SN74LV166ADR [TI]

8-BIT PARALLEL-LOAD SHIFT REGISTERS; 8位并联负载移位寄存器
SN74LV166ADR
型号: SN74LV166ADR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8-BIT PARALLEL-LOAD SHIFT REGISTERS
8位并联负载移位寄存器

移位寄存器
文件: 总15页 (文件大小:386K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢇ ꢈꢉ ꢀꢁꢊ ꢃꢄꢅ ꢆꢇ ꢇꢈ  
ꢌꢍꢎ ꢏ ꢐꢈꢑꢈ ꢄꢄ ꢒꢄ ꢌꢄ ꢓ ꢈꢔ ꢀꢕꢎ ꢖ ꢏ ꢑꢒꢗ ꢎ ꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
D
D
D
2-V to 5.5-V V  
Operation  
D
D
D
Direct Overriding Clear  
CC  
Max t of 10.5 ns at 5 V  
Parallel-to-Serial Conversion  
pd  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
OLP  
CC  
= 3.3 V, T = 25°C  
A
D
D
D
Typical V  
>2.3 V at V  
(Output V  
Undershoot)  
D
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
OHV  
CC  
OH  
= 3.3 V, T = 25°C  
A
I
Supports Partial-Power-Down-Mode  
off  
− 1000-V Charged-Device Model (C101)  
Operation  
Synchronous Load  
SN54LV166A . . . J OR W PACKAGE  
SN74LV166A . . . D, DB, DGV, NS, OR PW PACKAGE  
(TOP VIEW)  
SN54LV166A . . . FK PACKAGE  
(TOP VIEW)  
SER  
V
CC  
SH/LD  
H
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A
3
2
1 20 19  
18  
B
C
H
Q
B
4
5
6
7
8
Q
H
G
C
NC  
17  
16  
15  
14  
H
D
NC  
G
CLK INH  
CLK  
F
D
E
F
CLK INH  
9 10 11 12 13  
GND  
CLR  
NC − No internal connection  
description/ordering information  
The ’LV166A devices are 8-bit parallel-load shift registers, designed for 2-V to 5.5-V V  
operation.  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube of 40  
SN74LV166AD  
SOIC − D  
LV166A  
Reel of 2500  
Reel of 2000  
Reel of 2000  
Tube of 90  
SN74LV166ADR  
SN74LV166ANSR  
SN74LV166ADBR  
SN74LV166APW  
SN74LV166APWR  
SN74LV166APWT  
SN74LV166ADGVR  
SNJ54LV166AJ  
SOP − NS  
74LV166A  
LV166A  
SSOP − DB  
−40°C to 85°C  
Reel of 2000  
Reel of 250  
Reel of 2000  
Tube of 25  
TSSOP − PW  
LV166A  
TVSOP − DGV  
CDIP − J  
LV166A  
SNJ54LV166AJ  
SNJ54LV166AW  
−55°C to 125°C  
CFP − W  
Tube of 150  
Tube of 55  
SNJ54LV166AW  
SNJ54LV166AFK  
LCCC − FK  
SNJ54LV166AFK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2004, Texas Instruments Incorporated  
ꢘ ꢁ ꢄꢒꢀꢀ ꢓ ꢏꢕ ꢒꢑꢙ ꢎꢀ ꢒ ꢁ ꢓꢏꢒꢔ ꢚꢛ ꢜꢝ ꢞꢟꢠ ꢡꢢꢣ ꢤꢚ ꢠꢟ ꢤꢚꢥ ꢜꢤꢝ ꢐꢑ ꢓ ꢔ ꢘ ꢦꢏ ꢎꢓ ꢁ  
ꢩꢥ ꢨ ꢥ ꢢ ꢣ ꢚ ꢣ ꢨ ꢝ ꢬ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢇꢈ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆ ꢇꢇ ꢈ  
ꢋꢌ ꢍꢎ ꢏ ꢐꢈ ꢑꢈ ꢄ ꢄ ꢒꢄ ꢌꢄꢓ ꢈꢔ ꢀ ꢕꢎ ꢖ ꢏ ꢑꢒ ꢗ ꢎꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
description/ordering information (continued)  
The ’LV166A parallel-in or serial-in, serial-out registers feature gated clock (CLK, CLK INH) inputs and an  
overriding clear (CLR) input. The parallel-in or serial-in modes are established by the shift/load (SH/LD) input.  
When high, SH/LD enables the serial (SER) data input and couples the eight flip-flops for serial shifting with each  
clock (CLK) pulse. When low, the parallel (broadside) data inputs are enabled, and synchronous loading occurs  
on the next clock pulse. During parallel loading, serial data flow is inhibited. Clocking is accomplished on the  
low-to-high-level edge of CLK through a 2-input positive-NOR gate, permitting one input to be used as a  
clock-enable or clock-inhibit function. Holding either CLK or CLK INH high inhibits clocking; holding either low  
enables the other clock input. This allows the system clock to be free running, and the register can be stopped  
on command with the other clock input. CLK INH should be changed to the high level only when CLK is high.  
CLR overrides all other inputs, including CLK, and resets all flip-flops to zero.  
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the  
off  
off  
outputs, preventing damaging current backflow through the devices when they are powered down.  
FUNCTION TABLE  
OUTPUTS  
INPUTS  
INTERNAL  
Q
PARALLEL  
A . . . H  
H
CLK INH CLK  
SER  
Q
Q
B
CLR  
SH/LD  
A
L
X
X
L
X
L
L
L
L
H
X
L
X
X
X
H
L
X
L
L
L
H
H
H
H
H
X
Q
Q
Q
H0  
h
A0  
B0  
a . . . h  
a
H
L
b
H
H
X
X
X
X
Q
Q
Gn  
Q
Gn  
Q
H0  
An  
An  
B0  
Q
Q
X
Q
A0  
2
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ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢇ ꢈꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢇꢈ  
ꢄꢄ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
logic diagram (positive logic)  
A
B
C
D
E
F
G
H
2
3
4
5
10  
11  
12  
14  
15  
1
SH/LD  
SER  
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
1D  
C1  
R
6
7
CLK INH  
CLK  
9
13  
CLR  
Q
H
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.  
typical clear, shift, load, inhibit, and shift sequence  
CLK  
CLK INH  
CLR  
SER  
SH/LD  
A
H
L
B
C
H
L
D
Parallel  
Inputs  
E
H
L
F
G
H
H
H
L
L
L
H
H
H
H
H
Q
H
Inhibit  
Serial Shift  
Serial Shift  
Clear  
Load  
3
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ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢇꢈ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆ ꢇꢇ ꢈ  
ꢋꢌ ꢍꢎ ꢏ ꢐꢈ ꢑꢈ ꢄ ꢄ ꢒꢄ ꢌꢄꢓ ꢈꢔ ꢀ ꢕꢎ ꢖ ꢏ ꢑꢒ ꢗ ꢎꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Output voltage range applied in high or low state, V (see Notes 1 and 2) . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Voltage range applied to any output in the power-off state, V (see Note 1) . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA  
IK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
OK  
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Continuous current through V  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. This value is limited to 5.5 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
4
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ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢇ ꢈꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢇꢈ  
ꢐꢈ  
ꢄꢄ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
recommended operating conditions (see Note 4)  
SN54LV166A  
SN74LV166A  
MIN MAX  
UNIT  
MIN  
2
MAX  
V
V
Supply voltage  
5.5  
2
5.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
1.5  
1.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
V
V
V
× 0.7  
× 0.7  
× 0.7  
V
V
V
× 0.7  
CC  
CC  
CC  
CC  
CC  
CC  
High-level input voltage  
V
V
IH  
× 0.7  
× 0.7  
0.5  
0.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
V
V
V
× 0.3  
V
V
V
× 0.3  
CC  
CC  
CC  
CC  
CC  
CC  
V
IL  
Low-level input voltage  
× 0.3  
× 0.3  
× 0.3  
× 0.3  
V
V
Input voltage  
0
0
5.5  
0
0
5.5  
V
V
I
Output voltage  
V
V
CC  
O
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
−50  
−2  
−50  
−2  
−6  
−12  
50  
2
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
I
High-level output current  
Low-level output current  
OH  
OL  
−6  
mA  
−12  
50  
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
2
I
6
6
mA  
12  
12  
200  
100  
20  
85  
200  
100  
20  
t/v Input transition rise or fall rate  
ns/V  
T
Operating free-air temperature  
−55  
125  
−40  
°C  
A
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54LV166A  
SN74LV166A  
PARAMETER  
TEST CONDITIONS  
UNIT  
V
CC  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
I
I
I
I
I
I
I
I
= −50 µA  
2 V to 5.5 V  
2.3 V  
V
−0.1  
2
V
CC  
−0.1  
2
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
CC  
= −2 mA  
= −6 mA  
= −12 mA  
= 50 µA  
= 2 mA  
V
V
V
OH  
3 V  
2.48  
3.8  
2.48  
3.8  
4.5 V  
2 V to 5.5 V  
2.3 V  
0.1  
0.4  
0.44  
0.55  
1
0.1  
0.4  
0.44  
0.55  
1
V
OL  
= 6 mA  
3 V  
= 12 mA  
4.5 V  
I
I
I
V = 5.5 V or GND  
0 to 5.5 V  
5.5 V  
µA  
µA  
µA  
pF  
I
I
V = V  
CC  
or GND,  
I = 0  
O
20  
20  
CC  
off  
I
V or V = 0 to 5.5 V  
0
5
5
I
O
C
V = V  
or GND  
3.3 V  
1.6  
1.6  
i
I
CC  
ꢞꢣ ꢝ ꢜ ꢰꢤ ꢩꢛ ꢥ ꢝ ꢣ ꢟꢧ ꢞꢣ ꢱ ꢣ ꢫꢟ ꢩꢢꢣ ꢤꢚꢬ ꢦ ꢛꢥ ꢨꢥ ꢠꢚ ꢣꢨ ꢜꢝ ꢚꢜ ꢠ ꢞꢥ ꢚꢥ ꢥꢤ ꢞ ꢟꢚ ꢛꢣꢨ  
ꢠ ꢛꢥ ꢤ ꢰꢣ ꢟꢨ ꢞꢜ ꢝ ꢠ ꢟꢤ ꢚꢜ ꢤꢡꢣ ꢚ ꢛꢣ ꢝ ꢣ ꢩꢨ ꢟꢞ ꢡꢠꢚ ꢝ ꢮ ꢜꢚꢛ ꢟꢡꢚ ꢤꢟꢚ ꢜꢠꢣ ꢬ  
5
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ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢇꢈ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆ ꢇꢇ ꢈ  
ꢋꢌ ꢍꢎ ꢏ ꢐꢈ ꢑꢈ ꢄ ꢄ ꢒꢄ ꢌꢄꢓ ꢈꢔ ꢀ ꢕꢎ ꢖ ꢏ ꢑꢒ ꢗ ꢎꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 2.5 V 0.2 V  
CC  
T
= 25°C  
SN54LV166A SN74LV166A  
A
UNIT  
MIN  
8
MAX  
MIN  
9
MAX  
MIN  
9
MAX  
CLR low  
t
w
Pulse duration  
ns  
CLK high or low  
8.5  
7
9
9
CLK INH before CLK↑  
Data before CLK↑  
SH/LD before CLK↑  
SER before CLK↑  
CLRinactive before CLK↑  
Data after CLK↑  
7
7
6.5  
7
8.5  
8.5  
9.5  
7
8.5  
8.5  
9.5  
7
t
t
ns  
ns  
Setup time  
Hold time  
su  
8.5  
6
−0.5  
0
0
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 3.3 V 0.3 V  
CC  
T
= 25°C  
SN54LV166A SN74LV166A  
A
UNIT  
MIN  
6
MAX  
MIN  
7
MAX  
MIN  
7
MAX  
CLR low  
t
w
Pulse duration  
ns  
CLK high or low  
6
7
7
CLK INH before CLK↑  
Data before CLK↑  
SH/LD before CLK↑  
SER before CLK↑  
CLRinactive before CLK↑  
Data after CLK↑  
5
5
5
5
6
6
5
6
6
t
t
ns  
ns  
Setup time  
Hold time  
su  
5
6
6
4
4
4
0
0
0
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V 0.5 V  
CC  
T
= 25°C  
SN54LV166A SN74LV166A  
A
UNIT  
MIN  
5
MAX  
MIN  
5
MAX MIN4  
MAX  
CLR low  
5
4
t
w
Pulse duration  
ns  
CLK high or low  
4
4
CLK INH before CLK↑  
Data before CLK↑  
SH/LD before CLK↑  
SER before CLK↑  
CLRinactive before CLK↑  
Data after CLK↑  
3.5  
4.5  
4
3.5  
4.5  
4
3.5  
4.5  
4
t
t
ns  
ns  
Setup time  
Hold time  
su  
4
4
4
3.5  
1
3.5  
1
3.5  
1
h
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢇ ꢈꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢇꢈ  
ꢋ ꢌꢍꢎ ꢏ ꢐꢈꢑꢈ ꢄꢄ ꢒꢄ ꢌꢄ ꢓ ꢈꢔ ꢀꢕ ꢎꢖ ꢏ ꢑꢒꢗ ꢎ ꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
switching characteristics over recommended operating free-air temperature range,  
V
= 2.5 V 0.2 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
105*  
80  
SN54LV166A SN74LV166A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MIN  
50*  
40  
MAX  
MIN  
45*  
35  
MAX  
MIN  
45  
35  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
MHz  
max  
t
t
t
t
8.8*  
16*  
1*  
18*  
22*  
22  
18  
22  
22  
26  
CLR  
CLK  
CLR  
CLK  
PHL  
C
C
= 15 pF  
= 50 pF  
ns  
ns  
Q
H
L
L
9.2* 19.8*  
1*  
1
1
1
1
pd  
11.3  
11.8  
19.5  
23.3  
PHL  
pd  
Q
H
1
26  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
switching characteristics over recommended operating free-air temperature range,  
V
= 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
SN54LV166A SN74LV166A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MIN  
65*  
60  
MAX  
MIN  
55*  
50  
MAX  
MIN  
55  
50  
1
MAX  
C
C
= 15 pF  
= 50 pF  
150*  
120  
L
L
f
MHz  
max  
t
t
t
t
6.3* 12.5*  
6.6* 15.4*  
1*  
15*  
18*  
15  
18  
CLR  
CLK  
CLR  
CLK  
PHL  
C
C
= 15 pF  
= 50 pF  
ns  
ns  
Q
H
L
L
1*  
1
1
1
1
pd  
7.9  
8.3  
16.3  
18.9  
18.5  
21.5  
18.5  
21.5  
PHL  
pd  
Q
H
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
switching characteristics over recommended operating free-air temperature range,  
V
= 5 V 0.5 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
205*  
160  
SN54LV166A SN74LV166A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MIN  
110*  
95  
MAX  
MIN  
90*  
85  
MAX  
MIN  
90  
85  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
MHz  
max  
t
t
t
t
4.6*  
8.6*  
9.9*  
10.6  
11.9  
1*  
10*  
10  
11.5  
12  
CLR  
CLK  
CLR  
CLK  
PHL  
C
C
= 15 pF  
= 50 pF  
ns  
ns  
Q
H
L
L
4.8*  
5.7  
6.1  
1* 11.5*  
1
1
1
pd  
1
1
12  
PHL  
pd  
Q
H
13.5  
13.5  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 10 MHz  
L
V
TYP  
39.1  
44.5  
UNIT  
CC  
3.3 V  
C
Power dissipation capacitance  
C
pF  
pd  
5 V  
ꢞꢣ ꢝ ꢜ ꢰꢤ ꢩꢛ ꢥ ꢝ ꢣ ꢟꢧ ꢞꢣ ꢱ ꢣ ꢫꢟ ꢩꢢꢣ ꢤꢚꢬ ꢦ ꢛꢥ ꢨꢥ ꢠꢚ ꢣꢨ ꢜꢝ ꢚꢜ ꢠ ꢞꢥ ꢚꢥ ꢥꢤ ꢞ ꢟꢚ ꢛꢣꢨ  
ꢠ ꢛꢥ ꢤ ꢰꢣ ꢟꢨ ꢞꢜ ꢝ ꢠ ꢟꢤ ꢚꢜ ꢤꢡꢣ ꢚ ꢛꢣ ꢝ ꢣ ꢩꢨ ꢟꢞ ꢡꢠꢚ ꢝ ꢮ ꢜꢚꢛ ꢟꢡꢚ ꢤꢟꢚ ꢜꢠꢣ ꢬ  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢇꢈ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆ ꢇꢇ ꢈ  
ꢋꢌ ꢍꢎ ꢏ ꢐꢈ ꢑꢈ ꢄ ꢄ ꢒꢄ ꢌꢄꢓ ꢈꢔ ꢀ ꢕꢎ ꢖ ꢏ ꢑꢒ ꢗ ꢎꢀ ꢏꢒ ꢑꢀ  
SCLS456B − FEBRUARY 2001 − REVISED DECEMBER 2004  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
50% V  
CC  
Timing Input  
0 V  
t
w
t
h
t
V
CC  
su  
V
CC  
50% V  
CC  
50% V  
CC  
Input  
Input  
50% V  
CC  
50% V  
CC  
Data Input  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
CC  
50% V  
50% V  
CC  
50% V  
CC  
CC  
0 V  
0 V  
t
t
PLZ  
PZL  
t
t
t
PLH  
PHL  
Output  
Waveform 1  
V
V  
OH  
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
(see Note B)  
CC  
V
OL  
+ 0.3 V  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
Out-of-Phase  
Output  
V
OH  
− 0.3 V  
50% V  
CC  
50% V  
50% V  
CC  
CC  
V
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time, with one input transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PLH  
are the same as t  
.
dis  
PLZ  
PZL  
PHL  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
SN74LV166AD  
Status (1)  
ACTIVE  
PREVIEW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SN74LV166ADB  
SN74LV166ADBR  
SN74LV166ADGVR  
SN74LV166ADR  
SN74LV166ANSR  
SN74LV166APW  
SN74LV166APWR  
SN74LV166APWT  
SSOP  
SSOP  
TVSOP  
SOIC  
DB  
DB  
80  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
2000  
2000  
2500  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
DGV  
D
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SO  
NS  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
CU NIPDAU Level-1-250C-UNLIM  
CU NIPDAU Level-1-250C-UNLIM  
2000  
250  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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