SN74LVC1G3157DSFR [TI]

5V、2:1 (SPDT)、单通道通用模拟开关 | DSF | 6 | -40 to 125;
SN74LVC1G3157DSFR
型号: SN74LVC1G3157DSFR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

5V、2:1 (SPDT)、单通道通用模拟开关 | DSF | 6 | -40 to 125

开关 光电二极管 输出元件
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
FEATURES  
Low On-State Resistance, Typically 6 Ω  
(VCC = 4.5 V)  
1.65-V to 5.5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Useful for Both Analog and Digital  
Applications  
ESD Protection Exceeds JESD 22  
Specified Break-Before-Make Switching  
Rail-to-Rail Signal Handling  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
High Degree of Linearity  
1000-V Charged-Device Model (C101)  
High Speed, Typically 0.5 ns  
(VCC = 3 V, CL = 50 pF)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
B2  
GND  
B1  
S
1
2
3
6
5
4
B2  
GND  
B1  
S
1
2
3
6
5
4
B2  
GND  
B1  
S
VCC  
VCC  
A
VCC  
A
A
DRY PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
B1  
GND  
B2  
A
1
2
3
6
5
4
B2  
GND  
B1  
S
VCC  
VCC  
S
A
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to VCC (peak) to be transmitted in either direction.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SON – DRY  
Reel of 3000  
SN74LVC1G3157YZPR  
_ _ _ C5_  
Reel of 5000  
Reel of 3000  
Reel of 3000  
Reel of 4000  
SN74LVC1G3157DRYR  
SN74LVC1G3157DBVR  
SN74LVC1G3157DCKR  
SN74LVC1G3157DRLR  
C5_  
CC5_  
C5_  
C5_  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
SOT (SOT-553) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
FUNCTION TABLE  
CONTROL  
INPUT  
ON  
CHANNEL  
S
L
B1  
B2  
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
6
3
B2  
S
4
A
B1  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
MAX UNIT  
VCC  
VIN  
VI/O  
IIK  
Supply voltage range(2)  
6.5  
6.5  
V
Control input voltage range(2)(3)  
Switch I/O voltage range(2)(3)(4)(5)  
Control input clamp current  
I/O port diode current  
V
–0.5 VCC + 0.5  
V
VIN < 0  
–50  
±50  
mA  
mA  
mA  
mA  
IIOK  
II/O  
VI/O < 0 or VI/O > VCC  
VI/O = 0 to VCC  
On-state switch current(6)  
±128  
±100  
165  
Continuous current through VCC or GND  
DBV package  
DCK package  
DRL package  
DRY package  
YZP package  
259  
θJA  
Package thermal impedance(7)  
142 °C/W  
234  
123  
Tstg  
Storage temperature range  
–65  
150  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to ground unless otherwise specified.  
(3) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(4) This value is limited to 5.5 V maximum.  
(5) VI, VO, VA, and VBn are used to denote specific conditions for VI/O  
(6) II, IO, IA, and IBn are used to denote specific conditions for II/O  
(7) The package thermal impedance is calculated in accordance with JESD 51-7.  
.
.
2
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
Recommended Operating Conditions(1)  
MIN  
MAX UNIT  
VCC  
VI/O  
VIN  
1.65  
5.5  
VCC  
5.5  
V
V
V
0
0
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
V
CC × 0.75  
VIH  
VIL  
High-level input voltage, control input  
Low-level input voltage, control input  
V
V
V
CC × 0.7  
V
CC × 0.25  
V
CC × 0.3  
20  
20  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
10  
VCC = 4.5 V to 5.5 V  
10  
TA  
–40  
85  
°C  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
MIN TYP(1)  
MAX UNIT  
VI = 0 V  
IO = 4 mA  
11  
15  
8
20  
50  
12  
30  
1.65 V  
VI = 1.65 V IO = –4 mA  
VI = 0 V  
IO = 8 mA  
2.3 V  
3 V  
VI = 2.3 V  
VI = 0 V  
IO = –8 mA  
IO = 24 mA  
IO = –24 mA  
IO = 30 mA  
IO = –30 mA  
IO = –30 mA  
IA = –4 mA  
IA = –8 mA  
IA = –24 mA  
IA = –30 mA  
11  
7
See Figure 1 and  
Figure 2  
ron  
On-state switch resistance(2)  
9
20  
7
VI = 3 V  
9
VI = 0 V  
6
VI = 2.4 V  
VI = 4.5 V  
4.5 V  
7
12  
15  
140  
45  
18  
10  
7
1.65 V  
2.3 V  
3 V  
On-state switch resistance  
over signal range(2)(3)  
0 VBn VCC  
rrange  
(see Figure 1 and Figure 2)  
4.5 V  
VBn = 1.15  
V
IA = –4 mA  
1.65 V  
0.5  
Difference of on-state  
resistance between  
switches(2)(4)(5)  
VBn = 1.6 V IA = –8 mA  
VBn = 2.1 V IA = –24 mA  
2.3 V  
3 V  
0.1  
0.1  
ron  
See Figure 1  
VBn = 3.15  
IA = –30 mA  
V
4.5 V  
0.1  
IA = –4 mA  
IA = –8 mA  
IA = –24 mA  
IA = –30 mA  
1.65 V  
2.3 V  
3 V  
110  
26  
9
ron(flat)  
ON resistance flatness(2)(4)(6) 0 VBn VCC  
4.5 V  
4
(1) TA = 25°C  
(2) Measured by the voltage drop between I/O pins at the indicated current through the switch. ON resistance is determined by the lower of  
the voltages on the two (A or B) ports.  
(3) Specified by design  
(4) ron = ron(max) – ron(min) measured at identical VCC, temperature, and voltage levels  
(5) This parameter is characterized, but not tested in production.  
(6) Flatness is defined as the difference between the maximum and minimum values of ON resistance over the specified range of  
conditions.  
3
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
Electrical Characteristics (continued)  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
MIN TYP(1)  
MAX UNIT  
±1  
µA  
Off-state switch leakage  
current  
0 VI, VO VCC  
(see Figure 3 )  
1.65 V to  
5.5 V  
(7)  
Ioff  
±0.05  
±1(1)  
±1  
µA  
On-state switch leakage  
current  
VI = VCC or GND, VO = Open  
(see Figure 4)  
IS(on)  
5.5 V  
±0.1(1)  
±1  
µA  
0 V to  
5.5 V  
IIN  
Control input current  
0 VINVCC  
±0.05  
±1(1)  
ICC  
Supply current  
VIN = VCC or GND  
VIN = VCC – 0.6 V  
5.5 V  
5.5 V  
1
10  
µA  
µA  
ICC  
Supply-current change  
500  
Control input  
capacitance  
Cin  
S
5 V  
5 V  
2.7  
5.2  
pF  
pF  
Switch input/ouput  
capacitance  
Cio(off)  
Bn  
Bn  
A
17.3  
17.3  
Switch input/ouput  
capacitance  
Cio(on)  
5 V  
pF  
(7) Ioff is the same as IS(off) (off-state switch leakage current).  
4
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
Analog Switch Characteristics  
TA = 25°C  
FROM  
PARAMETER  
TO  
(OUTPUT)  
TEST CONDITIONS  
VCC  
TYP  
UNIT  
(INPUT)  
1.65 V  
2.3 V  
3 V  
300  
300  
300  
300  
–54  
–54  
–54  
–54  
–57  
–57  
–57  
–57  
3
Frequency  
RL = 50 ,  
fin = sine wave  
(see Figure 6 )  
response(1)  
(switch on)  
A or Bn  
Bn or A  
MHz  
4.5 V  
1.65 V  
2.3 V  
3 V  
Crosstalk(2)  
(between  
switches)  
RL = 50 ,  
fin = 10 MHz (sine wave)  
(see Figure 7 )  
B1 or B2  
B2 or B1  
dB  
4.5 V  
1.65 V  
2.3 V  
3 V  
Feed-through  
attenuation(2)  
(switch off)  
CL = 5 pF, RL = 50 ,  
fin = 10 MHz (sine wave)  
(see Figure 8 )  
A or Bn  
Bn or A  
dB  
pC  
%
4.5 V  
3.3 V  
5 V  
CL = 0.1 nF, RL = 1 MΩ  
(see Figure 9 )  
Charge injection(3)  
S
A
7
1.65 V  
2.3 V  
3 V  
0.1  
VI = 0.5 Vp-p, RL = 600 ,  
fin = 600 Hz to 20 kHz (sine wave)  
(see Figure 10 )  
0.025  
0.015  
0.01  
Total harmonic  
distortion  
A or Bn  
Bn or A  
4.5 V  
(1) Adjust fin voltage to obtain 0 dBm at output. Increase fin frequency until dB meter reads –3 dB.  
(2) Adjust fin voltage to obtain 0 dBm at input.  
(3) Specified by design  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5 and Figure 11)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN MAX  
MIN  
MAX  
(1)  
tpd  
A or Bn  
S
Bn or A  
Bn  
2
24  
13  
1.2  
14  
0.8  
0.3  
5.7  
3.8  
ns  
ns  
ns  
(2)  
ten  
7
3
3.5  
2
2.5  
1.5  
0.5  
7.6  
5.3  
1.7  
0.8  
0.5  
(3)  
tdis  
7.5  
(4)  
tB-M  
0.5  
0.5  
(1) tpd is the slower of tPLH or tPHL. The propagation delay is calculated RC time constant of the typical on-state resistance of the switch and  
the specified load capacitance when driven by an ideal voltage source (zero output impedance).  
(2) ten is the slower of tPZL or tPZH  
.
(3) tdis is the slower of tPLZ or tPHZ  
(4) Specified by design  
.
5
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION  
V V  
I
O
r
=
Ω
on  
IO  
Figure 1. On-State Resistance Test Circuit  
120  
100  
80  
60  
40  
20  
0
V
CC  
= 1.65 V  
V
CC  
= 2.3 V  
V
= 3 V  
CC  
V
CC  
= 4.5 V  
0
1
2
3
4
5
V - V  
I
Figure 2. Typical ron as a Function of Input Voltage (VI) for VI = 0 to VCC  
6
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
Figure 3. Off-State Switch Leakage-Current Test Circuit  
V
CC  
SW  
1
S
V
IL  
2
V
IH  
V
CC  
S
V
or V  
IH  
IL  
1
2
B1  
B2  
SW  
V
O
V
= Open  
O
A
V
A
or GND  
I
GND  
V = V  
CC  
I
Figure 4. On-State Switch Leakage-Current Test Circuit  
7
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
VLOAD  
Open  
S1  
RL  
From Output  
Under Test  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
GND  
Open  
VLOAD  
GND  
CL  
(see Note A)  
RL  
LOAD CIRCUIT  
INPUTS  
VCC  
VM  
VLOAD  
CL  
RL  
V
D
VI  
tr/tf  
VCC  
VCC  
VCC  
VCC  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
£2 ns  
£2 ns  
VCC/2  
VCC/2  
VCC/2  
VCC/2  
2 × VCC  
2 × VCC  
2 × VCC  
2 × VCC  
50 pF  
50 pF  
50 pF  
50 pF  
500 W  
0.3 V  
0.3 V  
0.3 V  
0.3 V  
500 W  
500 W  
500 W  
£2.5 ns  
£2.5 ns  
VI  
Timing Input  
Data Input  
VM  
0 V  
tW  
tsu  
th  
VI  
VI  
Input  
VM  
VM  
VM  
VM  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
VI  
VI  
Output  
Control  
VM  
VM  
Input  
VM  
VM  
0 V  
0 V  
tPZL  
tPLZ  
tPLH  
tPHL  
VM  
Output  
Waveform 1  
S1 at VLOAD  
VOH  
VOL  
VLOAD/2  
VM  
VM  
Output  
Output  
VOL + V  
D
VOL  
(see Note B)  
tPHL  
tPLH  
tPZH  
tPHZ  
VOH  
VOL  
Output  
Waveform 2  
S1 at GND  
VOH  
VOH – V  
D
VM  
VM  
VM  
»0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis.  
F. tPZL and tPZH are the same as ten.  
G. tPLH and tPHL are the same as tpd.  
H. All parameters and waveforms are not applicable to all devices.  
Figure 5. Load Circuit and Voltage Waveforms  
8
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
50  
R
= 50 Ω  
L
Figure 6. Frequency Response (Switch On)  
S
TEST CONDITION  
20log (V /V )  
V
V
V
IL  
10 O2 I  
CC  
20log (V /V )  
10 O1  
V
IH  
I
CC  
S
V
or V  
IH  
V
B1  
IL  
B1  
f
in  
V
B2  
A
Analyzer  
B2  
GND  
R
L
50  
R
= 50 Ω  
L
Figure 7. Crosstalk (Between Switches)  
9
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
50  
R
= 50 Ω  
L
Figure 8. Feedthrough  
V
CC  
CC  
V
S
1
2
B1  
B2  
LOGIC  
INPUT  
R
GEN  
SW  
V
GE  
A
V
OUT  
GND  
R /C = 1 M/100 pF  
L L  
R
L
C
L
LOGIC  
INPUT  
OFF  
ON  
OFF  
V  
OUT  
V
OUT  
Q = (V  
) (C )  
L
OUT  
Figure 9. Charge-Injection Test  
10  
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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
10 k  
600 Ω  
Figure 10. Total Harmonic Distortion  
V
CC  
CC  
V
S
B1  
B2  
V = V /2  
I CC  
V
O
A
GND  
V
V
S
R
L
C
L
R /C = 50 /35 pF  
L
L
O
0.9 x V  
O
t
D
Figure 11. Break-Before-Make Internal Timing  
11  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jan-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
74LVC1G3157DBVRE4  
74LVC1G3157DBVRG4  
74LVC1G3157DCKRE4  
74LVC1G3157DCKRG4  
74LVC1G3157DRLRG4  
74LVC1G3157DRYRG4  
SN74LVC1G3157DBVR  
SN74LVC1G3157DCKR  
SOT-23  
DBV  
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SC70  
SC70  
SOT  
DBV  
DCK  
DCK  
DRL  
DRY  
DBV  
DCK  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G3157DGVR  
SN74LVC1G3157DRLR  
PREVIEW  
ACTIVE  
SOT-23  
SOT  
DBV  
DRL  
6
6
TBD  
Call TI  
Call TI  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G3157DRYR  
SN74LVC1G3157YZPR  
ACTIVE  
ACTIVE  
SON  
DRY  
YZP  
6
6
5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jan-2009  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74LVC1G3157 :  
Automotive: SN74LVC1G3157-Q1  
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Sep-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LVC1G3157DBVR SOT-23  
DBV  
DCK  
DCK  
DRL  
DRY  
YZP  
6
6
6
6
6
6
3000  
3000  
3000  
4000  
5000  
3000  
180.0  
180.0  
180.0  
180.0  
179.0  
180.0  
9.2  
8.4  
9.2  
9.2  
8.4  
8.4  
3.23  
2.24  
2.24  
1.78  
1.2  
3.17  
2.34  
2.34  
1.78  
1.65  
1.52  
1.37  
1.22  
1.22  
0.69  
0.7  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
SN74LVC1G3157DCKR  
SN74LVC1G3157DCKR  
SN74LVC1G3157DRLR  
SN74LVC1G3157DRYR  
SC70  
SC70  
SOT  
SON  
SN74LVC1G3157YZPR DSBGA  
1.02  
0.63  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Sep-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVC1G3157DBVR  
SN74LVC1G3157DCKR  
SN74LVC1G3157DCKR  
SN74LVC1G3157DRLR  
SN74LVC1G3157DRYR  
SN74LVC1G3157YZPR  
SOT-23  
SC70  
SC70  
SOT  
DBV  
DCK  
DCK  
DRL  
DRY  
YZP  
6
6
6
6
6
6
3000  
3000  
3000  
4000  
5000  
3000  
202.0  
202.0  
205.0  
202.0  
220.0  
220.0  
201.0  
201.0  
200.0  
201.0  
205.0  
220.0  
28.0  
28.0  
33.0  
28.0  
50.0  
34.0  
SON  
DSBGA  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
Automotive  
www.ti.com/automotive  
www.ti.com/communications  
Communications and  
Telecom  
DSP  
dsp.ti.com  
Computers and  
Peripherals  
www.ti.com/computers  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Consumer Electronics  
Energy  
www.ti.com/consumer-apps  
www.ti.com/energy  
Logic  
Industrial  
www.ti.com/industrial  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Medical  
www.ti.com/medical  
microcontroller.ti.com  
www.ti-rfid.com  
Security  
www.ti.com/security  
Space, Avionics &  
Defense  
www.ti.com/space-avionics-defense  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2010, Texas Instruments Incorporated  

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