SN74LVC540APWG4 [TI]

LVC/LCX/Z SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, GREEN, PLASTIC, TSSOP-20;
SN74LVC540APWG4
型号: SN74LVC540APWG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LVC/LCX/Z SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, GREEN, PLASTIC, TSSOP-20

驱动 光电二极管 输出元件 逻辑集成电路
文件: 总22页 (文件大小:1061K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
FEATURES  
SN54LVC540A . . . J OR W PACKAGE  
SN74LVC540A . . . DB, DGV, DW, NS, OR PW PACKAGE  
(TOP VIEW)  
Operate From 1.65 V to 3.6 V  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.3 ns at 3.3 V  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE1  
A1  
V
CC  
Typical VOLP (Output Ground Bounce) < 0.8 V  
at VCC = 3.3 V, TA = 25°C  
OE2  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
A2  
A3  
A4  
A5  
Typical VOHV (Output VOH Undershoot) > 2 V at  
VCC = 3.3 V, TA = 25°C  
Support Mixed-Mode Signal Operation on All  
Ports (5-V Input/Output Voltage With 3.3-V  
A6  
A7  
A8  
GND  
VCC  
)
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
SN54LVC540A . . . FK PACKAGE  
(TOP VIEW)  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 1000-V Charged-Device Model (C101)  
3
9
2
1
20 19  
18  
Y1  
Y2  
Y3  
Y4  
Y5  
A3  
A4  
A5  
A6  
A7  
4
5
6
7
8
DESCRIPTION/ORDERING INFORMATION  
17  
16  
15  
14  
The SN54LVC540A octal buffer/driver is designed for  
2.7-V to 3.6-V VCC operation, and the SN74LVC540A  
octal buffer/driver is designed for 1.65-V to 3.6-V VCC  
operation.  
10 11 12 13  
These devices are ideal for driving bus lines or buffer  
memory address registers. These devices feature  
inputs and outputs on opposite sides of the package  
that facilitate printed circuit board layout.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LVC540ADW  
TOP-SIDE MARKING  
LVC540A  
Tube of 25  
SOIC – DW  
Reel of 2000  
Reel of 2000  
Reel of 2000  
Tube of 70  
Reel of 2000  
Reel of 250  
Reel of 2000  
Tube of 20  
Tube of 85  
Tube of 55  
SN74LVC540ADWR  
SN74LVC540ANSR  
SN74LVC540ADBR  
SN74LVC540APW  
SOP – NS  
LVC540A  
LC540A  
SSOP – DB  
–40°C to 85°C  
TSSOP – PW  
SN74LVC540APWR  
SN74LVC540APWT  
SN74LVC540ADGVR  
SNJ54LVC540AJ  
LC540A  
TVSOP – DGV  
CDIP – J  
LC540A  
SNJ54LVC540AJ  
SNJ54LVC540AW  
SNJ54LVC540AFK  
–55°C to 125°C  
CFP – W  
SNJ54LVC540AW  
LCCC – FK  
SNJ54LVC540AFK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1993–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
On products compliant to MIL-PRF-38535, all parameters are  
Instruments standard warranty. Production processing does not  
tested unless otherwise noted. On all other products, production  
necessarily include testing of all parameters.  
processing does not necessarily include testing of all parameters.  
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output-enable (OE1 or OE2)  
input is high, all outputs are in the high-impedance state.  
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators  
in a mixed 3.3-V/5-V system environment.  
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the  
outputs, preventing damaging current backflow through the devices when they are powered down.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
OE1  
L
OE2  
L
A
L
H
L
L
L
H
X
X
H
X
Z
Z
X
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
OE1  
19  
OE2  
2
18  
A1  
Y1  
To Seven Other Channels  
2
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VO  
VO  
IIK  
6.5  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–50  
–50  
±50  
±100  
70  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
DB package  
DGV package  
DW package  
NS package  
PW package  
92  
θJA  
Package thermal impedance(4)  
58  
°C/W  
°C  
60  
83  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
SN54LVC540A  
SN74LVC540A  
UNIT  
MIN  
2
MAX  
MIN  
1.65  
1.5  
MAX  
Operating  
3.6  
3.6  
VCC  
Supply voltage  
V
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
1.5  
0.65 × VCC  
VIH  
High-level input voltage  
1.7  
2
V
V
2
0.35 × VCC  
VIL  
Low-level input voltage  
0.7  
0.8  
5.5  
VCC  
5.5  
–4  
0.8  
5.5  
VI  
Input voltage  
0
0
0
0
0
0
V
V
High or low state  
3-state  
VCC  
5.5  
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
–8  
IOH  
High-level output current  
mA  
–12  
–24  
–12  
–24  
4
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
8
IOL  
Low-level output current  
mA  
°C  
12  
24  
12  
24  
TA  
Operating free-air temperature  
–55  
125  
–40  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
SN54LVC540A  
MIN TYP(1) MAX  
SN74LVC540A  
MIN TYP(1) MAX  
VCC – 0.2  
PARAMETER  
TEST CONDITIONS  
VCC  
UNIT  
1.65 V to 3.6 V  
2.7 V to 3.6 V  
1.65 V  
2.3 V  
IOH = –100 µA  
VCC – 0.2  
IOH = –4 mA  
IOH = –8 mA  
1.2  
1.7  
2.2  
2.4  
2.2  
VOH  
V
2.7 V  
2.2  
2.4  
2.2  
IOH = –12 mA  
IOH = –24 mA  
IOL = 100 µA  
3 V  
3 V  
1.65 V to 3.6 V  
2.7 V to 3.6 V  
1.65 V  
2.3 V  
0.2  
0.2  
IOL = 4 mA  
0.45  
0.7  
0.4  
0.55  
±5  
VOL  
V
IOL = 8 mA  
IOL = 12 mA  
2.7 V  
0.4  
0.55  
±5  
IOL = 24 mA  
3 V  
II  
VI = 0 to 5.5 V  
VI or VO = 5.5 V  
VO = 0 to 5.5 V  
VI = VCC or GND  
3.6 V VI 5.5 V(2)  
One input at VCC – 0.6 V,  
3.6 V  
µA  
µA  
µA  
Ioff  
IOZ  
0
±10  
±10  
10  
3.6 V  
±15  
10  
ICC  
IO = 0  
3.6 V  
µA  
µA  
10  
10  
ICC  
2.7 V to 3.6 V  
500  
500  
Other inputs at VCC or GND  
Ci  
VI = VCC or GND  
3.3 V  
3.3 V  
4
4
pF  
pF  
Co  
VO = VCC or GND  
5.5  
5.5  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) This applies in the disabled state only.  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
SN54LVC540A  
VCC = 3.3 V  
± 0.3 V  
MIN MAX  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC = 2.7 V  
UNIT  
MIN  
MAX  
tpd  
ten  
tdis  
A
Y
Y
Y
7.1  
8
1
1
1
5.3  
6.6  
7.4  
ns  
ns  
ns  
OE  
OE  
8.2  
4
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
SN74LVC540A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
PARAMETER  
VCC = 2.7 V  
UNIT  
MIN  
1
MAX  
MIN  
1
MAX  
MIN  
1
MAX  
MIN  
1.4  
1.1  
1.8  
MAX  
tpd  
ten  
A
Y
Y
Y
16.4  
16.5  
15.9  
7.8  
10.5  
9
7.1  
8
5.3  
6.6  
7.4  
1
ns  
ns  
ns  
ns  
OE  
OE  
1
1
1
tdis  
1
1
1
8.2  
tsk(o)  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
TYP  
63  
3
TYP  
56  
3
TYP  
31  
3
Outputs enabled  
Outputs disabled  
Power dissipation capacitance per  
Cpd  
f = 10 MHz  
pF  
buffer/driver  
5
SN54LVC540A, SN74LVC540A  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS297MJANUARY 1993REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
S1  
Open  
R
L
From Output  
Under Test  
TEST  
/t  
S1  
GND  
t
t
Open  
PLH PHL  
C
L
t
/t  
V
R
L
PLZ PZL  
LOAD  
GND  
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
LOAD  
C
L
R
L
V
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
2.7 V  
V
V
2.7 V  
2.7 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 k  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
V
CC  
CC  
CC  
1.5 V  
1.5 V  
3.3 V ± 0.3 V  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
OH  
V
V
/2  
LOAD  
V
V
V
M
M
Output  
V
V
M
S1 at V  
LOAD  
V
OL  
+ V  
OL  
(see Note B)  
OL  
t
PHL  
PLH  
t
t
PHZ  
PZH  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
− V  
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
5962-9759401Q2A  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
5962-  
9759401Q2A  
SNJ54LVC  
540AFK  
5962-9759401QRA  
5962-9759401QSA  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
5962-9759401QR  
A
SNJ54LVC540AJ  
W
Call TI  
5962-9759401QS  
A
SNJ54LVC540AW  
SN74LVC540ADBLE  
SN74LVC540ADBR  
OBSOLETE  
ACTIVE  
SSOP  
SSOP  
DB  
DB  
20  
20  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
2000  
2000  
2000  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
LC540A  
LC540A  
LC540A  
LC540A  
LC540A  
LC540A  
LVC540A  
LVC540A  
LVC540A  
LVC540A  
LVC540A  
LVC540A  
SN74LVC540ADBRE4  
SN74LVC540ADBRG4  
SN74LVC540ADGVR  
SN74LVC540ADGVRE4  
SN74LVC540ADGVRG4  
SN74LVC540ADW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
TVSOP  
TVSOP  
TVSOP  
SOIC  
DB  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Green (RoHS  
& no Sb/Br)  
DGV  
DGV  
DGV  
DW  
DW  
DW  
DW  
DW  
DW  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SN74LVC540ADWE4  
SN74LVC540ADWG4  
SN74LVC540ADWR  
SN74LVC540ADWRE4  
SN74LVC540ADWRG4  
SOIC  
25  
Green (RoHS  
& no Sb/Br)  
SOIC  
25  
Green (RoHS  
& no Sb/Br)  
SOIC  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
SOIC  
Green (RoHS  
& no Sb/Br)  
SOIC  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
SN74LVC540ANSR  
SN74LVC540ANSRE4  
SN74LVC540ANSRG4  
SN74LVC540APW  
ACTIVE  
SO  
SO  
NS  
20  
20  
20  
20  
20  
20  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
LVC540A  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NS  
NS  
2000  
2000  
70  
Green (RoHS  
& no Sb/Br)  
LVC540A  
LVC540A  
LC540A  
LC540A  
LC540A  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
SN74LVC540APWE4  
SN74LVC540APWG4  
70  
Green (RoHS  
& no Sb/Br)  
70  
Green (RoHS  
& no Sb/Br)  
SN74LVC540APWLE  
SN74LVC540APWR  
OBSOLETE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
2000  
2000  
2000  
250  
250  
250  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
LC540A  
LC540A  
LC540A  
LC540A  
LC540A  
LC540A  
SN74LVC540APWRE4  
SN74LVC540APWRG4  
SN74LVC540APWT  
SN74LVC540APWTE4  
SN74LVC540APWTG4  
SNJ54LVC540AFK  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
LCCC  
PW  
PW  
PW  
PW  
PW  
FK  
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-55 to 125  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TBD  
5962-  
9759401Q2A  
SNJ54LVC  
540AFK  
SNJ54LVC540AJ  
SNJ54LVC540AW  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
5962-9759401QR  
A
SNJ54LVC540AJ  
W
Call TI  
5962-9759401QS  
A
SNJ54LVC540AW  
(1) The marketing status values are defined as follows:  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54LVC540A, SN74LVC540A :  
Catalog: SN74LVC540A  
Automotive: SN74LVC540A-Q1, SN74LVC540A-Q1  
Enhanced Product: SN74LVC540A-EP, SN74LVC540A-EP  
Military: SN54LVC540A  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
Military - QML certified for Military and Defense Applications  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LVC540ADBR  
SN74LVC540ADGVR  
SN74LVC540ADWR  
SN74LVC540ANSR  
SN74LVC540APWR  
SN74LVC540APWT  
SSOP  
TVSOP  
SOIC  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
2000  
250  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
12.4  
24.4  
24.4  
16.4  
16.4  
8.2  
6.9  
7.5  
5.6  
2.5  
1.6  
2.7  
2.5  
1.6  
1.6  
12.0  
8.0  
16.0  
12.0  
24.0  
24.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
10.8  
8.2  
13.0  
13.0  
7.1  
12.0  
12.0  
8.0  
SO  
TSSOP  
TSSOP  
PW  
PW  
6.95  
6.95  
7.1  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVC540ADBR  
SN74LVC540ADGVR  
SN74LVC540ADWR  
SN74LVC540ANSR  
SN74LVC540APWR  
SN74LVC540APWT  
SSOP  
TVSOP  
SOIC  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
2000  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
35.0  
45.0  
45.0  
38.0  
38.0  
SO  
TSSOP  
TSSOP  
PW  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
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www.ti.com/space-avionics-defense  
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OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

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