SN74LVC1G19_15 [TI]
1-of-2 Decoder and Demultiplexer;
| 型号： | SN74LVC1G19_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1-of-2 Decoder and Demultiplexer |
| 文件： | 总19页 (文件大小：854K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
•
VOHV (Output VOH Undershoot) >2 V Typ
at VCC = 3.3 V, TA = 25°C
•
•
•
•
•
•
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 4 ns at 3.3 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
VOLP (Output Ground Bounce) <0.8 V Typ at
VCC = 3.3 V, TA = 25°C
1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
1
2
3
6
5
A
GND
E
Y0
1
2
3
6
5
A
GND
E
Y0
1
2
3
A
GND
E
6
5
4
Y0
VCC
VCC
4
Y1
VCC
4
Y1
Y1
DRY PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1
2
3
6
5
4
3
2
1
4
5
6
A
Y0
E
GND
A
Y1
VCC
GND
E
VCC
Y1
Y0
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to
the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
SN74LVC1G19YZPR
SN74LVC1G19YZPRB
SN74LVC1G19DRYR
SN74LVC1G19DBVR
SN74LVC1G19DBVRE4
SN74LVC1G19DCKR
SN74LVC1G19DCKRE4
SN74LVC1G19DCKRG4
SN74LVC1G19DRLR
SN74LVC1G19DRLRG4
NanoFree™ – WCSP (DSBGA)
Reel of 3000
Reel of 4000
Reel of 3000
_ _ _CY_
CY_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
CY_
–40°C to 85°C
Reel of 3000
Reel of 4000
CY_
CY_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUTS
E
L
A
L
Y0
L
Y1
H
L
L
H
X
H
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
Y0
Y1
2
Submit Documentation Feedback
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
6.5
V
VO
VO
IIK
6.5
V
VCC + 0.5
–50
V
Input clamp current
VI < 0
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
±50
±100
165
DBV package
DCK package
DRL package
DRY package
YZP package
259
θJA
Package thermal impedance(4)
142
°C/W
°C
234
123
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
3
Submit Documentation Feedback
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
Recommended Operating Conditions(1)
MIN
1.65
MAX UNIT
Operating
5.5
V
VCC Supply voltage
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
0.65 × VCC
1.7
VIH
High-level input voltage
Low-level input voltage
V
2
0.7 × VCC
0.35 × VCC
0.7
VIL
V
0.8
0.3 × VCC
5.5
VCC
–4
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
–8
IOH
High-level output current
Low-level output current
–16
–24
–32
4
mA
mA
VCC = 3 V
VCC = 4.5 V
VCC = 1.65 V
VCC = 2.3 V
8
IOL
16
VCC = 3 V
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
20
∆t/∆v Input transition rise or fall rate
10
ns/V
5
TA
Operating free-air temperature
–40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
Submit Documentation Feedback
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to 5.5 V
1.65 V
MIN TYP(1)
VCC – 0.1
MAX
UNIT
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
IOH = –16 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 4 mA
1.2
1.9
2.4
2.3
3.8
2.3 V
VOH
V
3 V
4.5 V
1.65 V to 5.5 V
1.65 V
0.1
0.45
0.3
IOL = 8 mA
2.3 V
VOL
V
IOL = 16 mA
0.4
3 V
IOL = 24 mA
0.55
0.55
±1
IOL = 32 mA
4.5 V
0 to 5.5 V
0
II
VI = 5.5 V or GND
VI or VO = 5.5 V
VI = 5.5 V or GND,
µA
µA
µA
Ioff
ICC
±10
10
IO = 0
1.65 V to 5.5 V
Other inputs at VCC or
GND
∆ICC
One input at VCC– 0.6 V,
VI = VCC or GND
3 V to 5.5 V
3.3 V
500
µA
CI
3.5
pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
16.1
MIN
MAX
5.9
MIN MAX
MIN
MAX
2.8
tpd
A or E
Y
2.5
1.5
1
4
0.5
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
16.1
MIN
MAX
MIN MAX
MIN
MAX
3.9
tpd
A or E
Y
3.2
1.5
6.5
1.1
5.2
0.5
ns
Operating Characteristics
TA = 25°C
VCC = 1.8 V
TYP
VCC = 2.5 V
TYP
VCC = 3.3 V VCC = 5 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
Cpd
Power dissipation capacitance
f = 10 MHz
15.5
16
16
18
pF
5
Submit Documentation Feedback
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
PARAMETER MEASUREMENT INFORMATION
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
15 pF
15 pF
15 pF
15 pF
1 MW
0.15 V
0.15 V
0.3 V
1 MW
1 MW
1 MW
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VM
VM
Output
Output
VOL + V
D
VOL
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
SN74LVC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES464E–JUNE 2003–REVISED FEBRUARY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
30 pF
30 pF
50 pF
50 pF
1 kW
0.15 V
0.15 V
0.3 V
500 W
500 W
500 W
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VOL
VM
VM
Output
Output
VOL + V
D
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
7
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN74LVC1G19DBVR
SN74LVC1G19DBVRE4
SN74LVC1G19DBVRG4
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
6
6
6
3000
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Request Free Samples
Green (RoHS
& no Sb/Br)
SN74LVC1G19DBVT
SN74LVC1G19DCKR
PREVIEW
ACTIVE
SOT-23
SC70
DBV
DCK
6
6
250
TBD
Call TI
Call TI
Samples Not Available
Request Free Samples
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G19DCKRE4
SN74LVC1G19DCKRG4
ACTIVE
ACTIVE
SC70
SC70
DCK
DCK
6
6
3000
3000
Green (RoHS
& no Sb/Br)
Request Free Samples
Request Free Samples
Green (RoHS
& no Sb/Br)
SN74LVC1G19DCKT
SN74LVC1G19DRLR
PREVIEW
ACTIVE
SC70
SOT
DCK
DRL
6
6
250
TBD
Call TI
Call TI
Samples Not Available
Request Free Samples
4000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SN74LVC1G19DRLRG4
SN74LVC1G19DRYR
SN74LVC1G19DRYRG4
SN74LVC1G19YZPR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT
SON
DRL
DRY
DRY
YZP
6
6
6
6
4000
5000
5000
3000
Green (RoHS
& no Sb/Br)
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
DSBGA
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2010
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LVC1G19DBVR
SN74LVC1G19DBVT
SN74LVC1G19DCKR
SN74LVC1G19DCKR
SN74LVC1G19DRLR
SN74LVC1G19DRYR
SN74LVC1G19YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DRL
DRY
YZP
6
6
6
6
6
6
6
3000
250
180.0
180.0
180.0
178.0
180.0
179.0
180.0
9.2
9.2
9.2
9.0
9.2
8.4
8.4
3.23
3.23
2.24
2.4
3.17
3.17
2.34
2.5
1.37
1.37
1.22
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q1
Q1
3000
3000
4000
5000
3000
SC70
SOT
1.78
1.2
1.78
1.65
1.52
0.69
0.7
SON
DSBGA
1.02
0.63
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LVC1G19DBVR
SN74LVC1G19DBVT
SN74LVC1G19DCKR
SN74LVC1G19DCKR
SN74LVC1G19DRLR
SN74LVC1G19DRYR
SN74LVC1G19YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DRL
DRY
YZP
6
6
6
6
6
6
6
3000
250
205.0
205.0
205.0
180.0
202.0
203.0
220.0
200.0
200.0
200.0
180.0
201.0
203.0
220.0
33.0
33.0
33.0
18.0
28.0
35.0
34.0
3000
3000
4000
5000
3000
SC70
SOT
SON
DSBGA
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明