SN74LV174A_07 [TI]

HEX D-TYPE FLIP-FLOPS WITH CLEAR; 六路D型触发器与Clear
SN74LV174A_07
型号: SN74LV174A_07
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

HEX D-TYPE FLIP-FLOPS WITH CLEAR
六路D型触发器与Clear

触发器
文件: 总18页 (文件大小:428K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢃ ꢈꢉ ꢀꢁꢇ ꢃꢄꢅ ꢆꢇ ꢃꢈ  
ꢊꢋ ꢌ ꢍꢎꢏ ꢐꢑ ꢋ ꢒ ꢄ ꢓꢑ ꢎ ꢒꢄꢔ ꢑ ꢀ  
ꢕ ꢓꢏꢊ ꢖ ꢄꢋ ꢈꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
SN54LV174A . . . J OR W PACKAGE  
SN74LV174A . . . D, DB, DGV, NS, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
2-V to 5.5-V V  
Operation  
CC  
Max t of 8.5 ns at 5 V  
pd  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CLR  
1Q  
1D  
2D  
2Q  
3D  
3Q  
GND  
V
CC  
A
6Q  
6D  
5D  
5Q  
4D  
4Q  
CLK  
Typical V  
>2.3 V at V  
(Output V  
Undershoot)  
OHV  
CC  
OH  
= 3.3 V, T = 25°C  
A
Support Mixed-Mode Voltage Operation on  
All Ports  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
SN54LV174A . . . FK PACKAGE  
(TOP VIEW)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
3
2
1 20 19  
18 6D  
The ’LV174A devices are hex D-type flip-flops  
1D  
2D  
NC  
2Q  
3D  
4
5
6
7
8
designed for 2-V to 5.5-V V  
operation.  
CC  
17  
5D  
NC  
5Q  
4D  
These devices are positive-edge-triggered  
flip-flops with a direct clear (CLR) input.  
Information at the data (D) inputs meeting the  
setup time requirements is transferred to the  
outputs on the positive-going edge of the clock  
pulse. Clock triggering occurs at a particular  
voltage level and is not directly related to the  
transition time of the positive-going edge of the  
clock pulse. When the clock (CLK) input is at  
either the high or low level, the D-input signal has  
no effect at the output.  
16  
15  
14  
9 10 11 12 13  
NC − No internal connection  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube of 40  
SN74LV174AD  
SOIC − D  
LV174A  
Reel of 2500  
Reel of 2000  
Reel of 2000  
Tube of 90  
SN74LV174ADR  
SN74LV174ANSR  
SN74LV174ADBR  
SN74LV174APW  
SN74LV174APWR  
SN74LV174APWT  
SN74LV174ADGVR  
SNJ54LV174AJ  
SOP − NS  
74LV174A  
LV174A  
SSOP − DB  
−40°C to 85°C  
Reel of 2000  
Reel of 250  
Reel of 2000  
Tube of 25  
TSSOP − PW  
LV174A  
TVSOP − DGV  
CDIP − J  
LV174A  
SNJ54LV174AJ  
SNJ54LV174AW  
SNJ54LV174AFK  
−55°C to 125°C  
CFP − W  
Tube of 150  
Tube of 55  
SNJ54LV174AW  
SNJ54LV174AFK  
LCCC − FK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2005, Texas Instruments Incorporated  
ꢘ ꢁ ꢄꢋꢀꢀ ꢔ ꢏꢊ ꢋꢗꢕ ꢓꢀ ꢋ ꢁ ꢔꢏꢋꢍ ꢙꢚ ꢛꢜ ꢝꢞꢟ ꢠꢡꢢ ꢣꢙ ꢟꢞ ꢣꢙꢤ ꢛꢣꢜ ꢑꢗ ꢔ ꢍ ꢘ ꢖꢏ ꢓꢔ ꢁ  
ꢧꢤ ꢦ ꢤ ꢡ ꢢ ꢙ ꢢ ꢦ ꢜ ꢪ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢃꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢃ ꢈ  
ꢊ ꢋꢌ ꢍ ꢎꢏ ꢐꢑꢋ ꢒ ꢄ ꢓ ꢑ ꢎꢒꢄꢔ ꢑ ꢀ  
ꢕꢓ ꢏ ꢊ ꢖ ꢄ ꢋꢈ ꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Q
CLR  
L
CLK  
X
D
X
H
L
L
H
L
H
H
H
L
X
Q
0
logic diagram (positive logic)  
1
CLR  
9
CLK  
3
1D  
1D  
C1  
2
1Q  
R
To Five Other Channels  
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
O
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Continuous current through V  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
2. This value is limited to 5.5 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢃ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢃꢈ  
ꢊꢋꢌ ꢍꢎꢏ ꢐꢑ ꢋ ꢒ ꢄꢓ ꢑ ꢎꢒ ꢄꢔ ꢑꢀ  
ꢕ ꢓꢏ ꢊ ꢖ ꢄꢋ ꢈꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
recommended operating conditions (see Note 4)  
SN54LV174A  
SN74LV174A  
UNIT  
MIN  
2
MAX  
MIN  
2
MAX  
V
V
Supply voltage  
5.5  
5.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
1.5  
1.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
V
V
V
× 0.7  
V
V
V
× 0.7  
CC  
CC  
CC  
CC  
CC  
CC  
High-level input voltage  
V
V
IH  
× 0.7  
× 0.7  
× 0.7  
× 0.7  
0.5  
0.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
V
V
V
× 0.3  
V
V
V
× 0.3  
× 0.3  
× 0.3  
5.5  
CC  
CC  
CC  
CC  
CC  
CC  
V
IL  
Low-level input voltage  
× 0.3  
× 0.3  
5.5  
V
V
Input voltage  
0
0
0
0
V
V
I
Output voltage  
V
V
CC  
O
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
−50  
−2  
−50  
−2  
−6  
−12  
50  
2
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
I
High-level output current  
Low-level output current  
OH  
OL  
−6  
mA  
−12  
50  
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
2
I
6
6
mA  
12  
12  
200  
100  
20  
85  
200  
100  
20  
t/v Input transition rise or fall rate  
ns/V  
T
Operating free-air temperature  
−55  
125  
−40  
°C  
A
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54LV174A  
SN74LV174A  
PARAMETER  
TEST CONDITIONS  
UNIT  
V
CC  
MIN  
−0.1  
2
TYP  
MAX  
MIN  
−0.1  
2
TYP  
MAX  
I
I
I
I
I
I
I
I
= −50 µA  
= −2 mA  
= −6 mA  
= −12 mA  
= 50 µA  
= 2 mA  
2 V to 5.5 V  
2.3 V  
V
CC  
V
CC  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
V
V
V
OH  
3 V  
2.48  
3.8  
2.48  
3.8  
4.5 V  
2 V to 5.5 V  
2.3 V  
0.1  
0.4  
0.44  
0.55  
1
0.1  
0.4  
0.44  
0.55  
1
V
OL  
= 6 mA  
3 V  
= 12 mA  
4.5 V  
I
I
I
V = 5.5 V or GND  
0 to 5.5 V  
5.5 V  
µA  
µA  
µA  
pF  
I
I
V = V  
CC  
or GND,  
I = 0  
O
20  
20  
CC  
off  
I
V or V = 0 to 5.5 V  
0
5
5
I
O
C
V = V  
or GND  
3.3 V  
1.7  
1.7  
i
I
CC  
ꢝꢢ ꢜ ꢛ ꢮꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩꢞ ꢧꢡꢢ ꢣꢙꢪ ꢖ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞꢝ ꢠꢟꢙ ꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢃꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢃ ꢈ  
ꢊ ꢋꢌ ꢍ ꢎꢏ ꢐꢑꢋ ꢒ ꢄ ꢓ ꢑ ꢎꢒꢄꢔ ꢑ ꢀ  
ꢕꢓ ꢏ ꢊ ꢖ ꢄ ꢋꢈ ꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 2.5 V 0.2 V  
CC  
T
A
= 25°C  
SN54LV174A SN74LV174A  
UNIT  
MIN  
6
TYP  
MAX  
MIN  
6.5  
7
MAX  
MIN  
6.5  
7
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
7
8.5  
4
9.5  
4
9.5  
4
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
Hold time, data after CLK↑  
−0.5  
0
0
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 3.3 V 0.3 V  
CC  
T
A
= 25°C  
SN54LV174A SN74LV174A  
UNIT  
MIN  
5
TYP  
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
5
5
5
5
6
6
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
3
3
3
Hold time, data after CLK↑  
0
0
0
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V 0.5 V  
CC  
T
A
= 25°C  
SN54LV174A SN74LV174A  
UNIT  
MIN  
5
TYP  
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
5
5
5
4.5  
2.5  
0.5  
4.5  
2.5  
0.5  
4.5  
2.5  
0.5  
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
Hold time, data after CLK↑  
h
switching characteristics over recommended operating free-air temperature range,  
V
= 2.5 V 0.2 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
115*  
90  
SN54LV174A SN74LV174A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
55*  
45  
MAX  
MIN  
50*  
40  
MAX  
MIN  
50  
40  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
max  
pd  
CLR  
CLK  
CLR  
CLK  
6.3* 17.3*  
8.4* 17.1*  
1* 19.5*  
19.5  
19  
Q
Q
C
= 15 pF  
t
L
1*  
1
19*  
23.5  
23  
1
8.2  
21.9  
20.6  
2
1
23.5  
23  
t
t
pd  
10.8  
1
1
C
= 50 pF  
ns  
L
2
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
ꢝ ꢢ ꢜ ꢛ ꢮ ꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩ ꢞꢧ ꢡꢢ ꢣ ꢙꢪ ꢖ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚ ꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠ ꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞ ꢝꢠꢟ ꢙꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢃ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢃꢈ  
ꢊꢋꢌ ꢍꢎꢏ ꢐꢑ ꢋ ꢒ ꢄꢓ ꢑ ꢎꢒ ꢄꢔ ꢑꢀ  
ꢕ ꢓꢏ ꢊ ꢖ ꢄꢋ ꢈꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
switching characteristics over recommended operating free-air temperature range,  
V
= 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
SN54LV174A SN74LV174A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
95*  
55  
MAX  
MIN  
80*  
50  
MAX  
MIN  
80  
50  
1
MAX  
C
C
= 15 pF  
= 50 pF  
170*  
130  
L
L
f
max  
pd  
CLR  
CLK  
CLR  
CLK  
4.5* 11.4*  
1* 13.5*  
13.5  
13  
Q
Q
C
= 15 pF  
t
L
5.8*  
6
11*  
14.9  
14.5  
1.5  
1*  
1
13*  
17  
1
1
17  
t
t
pd  
7.5  
1
16.5  
1
16.5  
1.5  
C
= 50 pF  
ns  
L
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
switching characteristics over recommended operating free-air temperature range,  
V
= 5 V 0.5 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
240*  
180  
3*  
SN54LV174A SN74LV174A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
130*  
90  
MAX  
MIN  
110*  
80  
1*  
MAX  
MIN  
110  
80  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
max  
pd  
CLR  
CLK  
CLR  
CLK  
7.6*  
7.2*  
9.6  
9.2  
1
9*  
8.5*  
11  
9
8.5  
11  
Q
Q
C
= 15 pF  
t
L
4.1*  
4.2  
1*  
1
1
1
t
t
pd  
5.5  
1
10.5  
1
10.5  
1
C
= 50 pF  
ns  
L
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
noise characteristics, V  
= 3.3 V, C = 50 pF, T = 25°C (see Note 5)  
CC  
L
A
SN74LV174A  
PARAMETER  
UNIT  
MIN  
TYP  
0.34  
−0.3  
3.02  
MAX  
V
V
V
V
V
Quiet output, maximum dynamic V  
0.8  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
Quiet output, minimum dynamic V  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
−0.8  
OL  
OH  
2.31  
0.99  
NOTE 5: Characteristics are for surface-mount packages only.  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 10 MHz  
L
V
TYP  
14  
UNIT  
CC  
3.3 V  
C
Power dissipation capacitance  
C
pF  
pd  
5 V  
15.1  
ꢝꢢ ꢜ ꢛ ꢮꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩꢞ ꢧꢡꢢ ꢣꢙꢪ ꢖ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞꢝ ꢠꢟꢙ ꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
ꢢꢜ  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢃꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢃ ꢈ  
ꢊ ꢋꢌ ꢍ ꢎꢏ ꢐꢑꢋ ꢒ ꢄ ꢓ ꢑ ꢎꢒꢄꢔ ꢑ ꢀ  
ꢕꢓ ꢏ ꢊ ꢖ ꢄ ꢋꢈ ꢗ  
SCLS401G − APRIL 1998 − REVISED APRIL 2005  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
50% V  
CC  
Timing Input  
0 V  
t
w
t
h
t
V
CC  
su  
V
CC  
50% V  
CC  
50% V  
CC  
Input  
Input  
50% V  
CC  
50% V  
CC  
Data Input  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
CC  
50% V  
50% V  
CC  
50% V  
CC  
CC  
0 V  
0 V  
t
t
t
t
t
PLZ  
PLH  
PHL  
PZL  
Output  
Waveform 1  
V
V  
OH  
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
V
OL  
+ 0.3 V  
S1 at V  
(see Note B)  
CC  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
Out-of-Phase  
Output  
V
OH  
− 0.3 V  
50% V  
CC  
50% V  
50% V  
CC  
CC  
0 V  
V
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time, with one input transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PLH  
are the same as t  
.
dis  
PLZ  
PZL  
PHL  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
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representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
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non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
SN74LV174AD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV174ADBR  
SN74LV174ADBRE4  
SN74LV174ADBRG4  
SN74LV174ADE4  
SN74LV174ADG4  
SN74LV174ADGVR  
SN74LV174ADGVRE4  
SN74LV174ADGVRG4  
SN74LV174ADR  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
TVSOP  
TVSOP  
TVSOP  
SOIC  
SOIC  
SOIC  
SO  
DB  
DB  
DB  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGV  
DGV  
DGV  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV174ADRE4  
SN74LV174ADRG4  
SN74LV174ANSR  
SN74LV174ANSRE4  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV174ANSRG4  
SN74LV174APW  
ACTIVE  
ACTIVE  
SO  
NS  
16  
16  
2000  
TBD  
Call TI  
Call TI  
TSSOP  
PW  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV174APWE4  
SN74LV174APWG4  
SN74LV174APWR  
SN74LV174APWRE4  
SN74LV174APWRG4  
SN74LV174APWT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
16  
16  
16  
16  
16  
16  
16  
16  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV174APWTE4  
SN74LV174APWTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Jun-2007  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
0
(mm)  
16  
SN74LV174ADBR  
SN74LV174ADGVR  
SN74LV174ADR  
DB  
DGV  
D
16  
16  
16  
16  
16  
MLA  
MLA  
FMX  
MLA  
MLA  
8.2  
6.8  
6.5  
8.2  
7.0  
6.6  
4.0  
2.5  
1.6  
12  
8
16  
16  
16  
16  
12  
Q1  
Q1  
Q1  
Q1  
Q1  
12  
16  
10.3  
10.5  
5.6  
12.1  
2.5  
2
SN74LV174ANSR  
SN74LV174APWR  
NS  
330  
330  
16  
12  
8
PW  
12  
1.6  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74LV174ADBR  
SN74LV174ADGVR  
SN74LV174ADR  
DB  
DGV  
D
16  
16  
16  
16  
16  
MLA  
MLA  
FMX  
MLA  
MLA  
342.9  
338.1  
342.9  
342.9  
338.1  
336.6  
340.5  
336.6  
336.6  
340.5  
28.58  
20.64  
28.58  
28.58  
20.64  
SN74LV174ANSR  
SN74LV174APWR  
NS  
PW  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
Pack Materials-Page 3  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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