SN75C3221EDBG4 [TI]
LINE TRANSCEIVER, PDSO16, GREEN, PLASTIC, SSOP-16;
| 型号： | SN75C3221EDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LINE TRANSCEIVER, PDSO16, GREEN, PLASTIC, SSOP-16 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总20页 (文件大小：578K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
1
FEATURES
DB OR PW PACKAGE
•
ESD Protection for RS-232 Pins
(TOP VIEW)
–
–
–
±15-kV Human-Body Model (HBM)
EN
C1+
V+
FORCEOFF
VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
±8-kV IEC 61000-4-2 Contact Discharge
±15-kV IEC 61000-4-2 Air-Gap Discharge
GND
•
•
•
•
•
•
Operate With 3-V to 5.5-V VCC Supply
Operate up to 1 Mbit/s
C1−
C2+
C2−
V−
DOUT
FORCEON
DIN
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
INVALID
ROUT
RIN
RS-232 Bus-Pin ESD Protection Exceeds ±15
kV Using Human-Body Model (HBM)
•
Auto-Powerdown Feature Automatically
Disables Drivers for Power Savings
APPLICATIONS
•
Battery-Powered, Hand-Held, and Portable
Equipment
•
•
•
•
PDAs and Palmtop PCs
Notebooks, Sub-Notebooks, and Laptops
Digital Cameras
Mobile Phones and Wireless Devices
DESCRIPTION/ORDERING INFORMATION
The SN65C3221E and SN75C3221E consist of one line driver, one line receiver, and a dual charge-pump circuit
with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). These devices provide
the electrical interface between an asynchronous communication controller and the serial-port connector. The
charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices
operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the devices do not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If
FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is
reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown
condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With
auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver
input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high
(valid data) if the receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V
and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and
0.3 V for more than 30 µs. See Figure 5 for receiver input levels.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN65C3221E, SN75C3221E
SLLS694B–NOVEMBER 2005–REVISED APRIL 2009.................................................................................................................................................. www.ti.com
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
SN75C3221EDBR
TOP-SIDE MARKING
MY221E
SSOP – DB
TSSOP – PW
SSOP – DB
TSSOP – PW
Reel of 2000
–0°C to 70°C
Tube of 90
SN75C3221EPW
MY221E
MU221E
MU221E
Reel of 2000
Reel of 2000
Tube of 90
SN75C3221EPWR
SN65C3221EDBR
–40°C to 85°C
SN65C3221EPW
Reel of 2000
SN65C3221EPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
abc
EACH DRIVER(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
abc
EACH RECEIVER(1)
INPUTS
OUTPUT
ROUT
VALID RIN
RS-232 LEVEL
RIN
EN
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off),
Open = disconnected input or connected driver off
2
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Product Folder Link(s): SN65C3221E SN75C3221E
SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
LOGIC DIAGRAM (POSITIVE LOGIC)
11
13
10
DIN
DOUT
16
12
FORCEOFF
FORCEON
INVALID
Auto-powerdown
9
8
1
ROUT
RIN
EN
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Product Folder Link(s): SN65C3221E SN75C3221E
SN65C3221E, SN75C3221E
SLLS694B–NOVEMBER 2005–REVISED APRIL 2009.................................................................................................................................................. www.ti.com
Table 1. 1-Mbit/s RS-232 Parts
SUPPLY
VCC
(V)
PART
NO.
TEMPERATURE DRIVER RECEIVER
ESD
FEATURE
Auto powerdown
Low pin count
PIN/PACKAGE
RANGE
NO.
NO.
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
SN65C3221E
SN65C3232E
MAX3227I
1
1
3.3 or 5
3.3 or 5
3.3 or 5
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
2
1
2
1
±8-kV Air-Gap,
±8-k V Contact,
±15-kV HBM
Auto powerdown plus,
ready signal
16-pin SSOP
16-pin SOIC,
SSOP, TSSOP
SN65C3221
SN65C3223
SN65C3222
SN65C3232
SN65C3238
SN65C3243
1
2
2
2
5
3
1
2
2
2
3
5
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
Auto powerdown
–40°C to 85°C
Auto powerdown,
enable signal
20-pin SOIC,
SSOP, TSSOP
Enable,
powerdown signal
20-pin SOIC,
SSOP, TSSOP
16-pin SOIC,
SSOP, TSSOP
Low pin count
Auto powerdown plus
Auto powerdown
28-pin SOIC,
SSOP, TSSOP
28-pin SOIC,
SSOP, TSSOP
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
SN75C3221E
SN75C3232E
MAX3227C
1
2
1
1
2
1
3.3 or 5
3.3 or 5
3.3 or 5
Auto powerdown
Low pin count
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
±8-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
Auto powerdown plus,
ready signal
16-pin SSOP
16-pin SOIC,
SSOP, TSSOP
SN75C3221
SN75C3223
SN75C3222
SN75C3232
SN75C3238
SN75C3243
1
2
2
2
5
3
1
2
2
2
3
5
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
3.3 or 5
3.5 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
Auto powerdown
0°C to 70°C
Auto powerdown,
enable signal
20-pin SOIC,
SSOP, TSSOP
Enable,
powerdown signal
20-pin SOIC,
SSOP, TSSOP
16-pin SOIC,
SSOP, TSSOP
Low pin count
Auto powerdown plus
Auto powerdown
28-pin SOIC,
SSOP, TSSOP
28-pin SOIC,
SSOP, TSSOP
4
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Product Folder Link(s): SN65C3221E SN75C3221E
SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive output supply voltage range(2)
Negative output supply voltage range(2)
6
V
V
V
V
7
V–
–7
V+ – V– Supply voltage difference(2)
13
Driver (FORCEOFF, FORCEON, EN)
Receiver
–0.3
–25
6
25
VI
Input voltage range
V
V
Driver
–13.2
–0.3
13.2
VO
θJA
Output voltage range
Receiver (INVALID)
DB package
VCC + 0.3
82
Package thermal impedance(3)(4)
°C/W
PW package
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 6
MIN NOM
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
V
Supply voltage
5.5
Driver and control
high-level input voltage
VIH
VIL
DIN, FORCEOFF, FORCEON, EN
V
2.4
Driver and control
low-level input voltage
DIN, FORCEOFF, FORCEON, EN
DIN, FORCEOFF, FORCEON
0.8
V
VI
VI
Driver and control input voltage
Receiver input voltage
0
–25
–40
0
5.5
25
85
70
V
V
SN65C3221E
SN75C3221E
TA
Operating free-air temperature
°C
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX UNIT
II
Input leakage current FORCEOFF, FORCEON, EN
±0.01
±1
µA
No load,
Auto-powerdown disabled
0.3
1
1
mA
FORCEOFF and FORCEON at VCC
Supply current
(TA = 25°C)
Powered off
No load, FORCEOFF at GND
10
ICC
No load, FORCEOFF at VCC
FORCEON at GND,
,
µA
Auto-powerdown enabled
1
10
All RIN are open or grounded
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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DRIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND, DIN = GND
DOUT at RL = 3 kΩ to GND, DIN = VCC
VI = VCC
MIN
5
TYP(2) MAX UNIT
VOH High-level output voltage
VOL Low-level output voltage
5.4
–5.4
±0.01
±0.01
±35
V
V
–5
IIH
IIL
High-level input current
Low-level input current
±1
±1
µA
µA
VI at GND
VCC = 3.6 V,
VO = 0 V
±60
±90
Short-circuit output
current(3)
IOS
ro
mA
Ω
VCC = 5.5 V,
VO = 0 V
±35
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
VO = ±12 V,
VO = ±10 V,
300
10M
VCC = 3 V to 3.6 V
±25
±25
Ioff
Output leakage current
FORCEOFF = GND
µA
VCC = 4.5 V to 5.5 V
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
CL = 1000 pF
MIN
250
TYP(2)
MAX UNIT
Maximum data rate
(see Figure 1)
RL = 3 kΩ
CL = 250 pF,
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
See Figure 2
1000
1000
kbit/s
CL = 1000 pF,
tsk(p)
Pulse skew(3)
Slew rate,
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
100
ns
SR(tr) transition region
(see Figure 1)
VCC = 3.3 V, RL = 3 kΩ to 7 kΩ,
CL = 150 pF to 1000 pF
18
150 V/µs
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME
NO.
HBM
±15
DOUT
13
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
±8
kV
±15
6
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Product Folder Link(s): SN65C3221E SN75C3221E
SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
RECEIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6 V
VCC – 0.1 V
V
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
VIT–
V
1.4
Vhys
Ioff
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.5
V
FORCEOFF = 0 V
VI = ±3 V to ±25 V
±0.05
5
±10
7
µA
kΩ
3
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2)
150
150
200
200
50
UNIT
ns
tPLH
tPHL
ten
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ns
ns
tdis
Output disable time
Pulse skew(3)
ns
tsk(p)
ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME
NO.
HBM
±15
RIN
8
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
±8
kV
±15
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SLLS694B–NOVEMBER 2005–REVISED APRIL 2009.................................................................................................................................................. www.ti.com
AUTO-POWERDOWN SECTION
abc
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
Receiver input threshold
for INVALID high-level output voltage
VT+(valid)
VT–(valid)
VT(invalid)
VOH
FORCEON = GND,
FORCEOFF = VCC
FORCEOFF = VCC
FORCEOFF = VCC
2.7
0.3
0.4
V
V
V
V
V
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
–2.7
–0.3
Receiver input threshold
for INVALID low-level output voltage
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Propagation delay time, low- to high-level output
TYP(1)
1
UNIT
µs
tvalid
tinvalid
ten
Propagation delay time, high- to low-level output
Supply enable time
30
µs
100
µs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
8
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SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
PARAMETER MEASUREMENT INFORMATION
FORCEON
3 V
0 V
3 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
3 V
−3 V
−3 V
VOLTAGE WAVEFORMS
3 V
FORCEOFF
Output
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
FORCEON
3 V
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
VOLTAGE WAVEFORMS
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
EN = V
CC
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
V
CC
GND
0 V
(S1 at GND)
S1
t
t
PZH
PHZ
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
EN
t
t
PZL
PLZ
(S1 at V
)
(S1 at V )
CC
CC
Generator
(see Note B)
50 Ω
0.3 V
Output
50%
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 4. Receiver Enable and Disable Times
10
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Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C3221E SN75C3221E
SN65C3221E, SN75C3221E
www.ti.com .................................................................................................................................................. SLLS694B–NOVEMBER 2005–REVISED APRIL 2009
PARAMETER MEASUREMENT INFORMATION
3 V
2.7 V
2.7 V
0 V
0 V
EN = GND
Receiver
Input
ROUT
−2.7 V
−2.7 V
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
50% V
t
50% V
CC
CC
INVALID
Output
0 V
Auto-
powerdown
INVALID
en
C = 30 pF
L
(see Note A)
≈V+
V+
0.3 V
V
CC
Supply
FORCEOFF
FORCEON
0 V
0.3 V
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
2.7 V
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdowndisables drivers and reduces supply
current to 1 µA.
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time
Copyright © 2005–2009, Texas Instruments Incorporated
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11
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SN65C3221E, SN75C3221E
SLLS694B–NOVEMBER 2005–REVISED APRIL 2009.................................................................................................................................................. www.ti.com
APPLICATION INFORMATION
1
2
16
15
FORCEOFF
EN
V
CC
C1+
V+
+
C
= 0.1 µF
BYPASS
3
−
14
Auto-
powerdown
+
−
+
−
(1)
GND
C1
C3
4
5
C1−
C2+
13
DOUT
+
−
12
11
10
FORCEON
DIN
C2
C4
6
7
C2−
V−
−
+
INVALID
8
9
RIN
ROUT
5 kΩ
(1) C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected
as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
12
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Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): SN65C3221E SN75C3221E
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2009
PACKAGING INFORMATION
Orderable Device
SN65C3221EDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3221EDBG4
SN65C3221EDBR
SN65C3221EDBRG4
SN65C3221EPW
SSOP
SSOP
DB
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
PW
PW
PW
PW
PW
PW
DB
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3221EPWE4
SN65C3221EPWG4
SN65C3221EPWR
SN65C3221EPWRE4
SN65C3221EPWRG4
SN75C3221EDB
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3221EDBG4
SN75C3221EDBR
SN75C3221EDBRG4
SN75C3221EPW
SSOP
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3221EPWE4
SN75C3221EPWG4
SN75C3221EPWR
SN75C3221EPWRE4
SN75C3221EPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN65C3221EDBR
SN65C3221EPWR
SN75C3221EDBR
SN75C3221EPWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
12.4
16.4
12.4
8.2
6.9
8.2
6.9
6.6
5.6
6.6
5.6
2.5
1.6
2.5
1.6
12.0
8.0
16.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN65C3221EDBR
SN65C3221EPWR
SN75C3221EDBR
SN75C3221EPWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
35.0
38.0
35.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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