SN74S74ADR [TI]
S SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14;型号: | SN74S74ADR |
厂家: | TEXAS INSTRUMENTS |
描述: | S SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 触发器 |
文件: | 总18页 (文件大小:696K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
JM38510/00205BCA
JM38510/00205BDA
JM38510/00205BDA
JM38510/07101BCA
JM38510/07101BCA
JM38510/07101BDA
JM38510/07101BDA
JM38510/30102B2A
JM38510/30102B2A
JM38510/30102BCA
JM38510/30102BCA
JM38510/30102BDA
JM38510/30102BDA
JM38510/30102SCA
JM38510/30102SCA
JM38510/30102SDA
JM38510/30102SDA
SN5474J
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
J
W
W
J
14
14
14
14
14
14
14
20
20
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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Call TI
CFP
Call TI
CDIP
CDIP
CFP
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
ACTIVE
J
ACTIVE
W
W
FK
FK
J
ACTIVE
CFP
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
ACTIVE
ACTIVE
ACTIVE
J
ACTIVE
W
W
J
ACTIVE
CFP
ACTIVE
CDIP
CDIP
CFP
ACTIVE
J
ACTIVE
W
W
J
ACTIVE
CFP
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
SOIC
SN5474J
J
Call TI
SN54LS74AJ
J
1
1
1
1
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
SN54LS74AJ
ACTIVE
J
SN54S74J
ACTIVE
J
SN54S74J
ACTIVE
J
SN7474DR
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
D
D
N
N
N
N
D
SN7474DR
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SN7474N
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SN7474N
Call TI
SN7474N3
Call TI
SN7474N3
Call TI
SN74LS74AD
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS74AD
SN74LS74ADBR
SN74LS74ADBR
SN74LS74ADBRE4
SN74LS74ADBRE4
SN74LS74ADE4
SN74LS74ADE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
D
DB
DB
DB
DB
D
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN74LS74ADR
SN74LS74ADR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
D
D
D
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS74ADRE4
SN74LS74ADRE4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS74AJ
SN74LS74AJ
SN74LS74AN
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
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N
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS74AN
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS74AN3
SN74LS74AN3
SN74LS74ANE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
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25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS74ANE4
SN74LS74ANSR
SN74LS74ANSR
SN74LS74ANSRG4
SN74LS74ANSRG4
SN74S74D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
PDIP
SO
N
NS
NS
NS
NS
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S74D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S74DE4
SN74S74DE4
SN74S74DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S74DR
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S74DRE4
SN74S74DRE4
SN74S74N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S74N
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S74N3
N
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Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
PDIP
Drawing
SN74S74N3
OBSOLETE
ACTIVE
N
N
14
14
TBD
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SN74S74NE4
25
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74S74NE4
SN74S74NSR
SN74S74NSR
SN74S74NSRE4
SN74S74NSRE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
N
14
14
14
14
14
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
NS
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ5474J
SNJ5474J
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
CFP
J
J
14
14
14
14
20
20
14
14
14
14
20
20
14
14
14
14
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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SNJ5474W
W
W
FK
FK
J
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SNJ5474W
CFP
Call TI
SNJ54LS74AFK
SNJ54LS74AFK
SNJ54LS74AJ
SNJ54LS74AJ
SNJ54LS74AW
SNJ54LS74AW
SNJ54S74FK
SNJ54S74FK
SNJ54S74J
LCCC
LCCC
CDIP
CDIP
CFP
1
1
1
1
1
1
1
1
1
1
1
1
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
ACTIVE
ACTIVE
ACTIVE
J
ACTIVE
W
W
FK
FK
J
ACTIVE
CFP
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
ACTIVE
ACTIVE
SNJ54S74J
ACTIVE
J
SNJ54S74W
SNJ54S74W
ACTIVE
W
W
ACTIVE
CFP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
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