SN74S124DG4 [TI]
DUAL VOLTAGE-CONTROLLED OSCILLATORS; 双电压控制振荡器
| 型号： | SN74S124DG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL VOLTAGE-CONTROLLED OSCILLATORS |
| 文件： | 总13页 (文件大小：960K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢈꢉꢊ ꢋ ꢌꢍ ꢋꢎꢊꢏ ꢐꢑꢒꢍ ꢁꢎ ꢓꢍ ꢋ ꢋ ꢐꢈ ꢍ ꢀꢒꢔ ꢋꢋ ꢊꢎꢍ ꢓꢀ
SDLS201A − DECEMBER 1983 − REVISED APRIL 2004
Two independent VCOs in a 16-Pin
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢀꢄ ꢅ ꢃ ꢆ ꢀꢁ ꢇꢃ ꢀ ꢄ ꢅ ꢃ
ꢈꢉ ꢊ ꢋ ꢌꢍꢋꢎꢊ ꢏꢐ ꢑꢒꢍ ꢁꢎꢓ ꢍꢋ ꢋꢐ ꢈ ꢍ ꢀꢒ ꢔꢋꢋ ꢊꢎꢍ ꢓꢀ
SDLS201A − DECEMBER 1983 − REVISED APRIL 2004
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢀ ꢄ ꢅ ꢃꢆ ꢀꢁꢇ ꢃꢀ ꢄꢅ ꢃ
ꢈꢉꢊ ꢋ ꢌꢍ ꢋꢎꢊꢏ ꢐꢑꢒꢍ ꢁꢎ ꢓꢍ ꢋ ꢋ ꢐꢈ ꢍ ꢀꢒꢔ ꢋꢋ ꢊꢎꢍ ꢓꢀ
SDLS201A − DECEMBER 1983 − REVISED APRIL 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢀꢄ ꢅ ꢃ ꢆ ꢀꢁ ꢇꢃ ꢀ ꢄ ꢅ ꢃ
ꢈꢉ ꢊ ꢋ ꢌꢍꢋꢎꢊ ꢏꢐ ꢑꢒꢍ ꢁꢎꢓ ꢍꢋ ꢋꢐ ꢈ ꢍ ꢀꢒ ꢔꢋꢋ ꢊꢎꢍ ꢓꢀ
SDLS201A − DECEMBER 1983 − REVISED APRIL 2004
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
SN54S124J
SN74S124D
ACTIVE
ACTIVE
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S124DE4
SN74S124DG4
SN74S124DR
SN74S124DRE4
SN74S124DRG4
SN74S124N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
D
D
D
D
D
N
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S124N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
SN74S124NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SNJ54S124J
SNJ54S124W
ACTIVE
ACTIVE
CDIP
CFP
J
16
16
1
1
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74S124DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 16
SPQ
Length (mm) Width (mm) Height (mm)
333.2 345.9 28.6
SN74S124DR
D
2500
Pack Materials-Page 2
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