概述
规格参数
数据手册SN74LS181N-00 概述
LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PDIP24 运算电路
SN74LS181N-00 规格参数
| 生命周期： | Obsolete | 包装说明： | DIP, |
| Reach Compliance Code： | unknown | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.28 | 其他特性： | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS |
| 系列： | LS | JESD-30 代码： | R-PDIP-T24 |
| 长度： | 31.75 mm | 负载电容（CL）： | 15 pF |
| 逻辑集成电路类型： | ARITHMETIC LOGIC UNIT | 位数： | 4 |
| 功能数量： | 1 | 端子数量： | 24 |
| 最高工作温度： | 70 °C | 最低工作温度： | |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | DIP |
| 封装形状： | RECTANGULAR | 封装形式： | IN-LINE |
| 最大电源电流（ICC）： | 37 mA | 传播延迟（tpd）： | 62 ns |
| 认证状态： | Not Qualified | 座面最大高度： | 5.08 mm |
| 最大供电电压 (Vsup)： | 5.25 V | 最小供电电压 (Vsup)： | 4.75 V |
| 标称供电电压 (Vsup)： | 5 V | 表面贴装： | NO |
| 技术： | TTL | 温度等级： | COMMERCIAL |
| 端子形式： | THROUGH-HOLE | 端子节距： | 2.54 mm |
| 端子位置： | DUAL | 宽度： | 15.24 mm |
| Base Number Matches： | 1 |
SN74LS181N-00 数据手册
通过下载SN74LS181N-00数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
Copyright © 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS181, SN54S181
SN74LS181, SN74S181
ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS
SDLS136 – DECEMBER 1972 – REVISED MARCH 1988
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
JM38510/07801BJA
M38510/07801BJA
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
CDIP
CDIP
J
24
24
1
TBD
Call TI
Call TI
N / A for Pkg Type
JM38510/
07801BJA
ACTIVE
J
1
TBD
N / A for Pkg Type
-55 to 125
JM38510/
07801BJA
SN54LS181J
SN54S181J
SN74LS181N
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
PDIP
J
J
24
24
24
1
1
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
0 to 70
SN54LS181J
SN54S181J
SN74LS181N
N
15
Pb-Free
(RoHS)
CU NIPDAU
SN74LS181N3
SN74LS181NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
24
24
TBD
Call TI
Call TI
0 to 70
0 to 70
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS181N
SN74S181J
SN74S181N
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
CDIP
PDIP
PDIP
LCCC
J
N
24
24
24
28
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
SN74S181N3
SNJ54LS181FK
N
Call TI
Call TI
0 to 70
FK
1
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
181FK
SNJ54LS181J
SNJ54LS181W
SNJ54S181FK
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
24
24
28
1
1
1
TBD
TBD
TBD
Call TI
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
SNJ54LS181J
W
FK
SNJ54LS181W
LCCC
POST-PLATE
SNJ54S
181FK
SNJ54S181J
SNJ54S181JT
SNJ54S181W
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
J
24
24
24
1
1
1
TBD
TBD
TBD
Call TI
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
SNJ54S181J
SNJ54S181JT
SNJ54S181W
JT
W
A42
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS181, SN54S181, SN74LS181, SN74S181 :
Catalog: SN74LS181, SN74S181
•
Military: SN54LS181, SN54S181
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
12
1
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.090 (2,29)
0.060 (1,53)
0.175 (4,45)
0.140 (3,56)
A
Seating Plane
0.018 (0,46) MIN
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
24
28
32
40
PINS **
DIM
”A”
NARR
WIDE
NARR
WIDE
NARR
WIDE
NARR
WIDE
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
MAX
MIN
MAX
MIN
”B”
”C”
MAX
MIN
4040084/C 10/97
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
24
28
DIM
13
24
1.280
(32,51) (37,08)
1.460
A MAX
1.240
(31,50) (36,58)
1.440
B
A MIN
B MAX
B MIN
0.300
(7,62)
0.291
(7,39)
1
12
0.070 (1,78)
0.030 (0,76)
0.245
(6,22)
0.285
(7,24)
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.100 (2,54) MAX
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.045 (1,14)
0.026 (0,66)
0.090 (2,29)
0.045 (1,14)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
0.360 (9,14)
0.240 (6,10)
0.019 (0,48)
0.015 (0,38)
1
24
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.020 (0,51) MIN
0.425 (10,80) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.010 (0,25)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
SN74LS181N-00 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| SN74LS181N-10 | TI | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PDIP24 | 获取价格 |
|
| SN74LS181N1 | TI | IC,FIXED POINT ALU,LS-TTL,DIP,24PIN,PLASTIC | 获取价格 |
|
| SN74LS181N3 | TI | ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS | 获取价格 |
|
| SN74LS181ND | MOTOROLA | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PDIP24, PLASTIC, DIP-24 | 获取价格 |
|
| SN74LS181NDS | MOTOROLA | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PDIP24, PLASTIC, DIP-24 | 获取价格 |
|
| SN74LS181NE4 | TI | ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS | 获取价格 |
|
| SN74LS181NS | MOTOROLA | 暂无描述 | 获取价格 |
|
| SN74LS182 | MOTOROLA | CARRY LOOKAHEAD GENERATOR LOW POWER SCHOTTKY | 获取价格 |
|
| SN74LS182JD | MOTOROLA | 暂无描述 | 获取价格 |
|
| SN74LS182JS | MOTOROLA | LS SERIES, 4-BIT LOOK-AHEAD CARRY GENERATOR, CDIP16, CERAMIC, DIP-16 | 获取价格 |
|
SN74LS181N-00 相关文章
Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
- 2024-09-20
- 6
Bourns 精密环境传感器产品选型手册(英文版)
- 2024-09-20
- 9
Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
- 2024-09-20
- 8
Bourns GMOV 混合过压保护组件产品选型手册(英文版)
- 2024-09-20
- 6
