SN74LS155ADE4 [TI]

DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS; 双路2号线至4线解码器/多路解复用器
SN74LS155ADE4
型号: SN74LS155ADE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
双路2号线至4线解码器/多路解复用器

解码器 驱动器 解复用器 逻辑集成电路 光电二极管
文件: 总17页 (文件大小:730K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54155, SN54156, SN54LS155A, SN54LS156,  
SN74155, SN74156, SN74LS155A, SN74LS156  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
Copyright 1988, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54155, SN54156, SN54LS155A, SN54LS156,  
SN74155, SN74156, SN74LS155A, SN74LS156  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54155, SN54156, SN54LS155A, SN54LS156,  
SN74155, SN74156, SN74LS155A, SN74LS156  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54155, SN54156, SN54LS155A, SN54LS156,  
SN74155, SN74156, SN74LS155A, SN74LS156  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54155A, SN74155A  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54LS155A, SN74LS155A  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54LS156A, SN74LS156A  
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS  
SDLS057 – MARCH 1974 – REVISED MARCH 1988  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CDIP  
CFP  
Drawing  
5962-9750801Q2A  
5962-9750801QEA  
5962-9750801QEA  
5962-9750801QFA  
5962-9750801QFA  
SN54155J  
ACTIVE  
ACTIVE  
FK  
J
20  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
J
ACTIVE  
W
W
J
ACTIVE  
CFP  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
SN54155J  
J
Call TI  
SN54LS155AJ  
SN54LS155AJ  
SN54LS156J  
SN54LS156J  
SN74155N  
J
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
J
ACTIVE  
J
ACTIVE  
J
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
N
N
N
N
N
N
D
SN74155N  
Call TI  
SN74155N3  
Call TI  
SN74155N3  
Call TI  
SN74156N  
Call TI  
SN74156N  
Call TI  
SN74LS155AD  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS155AD  
SN74LS155ADE4  
SN74LS155ADE4  
SN74LS155ADR  
SN74LS155ADR  
SN74LS155ADRE4  
SN74LS155ADRE4  
SN74LS155AN  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
PDIP  
PDIP  
SO  
D
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
N
25  
25  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CU NIPDAU Level-NC-NC-NC  
CU NIPDAU Level-NC-NC-NC  
CU NIPDAU Level-NC-NC-NC  
SN74LS155AN  
N
Pb-Free  
(RoHS)  
SN74LS155ANE4  
SN74LS155ANE4  
SN74LS155ANSR  
SN74LS155ANSR  
SN74LS155ANSRE4  
N
Pb-Free  
(RoHS)  
N
Pb-Free  
(RoHS)  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
SN74LS155ANSRE4  
SN74LS156D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
D
D
D
D
D
D
D
D
N
N
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS156D  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS156DE4  
SN74LS156DE4  
SN74LS156DR  
SN74LS156DR  
SN74LS156DRE4  
SN74LS156DRE4  
SN74LS156N  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74LS156N  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74LS156N3  
SN74LS156N3  
SN74LS156NSR  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
SO  
N
N
16  
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS156NSR  
SN74LS156NSRE4  
SN74LS156NSRE4  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
SO  
NS  
NS  
NS  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54155J  
SNJ54155J  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CFP  
J
J
16  
16  
16  
16  
20  
20  
16  
16  
16  
16  
20  
20  
16  
16  
16  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
SNJ54155W  
W
W
FK  
FK  
J
Call TI  
SNJ54155W  
CFP  
Call TI  
SNJ54LS155AFK  
SNJ54LS155AFK  
SNJ54LS155AJ  
SNJ54LS155AJ  
SNJ54LS155AW  
SNJ54LS155AW  
SNJ54LS156FK  
SNJ54LS156FK  
SNJ54LS156J  
SNJ54LS156J  
SNJ54LS156W  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
1
1
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
J
ACTIVE  
W
W
FK  
FK  
J
ACTIVE  
CFP  
OBSOLETE  
OBSOLETE  
ACTIVE  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
Call TI  
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
ACTIVE  
J
ACTIVE  
W
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SNJ54LS156W  
ACTIVE  
CFP  
W
16  
1
TBD  
Call TI  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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