SN74LVC2G79 [TI]

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP; 双上升沿触发的D型触发器
SN74LVC2G79
型号: SN74LVC2G79
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
双上升沿触发的D型触发器

触发器
文件: 总13页 (文件大小:279K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
Supports 5-V V Operation  
D
D
D
D
D
D
CC  
1CLK  
1D  
2Q  
GND  
V
CC  
1Q  
2D  
2CLK  
1
2
3
4
8
7
6
5
Inputs Accept Voltages to 5.5 V  
Max t of 4.2 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
A
4 5  
3 6  
2 7  
1 8  
GND  
2Q  
1D  
2CLK  
2D  
1Q  
D
D
D
D
Typical V  
(Output V  
Undershoot)  
OHV  
OH  
>2 V at V  
= 3.3 V, T = 25°C  
CC  
A
I
Feature Supports Partial-Power-Down  
off  
1CLK  
V
CC  
Mode Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V  
operation.  
CC  
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on  
the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related  
to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without  
affecting the levels at the outputs.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC2G79YEPR  
SN74LVC2G79YZPR  
Tape and reel  
_ _ _CR_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
SSOP − DCT  
Tape and reel  
Tape and reel  
SN74LVC2G79DCTR  
SN74LVC2G79DCUR  
C79_ _ _  
C79_  
VSSOP − DCU  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢐꢡ  
Copyright 2003, Texas Instruments Incorporated  
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1
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
description/ordering information (continued)  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Q
CLK  
D
H
L
L
H
L
X
Q
0
logic diagram, each flip-flop (positive logic)  
C
CLK  
C
C
TG  
Q
C
C
C
C
TG  
TG  
TG  
D
C
C
C
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
I
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
OK  
O
Continuous output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Continuous current through V  
O
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
CC  
Package thermal impedance, θ (see Note 3): DCT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C/W  
JA  
DCU package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227°C/W  
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 102°C/W  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Storage temperature range, T  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The value of V is provided in the recommended operating conditions table.  
CC  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
recommended operating conditions (see Note 4)  
MIN  
1.65  
MAX  
UNIT  
Operating  
Data retention only  
5.5  
V
Supply voltage  
V
CC  
IH  
1.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.65 × V  
1.7  
CC  
V
High-level input voltage  
V
V
2
= 4.5 V to 5.5 V  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.7 × V  
CC  
0.35 × V  
0.7  
CC  
V
IL  
Low-level input voltage  
0.8  
= 4.5 V to 5.5 V  
0.3 × V  
5.5  
CC  
V
V
Input voltage  
0
0
V
V
I
Output voltage  
V
CC  
−4  
O
V
V
= 1.65 V  
= 2.3 V  
CC  
−8  
CC  
−16  
−24  
−32  
4
I
High-level output current  
Low-level output current  
mA  
mA  
OH  
OL  
V
= 3 V  
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
= 1.65 V  
= 2.3 V  
8
16  
24  
32  
20  
10  
5
I
V
CC  
= 3 V  
V
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
= 1.8 V 0.15 V, 2.5 V 0.2 V  
= 3.3 V 0.3 V  
= 5 V 0.5 V  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
T
−40  
85  
°C  
A
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
V
MIN  
V −0.1  
CC  
TYP  
MAX  
UNIT  
CC  
I
I
I
I
= −100 mA  
= −4 mA  
= −8 mA  
= −16 mA  
1.65 V to 5.5 V  
1.65 V  
OH  
OH  
OH  
OH  
1.2  
1.9  
2.4  
2.3 V  
V
V
OH  
3 V  
2.3  
3.8  
I
= −24 mA  
OH  
4.5 V  
1.65 V to 5.5 V  
1.65 V  
I
I
I
I
I
= −32 mA  
= 100 mA  
= 4 mA  
OH  
OL  
OL  
OL  
OL  
0.1  
0.45  
0.3  
= 8 mA  
2.3 V  
V
V
OL  
0.4  
= 16 mA  
3 V  
0.55  
I
I
= 24 mA  
= 32 mA  
OL  
OL  
4.5 V  
0 to 5.5 V  
0
0.55  
1
I
I
I
D input  
V = 5.5 V or GND  
mA  
mA  
mA  
mA  
pF  
I
I
V or V = 5.5 V  
1
off  
I
O
V = 5.5 V or GND,  
I = 0  
O
1.65 V to 5.5 V  
3 V to 5.5 V  
0
5
CC  
I
I  
CC  
One input at V  
CC  
− 0.6 V,  
Other inputs at V  
CC  
or GND  
500  
C
V = V  
or GND  
= 3.3 V, T = 25°C.  
3.5  
i
I
CC  
All typical values are at V  
CC  
A
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 2)  
V = 1.8 V  
CC  
0.15 V  
V = 2.5 V  
CC  
0.2 V  
V = 3.3 V  
CC  
0.3 V  
V = 5 V  
CC  
0.5 V  
UNIT  
MIN MAX  
160  
MIN MAX  
160  
MIN MAX  
160  
MIN  
MAX  
160  
f
t
Clock frequency  
MHz  
ns  
clock  
Pulse duration, CLK high or low  
2.5  
2.2  
2.2  
1.4  
2.5  
1.4  
1.4  
0.8  
2.5  
1.1  
1.1  
0.7  
2.5  
0.9  
0.9  
0.5  
w
Data high  
Data low  
Setup time  
before CLK↑  
t
t
ns  
ns  
su  
Hold time, data after CLK↑  
h
4
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
switching characteristics over recommended operating free-air temperature range, C = 15 pF  
L
(unless otherwise noted) (see Figure 1)  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
V
= 5 V  
CC  
0.15 V  
CC  
0.2 V  
CC  
0.3 V  
CC  
0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
160  
1.1  
MAX  
f
t
160  
3
160  
1.5  
160  
1.3  
MHz  
ns  
max  
CLK  
9.1  
6
4.2  
3.7  
Q
pd  
switching characteristics over recommended operating free-air temperature range, C = 30 pF or  
L
50 pF (unless otherwise noted) (see Figure 2)  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
V
= 5 V  
CC  
0.15 V  
CC  
0.2 V  
CC  
0.3 V  
CC  
0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
160  
1.3  
MAX  
f
t
160  
4.4  
160  
2.3  
160  
2
MHz  
ns  
max  
CLK  
9.9  
7
5.2  
4.5  
Q
pd  
operating characteristics, T = 25°C  
A
V
CC  
= 1.8 V  
V
= 2.5 V  
V
CC  
= 3.3 V  
V
= 5 V  
CC  
TYP  
23  
CC  
TYP  
28  
PARAMETER  
TEST CONDITIONS  
f = 10 MHz  
UNIT  
TYP  
TYP  
24  
C
Power dissipation capacitance  
23  
pF  
pd  
5
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
Open  
S1  
R
L
From Output  
Under Test  
TEST  
S1  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
L
t
V
R
PLZ PZL  
LOAD  
GND  
L
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
C
R
L
V
LOAD  
L
V
I
t /t  
r f  
1.8 V 0.15 V  
2.5 V 0.2 V  
3.3 V 0.3 V  
5 V 0.5 V  
V
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
2 × V  
CC  
15 pF  
15 pF  
15 pF  
15 pF  
1 MΩ  
1 MΩ  
1 MΩ  
1 MΩ  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
CC  
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
su  
h
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
V
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
+ V  
PLH  
PHL  
Output  
Waveform 1  
V
/2  
OH  
LOAD  
V
V
V
M
Output  
M
V
V
M
S1 at V  
(see Note B)  
V
LOAD  
OL  
V
OL  
V
OL  
t
PLH  
t
t
PZH  
PHZ  
− V  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
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SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
Open  
S1  
R
L
From Output  
Under Test  
TEST  
S1  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
L
t
V
R
PLZ PZL  
LOAD  
GND  
L
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
C
R
L
V
LOAD  
L
V
I
t /t  
r f  
1.8 V 0.15 V  
2.5 V 0.2 V  
3.3 V 0.3 V  
5 V 0.5 V  
V
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
CC  
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
11 V  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
su  
h
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
V
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
+ V  
PLH  
PHL  
Output  
Waveform 1  
V
/2  
OH  
LOAD  
V
V
V
M
Output  
M
V
V
M
S1 at V  
(see Note B)  
V
LOAD  
OL  
V
OL  
V
OL  
t
PLH  
t
t
PZH  
PHZ  
− V  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SM8  
US8  
Drawing  
SN74LVC2G79DCTR  
SN74LVC2G79DCUR  
ACTIVE  
ACTIVE  
DCT  
8
8
3000  
3000  
None  
CU SNPB  
Level-1-235C-UNLIM  
DCU  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-260C-UNLIM  
SN74LVC2G79YEPR  
SN74LVC2G79YZPR  
ACTIVE  
ACTIVE  
WCSP  
WCSP  
YEP  
YZP  
8
8
3000  
3000  
None  
SNPB  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Pb-Free  
(RoHS)  
SNAGCU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
DCT (R-PDSO-G8)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,13  
0,65  
8
5
0,15 NOM  
2,90  
2,70  
4,25  
3,75  
Gage Plane  
PIN 1  
INDEX AREA  
0,25  
1
4
0° – 8°  
0,60  
0,20  
3,15  
2,75  
1,30 MAX  
Seating Plane  
0,10  
0,10  
0,00  
4188781/C 09/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion  
D. Falls within JEDEC MO-187 variation DA.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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Copyright 2005, Texas Instruments Incorporated  

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