SN74LVC2244ANSRE4 [TI]

OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS; 八路缓冲器/驱动器,具有三态输出
SN74LVC2244ANSRE4
型号: SN74LVC2244ANSRE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
八路缓冲器/驱动器,具有三态输出

总线驱动器 总线收发器 逻辑集成电路 光电二极管 输出元件
文件: 总16页 (文件大小:534K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74LVC2244A  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS572KAPRIL 1996REVISED MARCH 2005  
FEATURES  
DB, DBQ, DGV, DW, NS, OR PW PACKAGE  
(TOP VIEW)  
Operates From 1.65 V to 3.6 V  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.5 ns at 3.3 V  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
Output Ports Have Equivalent 26-Series  
Resistors, So No External Resistors Are  
Required  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
Supports Mixed-Mode Signal Operation on All  
Ports (5-V Input/Output Voltage  
With 3.3-V VCC  
)
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This octal buffer/line driver is designed for 1.65-V to 3.6-V VCC operation.  
The SN74LVC2244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is  
low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
The outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and  
undershoot.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LVC2244ADW  
TOP-SIDE MARKING  
LVC2244A  
Tube of 25  
SOIC – DW  
Reel of 2000  
Reel of 2000  
Reel of 2000  
Reel of 2500  
Tube of 70  
SN74LVC2244ADWR  
SN74LVC2244ANSR  
SN74LVC2244ADBR  
SN74LVC2244ADBQR  
SN74LVC2244APW  
SN74LVC2244APWR  
SN74LVC2244APWT  
SN74LVC2244ADGVR  
SOP – NS  
LVC2244A  
LE244A  
SSOP – DB  
–40°C to 85°C  
SSOP (QSOP) – DBQ  
LVC2244A  
TSSOP – PW  
TVSOP – DGV  
Reel of 2000  
Reel of 250  
Reel of 2000  
LE244A  
LE244A  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1996–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC2244A  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS572KAPRIL 1996REVISED MARCH 2005  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in  
a mixed 3.3-V/5-V system environment.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
FUNCTION TABLE  
(EACH BUFFER)  
INPUTS  
OE  
OUTPUT  
Y
A
H
L
L
L
H
L
H
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
2
19  
1OE  
1A1  
2OE  
18  
16  
14  
12  
11  
13  
15  
17  
9
7
5
3
1Y1  
1Y2  
1Y3  
1Y4  
2A1  
2A2  
2A3  
2A4  
2Y1  
2Y2  
2Y3  
2Y4  
4
6
8
1A2  
1A3  
1A4  
2
SN74LVC2244A  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS572KAPRIL 1996REVISED MARCH 2005  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VO  
VO  
IIK  
6.5  
V
VCC + 0.5  
–50  
–50  
±50  
±100  
70  
V
Input clamp current  
VI < 0  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
DB package  
DBQ package  
DGV package  
DW package  
NS package  
PW package  
68  
92  
θJA  
Package thermal impedance(4)  
°C/W  
°C  
58  
60  
83  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
MIN  
MAX UNIT  
Operating  
1.65  
3.6  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
1.5  
0.65 × VCC  
VIH  
High-level input voltage  
1.7  
2
V
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
V
0.8  
5.5  
VCC  
5.5  
–2  
–4  
–8  
–12  
2
VI  
Input voltage  
0
0
0
V
V
High or low state  
3-state  
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
IOH  
High-level output current  
Low-level output current  
mA  
mA  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
4
IOL  
8
12  
10  
85  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
TA  
–40  
°C  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
SN74LVC2244A  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS572KAPRIL 1996REVISED MARCH 2005  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 3.6 V  
1.65 V  
2.3 V  
MIN TYP(1) MAX  
UNIT  
IOH = –100 µA  
VCC – 0.2  
IOH = –2 mA  
1.2  
1.7  
2.2  
2.4  
2
IOH = –4 mA  
VOH  
2.7 V  
V
IOH = –6 mA  
IOH = –8 mA  
IOH = –12 mA  
IOL = 100 µA  
IOL = 2 mA  
3 V  
2.7 V  
3 V  
2
1.65 V to 3.6 V  
1.65 V  
2.3 V  
0.2  
0.45  
0.7  
0.4  
0.55  
0.6  
0.8  
±5  
IOL = 4 mA  
VOL  
2.7 V  
V
IOL = 6 mA  
3 V  
IOL = 8 mA  
2.7 V  
IOL = 12 mA  
3 V  
II  
VI = 0 to 5.5 V  
VI or VO = 5.5 V  
VO = 0 to 5.5 V  
VI = VCC or GND  
3.6 V  
µA  
µA  
µA  
Ioff  
IOZ  
0
±10  
±10  
10  
3.6 V  
ICC  
IO = 0  
3.6 V  
µA  
3.6 V VI 5.5 V(2)  
10  
ICC  
Ci  
One input at VCC – 0.6 V, Other inputs at VCC or GND  
VI = VCC or GND  
2.7 V to 3.6 V  
3.3 V  
500  
µA  
pF  
pF  
4
Co  
VO = VCC or GND  
3.3 V  
5.5  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) This applies in the disabled state only.  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 2.7 V  
MIN MAX  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
1.5  
1
MAX  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
tpd  
ten  
tdis  
A
Y
Y
Y
6.4  
8.1  
7.3  
5.5  
7.1  
6.8  
ns  
ns  
ns  
(1)  
(1)  
(1)  
(1)  
OE  
OE  
1.5  
(1) This information was not available at the time of publication.  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
TYP  
TYP  
TYP  
46  
2
(1)  
(1)  
Outputs enabled  
Outputs disabled  
Power dissipation capacitance  
per buffer/driver  
Cpd  
f = 10 MHz  
pF  
(1)  
(1)  
(1) This information was not available at the time of publication.  
4
SN74LVC2244A  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS572KAPRIL 1996REVISED MARCH 2005  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
S1  
Open  
R
L
From Output  
Under Test  
TEST  
/t  
S1  
GND  
t
t
Open  
PLH PHL  
C
L
t
/t  
V
R
L
PLZ PZL  
LOAD  
GND  
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
LOAD  
C
L
R
L
V
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
2.7 V  
V
V
2.7 V  
2.7 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 k  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
V
CC  
CC  
CC  
1.5 V  
1.5 V  
3.3 V ± 0.3 V  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
OH  
V
V
/2  
LOAD  
V
V
V
M
M
Output  
V
V
M
S1 at V  
LOAD  
V
OL  
+ V  
OL  
(see Note B)  
OL  
t
PHL  
PLH  
t
t
PHZ  
PZH  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
− V  
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74LVC2244ADBLE  
SN74LVC2244ADBQR  
OBSOLETE  
ACTIVE  
SSOP  
DB  
20  
20  
TBD  
Call TI  
Call TI  
SSOP/  
QSOP  
DBQ  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SN74LVC2244ADBQRE4  
SN74LVC2244ADBQRG4  
SN74LVC2244ADBR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP/  
QSOP  
DBQ  
DBQ  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP  
SSOP  
TVSOP  
TVSOP  
TVSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244ADBRG4  
SN74LVC2244ADGVR  
SN74LVC2244ADGVRE4  
SN74LVC2244ADGVRG4  
SN74LVC2244ADW  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGV  
DGV  
DGV  
DW  
DW  
DW  
DW  
DW  
DW  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244ADWE4  
SN74LVC2244ADWG4  
SN74LVC2244ADWR  
SN74LVC2244ADWRE4  
SN74LVC2244ADWRG4  
SN74LVC2244ANSR  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244ANSRE4  
SN74LVC2244ANSRG4  
SN74LVC2244APW  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244APWE4  
SN74LVC2244APWG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244APWLE  
SN74LVC2244APWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2244APWRE4  
SN74LVC2244APWRG4  
SN74LVC2244APWT  
PW  
PW  
PW  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
SN74LVC2244APWTE4  
SN74LVC2244APWTG4  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
20  
20  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
SN74LVC2244ADBQR  
SSOP/  
QSOP  
DBQ  
20  
2500  
330.0  
16.4  
6.5  
9.0  
2.1  
8.0  
16.0  
Q1  
SN74LVC2244ADBR  
SN74LVC2244ADGVR  
SN74LVC2244ADWR  
SN74LVC2244APWR  
SSOP  
TVSOP  
SOIC  
DB  
DGV  
DW  
PW  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
16.4  
12.4  
24.4  
16.4  
8.2  
7.0  
7.5  
5.6  
2.5  
1.6  
2.7  
1.6  
12.0  
8.0  
16.0  
12.0  
24.0  
16.0  
Q1  
Q1  
Q1  
Q1  
10.8  
6.95  
13.0  
7.1  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVC2244ADBQR  
SN74LVC2244ADBR  
SN74LVC2244ADGVR  
SN74LVC2244ADWR  
SN74LVC2244APWR  
SSOP/QSOP  
SSOP  
DBQ  
DB  
20  
20  
20  
20  
20  
2500  
2000  
2000  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
29.0  
41.0  
33.0  
TVSOP  
SOIC  
DGV  
DW  
PW  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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