SN74LS673_技术文档

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS673, SN54LS674, SN74LS673, SN74LS674

16-BIT SHIFT REGISTERS

SDLS195 – MARCH 1985 – REVISED MARCH 1988

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

17-Oct-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

LCCC

CDIP

CFP

Drawing

5962-88602013A

5962-8860201JA

5962-8860201KA

5962-8860201LA

5962-88607013A

5962-8860701JA

5962-8860701KA

SN54LS673J

ACTIVE

FK

J

28

24

28

24

1

TBD

Call TI

Level-NC-NC-NC

Call TI

ACTIVE

J

OBSOLETE

ACTIVE

W

JT

FK

J

CFP

Call TI

CDIP

LCCC

CDIP

CFP

1

Level-NC-NC-NC

Call TI

ACTIVE

J

OBSOLETE

ACTIVE

W

J

CFP

Call TI

CDIP

SOIC

1

Level-NC-NC-NC

SN54LS673J

ACTIVE

J

SN54LS673JT

SN54LS674J

ACTIVE

JT

J

ACTIVE

SN54LS674J

ACTIVE

J

SN54LS674JT

SN74LS673DW

ACTIVE

JT

DW

ACTIVE

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS673DW

SN74LS673DWE4

SN74LS673N

ACTIVE

SOIC

PDIP

SOIC

PDIP

DW

N

24

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

15

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS673N

N

Pb-Free

(RoHS)

SN74LS673NE4

SN74LS674DW

SN74LS674N

N

Pb-Free

(RoHS)

N

Pb-Free

(RoHS)

DW

N

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

15

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS674N

N

Pb-Free

(RoHS)

SN74LS674NE4

N

Pb-Free

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-Oct-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

(RoHS)

SN74LS674NE4

ACTIVE

PDIP

N

24

15

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SNJ54LS673FK

SNJ54LS673J

SNJ54LS673JT

SNJ54LS673W

SNJ54LS674FK

SNJ54LS674J

SNJ54LS674JT

SNJ54LS674W

ACTIVE

LCCC

CDIP

CFP

FK

J

28

24

28

24

1

TBD

Call TI

Level-NC-NC-NC

Call TI

ACTIVE

J

ACTIVE

JT

W

FK

J

ACTIVE

OBSOLETE

ACTIVE

CFP

Call TI

LCCC

CDIP

CFP

1

Level-NC-NC-NC

Call TI

ACTIVE

J

ACTIVE

JT

W

ACTIVE

OBSOLETE

CFP

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

-

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

&

no Sb/Br)

-

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997

J (R-GDIP-T**)

CERAMIC DUAL-IN-LINE PACKAGE

24 PINS SHOWN

B

13

24

C

12

1

0.065 (1,65)

0.045 (1,14)

Lens Protrusion (Lens Optional)

0.010 (0.25) MAX

0.090 (2,29)

0.060 (1,53)

0.175 (4,45)

0.140 (3,56)

A

Seating Plane

0.018 (0,46) MIN

0.125 (3,18) MIN

0.022 (0,56)

0.014 (0,36)

0.100 (2,54)

0.012 (0,30)

0.008 (0,20)

24

28

32

40

PINS **

DIM

”A”

NARR

WIDE

NARR

WIDE

NARR

WIDE

NARR

WIDE

0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)

0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)

1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)

1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)

0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)

0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)

MAX

MIN

MAX

MIN

”B”

”C”

MAX

MIN

4040084/C 10/97

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).

D. This package can be hermetically sealed with a ceramic lid using glass frit.

E. Index point is provided on cap for terminal identification.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MCER004A – JANUARY 1995 – REVISED JANUARY 1997

JT (R-GDIP-T**)

CERAMIC DUAL-IN-LINE

24 LEADS SHOWN

PINS **

A

24

28

DIM

13

24

1.280

(32,51) (37,08)

1.460

A MAX

1.240

(31,50) (36,58)

1.440

B

A MIN

B MAX

B MIN

0.300

(7,62)

0.291

(7,39)

1

12

0.070 (1,78)

0.030 (0,76)

0.245

(6,22)

0.285

(7,24)

0.320 (8,13)

0.290 (7,37)

0.015 (0,38) MIN

0.100 (2,54) MAX

0.200 (5,08) MAX

Seating Plane

0.130 (3,30) MIN

0.023 (0,58)

0.015 (0,38)

0°–15°

0.014 (0,36)

0.008 (0,20)

0.100 (2,54)

4040110/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MCFP007 – OCTOBER 1994

W (R-GDFP-F24)

CERAMIC DUAL FLATPACK

0.375 (9,53)

0.340 (8,64)

Base and Seating Plane

0.006 (0,15)

0.004 (0,10)

0.045 (1,14)

0.026 (0,66)

0.090 (2,29)

0.045 (1,14)

0.395 (10,03)

0.360 (9,14)

0.240 (6,10)

0.360 (9,14)

0.240 (6,10)

0.019 (0,48)

0.015 (0,38)

1

24

0.050 (1,27)

0.640 (16,26)

0.490 (12,45)

0.030 (0,76)

0.015 (0,38)

12

13

30° TYP

1.115 (28,32)

0.840 (21,34)

4040180-5/B 03/95

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD

E. Index point is provided on cap for terminal identification only.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002

N (R–PDIP–T24)

PLASTIC DUAL–IN–LINE

1.222 (31,04) MAX

24

13

0.360 (9,14) MAX

1

12

0.070 (1,78) MAX

0.200 (5,08) MAX

0.020 (0,51) MIN

0.425 (10,80) MAX

Seating Plane

0.125 (3,18) MIN

0.100 (2,54)

0.010 (0,25)

0’–15’

0.021 (0,53)

0.015 (0,38)

0.010 (0,25) NOM

4040051–3/D 09/01

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS–010

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MPDI008 – OCTOBER 1994

N (R-PDIP-T**)

PLASTIC DUAL-IN-LINE PACKAGE

24 PIN SHOWN

A

24

13

0.560 (14,22)

0.520 (13,21)

1

12

0.060 (1,52) TYP

0.200 (5,08) MAX

0.020 (0,51) MIN

0.610 (15,49)

0.590 (14,99)

Seating Plane

0.100 (2,54)

0.125 (3,18) MIN

0.010 (0,25) NOM

0°–15°

0.021 (0,53)

0.015 (0,38)

0.010 (0,25)

PINS **

M

24

28

32

40

48

52

DIM

1.270

1.450

1.650

2.090

2.450

2.650

A MAX

(32,26) (36,83) (41,91) (53,09) (62,23) (67,31)

1.230

1.410

1.610

2.040

2.390

2.590

A MIN

(31,24) (35,81) (40,89) (51,82) (60,71) (65,79)

4040053/B 04/95

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-011

D. Falls within JEDEC MS-015 (32 pin only)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265


型号：	SN74LS673
厂家：	TEXAS INSTRUMENTS
描述：	16-BIT SHIFT REGISTERS 16位的移位寄存器移位寄存器
文件：	总16页 (文件大小：522K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SN74LS673 [TI]

相关型号：

SN74LS673DW

SN74LS673DW3

SN74LS673DWE4

SN74LS673DWG4

SN74LS673DWR

SN74LS673FN

SN74LS673FN3

SN74LS673J

SN74LS673J4

SN74LS673JDS

SN74LS673JP4

SN74LS673JS