SN75LBC175ADR [TI]
QUADRUPLE RS-485 DIFFERENTIAL LINE RECEIVERS; 四路RS - 485差动线路接收器
| 型号： | SN75LBC175ADR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE RS-485 DIFFERENTIAL LINE RECEIVERS |
| 文件： | 总14页 (文件大小：338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢋ ꢌꢉꢍꢎ ꢌꢏꢄ ꢐ ꢎꢀ ꢑꢒꢓ ꢃ ꢍꢔ ꢕꢕ ꢐꢎ ꢐꢁꢖ ꢔꢉ ꢄ ꢄ ꢔꢁꢐ ꢎꢐ ꢆꢐ ꢔ ꢗꢐ ꢎ ꢀ
SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
SN65LBC175A (Marked as 65LBC175A)
SN75LBC175A (Marked as 75LBC175A)
D or N PACKAGE
D
Designed for TIA/EIA-485, TIA/EIA-422, and
ISO 8482 Applications
1
D
Signaling Rate Exceeding 50 Mbps
(TOP VIEW)
D
Fail-Safe in Bus Short-Circuit, Open-Circuit,
and Idle-Bus Conditions
1B
1A
V
CC
4B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
D
D
D
D
D
ESD Protection on Bus Inputs
Exceeds 6 kV
1Y
4A
1,2EN
2Y
4Y
Common-Mode Bus Input Range
–7 V to 12 V
3,4EN
3Y
2A
Propagation Delay Times <16 ns
2B
10 3A
3B
GND
9
Low Standby Power Consumption <20 µA
Pin-Compatible Upgrade for MC3486,
DS96F175, LTC489, and SN75175
logic diagram
1,2EN
description
1A
1B
The SN65LBC175A and SN75LBC175A are
1Y
2Y
quadruple differential line receivers with 3-state
outputs, designed for TIA/EIA-485 (RS-485),
TIA/EIA-422 (RS-422), and ISO 8482 (Euro
RS-485) applications.
2A
2B
These devices are optimized for balanced
multipoint bus communication at data rates up to
and exceeding 50 million bits per second. The
transmission media may be twisted-pair cables,
printed-circuit board traces, or backplanes. The
ultimate rate and distance of data transfer is
dependent upon the attenuation characteristics of
the media and the noise coupling to the
environment.
3,4EN
3A
3B
3Y
4Y
4A
4B
Each receiver operates over a wide range of positive and negative common-mode input voltages, and features
ESD protection to 6 kV, making it suitable for high-speed multipoint data transmission applications in harsh
environments. These devices are designed using LinBiCMOSt, facilitating low power consumption and
inherent robustness.
Two EN inputs provide pair-wise enable control, or these can be tied together externally to enable all four drivers
with the same signal.
The SN75LBC175A is characterized for operation over the temperature range of 0°C to 70°C. The
SN65LBC175A is characterized over the temperature range from −40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinBiCMOS is a trademark of Texas Instruments.
1
The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second).
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Copyright 2001, Texas Instruments Incorporated
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1
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ꢋꢌ ꢉ ꢍꢎ ꢌ ꢏꢄ ꢐ ꢎ ꢀꢑ ꢒꢓ ꢃ ꢍꢔ ꢕ ꢕꢐ ꢎꢐ ꢁꢖ ꢔ ꢉꢄ ꢄꢔ ꢁꢐ ꢎꢐꢆ ꢐꢔꢗ ꢐꢎꢀ
SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
FUNCTION TABLE
(each receiver)
DIFFERENTIAL INPUTS
A – B (V
ENABLE
EN
OUTPUT
Y
)
ID
≤ −0.2 V
V
H
L
?
ID
−0.2 V < V < −0.01 V
H
H
ID
−0.01 V ≤ V
H
Z
Z
ID
X
X
L
OPEN
Short circuit
Open circuit
H
H
H
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off),
? = indeterminate
AVAILABLE OPTIONS
PACKAGE
PLASTIC
SMALL OUTLINE
(JEDEC MS-012)
SN75LBC175AD
SN65LBC175AD
PLASTIC
DUAL-IN-LINE
(JEDEC MS-001)
T
A
†
0°C to 70°C
SN75LBC175AN
SN65LBC175AN
−40°C to 85°C
†
†
Add an R suffix for taped and reeled
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI web site at www.ti.com.
equivalent input and output schematic diagrams
A Input
B Input
V
CC
V
CC
100 kΩ
18 kΩ
4 kΩ
4 Ω
16 V
16 V
16 V
16 V
18 kΩ
Input
Input
100 kΩ
4 kΩ
4 kΩ
Enable Input
Y Output
V
CC
V
CC
5 Ω
1 kΩ
Output
Input
8 V
8 V
100 kΩ
8 V
2
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Voltage range at any bus input (steady state), A and B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −10 V to 15 V
Voltage range at any bus input (transient pulse through 100 Ω, see Figure 5) . . . . . . . . . . . . . . −30 V to 30 V
Voltage input range at 1,2EN and 3,4EN, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
I
CC
Receiver output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
O
Electrostatic discharge:
Human body model (see Note 2):
A and B to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 kV
All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 kV
Charged-device model (see Note 3): All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Power Dissipation Rating Table
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to GND, and are steady-state (unless otherwise specified).
2. Tested in accordance with JEDEC Standard 22, Test Method A114-A.
3. Tested in accordance with JEDEC Standard 22, Test Method C101.
DISSIPATION RATING TABLE
†
T
≤ 25°C
DERATING FACTOR
T
A
= 70°C
T = 85°C
A
A
PACKAGE
POWER RATING
ABOVE T = 25°C
POWER RATING POWER RATING
A
D
N
1080 mW
8.7 mW/°C
9.2 mW/°C
690 mW
736 mW
560 mW
598 mW
1150 mW
†
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air
flow.
recommended operating conditions
MIN NOM
MAX
5.25
12
UNIT
V
Supply voltage, V
CC
4.75
−7
2
5
Voltage at any bus terminal
A, B
EN
V
High-level input voltage, V
V
CC
0.8
IH
V
Low-level input voltage, V
Output current
0
IL
Y
−8
0
8
70
85
mA
SN75LBC175A
SN65LBC175A
Operating free-air temperature, T
°C
A
−40
3
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
electrical characteristics over recommended operating conditions
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
V
V
Positive-going differential input voltage threshold
−80
−200 −120
−40
−10
IT+
−7 V < V
CM
< 12 V (V
CM
= (V + V ) / 2 )
mV
Negative-going differential input voltage
threshold
A
B
IT−
V
V
Hysteresis voltage (V
− V
)
mV
V
HYS
IT+ IT−
Input clamp voltage
I = −18 mA
I
−1.5
2.7
−0.8
4.8
IK
V
OH
= 200 mV,
= −8 mA
ID
V
V
High-level output voltage
Low-level output voltage
OH
I
See Figure 1
V
V
OL
= −200 mV,
= 8 mA
ID
0.2
0.4
OL
I
I
High-impedance-state output current
V = 0 V to V
O CC
−1
1
µA
OZ
V = 12 V
0.9
I
Other input at 0 V,
= 0 V or 5 V
I
I
Line input current
mA
V
CC
V = −7 V
I
−0.7
I
High-level input current
100
µA
µA
IH
Enable inputs
I
IL
Low-level input current
Input resistance
−100
12
R
A, B
= 5 V
kΩ
mA
mA
I
V
1,2EN, 3,4EN at 0 V
20
16
ID
No load
I
Supply current
CC
1,2EN, 3,4EN at V
CC
11
†
All typical values are at V
CC
= 5 V and 25°C.
switching characteristics over recommended operating conditions
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
4
UNIT
ns
t
r
Output rise time
Output fall time
2
2
t
f
4
ns
V
ID
= −3 V to 3 V, See Figure 2
t
Propagation delay time, low-to-high level output
9
9
12
12
27
7
16
16
38
16
38
16
1
ns
PLH
t
Propagation delay time, high-to-low level output
ns
PHL
t
Propagation delay time, high-impedance to high-level output
Propagation delay time, high-level to high-impedance output
Propagation delay time, high-impedance to low level output
Propagation delay time, low-level to high-impedance output
ns
PZH
See Figure 3
See Figure 4
t
ns
PHZ
t
29
12
0.2
ns
PZL
t
ns
PLZ
t
Pulse skew (| (t
– t
|)
ns
sk(p)
PLH PHL)
t
Output skew (see Note 4)
Part-to-part skew (see Note 5)
All typical values are at V = 5 V and 25°C.
2
ns
sk(o)
t
2
ns
sk(pp)
†
CC
NOTES: 4. Outputs skew (t
) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs
sk(o)
connected together.
5. Part-to-part skew (t
) is the magnitude of the difference in propagation delay times between any specified terminals of two
sk(pp)
devices when both devices operate with the same input signals, the same supply voltages, at the same temperature, and have
identical packages and test circuits.
4
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
V
A
I
O
V
ID
V
B
V
O
Figure 1. Voltage and Current Definitions
Input B
3 V
0 V
A
B
Generator
Generator
50 Ω
50 Ω
1.5 V
1.5 V
Y
Input A
t
t
PLH
PHL
C
= 15 pF
V
L
OH
OL
90%
10%
90%
10%
(Includes Probe and
Jig Capacitance)
Output Y
1.5 V
V
t
t
r
f
Generators: PRR = 1 MHz, 50% Duty Cycle,
t <6 ns, Z = 50 Ω
r
o
Figure 2. Switching Test Circuit and Waveforms
V
CC
A
B
1.5 V
1 kΩ
Y
3 V
0 V
1.5 V
1.5 V
EN
EN
C
= 15 pF
L
(Includes Probe and
Jig Capacitance)
t
t
PHZ
PZH
V
OH
V
OH
−0.5 V
Generator
50 Ω
1.5 V
Y
GND
C
L
= 15 pF
Generators: PRR = 1 MHz, 50% Duty Cycle,
t <6 ns, Z = 50 Ω
r
o
Figure 3. Test Circuit Waveforms, t
and t
PHZ
PZH
5
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
V
CC
A
B
−1.5 V
1 kΩ
Y
3 V
0 V
C
= 15 pF
L
EN
EN
1.5 V
1.5 V
(Includes Probe and
Jig Capacitance)
t
t
PLZ
PZL
Y
V
CC
Generator
50 Ω
1.5 V
V
OL
+ 0.5 V
V
OL
Generators: PRR = 1 MHz, 50% Duty Cycle,
t <6 ns, Z = 50 Ω
r
o
Figure 4. Test Circuit Waveforms, t
and t
PLZ
PZL
V
TEST
100 Ω
0 V
15 µs
Pulse Generator,
15 µs Duration,
1% Duty Cycle
1.5 ms
V
TEST
Figure 5. Test Circuit and Waveform, Transient Over-Voltage Test
6
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
TYPICAL CHARACTERISTICS
BUS INPUT CURRENT
OUTPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE
vs
BUS INPUT VOLTAGE
800
600
6
5
4
3
2
1
V
T
A
= 5 V
CC
= 25°C
V
= 0 V
V
CC
V
= −7 V
= 0 V
IC
IC
IC
400
200
0
V
V
= 12 V
= 5 V
CC
V
= −7 V
= 0 V
IC
IC
IC
V
V
= 12 V
−200
−400
−600
0
−10
−5
0
5
10
15
−150
−100
−50
0
50
Bus Input Voltage − V
Differential Input Voltage − mV
Figure 6
Figure 7
SUPPLY CURRENT
vs
PROPAGATION DELAY TIME
vs
SIGNALING RATE (ALL FOUR CHANNELS)
FREE-AIR TEMPERATURE
60
50
13.5
13
t
PLH
40
30
V
= 5.25 V, C = 15 pF
L
CC
12.5
V
= 5 V, C = 15 pF
L
CC
t
PHL
12
11.5
11
V
CC
= 4.75 V, C = 15 pF
L
20
10
V
CC
= 5 V, No Load
0
1
10
100
−40
−20
0
20
40
60
80
Signaling Rate (All Four Channels) − Mbps
T
A
− Free-Air Temperature − °C
Figure 8
Figure 9
7
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
TYPICAL CHARACTERISTICS
500 mV
A, B
−500 mV
5 V
20 ns
Y
0 V
Figure 10. Receiver Inputs and Outputs, 50 Mbps Signaling Rate
8
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SLLS455B − NOVEMBER 2000 − REVISED MARCH 2005
APPLICATION INFORMATION
TMS320F243
DSP
SN65LBC174A
SN65LBC175A
TMS320F241
DSP
(Controller)
(Embedded
Application)
SPISIMO
SPISIMO
IOPA1
(Enable)
IOPA1
SPISTE
SPISTE
SPICLK
SPICLK
IOPA2
IOPA2
(Enable)
IOPA0
(Handshake
/Status)
IOPA0
SPISOMI
SPISOMI
Figure 11. Typical Application Circuit, DSP-to-DSP Link via Serial Peripheral Interface
Motion Controller
Servo
SN65LBC175A
Drive
Encoder Phase A
Encoder Phase B
Encoder Index
Status Bit
Figure 12. Typical Application Circuit, High-Speed Servomotor Encoder Interface
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-Mar-2006
PACKAGING INFORMATION
Orderable Device
SN65LBC175AD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65LBC175ADG4
SN65LBC175ADR
SN65LBC175ADRG4
SN65LBC175AN
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
N
N
D
D
D
D
N
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65LBC175ANE4
SN75LBC175AD
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75LBC175ADG4
SN75LBC175ADR
SN75LBC175ADRG4
SN75LBC175AN
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75LBC175ANE4
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Mar-2006
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
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