SN75C3222DBRE4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER; 3V至5.5V多通道RS - 232兼容线路驱动器/接收器
| 型号： | SN75C3222DBRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER |
| 文件： | 总14页 (文件大小：260K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢆ ꢇ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢆ ꢆ
ꢑ
ꢚ
ꢚ
ꢅ
ꢉ
ꢊ
ꢋ ꢌ
ꢃ
ꢍ
ꢃ
ꢉ
ꢊ
ꢎ
ꢏ
ꢐ
ꢋ
ꢑ
ꢄ
ꢒ
ꢓ
ꢁ
ꢁ
ꢔ
ꢐ
ꢕ
ꢀ
ꢉ
ꢆ
ꢅ
ꢆ
ꢄ
ꢌ
ꢎ
ꢖ
ꢓ
ꢋ
ꢑ
ꢗ
ꢐ
ꢔ
ꢐ
ꢁ
ꢔ
ꢘ
ꢕ
ꢑ
ꢊ
ꢔ
ꢕ
ꢙ
ꢕ
ꢔ
ꢄ
ꢔ
ꢑ
ꢊ
ꢔ
ꢕ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
DB, DW, OR PW PACKAGE
(TOP VIEW)
D
Operates With 3-V to 5.5-V V
Operates Up To 1 Mbit/s
Supply
CC
D
D
D
D
D
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
EN
C1+
V+
PWRDOWN
1
2
3
4
5
6
7
8
9
10
20
19
V
CC
18 GND
Accepts 5-V Logic Input With 3.3-V Supply
17
16
15
14
13
12
11
C1−
C2+
C2−
V−
DOUT1
RIN1
ROUT1
NC
DIN1
DIN2
NC
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
D
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
DOUT2
RIN2
ROUT2
NC − No internal connection
description/ordering information
The SN65C3222 and SN75C3222 consist of two line drivers, two line receivers, and a dual charge-pump circuit
with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The devices provide the
electrical interface between an asynchronous communication controller and the serial-port connector. The
charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices
operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs.
The SN65C3222 and SN75C3222 can be placed in the power-down mode by setting PWRDOWN low, which
draws only 1 µA from the power supply. When the devices are powered down, the receivers remain active while
the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is
disabled, V+ is lowered to V , and V− is raised toward GND. Receiver outputs also can be placed in the
CC
high-impedance state by setting EN high.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube of 25
SN75C3222DW
SOIC (DW)
SSOP (DB)
75C3222
Reel of 2000
Reel of 2000
Tube of 70
SN75C3222DWR
SN75C3222DBR
SN75C3222PW
SN75C3222PWR
SN65C3222DW
SN65C3222DWR
SN65C3222DBR
SN65C3222PW
SN65C3222PWR
CA3222
CA3222
−0°C to 70°C
−40°C to 85°C
TSSOP (PW)
Reel of 2000
Tube of 25
SOIC (DW)
SSOP (DB)
65C3222
CB3222
Reel of 2000
Reel of 2000
Tube of 70
TSSOP (PW)
CB3222
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢖ
ꢖ
ꢕ
ꢌ
ꢪ
ꢘ
ꢥ
ꢏ
ꢄ
ꢣ
ꢋ
ꢤ
ꢑ
ꢞ
ꢌ
ꢜ
ꢁ
ꢝ
ꢘ
ꢓ
ꢋ
ꢓ
ꢛ
ꢜ
ꢦ
ꢝ
ꢞ
ꢤ
ꢟ
ꢠ
ꢡ
ꢡ
ꢢ
ꢢ
ꢛ
ꢛ
ꢞ
ꢞ
ꢜ
ꢜ
ꢛ
ꢣ
ꢣ
ꢧ
ꢤ
ꢥ
ꢟ
ꢟ
ꢦ
ꢦ
ꢜ
ꢢ
ꢡ
ꢠ
ꢣ
ꢣ
ꢞ
ꢝ
ꢧ
ꢋꢦ
ꢥ
ꢨ
ꢣ
ꢩ
ꢛ
ꢤ
ꢡ
ꢣ
ꢢ
ꢛ
ꢢ
ꢞ
ꢟ
ꢜ
ꢥ
ꢪ
ꢡ
ꢜ
ꢢ
ꢢ
ꢦ
ꢣ
ꢍ
Copyright 2004, Texas Instruments Incorporated
ꢟ
ꢞ
ꢤ
ꢢ
ꢞ
ꢟ
ꢠ
ꢢ
ꢞ
ꢣ
ꢧ
ꢛ
ꢝ
ꢛ
ꢤ
ꢦ
ꢟ
ꢢ
ꢫ
ꢢ
ꢦ
ꢟ
ꢞ
ꢝ
ꢬ
ꢡ
ꢑ
ꢜ
ꢠ
ꢦ
ꢣ
ꢢ
ꢡ
ꢜ
ꢪ
ꢡ
ꢟ
ꢪ
ꢭ
ꢡ
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢯ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢍ
ꢟ
ꢟ
ꢡ
ꢜ
ꢢ
ꢮ
ꢍ
ꢖ
ꢟ
ꢞ
ꢪ
ꢥ
ꢤ
ꢢ
ꢛ
ꢞ
ꢜ
ꢧ
ꢟ
ꢞ
ꢤ
ꢦ
ꢣ
ꢣ
ꢛ
ꢜ
ꢯ
ꢪ
ꢞ
ꢦ
ꢣ
ꢜ
ꢞ
ꢢ
ꢜ
ꢦ
ꢤ
ꢦ
ꢣ
ꢣ
ꢡ
ꢟ
ꢛ
ꢩ
ꢮ
ꢛ
ꢜ
ꢤ
ꢩ
ꢥ
ꢪ
ꢦ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢆ ꢇ ꢀꢁ ꢈ ꢃ ꢄꢅ ꢆ ꢆ ꢆ
ꢅꢉ ꢊ ꢋꢌ ꢃ ꢍ ꢃꢉꢊ ꢎ ꢏꢐꢋꢑ ꢄ ꢒꢓ ꢁꢁꢔ ꢐ ꢕꢀ ꢉꢆ ꢅ ꢆ ꢄ ꢌꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔꢑ ꢊꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
DIN
X
PWRDOWN
L
H
H
Z
H
L
L
H
H = high level, L = low level, X = irrelevant,
Z = high impedance
EACH RECEIVER
INPUTS
OUTPUT
ROUT
RIN
L
EN
L
H
L
H
L
X
H
L
Z
H
Open
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = input
disconnected or connected driver off
logic diagram (positive logic)
13
17
8
DIN1
DOUT1
DOUT2
12
DIN2
20
Powerdown
PWRDOWN
1
EN
15
16
9
ROUT1
RIN1
RIN2
10
ROUT2
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢆ ꢇ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢆ ꢆ
ꢅ ꢉꢊ ꢋ ꢌ ꢃ ꢍ ꢃ ꢉꢊ ꢎꢏ ꢐꢋꢑ ꢄ ꢒꢓꢁ ꢁꢔꢐ ꢕꢀ ꢉꢆꢅ ꢆ ꢄꢌ ꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔ ꢑ ꢊ ꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, V : Drivers, EN, PWRDOWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
I
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, V :Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
O
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 5)
MIN NOM
MAX
3.6
UNIT
V
V
= 3.3 V
= 5 V
3
4.5
2
3.3
5
CC
Supply voltage
V
5.5
CC
V
V
= 3.3 V
= 5 V
CC
V
IH
Driver and control high-level input voltage
V
DIN, EN, PWRDOWN
2.4
CC
V
V
V
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, EN, PWRDOWN
DIN, EN, PWRDOWN
0.8
5.5
25
85
70
V
V
V
IL
0
−25
−40
0
I
I
SN65C3222
SN75C3222
T
A
Operating free-air temperature
°C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 5)
‡
PARAMETER
Input leakage current (EN, PWRDOWN)
Supply current
TEST CONDITIONS
MIN TYP
MAX
1
UNIT
µA
I
I
0.01
0.3
1
I
No load, PWRDOWN at V
CC
1
mA
µA
CC
Supply current (powered off)
No load, PWRDOWN at GND
10
‡
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢆ ꢇ ꢀꢁ ꢈ ꢃ ꢄꢅ ꢆ ꢆ ꢆ
ꢅꢉ ꢊ ꢋꢌ ꢃ ꢍ ꢃꢉꢊ ꢎ ꢏꢐꢋꢑ ꢄ ꢒꢓ ꢁꢁꢔ ꢐ ꢕꢀ ꢉꢆ ꢅ ꢆ ꢄ ꢌꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔꢑ ꢊꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 5)
†
PARAMETER
TEST CONDITIONS
DOUT at R = 3 kΩ to GND, DIN = GND
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
5
5.4
−5.4
0.01
0.01
35
OH
L
DOUT at R = 3 kΩ to GND, DIN = V
CC
−5
V
OL
L
I
IH
V = V
I CC
1
1
µA
µA
I
IL
V at GND
I
V
V
V
= 3.6 V,
V
O
V
O
V
O
V
O
V
O
= 0 V
60
90
CC
CC
CC
‡
I
mA
Short-circuit output current
OS
= 5.5 V,
= 0 V
35
r
Output resistance
, V+, and V− = 0 V,
=
=
=
2 V
300
10M
Ω
o
12 V,
10 V,
V
V
= 3 V to 3.6 V
25
25
CC
I
off
Output leakage current
PWRDOWN = GND
µA
= 4.5 V to 5.5 V
CC
†
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
250
MAX
UNIT
C
C
C
R
= 1000 pF
L
L
L
L
Maximum data rate
(see Figure 1)
R = 3 kΩ,
L
= 250 pF,
V
V
= 3 V to 4.5 V
1000
kbit/s
CC
One DOUT switching
= 1000 pF,
= 4.5 V to 5.5 V
1000
CC
= 3 kΩ to 7 kΩ,
§
t
Pulse skew
C
R
= 150 pF to 2500 pF
300
ns
sk(p)
L
See Figure 2
Slew rate,
transition region
(see Figure 1)
= 3 kΩ to 7 kΩ,
= 3.3 V
L
SR(tr)
C
= 150 pF to 1000 pF
18
150
V/µs
L
V
CC
†
§
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
Pulse skew is defined as |t
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢆ ꢇ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢆ ꢆ
ꢅ ꢉꢊ ꢋ ꢌ ꢃ ꢍ ꢃ ꢉꢊ ꢎꢏ ꢐꢋꢑ ꢄ ꢒꢓꢁ ꢁꢔꢐ ꢕꢀ ꢉꢆꢅ ꢆ ꢄꢌ ꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔ ꢑ ꢊ ꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 5)
†
PARAMETER
High-level output voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
I
I
= −1 mA
= 1.6 mA
V
CC
− 0.6 V
V
CC
− 0.1 V
OH
OH
Low-level output voltage
0.4
2.4
2.4
V
OL
OL
V
CC
V
CC
V
CC
V
CC
= 3.3 V
= 5 V
1.5
1.8
V
IT+
Positive-going input threshold voltage
V
V
= 3.3 V
= 5 V
0.6
0.8
1.2
V
V
Negative-going input threshold voltage
IT−
1.5
Input hysteresis (V
IT+
− V
)
0.3
V
hys
IT−
I
Output leakage current
EN = V
CC
0.05
10
7
µA
kΩ
off
r
Input resistance
V = 3 V to 25 V
I
3
5
i
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
150 pF, See Figure 3
MIN TYP
MAX
UNIT
ns
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
C
300
300
PLH
L =
C = 150 pF, See Figure 3
ns
PHL
L
C = 150 pF, R = 3 kΩ,
See Figure 4
L
L
t
Output enable time
Output disable time
200
ns
en
C = 150 pF, R = 3 kΩ,
L
L
t
t
200
300
ns
ns
dis
See Figure 4
‡
Pulse skew
See Figure 3
sk(p)
†
‡
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
Pulse skew is defined as |t
− t
| of each channel of the same device.
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
CC
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢆ ꢇ ꢀꢁ ꢈ ꢃ ꢄꢅ ꢆ ꢆ ꢆ
ꢅꢉ ꢊ ꢋꢌ ꢃ ꢍ ꢃꢉꢊ ꢎ ꢏꢐꢋꢑ ꢄ ꢒꢓ ꢁꢁꢔ ꢐ ꢕꢀ ꢉꢆ ꢅ ꢆ ꢄ ꢌꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔꢑ ꢊꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
R
t
TLH
THL
L
(see Note A)
3 V
PWRDOWN
V
V
OH
3 V
−3 V
3 V
−3 V
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
t
t
PLH
L
PHL
R
L
(see Note A)
V
V
OH
3 V
PWRDOWN
50%
50%
Output
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
EN
0 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation-Delay Times
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢆ ꢇ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢆ ꢆ
ꢉꢊ ꢋ ꢌ ꢃ ꢍ ꢃ ꢉꢊ ꢎꢏ ꢐꢋꢑ ꢄ ꢒꢓꢁ ꢁꢔꢐ ꢕꢀ ꢉꢆꢅ ꢆ ꢄꢌ ꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔ ꢑ ꢊ ꢔꢕ
ꢚ
ꢚ
ꢅ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
V
CC
S1
GND
Input
1.5 V
1.5 V
−3 V
R
L
t
t
PZH
PHZ
S1 at GND)
(S1 at GND)
V
3 V or 0 V
Output
OH
C
L
Output
50%
(see Note A)
EN
0.3 V
0.3 V
t
PLZ
(S1 at V
Generator
(see Note B)
)
CC
50 Ω
Output
50%
V
OL
t
PZL
(S1 at V
)
CC
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 4. Receiver Enable and Disable Times
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢆ ꢇ ꢀꢁ ꢈ ꢃ ꢄꢅ ꢆ ꢆ ꢆ
ꢅꢉ ꢊ ꢋꢌ ꢃ ꢍ ꢃꢉꢊ ꢎ ꢏꢐꢋꢑ ꢄ ꢒꢓ ꢁꢁꢔ ꢐ ꢕꢀ ꢉꢆ ꢅ ꢆ ꢄ ꢌꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔꢑ ꢊꢔꢕ
ꢚ
ꢚ
SLLS534B − MAY 2002 − REVISED OCTOBER 2004
APPLICATION INFORMATION
1
20
EN
Powerdown
PWRDOWN
2
19
18
17
V
C1+
V+
CC
+
−
C
= 0.1 µF
BYPASS
+
3
4
GND
C1
+
−
−
†
C3
DOUT1
RIN1
C1−
C2+
C2−
V−
16
15
14
13
12
11
5
+
−
C2
C4
6
ROUT1
NC
7
−
+
8
DOUT2
RIN2
DIN1
9
DIN2
NC
10
ROUT2
†
C3 can be connected to V
CC
or GND.
NOTES: A. Resistor values shown are nominal.
B. NC − No internal connection
V
CC
vs CAPACITOR VALUES
V
C1
C2, C3, and C4
0.1 µF
CC
0.1 µF
0.047 µF
0.1 µF
3.3 V " 0.3 V
5 V " 0.5 V
3 V to 5.5 V
0.33 µF
0.47 µF
Figure 5. Typical Operating Circuit and Capacitor Values
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
SN65C3222DB
Status (1)
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3222DBR
SN65C3222DBRE4
SN65C3222DW
SSOP
SSOP
SOIC
DB
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3222DWE4
SN65C3222DWR
SN65C3222DWRE4
SN65C3222PW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3222PWE4
SN65C3222PWR
SN65C3222PWRE4
SN75C3222DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3222DBR
SN75C3222DBRE4
SN75C3222DW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3222DWE4
SN75C3222DWR
SN75C3222DWRE4
SN75C3222PW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3222PWE4
SN75C3222PWR
SN75C3222PWRE4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
相关型号：
SN75C3222DBRG4
IC DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SSOP-20, Line Driver or Receiver
TI
SN75C3222EDBG4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH 【15-kV ESD PROTECTION
TI
SN75C3222EDBRG4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH 【15-kV ESD PROTECTION
TI
©2020 ICPDF网 联系我们和版权申明