SN75LBC174ADWR_技术文档

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

D

Designed for TIA/EIA-485, TIA/EIA-422 and

ISO 8482 Applications

D

Driver Positive- and Negative-Current

Limiting

†

Signaling Rates up to 30 Mbps

Power-Up and Power-Down Glitch-Free for

Line Insertion Applications

Propagation Delay Times < 11 ns

D

Thermal Shutdown Protection

Low Standby Power Consumption

1.5 mA Max

D

Industry Standard Pin-Out, Compatible

With SN75174, MC3487, DS96174, LTC487,

and MAX3042

D

Output ESD Protection Exceeds 13 kV

description

The SN65LBC174A and SN75LBC174A are quadruple differential line drivers with 3-state outputs, designed

for TIA/EIA-485 (RS-485), TIA/EIA-422 (RS-422), and ISO 8482 applications.

These devices are optimized for balanced multipoint bus transmission at signalling rates up to 30 million bits

per second. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate

rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise

coupling to the environment.

N PACKAGE

(TOP VIEW)

16-DW PACKAGE

(TOP VIEW)

logic diagram (positive logic)

2

1Y

1

2

3

4

5

6

7

8

16

1

4

7

1A

1Y

1Z

V

CC

4A

4Y

4Z

3,4EN

3Z

3Y

1A

1Y

V

CC

4A

1

2

3

4

5

6

7

8

16

15

14

13

12

1A

1,2EN

2A

3

15

14

13

12

11

10

9

1Z

4Y

6

5

2Y

2Z

1,2EN

2Z

2Y

2A

GND

1,2EN

2Z

4Z

3,4EN

2Y

11 3Z

10 3Y

10

11

3Y

3Z

9

2A

3A

3,4EN

4A

3A

GND

9

3A

12

15

14

13

4Y

4Z

20-DW PACKAGE

(TOP VIEW)

logic diagram (positive logic)

2

1

2

3

4

5

6

7

8

9

10

20

1A

1Y

NC

1Z

V

CC

4A

4Y

NC

4Z

3,4EN

3Z

NC

3Y

1Y

1

1A

19

18

17

16

15

14

13

12

11

4

1Z

5

1,2EN

8

2Y

9

2A

1,2EN

2Z

NC

2Y

2A

GND

6

2Z

12

3Y

11

3A

14

3Z

15

3,4EN

3A

18

4Y

19

4A

16

4Z

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

†

The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second).

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Copyright  2001 − 20003, Texas Instruments Incorporated

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1

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

description (continued)

Each driver features current limiting and thermal-shutdown circuitry making it suitable for high-speed multipoint

applications in noisy environments. These devices are designed using LinBiCMOSt, facilitating low power

consumption and robustness.

The two EN inputs provide pair-wise driver enabling, or can be externally tied together to provide enable control

of all four drivers with one signal. When disabled or powered off, the driver outputs present a high-impedance

to the bus for reduced system loading.

The SN75LBC174A is characterized for operation over the temperature range of 0°C to 70°C. The

SN65LBC174A is characterized for operation over the temperature range of −40°C to 85°C.

AVAILABLE OPTIONS

PACKAGE

16-PIN PLASTIC

SMALL OUTLINE

(JEDEC MS-013)

20-PIN PLASTIC

SMALL OUTLINE

(JEDEC MS-013)

16-PIN PLASTIC

THROUGH-HOLE

(JEDEC MS-001)

T

A

†

SN75LBC174A16DW

SN65LBC174A16DW

SN75LBC174ADW

Marked as 75LBC174A

SN65LBC174ADW

SN75LBC174AN

0°C to 70°C

SN65LBC174AN

−40°C to 85°C

Marked as 65LBC174A

†

Add R suffix for taped and reeled version.

FUNCTION TABLE

(EACH DRIVER)

INPUT

ENABLE

OUTPUTS

A

G

Y

L

Z

H

L

H

OPEN

L

H

L

H

L

OPEN

L

H

L

H

Z

OPEN

X

L

Z

H = high level, L = low level, X = irrelevant,

Z = high impedance (off)

LinBiCMOS is a trademark of Texas Instruments.

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

equivalent input and output schematic diagrams

Y or Z Output

A or EN Input

V

CC

V

CC

16 V

20 V

100 kΩ

1 kΩ

Input

Output

16 V

17 V

9 V

†

absolute maximum ratings

Supply voltage range, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V

CC

Voltage range at any bus (DC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −10 V to 15 V

Voltage range at any bus (transient pulse through 100 Ω, see Figure 8) . . . . . . . . . . . . . . . . . . . . . −30 V to 30 V

Input voltage range at any A or EN terminal, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V

+ 0.5 V

I

CC

Electrostatic discharge: Human body model (see Note 2)

Y, Z, and GND . . . . . . . . . . . . . . . . . . . . . 13 kV

All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 kV

Charged-device model (see Note 3) All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to GND.

2. Tested in accordance with JEDEC standard 22, Test Method A114-A.

3. Tested in accordance with JEDEC standard 22, Test Method C101.

DISSIPATION RATING TABLE

‡

JEDEC

BOARD

MODEL

T

A

≤ 25°C

DERATING FACTOR

T

= 70°C

T = 85°C

A

PACKAGE

POWER RATING

ABOVE T = 25°C

POWER RATING POWER RATING

A

Low K

High K

Low K

High K

Low K

1200 mW

2240 mW

1483 mW

2753 mW

1150 mW

9.6 mW/°C

17.9 mW/°C

11.86 mW/°C

22 mW/°C

769 mW

1434 mW

949 mW

1762 mW

736 mW

625 mW

1165 mW

771 mW

1432 mW

598 mW

16-PIN DW

20-PIN DW

16-PIN N

9.2 mW/°C

‡

This is the inverse of the junction-to-ambient thermal resistance when board-mounted with no air flow.

3

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

recommended operating conditions

MIN NOM

MAX

5.25

12

UNIT

V

Supply voltage, V

CC

4.75

−7

2

5

Voltage at any bus terminal

High-level input voltage, V

Y, Z

V

CC

0.8

IH

A, EN

V

Low-level input voltage, V

0

IL

Output current

−60

0

60

70

85

mA

SN75LBC174A

SN65LBC174A

Operating free-air temperature, T

°C

A

−40

electrical characteristics over recommended operating conditions

†

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

V

Input clamp voltage

Open-circuit output voltage

I = −18 mA

−1.5 −0.77

IK

I

Y or Z, No load

0

3

V

O

CC

No load (open circuit)

CC

2.5

Steady-state differential output

voltage magnitude

R

= 54 Ω, See Figure 1

1

1.6

V

OD(SS)



V

L

‡

With common-mode loading, See Figure 2

2.5

Change in steady-state differential

output voltage between logic

states

∆V

OD(SS)

See Figure 1

−0.1

2

0.1

V

Steady-state common-mode

output voltage

V

See Figure 3

2.4

2.8

OC(SS)

Change in steady-state

common-mode output voltage

between logic states

∆V

OC(SS)

See Figure 3

A, G, G

−0.02

0.02

I

Input current

−50

50

µA

I

V = 0 V

I

Short-circuit output current

−200

200

mA

OS

V = V

I CC

V

= −7 V to 12 V,

High-impedance-state output

current

TEST

See Figure 7

I

EN at 0 V

= 0 V

−50

−10

50

OZ

µA

Output current with power off

V

10

23

O(OFF)

CC

All drivers enabled

All drivers disabled

V = 0 V or V

I

No load

CC,

I

Supply current

mA

CC

1.5

†

‡

All typical values are at V

The minimum V

OD

of lower output signal into account in determining the maximum signal transmission distance.

= 5 V and 25°C.

may not fully comply with TIA/EIA-485-A at operating temperatures below 0°C. System designers should take the possibly

CC

4

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

switching characteristics over recommended operating conditions

PARAMETER

TEST CONDITIONS

MIN

5.5

3

TYP

8

MAX

11

2

UNIT

ns

t

Propagation delay time, low-to-high level output

Propagation delay time, high-to-low level output

Differential output voltage rise time

PLH

8

ns

PHL

7.5

0.6

ns

r

f

Differential output voltage fall time

3

ns

R

= 54 Ω, C = 50 pF,

L

See Figure 4

L

t

Pulse skew |t

– t

|

ns

sk(p)

PLH PHL

2

†

t

2

ns

Output skew

sk(o)

sk(pp)

PZH

PHZ

PZL

‡

3

Part-to-part skew

Propagation delay time, high-impedance-to-high-level output

Propagation delay time, high-level-output-to-high impedance

Propagation delay time, high-impedance-to-low-level output

Propagation delay time, low-level-output-to-high impedance

25

30

20

See Figure 5

See Figure 6

PLZ

†

‡

Output skew (t

Part-to-part skew (t

sk(pp)

) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together.

sk(o)

) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when

both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test

circuits.

5

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

I

OY

Y

Z

I

A

V

OD

54 Ω

I

V

OY

OZ

GND

V

I

OZ

Figure 1. Test Circuit, V

Without Common-Mode Loading

OD

375 Ω

Y

A

V

OD

V

TEST

= −7 V to 12 V

Input

60 Ω

375 Ω

Z

V

TEST

V

I

Figure 2. Test Circuit, V

With Common-Mode Loading

OD

27 Ω

Y

A

27 Ω

Z

V

Signal

Generator

OC

‡

= 50 pF

C

50 Ω

L

†

‡

PRR = 1 MHz, 50% duty cycle, t < 6 ns, t < 6 ns, Z = 50 Ω

Includes probe and jig capacitance

r

f

O

Figure 3. V

Test Circuit

OC

6

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

Y

A

‡

C = 50 pF

L

V

OD

R

= 54 Ω

L

Z

Signal

Generator

50 Ω

†

‡

PRR = 1 MHz, 50% duty cycle, t < 6 ns, t < 6 ns, Z = 50 Ω

Includes probe and jig capacitance

r

f

O

3 V

1.5 V

0 V

Input

t

PHL

PLH

≈ 1.5 V

90%

0 V

10%

Output

≈ −1.5 V

t

f

r

Figure 4. Output Switching Test Circuit and Waveforms

7

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

Y

S1

A

Output

‡

3 V or 0 V w

Z

C

= 50 pF

R = 110 Ω

L

Input

EN

Signal

Generator

50 Ω

†

‡

§

PRR = 1 MHz, 50% duty cycle, t < 6 ns, t < 6 ns, Z = 50 Ω

Includes probe and jig capacitance

3 V if testing Y output, 0 V if testing Z output

r

f

O

3 V

1.5 V

0 V

Input

t

0.5 V

PZH

V

OH

2.3 V

0 V

Output

t

PHZ

Figure 5. Enable Timing Test Circuit and Waveforms, t

and t

PHZ

PZH

8

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

5 V

R

= 110 Ω

L

Y

S1

A

Output

0 V or 3 V w

Z

‡

= 50 pF

C

L

Input

EN

Signal

Generator

50 Ω

†

‡

§

PRR = 1 MHz, 50% duty cycle, t < 6 ns, t < 6 ns, Z = 50 Ω

Includes probe and jig capacitance

3 V if testing Y output, 0 V if testing Z output

r

f

O

3 V

1.5 V

0 V

Input

t

PZL

t

PLZ

5 V

Output

2.3 V

V

OL

0.5 V

Figure 6. Enable Timing Test Circuit and Waveforms, t

and t

PLZ

PZL

9

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SLLS446C − OCTOBER 2000 − REVISED MAY 2003

PARAMETER MEASUREMENT INFORMATION

Y

I

O

V

I

Z

V

TEST

Voltage Source

= −7 V to 12 V

V

TEST

Slew Rate ≤ 1.2 V/µs

Figure 7. Test Circuit, Short-Circuit Output Current

Y

Z

V

TEST

100 Ω

0 V

15 µs

−V

TEST

Pulse Generator

15 µs Duration,

1% Duty Cycle

1.5 ms

Figure 8. Test Circuit Waveform, Transient Over-Voltage Test

10

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢌ ꢍꢊꢎꢏ ꢍꢐꢄ ꢑ ꢏꢀ ꢒꢉꢓ ꢃ ꢎꢔ ꢕꢕ ꢑꢏ ꢑꢁꢖ ꢔꢊ ꢄ ꢄ ꢔꢁꢑ ꢎ ꢏꢔ ꢗ ꢑꢏ ꢀ

SLLS446C − OCTOBER 2000 − REVISED MAY 2003

TYPICAL CHARACTERISTICS

DIFFERENTIAL OUTPUT VOLTAGE

vs

OUTPUT CURRENT

FREE-AIR TEMPERATURE

4

2.5

3.5

3

V

CC

= 5.25 V

2

V

CC

= 5 V

V

CC

= 5.25 V

2.5

2

1.5

V

CC

= 5 V

V

CC

= 4.75 V

1

0.5

0

1.5

1

V

= 4.75 V

CC

0.5

0

20

40

60

80

100

−60 −40 −20

0

20

40

60

80

100

I

O

− Output Current − mA

T

A

− Free-Air Temperature − °C

Figure 9

Figure 10

PROPAGATION DELAY TIME

vs

SUPPLY CURRENT (FOUR CHANNELS)

vs

FREE-AIR TEMPERATURE

SIGNALING RATE

8.5

144

142

140

138

136

134

132

130

128

R

C

= 54 Ω

= 50 pF

L

8

(Each Channel)

V

= 5.25 V

CC

7.5

V

= 4.75 V

CC

7

6.5

6

5.5

5

−40

−20

0

20

40

60

80

1

10

100

T

A

− Free-Air Temperature − °C

Signaling Rate − Mbps

Figure 11

Figure 12

11

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢊ ꢋ ꢀ ꢁꢈ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢊ

ꢌꢍ ꢊ ꢎꢏ ꢍ ꢐꢄ ꢑ ꢏꢀ ꢒꢉ ꢓ ꢃ ꢎꢔ ꢕ ꢕꢑ ꢏꢑ ꢁꢖ ꢔ ꢊꢄ ꢄꢔ ꢁꢑ ꢎꢏꢔ ꢗꢑ ꢏꢀ

SLLS446C − OCTOBER 2000 − REVISED MAY 2003

TYPICAL CHARACTERISTICS

DIFFERENTIAL OUTPUT VOLTAGE

vs

SUPPLY VOLTAGE

3

R

= 54 Ω

L

2.5

2

1.5

1

0.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5 6

V

CC

− Supply Voltage − V

Figure 13

R

C

= 54 Ω

= 50 pF

L

Figure 14. Eye Pattern, Pseudorandom Data at 30 Mbps

12

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀꢁꢂ ꢃ ꢄ ꢅꢆꢇ ꢈ ꢉ ꢊꢋ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊ

ꢌ ꢍꢊꢎꢏ ꢍꢐꢄ ꢑ ꢏꢀ ꢒꢉꢓ ꢃ ꢎꢔ ꢕꢕ ꢑꢏ ꢑꢁꢖ ꢔꢊ ꢄ ꢄ ꢔꢁꢑ ꢎ ꢏꢔ ꢗ ꢑꢏ ꢀ

SLLS446C − OCTOBER 2000 − REVISED MAY 2003

APPLICATION INFORMATION

TMS320F243

DSP

SN65LBC174A

SN65LBC175A

TMS320F241

DSP

(Controller)

(Embedded

Application)

SPISIMO

IOPA1

(Enable)

SPISTE

SPICLK

IOPA2

IOPA0

IOPA2

(Enable)

IOPA0

(Handshake

/Status)

SPISOMI

Figure 15. Typical Application Circuit, DSP-to-DSP Link via Serial Peripheral Interface

13

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

29-Jan-2007

PACKAGING INFORMATION

Orderable Device

SN65LBC174A16DW

SN65LBC174A16DWG4

SN65LBC174A16DWR

SN65LBC174A16DWRG4

SN65LBC174ADW

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

DW

16

20

16

20

16

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

PDIP

SOIC

PDIP

DW

N

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN65LBC174ADWG4

SN65LBC174ADWR

SN65LBC174ADWRG4

SN65LBC174AN

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25

Pb-Free

(RoHS)

CU NIPD

N / A for Pkg Type

SN75LBC174A16DW

SN75LBC174A16DWR

SN75LBC174A16DWRG4

SN75LBC174ADW

DW

N

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN75LBC174ADWG4

SN75LBC174ADWR

SN75LBC174ADWRG4

SN75LBC174AN

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25

Pb-Free

(RoHS)

CU NIPD

N / A for Pkg Type

SN75LBC174ANE4

N

25

Pb-Free

(RoHS)

CU NIPD

N / A for Pkg Type

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

29-Jan-2007

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to

discontinue any product or service without notice. Customers should obtain the latest relevant information

before placing orders and should verify that such information is current and complete. All products are sold

subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent

TI deems necessary to support this warranty. Except where mandated by government requirements, testing

of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible

for their products and applications using TI components. To minimize the risks associated with customer

products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent

right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,

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products or services does not constitute a license from TI to use such products or services or a warranty or

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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

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Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for

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and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Amplifiers

Data Converters

DSP

Interface

Applications

Audio

Automotive

Broadband

Digital Control

Military

amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

interface.ti.com

logic.ti.com

www.ti.com/audio

www.ti.com/automotive

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Logic

Power Mgmt

Microcontrollers

Low Power Wireless

power.ti.com

microcontroller.ti.com

www.ti.com/lpw

Optical Networking

Security

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Video & Imaging

Wireless

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265


型号：	SN75LBC174ADWR
厂家：	TEXAS INSTRUMENTS
描述：	QUADRUPLE RS-485 DIFFERENTIAL LINE DRIVERS 四路RS - 485差动线路驱动器驱动器
文件：	总19页 (文件大小：480K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SN75LBC174ADWR [TI]

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