SN74LVC2G80DCURG4 [TI]
双路正边沿触发式 D 型触发器 | DCU | 8 | -40 to 125;型号: | SN74LVC2G80DCURG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 双路正边沿触发式 D 型触发器 | DCU | 8 | -40 to 125 触发器 锁存器 |
文件: | 总13页 (文件大小:276K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
•
•
•
•
•
Supports 5-V VCC Operation
1CLK
1D
2Q
GND
V
CC
1
2
3
4
8
7
6
5
1Q
2D
2CLK
Inputs Accept Voltages to 5.5 V
Max tpd of 4.2 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
•
•
•
•
Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
4
3
2
1
5
6
7
8
GND
2Q
2CLK
2D
Ioff Feature Supports Partial-Power-Down
Mode Operation
1D
1CLK
1Q
V
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
CC
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting
the levels at the outputs.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC2G80YEPR
Tape and reel
_ _ _CX_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC2G80YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel SN74LVC2G80DCTR
Tape and reel SN74LVC2G80DCUR
C80_ _ _
C80_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
FUNCTION TABLE
(EACH FLIP-FLOP)
INPUTS
CLK
OUTPUT
Q
D
H
L
↑
↑
L
L
H
X
Q 0
LOGIC DIAGRAM (POSITIVE LOGIC)
C
CLK
C
C
Q
TG
C
C
C
C
D
TG
TG
TG
C
C
C
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
MAX
6.5
UNIT
V
VCC Supply voltage range
VI
Input voltage range(2)
6.5
V
VO
IIK
IOK
IO
Output voltage range(2)(3)
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±50
±100
220
227
102
mA
mA
mA
mA
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
DCT package
θJA
Package thermal impedance(4)
DCU package
°C/W
YEP/YZP package
Tstg
Storage temperature range
–65
150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
Recommended Operating Conditions(1)
MIN
1.65
MAX UNIT
Operating
5.5
V
VCC
Supply voltage
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
0.65 × VCC
1.7
VIH
High-level input voltage
V
2
0.7 × VCC
0.35 × VCC
0.7
VIL
Low-level input voltage
V
0.8
0.3 × VCC
5.5
VCC
–4
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
–8
IOH
High-level output current
Low-level output current
–16
–24
–32
4
mA
mA
VCC = 3 V
VCC = 4.5 V
VCC = 1.65 V
VCC = 2.3 V
8
IOL
16
VCC = 3 V
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
20
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
10
ns/V
°C
5
TA
–40
85
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to 5.5 V
1.65 V
MIN TYP(1) MAX
VCC – 0.1
UNIT
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
IOH = –16 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 4 mA
1.2
1.9
2.4
2.3
3.8
2.3 V
VOH
V
3 V
4.5 V
1.65 V to 5.5 V
1.65 V
0.1
0.45
0.3
0.4
0.55
0.55
±1
IOL = 8 mA
2.3 V
VOL
V
IOL = 16 mA
3 V
IOL = 24 mA
IOL = 32 mA
4.5 V
0 to 5.5 V
0
II
D input
VI = 5.5 V or GND
VI or VO = 5.5 V
VI = 5.5 V or GND,
µA
µA
µA
µA
pF
Ioff
ICC
∆ICC
Ci
±1
IO = 0
1.65 V to 5.5 V
3 V to 5.5 V
0
5
One input at VCC – 0.6 V,
VI = VCC or GND
Other inputs at VCC or GND
500
3.5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5.5 V
± 0.5 V
UNIT
MIN
MAX
160
MIN
MAX
160
MIN
MAX
160
MIN
MAX
160
fclock
tw
Clock frequency
MHz
ns
Pulse duration, CLK high or low
2.5
2.2
2.2
1.6
2.5
1.4
1.4
1
2.5
1.1
1.1
0.8
2.5
0.9
0.9
0.6
Data high
Data low
tsu
th
Setup time before CLK↑
ns
ns
Hold time, data after CLK↑
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
160
3
MAX
MIN
160
1.5
MAX
MIN
160
1.3
MAX
MIN
MAX
fmax
tpd
160
1.1
MHz
ns
CLK
Q
9.1
6
4.2
3.8
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
160
3.8
MAX
MIN
160
1.5
MAX
MIN
160
1.4
MAX
MIN
160
0.9
MAX
fmax
tpd
MHz
ns
CLK
Q
13.9
7
5.2
4.5
4
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
Operating Characteristics
TA = 25°C
VCC = 1.8 V
TYP
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
VCC = 5 V
TYP
PARAMETER
TEST CONDITIONS
UNIT
Cpd
Power dissipation capacitance
f = 10 MHz
21
21
22
25
pF
5
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
R
L
PLZ PZL
LOAD
GND
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
V
V
3 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
V
/2
/2
2 × V
2 × V
6 V
2 × V
CC
15 pF
15 pF
15 pF
15 pF
1 MΩ
1 MΩ
1 MΩ
1 MΩ
0.15 V
0.15 V
0.3 V
CC
CC
CC
V
CC
CC
CC
1.5 V
/2
V
CC
V
CC
0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
OL
+ V
∆
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
R
L
PLZ PZL
LOAD
GND
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
V
V
3 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
V
/2
/2
2 × V
2 × V
6 V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
CC
CC
CC
V
CC
CC
CC
1.5 V
/2
V
CC
V
CC
11 V
0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
OL
+ V
∆
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2005
PACKAGING INFORMATION
Orderable Device
SN74LVC2G80DCTR
SN74LVC2G80DCUR
SN74LVC2G80DCURE4
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SM8
DCT
8
8
8
3000
3000
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
US8
US8
DCU
DCU
Pb-Free
(RoHS)
Pb-Free
(RoHS)
SN74LVC2G80YEPR
SN74LVC2G80YZPR
ACTIVE
ACTIVE
WCSP
WCSP
YEP
YZP
8
8
3000
3000
TBD
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Pb-Free
(RoHS)
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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