SN74LVC2G157BDCT [TI]

LVC/LCX/Z SERIES, 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO8;
SN74LVC2G157BDCT
型号: SN74LVC2G157BDCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LVC/LCX/Z SERIES, 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO8

复用器
文件: 总12页 (文件大小:393K)
中文:  中文翻译
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SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207KAPRIL 1999REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6 ns at 3.3 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
Y
A/B  
G
GND  
Y
B
A
B
Y
V
CC  
1
2
3
4
8
7
6
5
3 6  
1
2
8
7
A
B
V
CC  
G
A/B  
Y
2
7
A
1 8  
V
CC  
G
GND  
3
4
6
5
Y
A/B  
Y
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single 2-line to 1-line data selector/multiplexer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G157 features a common strobe (G) input. When the strobe is high, Y is low and Y is high.  
When the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The device  
provides true and complementary data.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC2G157YZPR  
_ _ _C3_  
C57_ _ _  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G157DCTR  
SN74LVC2G157DCUR  
SN74LVC2G157DCUT  
–40°C to 85°C  
VSSOP – DCU  
C57_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207KAPRIL 1999REVISED JANUARY 2007  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
G
H
L
A/B  
X
A
X
L
B
X
X
X
L
Y
L
Y
H
H
L
L
L
L
L
H
X
X
H
L
L
H
H
L
L
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
2
A
B
5
3
Y
Y
7
6
G
A/B  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX UNIT  
VCC Supply voltage range  
–0.5  
–0.5  
–0.5  
6.5  
6.5  
6.5  
V
V
VI  
Input voltage range(2)  
VO  
VO  
IIK  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–50  
–50  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
±50 mA  
±100 mA  
220  
DCT package  
DCU package  
YZP package  
θJA  
Package thermal impedance(4)  
227 °C/W  
102  
Tstg  
Storage temperature range  
–65  
150  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
2
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SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207KAPRIL 1999REVISED JANUARY 2007  
Recommended Operating Conditions(1)  
MIN  
1.65  
MAX UNIT  
Operating  
5.5  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
1.5  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
V
2
0.7 × VCC  
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
V
0.8  
0.3 × VCC  
5.5  
VCC  
–4  
VI  
Input voltage  
0
0
V
V
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
–8  
IOH  
High-level output current  
Low-level output current  
–16  
–24  
–32  
4
mA  
mA  
VCC = 3 V  
VCC = 4.5 V  
VCC = 1.65 V  
VCC = 2.3 V  
8
IOL  
16  
VCC = 3 V  
24  
VCC = 4.5 V  
32  
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V  
VCC = 3.3 V ± 0.3 V  
VCC = 5 V ± 0.5 V  
20  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
10  
ns/V  
°C  
5
TA  
–40  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
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SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207KAPRIL 1999REVISED JANUARY 2007  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 5.5 V  
1.65 V  
MIN TYP(1)  
VCC – 0.1  
MAX UNIT  
IOH = –100 µA  
IOH = –4 mA  
IOH = –8 mA  
IOH = –16 mA  
IOH = –24 mA  
IOH = –32 mA  
IOL = 100 µA  
IOL = 4 mA  
1.2  
1.9  
2.4  
2.3  
3.8  
2.3 V  
VOH  
V
3 V  
4.5 V  
1.65 V to 5.5 V  
1.65 V  
0.1  
0.45  
IOL = 8 mA  
2.3 V  
0.3  
V
VOL  
IOL = 16 mA  
IOL = 24 mA  
IOL = 32 mA  
0.4  
3 V  
0.55  
0.55  
4.5 V  
A, B, or  
control inputs  
II  
VI = 5.5 V or GND  
0 to 5.5 V  
±5  
µA  
Ioff  
VI or VO = 5.5 V  
0
±10  
10  
µA  
µA  
µA  
pF  
ICC  
VI = 5.5 V or GND,  
IO = 0  
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
ICC  
One input at VCC – 0.6 V, Other inputs at VCC or GND  
VI = VCC or GND  
500  
Ci  
5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
4.4  
4.9  
4.2  
MAX  
MIN  
2.1  
2.5  
2
MAX  
MIN MAX  
MIN  
1.4  
1.6  
1.3  
MAX  
A or B  
A/B  
G
14  
16  
14  
8
9
8
2
2.1  
1.6  
6
6
6
4
4
4
tpd  
Y or Y  
ns  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
TYP  
VCC = 2.5 V  
TYP  
VCC = 3.3 V  
TYP  
VCC = 5 V  
TYP  
PARAMETER  
TEST CONDITIONS  
UNIT  
Cpd  
Power dissipation capacitance  
f = 10 MHz  
35  
35  
37  
40  
pF  
4
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SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207KAPRIL 1999REVISED JANUARY 2007  
PARAMETER MEASUREMENT INFORMATION  
VLOAD  
Open  
GND  
S1  
RL  
From Output  
Under Test  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
Open  
VLOAD  
GND  
CL  
(see Note A)  
RL  
LOAD CIRCUIT  
INPUTS  
VCC  
VM  
VLOAD  
CL  
RL  
V
D
VI  
tr/tf  
VCC  
VCC  
3 V  
VCC  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
£2 ns  
£2 ns  
VCC/2  
VCC/2  
1.5 V  
VCC/2  
2 × VCC  
2 × VCC  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 kW  
0.15 V  
0.15 V  
0.3 V  
500 W  
500 W  
500 W  
£2.5 ns  
£2.5 ns  
2 × VCC  
0.3 V  
VI  
Timing Input  
Data Input  
VM  
0 V  
tW  
tsu  
th  
VI  
VI  
Input  
VM  
VM  
VM  
VM  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
VI  
VI  
Output  
Control  
VM  
VM  
Input  
VM  
VM  
0 V  
0 V  
tPZL  
tPLZ  
tPLH  
tPHL  
VM  
Output  
Waveform 1  
S1 at VLOAD  
VOH  
VOL  
VLOAD/2  
VOL  
VM  
VM  
Output  
Output  
VOL + V  
D
(see Note B)  
tPHL  
tPLH  
tPZH  
tPHZ  
VOH  
VOL  
Output  
Waveform 2  
S1 at GND  
VOH  
VOH – V  
D
VM  
VM  
VM  
»0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis.  
F. tPZL and tPZH are the same as ten.  
G. tPLH and tPHL are the same as tpd.  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
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PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2007  
PACKAGING INFORMATION  
Orderable Device  
74LVC2G157DCTRE4  
74LVC2G157DCURE4  
74LVC2G157DCURG4  
74LVC2G157DCUTE4  
74LVC2G157DCUTG4  
SN74LVC2G157DCTR  
SN74LVC2G157DCTRG4  
SN74LVC2G157DCUR  
SN74LVC2G157DCUT  
SN74LVC2G157YZPR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DCT  
8
8
8
8
8
8
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
US8  
DCU  
DCU  
DCU  
DCU  
DCT  
DCT  
DCU  
DCU  
YZP  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
SM8  
US8  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
WCSP  
3000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
22-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
180  
(mm)  
SN74LVC2G157DCUR  
SN74LVC2G157YZPR  
DCU  
YZP  
8
8
SITE 35  
SITE 12  
9
8
2.25  
1.1  
3.35  
2.1  
1.05  
0.56  
4
4
8
8
Q3  
Q1  
180  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
22-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74LVC2G157DCUR  
SN74LVC2G157YZPR  
DCU  
YZP  
8
8
SITE 35  
SITE 12  
202.0  
220.0  
201.0  
220.0  
28.0  
0.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
DCT (R-PDSO-G8)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,13  
0,65  
8
5
0,15 NOM  
2,90  
2,70  
4,25  
3,75  
Gage Plane  
PIN 1  
INDEX AREA  
0,25  
1
4
0° – 8°  
0,60  
0,20  
3,15  
2,75  
1,30 MAX  
Seating Plane  
0,10  
0,10  
0,00  
4188781/C 09/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion  
D. Falls within JEDEC MO-187 variation DA.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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