SN74LVC139ADG4 [TI]
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER; 双2线， 4线译码器/解复用器
| 型号： | SN74LVC139ADG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER |
| 文件： | 总30页 (文件大小：1403K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O–MARCH 1994–REVISED FEBRUARY 2005
FEATURES
•
•
Latch-Up Performance Exceeds 250 mA Per
JESD 17
•
•
•
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 6.2 ns
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
– 1000-V Charged-Device Model (C101)
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
2G
1G
1A
CC
1
16
2A
2B
2Y0
2Y1
2Y2
2Y3
1B
1A
1B
2
3
4
5
6
7
2G
2A
15
14
1Y0
1Y1
1Y2
1Y3
GND
1Y0
1Y1
1Y2
1Y3
13 2B
12 2Y0
11
10
2Y1
2Y2
8
9
DESCRIPTION/ORDERING INFORMATION
This dual 2-line to 4-line decoder/demultiplexer is designed for 1.65-V to 3.6-V VCC operation.
The device comprises two individual 2-line to 4-line decoders in a single package. The active-low enable (G)
input can be used as a data line in demultiplexing applications. This decoder/demultiplexer features fully buffered
inputs, each of which represents only one normalized load to its driving circuit.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
SN74LVC139ARGYR
SN74LVC139AD
TOP-SIDE MARKING
QFN – RGY
SOIC – D
Reel of 1000
Tube of 40
LC139A
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
SN74LVC139ADR
LVC139A
SN74LVC139ADT
SOP – NS
SN74LVC139ANSR
SN74LVC139ADBR
SN74LVC139APW
LVC139A
LC139A
SSOP – DB
–40°C to 85°C
TSSOP – PW
Reel of 2000
Reel of 250
Reel of 2000
SN74LVC139APWR
SN74LVC139APWT
SN74LVC139ADGVR
SN74LVC139AGQNR
SN74LVC139AZQNR
LC139A
TVSOP – DGV
VFBGA – GQN
LC139A
LC139A
Reel of 1000
VFBGA – ZQN (Pb-free)
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1994–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O–MARCH 1994–REVISED FEBRUARY 2005
GQN OR ZQN PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS
1
2
3
4
1
2
3
4
A
B
C
D
E
1A
1G
VCC
2G
2A
A
B
C
D
E
1B
NC(1)
1Y0
NC(1)
1Y3
NC(1)
2Y0
NC(1)
2Y3
1Y1
1Y2
GND
2B
2Y1
2Y2
(1) NC - No internal connection
FUNCTION TABLE
(EACH DECODER/DEMULTIPLEXER)
INPUTS
OUTPUTS
SELECT
G
B
L
A
L
Y3
H
H
H
L
Y2
H
H
L
Y1
H
L
Y0
L
L
L
L
L
H
L
H
L
H
H
H
H
H
H
X
H
H
H
H
X
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
4
5
6
1Y0
1Y1
1Y2
1
1G
2
3
1A
1B
Select
Inputs
7
1Y3
Data
Outputs
12
2Y0
2Y1
2Y2
15
2G
11
10
14
13
2A
2B
Select
Inputs
9
2Y3
Pin numbers shown are for the D, DB, DGV, NS, PW, and RGY packages.
2
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O–MARCH 1994–REVISED FEBRUARY 2005
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
6.5
V
VO
IIK
Output voltage range(2)(3)
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±50
±100
73
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
D package(4)
DB package(4)
DGV package(4)
GQN/ZQN package(4)
NS package(4)
PW package(4)
RGY package(5)
82
120
78
θJA
Package thermal impedance
Storage temperature range
°C/W
°C
64
108
39
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions(1)
MIN
MAX UNIT
Operating
1.65
3.6
V
VCC
Supply voltage
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
1.5
0.65 × VCC
VIH
High-level input voltage
1.7
2
V
0.35 × VCC
0.7
VIL
Low-level input voltage
V
0.8
5.5
VCC
–4
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
–8
IOH
High-level output current
Low-level output current
mA
mA
–12
–24
4
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
8
IOL
12
24
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
10
ns/V
TA
–40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O–MARCH 1994–REVISED FEBRUARY 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP(1) MAX UNIT
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
1.65 V to 3.6 V VCC – 0.2
1.65 V
2.3 V
1.2
1.7
2.2
2.4
2.2
VOH
V
2.7 V
IOH = –12 mA
3 V
IOH = –24 mA
IOL = 100 µA
IOL = 4 mA
3 V
1.65 V to 3.6 V
1.65 V
2.3 V
0.2
0.45
VOL
IOL = 8 mA
0.7
0.4
0.55
±5
V
IOL = 12 mA
2.7 V
IOL = 24 mA
3 V
II
All inputs
VI = 5.5 V or GND
VI = VCC or GND,
3.6 V
µA
µA
µA
pF
ICC
∆ICC
Ci
IO = 0
3.6 V
10
One input at VCC – 0.6 V,
VI = VCC or GND
Other inputs at VCC or GND
2.7 V to 3.6 V
3.3 V
500
5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1
MAX
MIN
1
MAX
MIN
1
MAX
7.3
MIN
1
MAX
A or B
G
20.6
19.5
9.3
7.2
6.2
4.7
1
tpd
Y
ns
ns
1
1
1
5.2
1
tsk(o)
Operating Characteristics
TA = 25°C
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
TYP
Cpd
Power dissipation capacitance
f = 10 MHz
28.5
29.5
30.5
pF
4
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O–MARCH 1994–REVISED FEBRUARY 2005
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
R
L
PLZ PZL
LOAD
GND
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
V
V
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
V
/2
/2
2 × V
2 × V
6 V
6 V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
CC
CC
CC
V
CC
CC
CC
1.5 V
1.5 V
3.3 V ± 0.3 V
0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
OL
+ V
∆
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74LVC139AD
ACTIVE
SOIC
D
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADBLE
SN74LVC139ADBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADBRE4
SN74LVC139ADE4
SN74LVC139ADG4
SN74LVC139ADGVR
SN74LVC139ADGVRE4
SN74LVC139ADR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
16
16
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
TVSOP
SOIC
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADRE4
SN74LVC139ADRG4
SN74LVC139ADT
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADTE4
SN74LVC139AGQNR
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
GQN
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC139ANSR
SN74LVC139ANSRE4
SN74LVC139APW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWE4
SN74LVC139APWG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWLE
SN74LVC139APWR
OBSOLETE TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWRE4
SN74LVC139APWRG4
SN74LVC139APWT
PW
PW
PW
PW
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWTE4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Orderable Device
SN74LVC139APWTG4
SN74LVC139ARGYR
SN74LVC139ARGYRG4
SN74LVC139AZQNR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
16
16
16
20
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
QFN
QFN
RGY
RGY
ZQN
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74LVC139AD
ACTIVE
SOIC
D
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADBLE
SN74LVC139ADBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADBRE4
SN74LVC139ADE4
SN74LVC139ADG4
SN74LVC139ADGVR
SN74LVC139ADGVRE4
SN74LVC139ADR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
16
16
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
TVSOP
SOIC
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADRE4
SN74LVC139ADRG4
SN74LVC139ADT
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139ADTE4
SN74LVC139AGQNR
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
GQN
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC139ANSR
SN74LVC139ANSRE4
SN74LVC139APW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWE4
SN74LVC139APWG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWLE
SN74LVC139APWR
OBSOLETE TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWRE4
SN74LVC139APWRG4
SN74LVC139APWT
PW
PW
PW
PW
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC139APWTE4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
Orderable Device
SN74LVC139APWTG4
SN74LVC139ARGYR
SN74LVC139ARGYRG4
SN74LVC139AZQNR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
16
16
16
20
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
QFN
QFN
RGY
RGY
ZQN
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Data Converters
DSP
Interface
Applications
Audio
Automotive
Broadband
Digital Control
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amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Logic
Power Mgmt
Microcontrollers
Low Power Wireless
power.ti.com
microcontroller.ti.com
www.ti.com/lpw
Optical Networking
Security
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Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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