SN74LV07APWRG3 [TI]
HEX BUFFERS/DRIVERS WITH OPEN-DRAIN OUTPUTS; HEX缓冲器/带漏极开路输出驱动程序
| 型号： | SN74LV07APWRG3 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX BUFFERS/DRIVERS WITH OPEN-DRAIN OUTPUTS |
| 文件： | 总15页 (文件大小：463K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢈ
ꢊꢋꢌ ꢍꢎꢏ ꢏ ꢋꢐꢀꢑ ꢒ ꢐꢓ ꢅ ꢋꢐ ꢀ
ꢔ ꢓꢕ ꢊ ꢖ ꢗꢋꢁ ꢘꢒꢐꢈꢓ ꢁ ꢖ ꢎꢕ ꢗ ꢎꢕꢀ
SCES337I − MAY 2000 − REVISED JUNE 2006
SN54LV07A . . . J OR W PACKAGE
SN74LV07A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
D
D
2-V to 5.5-V V
Operation
CC
Typical V
OLP
(Output Ground Bounce)
= 3.3 V, T = 25°C
<0.8 V at V
CC
A
1A
1Y
2A
2Y
3A
V
1
2
3
4
5
6
7
14
13
12
11
10
9
D
D
D
D
D
Typical V
>2.3 V at V
(Output V
Undershoot)
CC
OHV
CC
OH
6A
6Y
5A
5Y
4A
4Y
= 3.3 V, T = 25°C
A
Outputs Are Disabled During Power Up and
Power Down With Inputs Tied to V
CC
Support Mixed-Mode Voltage Operation on
All Ports
3Y
GND
8
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
SN54LV07A . . . FK PACKAGE
(TOP VIEW)
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
3
2
1 20 19
18
6Y
NC
5A
NC
5Y
2A
NC
2Y
4
5
6
7
8
description/ordering information
17
16
15
14
These hex buffers/drivers are designed for 2-V to
5.5-V V
operation.
NC
3A
CC
The ’LV07A devices perform the Boolean function
Y = A in positive logic.
9 10 11 12 13
The open-drain outputs require pullup resistors to
perform correctly and can be connected to other
open-drain outputs to implement active-low
wired-OR or active-high wired-AND functions.
NC − No internal connection
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the
off
off
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube of 50
SN74LV07AD
SOIC − D
LV07A
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 90
SN74LV07ADR
SN74LV07ANSR
SN74LV07ADBR
SN74LV07APW
SN74LV07APWR
SN74LV07APWT
SN74LV07ADGVR
SNJ54LV07AJ
SOP − NS
74LV07A
LV07A
SSOP − DB
−40°C to 85°C
Reel of 2000
Reel of 250
Reel of 2000
Tube of 25
TSSOP − PW
LV07A
TVSOP − DGV
CDIP − J
LV07A
SNJ54LV07AJ
SNJ54LV07AW
SNJ54LV07AFK
−55°C to 125°C
CFP − W
Tube of 150
Tube of 55
SNJ54LV07AW
SNJ54LV07AFK
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2006, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢈ
ꢊ ꢋꢌ ꢍ ꢎ ꢏꢏ ꢋꢐ ꢀꢑ ꢒ ꢐꢓ ꢅ ꢋꢐ ꢀ
ꢔꢓ ꢕ ꢊ ꢖꢗꢋ ꢁꢘꢒ ꢐ ꢈꢓ ꢁ ꢖ ꢎꢕꢗ ꢎꢕ ꢀ
SCES337I − MAY 2000 − REVISED JUNE 2006
FUNCTION TABLE
(each buffer/driver)
INPUT
A
OUTPUT
Y
H
L
H
L
logic diagram, each buffer/driver (positive logic)
A
Y
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Voltage range applied to any output in the high-impedance or power-off state, V
O
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
IK
OK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −35 mA
Continuous current through V
O
O
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
CC
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢈ
ꢊꢋꢌ ꢍꢎꢏ ꢏ ꢋꢐꢀꢑ ꢒ ꢐꢓ ꢅ ꢋꢐ ꢀ
ꢔ ꢓꢕ ꢊ ꢖ ꢗꢋꢁ ꢘꢒꢐꢈꢓ ꢁ ꢖ ꢎꢕ ꢗꢎ ꢕꢀ
SCES337I − MAY 2000 − REVISED JUNE 2006
recommended operating conditions (see Note 3)
SN54LV07A
SN74LV07A
UNIT
MIN
2
MAX
MIN
2
MAX
V
V
Supply voltage
5.5
5.5
V
CC
V
V
V
V
V
V
V
V
= 2 V
1.5
2.1
3.5
1.5
2.1
3.5
CC
CC
CC
CC
CC
CC
CC
CC
= 3 V
High-level input voltage
V
V
IH
= 5 V
= 2.3 V to 5.5 V
= 2 V
V
× 0.7
V
× 0.7
CC
CC
0.5
0.9
1.5
× 0.3
5.5
5.5
50
0.5
0.9
1.5
× 0.3
5.5
5.5
50
= 3 V
V
IL
Low-level input voltage
= 5 V
= 2.3 V to 5.5 V
V
CC
V
CC
V
V
Input voltage
0
0
0
0
V
V
I
Output voltage
O
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
µA
= 2.3 V to 2.7 V
= 3 V to 3.6 V
= 4.5 V to 5.5 V
= 2.3 V to 2.7 V
= 3 V to 3.6 V
= 4.5 V to 5.5 V
2
2
I
Low-level output current
OL
8
8
mA
16
16
200
100
20
200
100
20
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
T
A
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV07A
SN74LV07A
PARAMETER
TEST CONDITIONS
UNIT
V
CC
MIN
TYP
MAX
0.1
0.4
0.44
0.55
1
MIN
TYP
MAX
0.1
0.4
0.44
0.55
1
I
I
I
I
= 50 µA
2 V to 5.5 V
2.3 V
OL
OL
OL
OL
= 2 mA
= 8 mA
= 16 mA
V
OL
V
3 V
4.5 V
I
I
I
I
V = 5.5 V or GND
0 to 5.5 V
5.5 V
µA
µA
µA
µA
pF
I
I
V = V
IH
,
V
= V
CC
2.5
20
2.5
20
OH
CC
off
I
OH
= 0
V = V
CC
or GND,
I
O
5.5 V
I
V or V = 0 to 5.5 V
0
5
5
I
O
C
V = V
or GND
3.3 V
1.6
1.6
i
I
CC
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3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢈ
ꢊ ꢋꢌ ꢍ ꢎ ꢏꢏ ꢋꢐ ꢀꢑ ꢒ ꢐꢓ ꢅ ꢋꢐ ꢀ
ꢔꢓ ꢕ ꢊ ꢖꢗꢋ ꢁꢘꢒ ꢐ ꢈꢓ ꢁ ꢖ ꢎꢕꢗ ꢎꢕ ꢀ
SCES337I − MAY 2000 − REVISED JUNE 2006
switching characteristics over recommended operating free-air temperature range,
V
= 2.5 V 0.2 V (unless otherwise noted) (see Figure 1)
CC
T = 25°C
A
SN54LV07A
SN74LV07A
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
MIN
TYP
MAX
MIN
MAX
MIN
1
MAX
13
∗
6.6
∗
10.4
∗
1
∗
13
t
A
A
A
A
Y
Y
Y
Y
PLH
C
C
= 15 pF
= 50 pF
ns
L
L
∗
7.5
∗
10.4
∗
1
∗
13
t
1
13
PHL
t
11.1
9.6
15.2
15.2
1
1
18
18
1
18
PLH
ns
t
1
18
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)
CC
T = 25°C
A
SN54LV07A
SN74LV07A
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
MIN
TYP
MAX
MIN
MAX
MIN
1
MAX
8.5
8.5
12
∗
5
∗
7.1
∗
1
∗
8.5
t
A
A
A
A
Y
Y
Y
Y
PLH
C
C
= 15 pF
= 50 pF
ns
L
L
∗
5
∗
7.1
∗
1
∗
8.5
t
1
PHL
t
8.2
6.6
10.6
10.6
1
1
12
12
1
PLH
ns
t
1
12
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
V
= 5 V 0.5 V (unless otherwise noted) (see Figure 1)
CC
T = 25°C
A
SN54LV07A
SN74LV07A
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
MIN
TYP
MAX
MIN
MAX
MIN
1
MAX
6.5
∗
3.8
∗
5.5
∗
1
∗
6.5
t
A
A
A
A
Y
Y
Y
Y
PLH
C
C
= 15 pF
= 50 pF
ns
L
L
∗
3.4
∗
5.5
∗
1
∗
6.5
t
1
6.5
PHL
t
5.7
4.5
7.5
7.5
1
1
8.5
8.5
1
8.5
PLH
ns
t
1
8.5
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, V
= 3.3 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74LV07A
PARAMETER
UNIT
MIN
TYP
0.4
MAX
0.8
V
V
V
V
V
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
−0.1
3.2
−0.8
OL
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
OH
2.31
0.99
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
= 50 pF, f = 10 MHz
L
V
TYP
2.9
UNIT
CC
3.3 V
C
Power dissipation capacitance
C
pF
pd
5 V
5.3
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4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCES337I − MAY 2000 − REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
V
CC
V
CC
R
= 1 kΩ
50% V
CC
50% V
Input
L
CC
0 V
From Output
Under Test
Test
Point
t
t
PHL
PLH
≈V
C
CC
L
50% V
CC
(see Note A)
Output
V
OL
+ 0.3 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
LOAD CIRCUIT FOR
OPEN-DRAIN OUTPUTS
NOTES: A.
C
includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
C. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2010
PACKAGING INFORMATION
Orderable Device
SN74LV07AD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07ADBR
SN74LV07ADBRE4
SN74LV07ADBRG4
SN74LV07ADE4
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07ADG4
SN74LV07ADGVR
SN74LV07ADGVRE4
SN74LV07ADGVRG4
SN74LV07ADR
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
TVSOP
TVSOP
SOIC
DGV
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07ADRE4
SN74LV07ADRG4
SN74LV07ANSR
SN74LV07ANSRG4
SN74LV07APW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
NS
NS
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07APWE4
SN74LV07APWG4
SN74LV07APWR
SN74LV07APWRE4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07APWRG3
SN74LV07APWRG4
PREVIEW
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
2000
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LV07APWT
SN74LV07APWTE4
SN74LV07APWTG4
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
PW
PW
PW
14
14
14
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2010
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74LV07ADBR
SN74LV07ADGVR
SN74LV07ADR
SSOP
TVSOP
SOIC
DB
DGV
D
14
14
14
14
14
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
12.4
16.4
16.4
12.4
8.2
6.8
6.5
8.2
7.0
6.6
4.0
2.5
1.6
2.1
2.5
1.6
12.0
8.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
9.0
8.0
SN74LV07ANSR
SN74LV07APWR
SO
NS
10.5
5.6
12.0
8.0
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LV07ADBR
SN74LV07ADGVR
SN74LV07ADR
SSOP
TVSOP
SOIC
DB
DGV
D
14
14
14
14
14
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
29.0
33.0
33.0
29.0
SN74LV07ANSR
SN74LV07APWR
SO
NS
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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