SN74LS157NSRE4 [TI]
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS; 四路2号线到1线数据选择器/多路复用器型号: | SN74LS157NSRE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS |
文件: | 总17页 (文件大小:732K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
76002012A
7600201EA
ACTIVE
ACTIVE
FK
J
20
16
16
20
16
16
16
16
16
16
20
16
16
16
16
16
16
16
16
16
16
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
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7600201FA
ACTIVE
W
FK
J
76033012A
ACTIVE
LCCC
CDIP
CFP
7603301EA
ACTIVE
7603301FA
ACTIVE
W
J
JM38510/07903BEA
JM38510/07903BFA
JM38510/07904BEA
JM38510/07904BFA
JM38510/30903B2A
JM38510/30903BEA
JM38510/30903BFA
SN54157J
ACTIVE
CDIP
CFP
ACTIVE
W
J
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CFP
W
FK
J
Call TI
LCCC
CDIP
CFP
1
1
1
1
1
1
1
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
ACTIVE
ACTIVE
W
J
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
PDIP
SOIC
SN54LS157J
ACTIVE
J
SN54LS158J
ACTIVE
J
SN54S157J
ACTIVE
J
SN54S158J
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
J
SN74157N
N
N
D
Call TI
SN74157N3
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SN74LS157D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS157DG4
SN74LS157DR
SN74LS157DRG4
SN74LS157N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
PDIP
D
D
D
N
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS157N3
SN74LS157NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
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Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS157NSR
SN74LS157NSRE4
SN74LS158D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
D
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
PDIP
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS158DE4
SN74LS158DR
SN74LS158DRE4
SN74LS158N
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
CU NIPDAU Level-NC-NC-NC
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
(RoHS)
SN74LS158N3
SN74LS158NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS158NSR
SN74LS158NSRE4
SN74S157D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
D
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
PDIP
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S157DE4
SN74S157N
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S157N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
SN74S157NE4
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S157NSR
ACTIVE
ACTIVE
SO
SO
NS
NS
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S157NSRE4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S158D
SN74S158DR
SN74S158N
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
SOIC
SOIC
PDIP
PDIP
CDIP
CFP
D
D
16
16
16
16
16
16
20
16
16
20
16
16
20
16
16
20
16
16
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
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N
Call TI
SN74S158N3
SNJ54157J
N
Call TI
J
1
1
1
1
1
1
1
1
1
1
1
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
SNJ54157W
ACTIVE
W
FK
J
SNJ54LS157FK
SNJ54LS157J
SNJ54LS157W
SNJ54LS158FK
SNJ54LS158J
SNJ54LS158W
SNJ54S157FK
SNJ54S157J
SNJ54S157W
SNJ54S158FK
SNJ54S158J
SNJ54S158W
ACTIVE
LCCC
CDIP
CFP
ACTIVE
ACTIVE
W
FK
J
ACTIVE
LCCC
CDIP
CFP
ACTIVE
ACTIVE
W
FK
J
ACTIVE
LCCC
CDIP
CFP
ACTIVE
ACTIVE
W
FK
J
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CFP
Call TI
W
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
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