SN74LVC2G07DRYR [TI]

Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125;
SN74LVC2G07DRYR
型号: SN74LVC2G07DRYR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125

驱动器 输出元件
文件: 总13页 (文件大小:363K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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ꢊꢋꢌ ꢄ ꢍꢋꢎ ꢎ ꢏ ꢐꢑ ꢊꢐ ꢒ ꢅꢏ ꢐ  
ꢓ ꢒꢔ ꢕ ꢖ ꢗꢏꢁ ꢘꢊꢐꢌꢒ ꢁ ꢖ ꢋꢔ ꢗ ꢋꢔꢀ  
SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
D
Inputs and Open-Drain Outputs Accept  
Voltages Up To 5.5 V  
V
CC  
2Y  
D
D
D
D
D
D
D
D
Max t of 3.7 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
24-mA Output Drive at 3.3 V  
Typical V (Output Ground Bounce)  
OLP  
CC  
3 4  
2 5  
1 6  
2A  
GND  
1A  
2Y  
<0.8 V at V  
= 3.3 V, T = 25°C  
A
V
CC  
Typical V  
(Output V  
Undershoot)  
1Y  
OHV  
OH  
>2 V at V  
= 3.3 V, T = 25°C  
CC  
A
I
Supports Partial-Power-Down Mode  
off  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This dual buffer/driver is designed for 1.65-V to 5.5-V V  
operation. The output of the SN74LVC2G07 is open  
CC  
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high  
wired-AND functions. The maximum sink current is 32 mA.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC2G07YEAR  
SN74LVC2G07YZAR  
SN74LVC2G07YEPR  
SN74LVC2G07YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CV_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SOT (SOT-23) − DBV  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G07DBVR  
SN74LVC2G07DCKR  
SN74LVC2G07DCKT  
C07_  
CV_  
SOT (SC-70) − DCK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢔꢤ  
Copyright 2003, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢓꢒ ꢔꢕ ꢖꢗꢏ ꢁꢘꢊ ꢐ ꢌꢒ ꢁ ꢖ ꢋꢔꢗ ꢋꢔ ꢀ  
SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
description/ordering information (continued)  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
FUNCTION TABLE  
(each buffer/driver)  
INPUT  
A
OUTPUT  
Y
H
L
H
L
logic diagram (positive logic)  
1
3
6
4
1A  
2A  
1Y  
2Y  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
I
Voltage range applied to any output in the high-impedance or power-off state, V  
O
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
Voltage range applied to any output in the high or low state, V  
O
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Continuous output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Continuous current through V  
O
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
CC  
Package thermal impedance, θ (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165°C/W  
JA  
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259°C/W  
YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 143°C/W  
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 123°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The value of V is provided in the recommended operating conditions table.  
CC  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
recommended operating conditions (see Note 4)  
MIN  
1.65  
MAX  
UNIT  
Operating  
5.5  
V
Supply voltage  
V
CC  
IH  
Data retention only  
1.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.65 × V  
1.7  
CC  
V
High-level input voltage  
V
V
2
= 4.5 V to 5.5 V  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.7 × V  
CC  
0.35 × V  
0.7  
0.8  
0.3 × V  
5.5  
5.5  
4
CC  
V
IL  
Low-level input voltage  
= 4.5 V to 5.5 V  
CC  
V
V
Input voltage  
0
0
V
V
I
Output voltage  
O
V
V
= 1.65 V  
= 2.3 V  
CC  
8
CC  
16  
I
Low-level output current  
mA  
OL  
V
CC  
= 3 V  
24  
V
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
32  
= 1.8 V 0.15 V, 2.5 V 0.2 V  
= 3.3 V 0.3 V  
= 5 V 0.5 V  
20  
10  
t/v Input transition rise or fall rate  
ns/V  
5
T
A
Operating free-air temperature  
−40  
85  
°C  
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
TYP  
PARAMETER  
TEST CONDITIONS  
V
MIN  
MAX  
0.1  
UNIT  
CC  
I
I
I
I
I
= 100 mA  
= 4 mA  
1.65 V to 5.5 V  
1.65 V  
OL  
OL  
OL  
OL  
OL  
0.45  
0.3  
= 8 mA  
2.3 V  
V
V
OL  
= 16 mA  
= 24 mA  
0.4  
3 V  
0.55  
4.5 V  
0 to 5.5 V  
0
0.55  
5
I
= 32 mA  
OL  
I
I
I
A inputs  
V = 5.5 V or GND  
mA  
mA  
mA  
mA  
pF  
I
I
V or V = 5.5 V  
10  
off  
I
O
V = 5.5 V or GND,  
I = 0  
O
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
10  
CC  
I
I  
CC  
One input at V  
CC  
− 0.6 V,  
Other inputs at V  
CC  
or GND  
500  
C
V = V  
or GND  
= 3.3 V, T = 25°C.  
3.5  
i
I
CC  
All typical values are at V  
CC  
A
3
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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (see Figure 1)  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
V
= 5 V  
CC  
0.15 V  
CC  
0.2 V  
CC  
0.3 V  
CC  
0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1.5  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
2.9  
t
pd  
A
8.6  
1
4.4  
1
3.7  
1
ns  
Y
operating characteristics, T = 25°C  
A
V
CC  
= 1.8 V  
V
= 2.5 V  
V
CC  
= 3.3 V  
V
= 5 V  
CC  
TYP  
CC  
TYP  
PARAMETER  
TEST CONDITIONS  
f = 10 MHz  
UNIT  
TYP  
TYP  
C
Power dissipation capacitance  
3
3
4
4
pF  
pd  
4
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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
(OPEN DRAIN)  
V
LOAD  
Open  
GND  
S1  
R
L
TEST  
S1  
From Output  
Under Test  
t
(see Notes E and F)  
(see Notes E and G)  
V
V
V
PZL  
LOAD  
LOAD  
LOAD  
C
L
t
PLZ  
R
(see Note A)  
L
t
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUT  
t /t  
V
M
V
V
C
R
V
CC  
LOAD  
L
L
V
I
r f  
1.8 V 0.15 V  
2.5 V 0.2 V  
3.3 V 0.3 V  
5 V 0.5 V  
V
V
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
30 pF  
30 pF  
50 pF  
50 pF  
CC  
CC  
CC  
CC  
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
2 × V  
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
I
I
Output  
Control  
V
M
V
M
V
M
V
M
Input  
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
+ V  
PLH  
Output  
Waveform 1  
V
V
OH  
V
/2  
/2  
LOAD  
S1 at V  
(see Note B)  
V
V
V
V
V
M
LOAD  
M
M
V
V
OL  
Output  
V
OL  
OL  
t
t
t
PHZ  
PHL  
PLH  
PZH  
Output  
Waveform 2  
V
V
OH  
V
− VLOAD  
LOAD/2  
S1 at V  
(see Note B)  
V
M
M
M
LOAD  
Output  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time with one transition per measurement.  
E. Since this device has open-drain outputs, t  
and t  
PZL  
are the same as t .  
pd  
PLZ  
F.  
G.  
t
t
is measured at V  
.
M
PZL  
PLZ  
is measured at V  
+ V .  
OL  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
SN74LVC2G07DBVR  
SN74LVC2G07DBVRE4  
SN74LVC2G07DBVRG4  
SN74LVC2G07DCKR  
SN74LVC2G07DCKRE4  
SN74LVC2G07DCKRG4  
SN74LVC2G07DCKT  
SN74LVC2G07DCKTE4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DCK  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC2G07YEAR  
SN74LVC2G07YEPR  
SN74LVC2G07YZAR  
ACTIVE  
ACTIVE  
ACTIVE  
WCSP  
WCSP  
WCSP  
YEA  
YEP  
YZA  
6
6
6
3000  
3000  
3000  
TBD  
TBD  
SNPB  
SNPB  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Pb-Free  
(RoHS)  
SNAGCU  
SN74LVC2G07YZPR  
ACTIVE  
WCSP  
YZP  
6
3000  
Pb-Free  
(RoHS)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS114 – FEBRUARY 2002  
DCK (R-PDSO-G6)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,10  
0,65  
6
4
0,13 NOM  
1,40 2,40  
1,10 1,80  
1
3
Gage Plane  
2,15  
1,85  
0,15  
0°–8°  
0,46  
0,26  
Seating Plane  
0,10  
1,10  
0,80  
0,10  
0,00  
4093553-3/D 01/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion.  
D. Falls within JEDEC MO-203  
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