN | ONSEMI | LOW POWER SCHOTTKY | 获取价格 |
|
| SN74LS109AN | MOTOROLA | LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, 648-08 | 获取价格 |
|
| SN74LS109AN-00 | ROCHESTER | LS SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16 | 获取价格 |
|
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