SN74LVTH125DBRG4_技术文档

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SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

D

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V V

D

Bus Hold on Data Inputs Eliminates the

Need for External Pullup/Pulldown

Resistors

)

CC

Support Unregulated Battery Operation

Down to 2.7 V

D

Latch-Up Performance Exceeds 500 mA Per

JESD 17

Typical V

<0.8 V at V

(Output Ground Bounce)

OLP

CC

= 3.3 V, T = 25°C

ESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

A

I

and Power-Up 3-State Support Hot

off

Insertion

SN74LVTH125 . . . RGY PACKAGE

(TOP VIEW)

SN54LVTH125 . . . FK PACKAGE

(TOP VIEW)

SN54LVTH125 . . . J OR W PACKAGE

SN74LVTH125 . . . D, DB, DGV, NS,

OR PW PACKAGE

(TOP VIEW)

1

14

1

2

3

4

5

6

7

14

13

12

11

10

9

1OE

1A

1Y

2OE

2A

2Y

V

CC

4OE

3

2

1

20 19

18 4A

1A

1Y

13 4OE

12 4A

1Y

NC

2

3

4

5

6

4

5

6

7

8

17

16

15

14

NC

4Y

4A

4Y

3OE

3A

3Y

11

10

9

2OE

2A

4Y

2OE

NC

3OE

3A

NC

3OE

2Y

2A

9 10 11 12 13

7

8

GND

NC − No internal connection

description/ordering information

These bus buffers are designed specifically for low-voltage (3.3-V) V

provide a TTL interface to a 5-V system environment.

operation, but with the capability to

CC

The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the

high-impedance state when the associated output-enable (OE) input is high.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

T

A

QFN − RGY

SOIC − D

Tape and reel

Tube

SN74LVTH125RGYR

SN74LVTH125D

LXH125

LVTH125

Tape and reel

Tube

SN74LVTH125DR

SN74LVTH125NSR

SN74LVTH125DBR

SN74LVTH125PW

SN74LVTH125PWR

SN74LVTH125DGVR

SNJ54LVTH125J

SOP − NS

LVTH125

LXH125

−40°C to 85°C

SSOP − DB

TSSOP − PW

LXH125

Tape and reel

Tube

TVSOP − DGV

CDIP − J

LXH125

SNJ54LVTH125J

SNJ54LVTH125W

SNJ54LVTH125FK

CFP − W

Tube

SNJ54LVTH125W

SNJ54LVTH125FK

−55°C to 125°C

LCCC − FK

Tube

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright  2003, Texas Instruments Incorporated

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1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

description/ordering information (continued)

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors

with the bus-hold circuitry is not recommended.

When V

is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.

CC

However, to ensure the high-impedance state above 1.5 V, OE should be tied to V

the minimum value of the resistor is determined by the current-sinking capability of the driver.

through a pullup resistor;

CC

These devices are fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry

off

disables the outputs, preventing damaging current backflow through the devices when they are powered down.

The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,

which prevents driver conflict.

FUNCTION TABLE

(each buffer)

INPUTS

OUTPUT

Y

OE

A

H

L

H

L

H

X

Z

logic diagram (positive logic)

1

10

1OE

3OE

3A

2

3

9

8

1A

1Y

2Y

3Y

4Y

4

13

12

2OE

4OE

4A

5

6

11

2A

Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V

CC

Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

I

Voltage range applied to any output in the high-impedance

or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

O

Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V

+ 0.5 V

O

CC

Current into any output in the low state, I : SN54LVTH125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA

O

SN74LVTH125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA

Current into any output in the high state, I (see Note 2): SN54LVTH125 . . . . . . . . . . . . . . . . . . . . . . . 48 mA

O

SN74LVTH125 . . . . . . . . . . . . . . . . . . . . . . . 64 mA

Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

IK

OK

I

Output clamp current, I

(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

O

Package thermal impedance, θ (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W

JA

(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W

(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W

(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W

(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W

(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This current flows only when the output is in the high state and V > V

.

CC

O

3. The package thermal impedance is calculated in accordance with JESD 51-7.

4. The package thermal impedance is calculated in accordance with JESD 51-5.

recommended operating conditions (see Note 5)

SN54LVTH125 SN74LVTH125

UNIT

MIN

2.7

2

MAX

MIN

2.7

2

MAX

V

Supply voltage

3.6

V

CC

High-level input voltage

Low-level input voltage

Input voltage

IH

0.8

5.5

−24

48

0.8

5.5

−32

64

V

IL

V

I

High-level output current

Low-level output current

Input transition rise or fall rate

Power-up ramp rate

mA

ns/V

µs/V

°C

OH

OL

∆t/∆v

∆t/∆V

Outputs enabled

10

200

−55

200

−40

CC

T

A

Operating free-air temperature

125

85

NOTE 5: All unused control inputs of the device must be held at V

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

CC

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3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

SN54LVTH125

SN74LVTH125

PARAMETER

TEST CONDITIONS

UNIT

†

TYP

†

TYP

MIN

MAX

MIN

MAX

V

= 2.7 V,

I = −18 mA

−1.2

V

IK

CC

I

= 2.7 V to 3.6 V,

= 2.7 V,

I

= −100 µA

= −8 mA

= −24 mA

= −32 mA

= 100 µA

= 24 mA

= 16 mA

= 32 mA

= 48 mA

= 64 mA

V

−0.2

V

CC

−0.2

OH

OL

CC

2.4

2

2.4

2

V

OH

V

= 3 V

CC

0.2

0.5

0.2

0.5

0.4

0.5

V

= 2.7 V

0.4

V

OL

0.5

V

CC

= 3 V

0.55

10

V

= 0 or 3.6 V,

= 3.6 V,

V = 5.5 V

I

10

1

CC

Control

inputs

V = V

or GND

1

CC

I

CC

I

µA

V = V

1

−5

I

CC

Data inputs

V

= 3.6 V

= 0,

CC

V = 0

I

−5

I

V or V = 0 to 4.5 V

I

100

µA

off

CC

O

V = 0.8 V

I

75

V

CC

= 3 V

V = 2 V

I

−75

Data inputs

I(hold)

‡

V

= 3.6 V ,

V = 0 to 3.6 V

500

5

CC

I

= 3.6 V,

V

= 3 V

5

µA

OZH

O

V

= 0.5 V

−5

OZL

= 0 to 1.5 V, V = 0.5 V to 3 V,

OE = don’t care

O

∗

50

µA

I

OZPU

OZPD

V

= 1.5 V to 0, V = 0.5 V to 3 V,

CC

OE = don’t care

O

∗

I

Outputs high

Outputs low

0.12

4.5

0.19

7

0.12

4.5

0.19

7

V

I

= 3.6 V,

CC

= 0,

I

mA

O

CC

V = V

I

or GND

CC

Outputs disabled

0.12

0.19

0.12

0.19

V

= 3 V to 3.6 V, One input at V − 0.6 V,

CC

Other inputs at V

§

0.3

0.2

∆I

CC

or GND

CC

C

V = 3 V or 0

4

pF

i

I

V

O

= 3 V or 0

6.5

o

∗

†

‡

§

On products compliant to MIL-PRF-38535, this parameter is not production tested.

All typical values are at V = 3.3 V, T = 25°C.

CC

This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.

This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V or GND.

A

CC

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ꢩ

ꢝ

ꢰ

ꢜ

ꢛ

ꢠ

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢆ

ꢇ

ꢈ

ꢉ

ꢂ

ꢊ

ꢀ

ꢁ

ꢋ

ꢃ

ꢌ ꢍꢌ ꢎꢅ ꢏꢐꢆ ꢑ ꢒꢏꢓꢔ ꢒꢕꢄ ꢖ ꢐꢒꢀ ꢐ ꢒꢗ ꢗꢖ ꢔ

ꢄ

ꢅ

ꢆ

ꢇ

ꢈ

ꢉ

ꢂ

ꢀ

ꢘ ꢙꢆ ꢇ ꢌ ꢎꢀꢆꢏꢆ ꢖ ꢚ ꢒꢆ ꢕ ꢒꢆ

SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

switching characteristics over recommended operating free-air temperature range, C = 50 pF

L

(unless otherwise noted) (see Figure 1)

SN54LVTH125

= 3.3 V

SN74LVTH125

V

CC

V

CC

= 3.3 V

V

FROM

(INPUT)

TO

(OUTPUT)

V

= 2.7 V

PARAMETER

UNIT

CC

0.3 V

†

MIN

MAX

4.2

4.1

4.9

5.3

4.7

MIN

MAX

4.7

5.1

5.6

5.9

4.2

MIN TYP

MAX

3.5

3.9

4

MIN

MAX

4.5

4.9

5.5

5.4

5.7

4

t

1

2

PLH

PHL

PZH

PZL

PHZ

PLZ

A

Y

ns

1

2.1

2

1

OE

1.1

1.5

1.3

1.1

1.5

1.3

2.1

2.3

2.8

4

4.5

†

All typical values are at V

CC

= 3.3 V, T = 25°C.

A

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ꢔ

ꢚ

ꢓ

ꢒ

ꢧ

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ꢕ

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ꢘ

ꢝ

ꢥ

ꢨ

ꢠ

ꢩ

ꢣ

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ꢝ

ꢠ

ꢥ

ꢡ

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ꢡ

ꢛ

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ꢝ

ꢥ

ꢛ

ꢜ

ꢤ

ꢨ

ꢠ

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ꢣ

ꢦ

ꢛ

ꢝ

ꢱ

ꢤ

ꢠ

ꢩ

ꢞ

ꢪ

ꢤ

ꢡ

ꢝ

ꢨ

ꢝ

ꢡ

ꢦ

ꢛ

ꢝ

ꢠ

ꢥ

ꢞ

ꢦ

ꢩ

ꢤ

ꢟ

ꢤ

ꢞ

ꢝ

ꢰ

ꢥ

ꢰ

ꢠ

ꢦ

ꢬ

ꢞ

ꢍ

ꢆ

ꢤ

ꢭ

ꢦ

ꢞ

ꢙ

ꢥ

ꢞ

ꢛ

ꢩ

ꢢ

ꢣ

ꢤ

ꢥ

ꢡ ꢜꢦ ꢥ ꢰꢤ ꢠꢩ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢪꢩ ꢠꢟ ꢢꢡꢛ ꢞ ꢮ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢍ

ꢛ

ꢞ

ꢩ

ꢤ

ꢞ

ꢤ

ꢩ

ꢱ

ꢤꢞ

ꢛ

ꢜ

ꢤ

ꢩ

ꢝ

ꢰ

ꢜ

ꢛ

ꢠ

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ

ꢁ

ꢌ

ꢂ

ꢃ

ꢄ

ꢏ

ꢌ

ꢅ

ꢐ

ꢎ

ꢆ

ꢀ

ꢇ

ꢑ

ꢆꢏ

ꢈ

ꢉ

ꢒ

ꢂ

ꢏ

ꢖ

ꢊ

ꢀ

ꢓ

ꢚ

ꢁ

ꢔ

ꢒ

ꢋ

ꢒ

ꢆ

ꢃ

ꢕ

ꢄ

ꢒ

ꢅ

ꢖ

ꢆ

ꢇ

ꢐ

ꢈ

ꢒ

ꢉ

ꢀ

ꢂ

ꢌ

ꢍ

ꢎ

ꢅ

ꢐ

ꢒ

ꢗ

ꢖꢔ

ꢀ

ꢘ

ꢙ

ꢆ

ꢇ

ꢆ

ꢀ

SCBS703I − AUGUST 1997 − REVISED OCTOBER 2003

PARAMETER MEASUREMENT INFORMATION

6 V

TEST

S1

Open

GND

S1

500 Ω

From Output

Under Test

t

/t

Open

6 V

PLH PHL

/t

t

PLZ PZL

/t

C

= 50 pF

L

t

GND

PHZ PZH

500 Ω

(see Note A)

2.7 V

0 V

LOAD CIRCUIT

Timing Input

Data Input

1.5 V

t

w

t

h

su

2.7 V

0 V

1.5 V

Input

1.5 V

0 V

VOLTAGE WAVEFORMS

PULSE DURATION

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

2.7 V

0 V

2.7 V

Output

Control

1.5 V

Input

0 V

V

t

PLZ

PZL

t

PHL

PLH

Output

Waveform 1

S1 at 6 V

3 V

OH

1.5 V

t

1.5 V

Output

V

+ 0.3 V

OL

V

OL

(see Note B)

V

OL

t

PZH

PHZ

PHL

PLH

Output

Waveform 2

S1 at GND

V

OH

V

OH

− 0.3 V

OH

1.5 V

Output

≈0 V

(see Note B)

OL

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

NOTES: A. includes probe and jig capacitance.

C

L

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.

O

r

f

D. The outputs are measured one at a time with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

21-Dec-2009

PACKAGING INFORMATION

Orderable Device

SN74LVTH125D

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

D

14

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LVTH125DBR

SN74LVTH125DBRE4

SN74LVTH125DBRG4

SN74LVTH125DE4

SSOP

SOIC

DB

D

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LVTH125DG4

SN74LVTH125DGVR

SN74LVTH125DGVRE4

SN74LVTH125DGVRG4

SN74LVTH125DR

SOIC

D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TVSOP

SOIC

DGV

D

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LVTH125DRE4

SN74LVTH125DRG4

SN74LVTH125NSR

SN74LVTH125NSRE4

SN74LVTH125NSRG4

SN74LVTH125PW

SOIC

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

NS

PW

RGY

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

VQFN

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LVTH125PWE4

SN74LVTH125PWG4

SN74LVTH125PWR

SN74LVTH125PWRE4

SN74LVTH125PWRG4

SN74LVTH125RGYR

SN74LVTH125RGYRG4

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

21-Dec-2009

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN74LVTH125 :

Enhanced Product: SN74LVTH125-EP

•

NOTE: Qualified Version Definitions:

Enhanced Product - Supports Defense, Aerospace and Medical Applications

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

30-Jul-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

SN74LVTH125DBR

SN74LVTH125DGVR

SN74LVTH125DR

SN74LVTH125NSR

SN74LVTH125PWR

SN74LVTH125RGYR

SSOP

TVSOP

SOIC

DB

DGV

D

14

2000

2500

2000

3000

330.0

16.4

12.4

16.4

12.4

8.2

6.8

6.5

8.2

6.9

3.75

6.6

4.0

2.5

1.6

2.1

2.5

1.6

1.15

12.0

8.0

16.0

12.0

16.0

12.0

Q1

9.0

8.0

SOIC

D

9.0

8.0

SO

NS

PW

RGY

10.5

5.6

12.0

8.0

TSSOP

VQFN

3.75

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

30-Jul-2010

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

SN74LVTH125DBR

SN74LVTH125DGVR

SN74LVTH125DR

SN74LVTH125NSR

SN74LVTH125PWR

SN74LVTH125RGYR

SSOP

TVSOP

SOIC

DB

DGV

D

14

2000

2500

2000

3000

346.0

333.2

346.0

345.9

346.0

33.0

29.0

28.6

33.0

29.0

SOIC

D

SO

NS

PW

RGY

TSSOP

VQFN

Pack Materials-Page 2

MECHANICAL DATA

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000

DGV (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

24 PINS SHOWN

0,23

0,13

M

0,07

0,40

24

13

0,16 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–ā8°

0,75

1

12

0,50

A

Seating Plane

0,08

0,15

0,05

1,20 MAX

PINS **

14

16

20

24

38

48

56

DIM

A MAX

A MIN

3,70

3,50

3,70

3,50

5,10

4,90

5,10

4,90

7,90

7,70

9,80

9,60

11,40

11,20

4073251/E 08/00

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.

D. Falls within JEDEC: 24/48 Pins – MO-153

14/16/20/56 Pins – MO-194

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

28

M

0,15

15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

1

14

0,25

A

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

14

16

20

24

28

30

38

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

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Products

Applications

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Amplifiers

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dataconverter.ti.com

www.dlp.com

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Data Converters

DLP® Products

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www.ti.com/automotive

www.ti.com/communications

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dsp.ti.com

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www.ti.com/consumer-apps

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www.ti.com/industrial

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RFID

power.ti.com

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Video and Imaging

Wireless

www.ti.com/video

www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	SN74LVTH125DBRG4
厂家：	TEXAS INSTRUMENTS
描述：	3.3-V ABT QUADRUPLE BUS BUFFERS WITH 3-STATE OUTPUTS 3.3 -V ABT翻两番总线缓冲器，三态输出总线驱动器总线收发器逻辑集成电路光电二极管输出元件信息通信管理
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