SN74S112ANSRG4 [TI]

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, GREEN, PLASTIC, SOP-16;
SN74S112ANSRG4
型号: SN74S112ANSRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, GREEN, PLASTIC, SOP-16

光电二极管 输出元件 逻辑集成电路 触发器
文件: 总19页 (文件大小:1301K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
JM38510/07102BEA  
JM38510/07102BFA  
JM38510/30103B2A  
JM38510/30103BEA  
JM38510/30103BFA  
M38510/07102BEA  
M38510/07102BFA  
M38510/30103B2A  
M38510/30103BEA  
M38510/30103BFA  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
CDIP  
CFP  
J
16  
16  
20  
16  
16  
16  
16  
20  
16  
16  
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
JM38510/07102B  
EA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
W
FK  
J
1
1
1
1
1
1
1
1
1
A42  
JM38510/  
07102BFA  
LCCC  
CDIP  
CFP  
POST-PLATE  
A42  
JM38510/  
30103B2A  
JM38510/  
30103BEA  
W
J
A42  
JM38510/  
30103BFA  
CDIP  
CFP  
A42  
JM38510/07102B  
EA  
W
FK  
J
A42  
JM38510/  
07102BFA  
LCCC  
CDIP  
CFP  
POST-PLATE  
A42  
JM38510/  
30103B2A  
JM38510/  
30103BEA  
W
A42  
JM38510/  
30103BFA  
SN54LS112AJ  
SN54S112J  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
16  
16  
16  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
0 to 70  
SN54LS112AJ  
SN54S112J  
LS112A  
SN74LS112AD  
D
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
SN74LS112ADE4  
SN74LS112ADG4  
SN74LS112ADR  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
D
D
D
16  
16  
16  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
TBD  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
LS112A  
LS112A  
SN74LS112ADRE4  
SN74LS112ADRG4  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
16  
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Call TI  
Level-1-260C-UNLIM  
Call TI  
0 to 70  
0 to 70  
TBD  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN74LS112AN  
ACTIVE  
PDIP  
N
16  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
0 to 70  
SN74LS112AN  
SN74LS112AN3  
SN74LS112ANE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
SN74LS112ANSR  
ACTIVE  
SO  
NS  
16  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
0 to 70  
74LS112A  
SN74LS112ANSRE4  
SN74LS112ANSRG4  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
16  
16  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
SN74S112AD  
SN74S112AN  
OBSOLETE  
ACTIVE  
SOIC  
PDIP  
D
N
16  
16  
Call TI  
Call TI  
0 to 70  
0 to 70  
25  
1
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74S112AN  
SN74S112AN3  
OBSOLETE  
ACTIVE  
PDIP  
N
16  
20  
TBD  
TBD  
Call TI  
Call TI  
0 to 70  
SNJ54LS112AFK  
LCCC  
FK  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
SNJ54LS  
112AFK  
SNJ54LS112AJ  
SNJ54LS112AW  
SNJ54S112FK  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
16  
16  
20  
1
1
1
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
-55 to 125  
SNJ54LS112AJ  
W
FK  
SNJ54LS112AW  
LCCC  
POST-PLATE  
SNJ54S  
112FK  
SNJ54S112J  
SNJ54S112W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
16  
16  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
SNJ54S112J  
W
SNJ54S112W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54LS112A, SN74LS112A :  
Catalog: SN74LS112A  
Military: SN54LS112A  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LS112ADR  
SN74LS112ANSR  
SOIC  
SO  
D
16  
16  
2500  
2000  
330.0  
330.0  
16.4  
16.4  
6.5  
8.2  
10.3  
10.5  
2.1  
2.5  
8.0  
16.0  
16.0  
Q1  
Q1  
NS  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LS112ADR  
SN74LS112ANSR  
SOIC  
SO  
D
16  
16  
2500  
2000  
333.2  
367.0  
345.9  
367.0  
28.6  
38.0  
NS  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2014, Texas Instruments Incorporated  

相关型号:

SN74S112D

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16
TI

SN74S112D3

IC,FLIP-FLOP,DUAL,J/K TYPE,S-TTL,SOP,16PIN,PLASTIC
TI

SN74S112DR

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16
TI

SN74S112FN

IC S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC20, FF/Latch
TI

SN74S112FN3

IC,FLIP-FLOP,DUAL,J/K TYPE,S-TTL,LDCC,20PIN,PLASTIC
TI

SN74S112J-00

IC S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16, FF/Latch
TI

SN74S112JP4

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP16, CERAMIC, DIP-16
TI

SN74S112N

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16
TI

SN74S112N-00

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16
TI

SN74S112N-10

S SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16
ROCHESTER

SN74S112N1

IC,FLIP-FLOP,DUAL,J/K TYPE,S-TTL,DIP,16PIN,PLASTIC
TI

SN74S112N3

IC,FLIP-FLOP,DUAL,J/K TYPE,S-TTL,DIP,16PIN,PLASTIC
TI