SN74LVT245BDBRG4 [TI]

3.3-V ABT OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS; 具有三态输出的3.3V ABT八路总线收发器
SN74LVT245BDBRG4
型号: SN74LVT245BDBRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3.3-V ABT OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS
具有三态输出的3.3V ABT八路总线收发器

总线收发器 输出元件
文件: 总19页 (文件大小:780K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74LVT245B  
3.3-V ABT OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003  
D
Supports Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
D
D
D
I
and Power-Up 3-State Support Hot  
off  
Insertion  
3.3-V V  
)
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
D
D
Supports Unregulated Battery Operation  
Down to 2.7 V  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
Typical V  
(Output Ground Bounce)  
OLP  
<0.8 V at V = 3.3 V, T = 25°C  
CC  
A
− 1000-V Charged-Device Model (C101)  
DB, DW, NS, OR PW PACKAGE  
(TOP VIEW)  
RGY PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
DIR  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
VCC  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
2
3
4
5
6
7
8
9
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
GND  
10  
11  
description/ordering information  
This octal bus transceiver is designed specifically for low-voltage (3.3-V) V operation, but with the capability  
CC  
to provide a TTL interface to a 5-V system environment.  
The SN74LVT245B is designed for asynchronous communication between data buses. The device transmits  
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the  
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are  
effectively isolated.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
QFN − RGY  
SOIC − DW  
Tape and reel  
Tube  
SN74LVT245BRGYR  
SN74LVT245BDW  
SN74LVT245BDWR  
SN74LVT245BNSR  
SN74LVT245BDBR  
SN74LVT245BPW  
SN74LVT245BPWR  
SN74LVT245BGQNR  
SN74LVT245BZQNR  
LX245B  
LVT245B  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
SOP − NS  
LVT245B  
LX245B  
SSOP − DB  
−40°C to 85°C  
TSSOP − PW  
LX245B  
LX245B  
Tape and reel  
VFBGA − GQN  
Tape and reel  
VFBGA − ZQN (Pb-free)  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright © 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74LVT245B  
3.3-V ABT OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003  
description/ordering information (continued)  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the device when it is powered down. The  
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
GQN OR ZQN PACKAGE  
(TOP VIEW)  
terminal assignments  
1
2
3
4
1
A1  
2
3
4
A
B
C
D
E
A
B
C
D
E
DIR  
B2  
A4  
B6  
A8  
V
OE  
B1  
B3  
B5  
B7  
CC  
A3  
A2  
A5  
B4  
A6  
B8  
A7  
GND  
FUNCTION TABLE  
INPUTS  
OPERATION  
OE  
L
DIR  
L
B data to A bus  
A data to B bus  
Isolation  
L
H
H
X
logic diagram (positive logic)  
1
2
DIR  
19  
18  
OE  
A1  
B1  
To Seven Other Channels  
Pin numbers shown are for the DB, DW, NS, PW, and RGY packages.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74LVT245B  
3.3-V ABT OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V + 0.5 V  
O
CC  
Current into any output in the low state, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
O
Current into any output in the high state, I (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA  
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
I
Output clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
OK  
O
Package thermal impedance, θ (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
JA  
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
(see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W  
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. This current flows only when the output is in the high state and V > V  
.
CC  
O
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
4. The package thermal impedance is calculated in accordance with JESD 51-5.  
recommended operating conditions (see Note 5)  
MIN  
2.7  
2
MAX  
UNIT  
V
V
V
V
V
Supply voltage  
3.6  
CC  
IH  
IL  
I
High-level input voltage  
Low-level input voltage  
Input voltage  
V
0.8  
5.5  
−32  
64  
V
V
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Power-up ramp rate  
mA  
mA  
ns/V  
μs/V  
°C  
OH  
OL  
Δt/Δv  
Δt/ΔV  
Outputs enabled  
10  
200  
−40  
CC  
T
A
Operating free-air temperature  
85  
NOTE 5: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74LVT245B  
3.3-V ABT OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
V
V
V
V
= 2.7 V,  
I = −18 mA  
−1.2  
V
IK  
CC  
CC  
CC  
CC  
I
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
= −100 μA  
= −8 mA  
= −32 mA  
= 100 μA  
= 24 mA  
= 16 mA  
= 32 mA  
= 64 mA  
V
−0.2  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
2.4  
V
OH  
V
V
= 3 V,  
2
0.2  
0.5  
0.4  
0.5  
0.55  
1
V
V
= 2.7 V  
CC  
V
OL  
= 3 V  
CC  
V
V
= 3.6 V,  
V = V or GND  
I CC  
CC  
Control inputs  
= 0 or 3.6 V,  
V = 5.5 V  
I
10  
CC  
V = 5.5 V  
I
20  
I
I
μA  
V = V  
1
V
CC  
= 3.6 V  
A or B ports  
I
CC  
V = 0  
I
−5  
I
V
V
V
V
= 0,  
V or V = 0 to 4.5 V  
100  
5
μA  
μA  
μA  
μA  
off  
CC  
CC  
CC  
CC  
I
O
I
I
I
= 3.6 V,  
= 3.6 V,  
V
= 3 V  
OZH  
OZL  
O
O
V
= 0.5 V  
−5  
= 0 to 1.5 V, V = 0.5 V to 3 V, OE = don’t care  
100  
O
OZPU  
OZPD  
V
CC  
= 1.5 V to 0, V = 0.5 V to 3 V, OE = don’t care  
100  
0.19  
5
μA  
I
O
Outputs high  
= 3.6 V,  
= 0,  
V
I
CC  
Outputs low  
I
mA  
O
CC  
V = V or GND  
I
CC  
Outputs disabled  
0.19  
V
= 3 V to 3.6 V, One input at V − 0.6 V,  
CC  
CC  
§
0.2  
mA  
ΔI  
CC  
Other inputs at V or GND  
CC  
C
C
V = 3 V or 0  
4
pF  
pF  
i
I
V
O
= 3 V or 0  
9
io  
§
All typical values are at V = 3.3 V, T = 25°C.  
CC  
A
Unused terminals are at V or GND.  
CC  
This is the increase in supply current for each input that is at the specified TTL-voltage level, rather than V or GND.  
CC  
switching characteristics over recommended operating free-air temperature range, CL = 50 pF  
(unless otherwise noted) (see Figure 1)  
V
= 3.3 V  
0.3 V  
CC  
V
= 2.7 V  
CC  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN TYP  
MAX  
3.5  
3.5  
5.5  
5.5  
5.9  
5
MIN  
MAX  
t
t
t
t
t
t
1.2  
1.2  
1.3  
1.7  
2.2  
2.2  
2.3  
4
4
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A or B  
OE  
B or A  
A or B  
A or B  
ns  
ns  
ns  
2.1  
3.2  
3.4  
3.5  
3.4  
7.1  
6.5  
6.5  
5.1  
OE  
All typical values are at V = 3.3 V, T = 25°C.  
CC  
A
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74LVT245B  
3.3-V ABT OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
6 V  
Open  
GND  
TEST  
/t  
S1  
S1  
500 Ω  
From Output  
Under Test  
t
t
Open  
6 V  
PLH PHL  
/t  
PLZ PZL  
C = 50 pF  
(see Note A)  
t
/t  
GND  
L
PHZ PZH  
500 Ω  
2.7 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
2.7 V  
2.7 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
PLZ  
PZL  
t
t
t
PHL  
PLH  
PHL  
Output  
Waveform 1  
S1 at 6 V  
3 V  
V
V
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
t
Output  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
t
PZH  
PHZ  
PLH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 Ω, t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
E. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Dec-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SSOP  
SSOP  
Drawing  
SN74LVT245BDBLE  
SN74LVT245BDBR  
OBSOLETE  
ACTIVE  
DB  
20  
20  
TBD  
Call TI  
Call TI  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVT245BDBRE4  
SN74LVT245BDBRG4  
SN74LVT245BDW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
DB  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
DW  
GQN  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVT245BDWE4  
SN74LVT245BDWG4  
SN74LVT245BDWR  
SN74LVT245BDWRE4  
SN74LVT245BDWRG4  
SN74LVT245BGQNR  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BGA MI  
CROSTA  
R JUNI  
OR  
1000  
TBD  
SNPB  
Level-1-240C-UNLIM  
SN74LVT245BNSR  
SN74LVT245BNSRE4  
SN74LVT245BNSRG4  
SN74LVT245BPW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
NS  
PW  
PW  
PW  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVT245BPWE4  
SN74LVT245BPWG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVT245BPWLE  
SN74LVT245BPWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
VQFN  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVT245BPWRE4  
SN74LVT245BPWRG4  
SN74LVT245BRGYR  
SN74LVT245BRGYRG4  
SN74LVT245BZQNR  
PW  
PW  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
RGY  
RGY  
ZQN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
VQFN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BGA MI  
CROSTA  
R JUNI  
OR  
1000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Dec-2009  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LVT245BDBR  
SN74LVT245BDWR  
SN74LVT245BGQNR  
SSOP  
SOIC  
DB  
DW  
20  
20  
20  
2000  
2000  
1000  
330.0  
330.0  
330.0  
16.4  
24.4  
12.4  
8.2  
10.8  
3.3  
7.5  
13.0  
4.3  
2.5  
2.7  
1.5  
12.0  
12.0  
8.0  
16.0  
24.0  
12.0  
Q1  
Q1  
Q1  
BGA MI  
CROSTA  
R JUNI  
OR  
GQN  
SN74LVT245BNSR  
SN74LVT245BPWR  
SN74LVT245BRGYR  
SN74LVT245BZQNR  
SO  
NS  
PW  
20  
20  
20  
20  
2000  
2000  
3000  
1000  
330.0  
330.0  
330.0  
330.0  
24.4  
16.4  
12.4  
12.4  
8.2  
6.95  
3.8  
13.0  
7.1  
4.8  
4.3  
2.5  
1.6  
1.6  
1.5  
12.0  
8.0  
8.0  
8.0  
24.0  
16.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
TSSOP  
VQFN  
RGY  
ZQN  
BGA MI  
CROSTA  
R JUNI  
OR  
3.3  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVT245BDBR  
SN74LVT245BDWR  
SN74LVT245BGQNR  
SSOP  
SOIC  
DB  
DW  
20  
20  
20  
2000  
2000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
41.0  
29.0  
BGA MICROSTAR  
JUNIOR  
GQN  
SN74LVT245BNSR  
SN74LVT245BPWR  
SN74LVT245BRGYR  
SN74LVT245BZQNR  
SO  
NS  
PW  
20  
20  
20  
20  
2000  
2000  
3000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
33.0  
29.0  
29.0  
TSSOP  
VQFN  
RGY  
ZQN  
BGA MICROSTAR  
JUNIOR  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
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