SN74LVC1G38DPWR [TI]

具有漏极开路输出的单路 2 输入、1.65V 至 5.5V 与非门 | DPW | 5 | -40 to 85;
SN74LVC1G38DPWR
型号: SN74LVC1G38DPWR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有漏极开路输出的单路 2 输入、1.65V 至 5.5V 与非门 | DPW | 5 | -40 to 85

栅 逻辑集成电路 栅极
文件: 总12页 (文件大小:261K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
5
4
A
B
V
Y
Supports 5-V VCC Operation  
CC  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.5 ns at 3.3 V  
GND  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Ioff Supports Partial-Power-Down Mode  
Operation  
3
2
1
4
5
GND  
B
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
A
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
The SN74LVC1G38 is designed for 1.65-V to 5.5-V VCC operation.  
This device is a single two-input NAND buffer gate with open-drain output. It performs the Boolean function  
Y = A B or Y = A + B in positive logic.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
NanoStar™ – WCSP (DSBGA)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
SN74LVC1G38YEPR  
0.23-mm Large Bump – YEP  
Reel of 3000  
_ _ _D7_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC1G38YZPR  
–40°C to 85°C  
Reel of 3000 SN74LVC1G38DBVR  
Reel of 250 SN74LVC1G38DBVT  
Reel of 3000 SN74LVC1G38DCKR  
Reel of 250 SN74LVC1G38DCKT  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
C38_  
D7_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
A
L
B
L
H
H
H
L
L
H
L
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
A
4
Y
2
B
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
6.5  
6.5  
V
VO  
IIK  
6.5  
V
Input clamp current  
VI < 0  
–50  
–50  
±50  
±100  
206  
252  
132  
150  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
DBV package  
θJA  
Package thermal impedance(3)  
DCK package  
°C/W  
°C  
YEP/YZP package  
Tstg  
Storage temperature range  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
2
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
Recommended Operating Conditions(1)  
MIN  
1.65  
MAX UNIT  
Operating  
5.5  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
1.5  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
V
2
0.7 × VCC  
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
V
0.8  
0.3 × VCC  
VI  
Input voltage  
0
0
5.5  
5.5  
4
V
V
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
8
IOL  
Low-level output current  
16  
24  
32  
20  
10  
5
mA  
VCC = 3 V  
VCC = 4.5 V  
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V  
VCC = 3.3 V ± 0.3 V  
VCC = 5 V ± 0.5 V  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
°C  
TA  
–40  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 5.5 V  
1.65 V  
MIN TYP(1) MAX  
UNIT  
IOL = 100 µA  
IOL = 4 mA  
IOL = 8 mA  
IOL = 16 mA  
IOL = 24 mA  
IOL = 32 mA  
0.1  
0.45  
0.3  
2.3 V  
VOL  
V
0.4  
3 V  
0.55  
0.55  
±1  
4.5 V  
1.65 V to 5.5 V  
0
II  
A or B inputs VI = 5.5 V or GND  
VI or VO = 5.5 V  
µA  
µA  
µA  
µA  
pF  
pF  
Ioff  
ICC  
ICC  
Ci  
±10  
10  
VI = 5.5 V or GND,  
IO = 0  
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
One input at VCC – 0.6 V,  
Other inputs at VCC or GND  
500  
3.5  
VI = VCC or GND  
VO = VCC or GND  
Co  
3.3 V  
4.5  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
Switching Characteristics  
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V  
± 0.15 V ± 0.2 V ± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN MAX MIN MAX MIN MAX MIN MAX  
2.9 7.4 1.7 3.8 1.5 4.9 0.9 2.4  
tpd  
A or B  
Y
ns  
3
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
Switching Characteristics  
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)  
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V  
± 0.15 V ± 0.2 V ± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN MAX MIN MAX MIN MAX MIN MAX  
2.8 10 1.6 1.4 4.5 3.9  
tpd  
A or B  
Y
6
1
ns  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V VCC = 2.5 V  
VCC = 3.3 V  
VCC = 5 V  
PARAMETER  
TEST CONDITIONS  
UNIT  
TYP  
TYP  
TYP  
TYP  
Cpd  
Power dissipation capacitance  
f = 10 MHz  
3
3
4
6
pF  
4
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
PARAMETER MEASUREMENT INFORMATION  
(OPEN DRAIN)  
V
LOAD  
S1  
Open  
R
L
TEST  
S1  
From Output  
Under Test  
GND  
t
(see Notes E and F)  
(see Notes E and G)  
V
V
V
PZL  
LOAD  
LOAD  
LOAD  
R
L
C
L
t
PLZ  
(see Note A)  
t
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUT  
V
M
V
LOAD  
C
L
V
R
L
V
CC  
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
1 M  
1 MΩ  
1 MΩ  
1MΩ  
0.15 V  
0.15 V  
0.3 V  
15 pF  
15 pF  
15 pF  
15 pF  
CC  
CC  
CC  
V
CC  
V
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
2 × V  
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
I
I
Output  
Control  
V
M
V
M
V
M
V
M
Input  
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
/2  
/2  
LOAD  
V
V
OH  
V
V
V
V
V
M
M
M
Output  
V
V
+ V  
OL  
S1 at V  
LOAD  
OL  
OL  
(see Note B)  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
V
LOAD  
V
V
OH  
- V  
LOAD/2  
M
V
M
M
Output  
S1 at V  
LOAD  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E. Since this device has open-drain outputs, t  
and t are the same as t .  
PZL pd  
PLZ  
F.  
G.  
t
t
is measured at V .  
M
is measured at V + V .  
OL  
PZL  
PLZ  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
SN74LVC1G38  
SINGLE 2-INPUT NAND GATE  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES538AJANUARY 2004REVISED APRIL 2005  
PARAMETER MEASUREMENT INFORMATION  
(OPEN DRAIN)  
V
LOAD  
S1  
Open  
R
L
TEST  
S1  
From Output  
Under Test  
GND  
t
(see Notes E and F)  
(see Notes E and G)  
V
V
V
PZL  
LOAD  
LOAD  
LOAD  
R
L
C
L
t
PLZ  
(see Note A)  
t
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUT  
V
M
V
LOAD  
C
L
V
R
L
V
CC  
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
1 k  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
30 pF  
30 pF  
50 pF  
50 pF  
CC  
CC  
CC  
V
CC  
V
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
2 × V  
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
I
I
Output  
Control  
V
M
V
M
V
M
V
M
Input  
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
/2  
/2  
LOAD  
V
V
OH  
V
V
V
V
V
M
M
M
Output  
V
V
+ V  
OL  
S1 at V  
LOAD  
OL  
OL  
(see Note B)  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
V
LOAD  
V
V
OH  
- V  
LOAD/2  
M
V
M
M
Output  
S1 at V  
LOAD  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E. Since this device has open-drain outputs, t  
and t are the same as t .  
PZL pd  
PLZ  
F.  
G.  
t
t
is measured at V .  
M
is measured at V + V .  
OL  
PZL  
PLZ  
H. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
6
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Apr-2005  
PACKAGING INFORMATION  
Orderable Device  
SN74LVC1G38DBVR  
SN74LVC1G38DBVT  
SN74LVC1G38DCKR  
SN74LVC1G38DCKT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
3000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-260C-UNLIM  
SOT-23  
SC70  
DBV  
DCK  
DCK  
250  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G38YEPR  
SN74LVC1G38YZPR  
ACTIVE  
ACTIVE  
WCSP  
WCSP  
YEP  
YZP  
5
5
3000  
3000  
TBD  
SNPB  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Pb-Free  
(RoHS)  
SNAGCU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002  
DCK (R-PDSO-G5)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,10  
0,65  
5
4
0,13 NOM  
1,40 2,40  
1,10 1,80  
1
3
Gage Plane  
2,15  
1,85  
0,15  
0°–8°  
0,46  
0,26  
Seating Plane  
0,10  
1,10  
0,80  
0,10  
0,00  
4093553-2/D 01/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion.  
D. Falls within JEDEC MO-203  
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