SN75LBC180DR [TI]
LOW-POWER RS-485 LINE DRIVER AND RECEIVER PAIRS; 低功耗RS - 485线路驱动器和接收器对
| 型号： | SN75LBC180DR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-POWER RS-485 LINE DRIVER AND RECEIVER PAIRS |
| 文件： | 总24页 (文件大小：877K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN55LBC180
SN65LBC180
SN75LBC180
RSA−16
D−14
N−14
www.ti.com................................................................................................................................................... SLLS174G–FEBRUARY 1994–REVISED APRIL 2009
LOW-POWER RS-485 LINE DRIVER AND RECEIVER PAIRS
1
FEATURES
RSA PACKAGE
(TOP VIEW)
D OR N PACKAGE
(TOP VIEW)
2
•
Designed for High-Speed Multipoint Data
Transmission Over Long Cables
NC
V
V
1
2
3
4
5
6
7
14
13
12
11
10
9
CC
•
•
•
Operate With Pulse Durations as Low as 30 ns
Low Supply Current . . . 5 mA Max
R
RE
CC
16 15 14 13
A
Meet or Exceed the Requirements of ANSI
Standard RS-485 and ISO 8482:1987(E)
1
A
B
Z
NC
R
12
DE
B
2
3
4
11
10
9
D
Z
RE
DE
GND
GND
Y
•
•
•
3-State Outputs for Party-Line Buses
Y
8
NC
5
6 7 8
Common-Mode Voltage Range of –7 V to 12 V
Thermal Shutdown Protection Prevents
Driver Damage From Bus Contention
NC − No internal connection
Pins 6 and 7 are connected together internally
Pins 13 and 14 are connected together internally
•
•
Positive and Negative Output Current
Limiting
Pin Compatible With the SN75ALS180
logic diagram (positive logic)
4
DESCRIPTION
DE
9
The SN55LBC180, SN65LBC180 and SN75LBC180
differential driver and receiver pairs are monolithic
integrated circuits designed for bidirectional data
communication over long cables that take on the
characteristics of transmission lines. They are
balanced, or differential, voltage mode devices that
meet or exceed the requirements of industry
standards ANSI RS-485 and ISO 8482:1987(E).
These devices are designed using TI's proprietary
LinBiCMOS™ with the low-power consumption of
CMOS and the precision and robustness of bipolar
transistors in the same circuit.
5
3
Y
D
10
Z
RE
12
11
2
A
B
R
this deviceinfo section is for space between the para and table
ORDERING INFORMATION
TA
PACKAGE
PDIP
PART NUMBER
SN75LBC180N
SN75LBC180D
SN75LBC180RSA
SN65LBC180N
SN65LBC180D
SN65LBC180RSA
SN55LBC180RSA
PART MARKING
SN75LBC180N
7LB180
0°C to 70°C
SOIC
QFN
LB180
PDIP
65LBC180N
6LB180
–40°C to 85°C
–55°C to 125°C
SOIC
QFN
BL180
QFN
SN55LBC180
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
LinBiCMOS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2009, Texas Instruments Incorporated
SN55LBC180
SN65LBC180
SN75LBC180
SLLS174G–FEBRUARY 1994–REVISED APRIL 2009................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The SN55LBC180, SN65LBC180 and SN75LBC180 combine a differential line driver and receiver with 3-state
outputs and operate from a single 5-V supply. The driver and receiver have active-high and active-low enables,
respectively, which can be externally connected to function as a direction control. The driver differential outputs
and the receiver differential inputs are connected to separate terminals for full-duplex operation and are designed
to present minimum loading to the bus whether disabled or powered off (VCC = 0). These parts feature a wide
common-mode voltage range making them suitable for point-to-point or multipoint data-bus applications.
The devices also provide positive and negative output-current limiting and thermal shutdown for protection from
line fault conditions. The line driver shuts down at a junction temperature of approximately 172°C.
The SN75LBC180 is characterized for operation over the commercial temperature range of 0°C to 70°C. The
SN65LBC180 is characterized over the industrial temperature range of –40°C to 85°C.
The SN55LBC180 is characterized for operation over the military temperature range of –55°C to 125°C.
FUNCTION TABLES(1)
DRIVER
INPUT
D
ENABLE
DE
OUTPUTS
Y
H
L
Z
H
L
H
H
L
L
H
Z
X
Z
RECEIVER
DIFFERENTIAL INPUTS
A–B
ENABLE
RE
OUTPUT
R
V
ID ≥ 0.2 V
L
L
L
H
L
H
?
–0.2 V < VID < 0.2 V
VID ≤ –0.2 V
L
X
Z
H
Open circuit
(1) H = high level, L = low level, ? = Indeterminate, X = irrelevant,
Z = high impedance (off)
2
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Product Folder Link(s): SN55LBC180 SN65LBC180 SN75LBC180
SN55LBC180
SN65LBC180
SN75LBC180
www.ti.com................................................................................................................................................... SLLS174G–FEBRUARY 1994–REVISED APRIL 2009
ABSOLUTE MAXIMUM RATINGS(1)
UNIT
(2)
VCC
Supply voltage range
–0.3 to 7
V
V
V
VBUS
Bus voltage range (A, B, Y, Z)(2)
Voltage range at D, R, DE, RE(2)
Continuous total power dissipation(3)
Total power dissipation
–10 to 15
–0.3 to VCC + 0.5
Internally limited
See Dissipation Rating Table
Tstg
IO
Storage temperature range
Receiver output current range
–65 to 150
–50 to 50
±4
°C
mA
kV
V
HBM (Human Body Model) EIA/JESD22-A114
ESD
Electrostatic discharge
MM (Machine Model) EIA/JESD22-A115
400
CDM (Charge Device Model) EIA/JESD22-C101
1.5
kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) The maximum operating junction temperature is internally limited. Use the dissipation rating table to operate below this temperature.
DISSIPATION RATING TABLE
T
A ≤ 25°C
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
PACKAGE(1)
POWER RATING
D
N
950 mW
7.6 mW/°C
9.2 mW/°C
608 mW
736 mW
2133 mW
494 mW
598 mW
1733 mW
—
—
1150 mW
RSA
3333 mW
26.67 mW/°C
400 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
RECOMMENDED OPERATING CONDITIONS
MIN NOM
MAX UNIT
VCC
Supply voltage
4.75
2
5
5.25
V
V
V
V
V
VIH
High-level input voltage
D, DE, and RE
D, DE, and RE
VIL
Low-level input voltage
0.8
6
VID
Differential input voltage
–6(1)
–7(1)
VO, VI, or VIC
Voltage at any bus terminal (separately or common mode)
A, B, Y, or Z
Y or Z
12
–60
–8
60
8
IOH
High-level output current
Low-level output current
mA
mA
R
Y or Z
IOL
R
SN55LBC180
SN65LBC180
SN75LBC180
–55
–40
0
125
85
70
TA
Operating free-air temperature
°C
(1) The algebraic convention where the least positive (more negative) limit is designated minimum, is used in this data sheet for the
differential input voltage, voltage at any bus terminal, operating temperature, input threshold voltage, and common-mode output voltage.
Copyright © 1994–2009, Texas Instruments Incorporated
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SN55LBC180
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SN75LBC180
SLLS174G–FEBRUARY 1994–REVISED APRIL 2009................................................................................................................................................... www.ti.com
DRIVER SECTION
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
Input clamp voltage
TEST CONDITIONS
II = -18 mA
MIN TYP(1)
MAX UNIT
VIK
–1.5
V
SN55LBC180
SN65LBC180
SN75LBC180
SN55LBC180
SN65LBC180
SN75LBC180
1
1.1
1.5
1
2.5
2.5
2.5
2.5
2
5
RL = 54 Ω,
See Figure 1
5
5
5
| VOD
|
Differential output voltage magnitude(2)
V
RL = 60 Ω,
See Figure 2
1.1
1.5
5
2
5
Δ| VOD
|
|
Change in magnitude of differential output voltage(3) See Figure 1 and Figure 2
±0.2
3
V
V
VOC
Common-mode output voltage
1
2.5
RL = 54 Ω,
See Figure 1
Change in magnitude of common-mode output
voltage(3)
Δ| VOC
±0.2
V
IO
Output current with power off
High-impedance-state output current
High-level input current
VCC = 0,
VO = –7 V to 12 V
±100
±100
100
100
±250
5
µA
µA
µA
µA
mA
IOZ
IIH
IIL
VO = –7 V to 12 V
VI = 2.4 V
Low-level input current
VI = 0.4 V
IOS
Short-circuit output current
–7 V ≤ VO ≤ 12 V
Outputs enabled
Outputs disabled
ICC
Supply current
Receiver disabled
mA
3
(1) All typical values are at VCC = 5 V and TA = 25°C.
(2) The minimum VOD specification may not fully comply with ANSI RS-485 at operating temperatures below 0°C. System designers should
take the possibly lower output signal into account in determining the maximum signal-transmission distance.
(3) Δ|VOD| and Δ|VOC| are the changes in the steady-state magnitude of VOD and VOC, respectively, that occur when the input is changed
from a high level to a low level.
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
18
UNIT
ns
td(OD)
tt(OD)
tPZH
tPZL
Differential output delay time
7
5
12
10
RL = 54 Ω,
See Figure 3
Differential output transition time
Output enable time to high level
Output enable time to low level
Output disable time from high level
Output disable time from low level
20
ns
RL = 110 Ω,
RL = 110 Ω,
RL = 110 Ω,
RL = 110 Ω,
See Figure 4
See Figure 5
See Figure 4
See Figure 5
35
ns
35
ns
tPHZ
tPLZ
50
ns
35
ns
SWITCHING CHARACTERISTICS (SN55LBC180)
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
ns
td(OD)
tt(OD)
tPZH
tPHZ
tPZL
Differential output delay time
15
21
32
55
32
20
RL = 54 Ω,
See Figure 3
See Figure 4
See Figure 5
Differential output transition time
Output enable time to high level
Output disable time from high level
Output enable time to low level
Output disable time from low level
ns
RL = 110 Ω,
RL = 110 Ω,
ns
ns
tPLZ
4
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Copyright © 1994–2009, Texas Instruments Incorporated
Product Folder Link(s): SN55LBC180 SN65LBC180 SN75LBC180
SN55LBC180
SN65LBC180
SN75LBC180
www.ti.com................................................................................................................................................... SLLS174G–FEBRUARY 1994–REVISED APRIL 2009
RECEIVER SECTION
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VIT+ Positive-going input threshold voltage
VIT– Negative-going input threshold voltage
IO = –8 mA
IO = 8 mA
0.2
V
V
–0.2
Vhys Hysteresis voltage (VIT+ – VIT–
)
45
mV
V
VIK Enable-input clamp voltage
II = –18 mA
-1.5
3.5
VOH High-level output voltage
VOL Low-level output voltage
VID = 200 mV,
IOH = –8 mA
IOL = 8 mA
4.5
0.3
V
VID = –200 mV,
VO = 0 V to VCC
VIH = 2.4 V
0.5
V
IOZ
IIH
IIL
High-impedance-state output current
High-level enable-input current
Low-level enable-input current
±20
µA
A
–50
VIL = 0.4 V
–100
µA
VI = 12 V, VCC = 5 V,
VI = 12 V, VCC = 0 V,
VI = -7 V, VCC = 5 V,
VI = -7 V, VCC = 0 V,
Other input at 0 V
Other input at 0 V
Other input at 0 V
Other input at 0 V
Outputs enabled
Outputs disabled
0.7
0.8
1
1
II
Bus input current
Supply current
mA
mA
–0.8
–0.8
-0.5
–0.5
5
3
ICC
Driver disabled
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
tPHL
tPLH
tsk(p)
tt
Propagation delay time, high- to low-level output
11
11
22
22
3
33
33
6
ns
ns
ns
ns
ns
ns
ns
ns
Propagation delay time, low- to high-level output
Pulse skew (| tPHL – tPLH|)
VID = –1.5 V to 1.5 V,
See Figure 6
Transition time
5
8
tPZH
tPZL
tPHZ
tPLZ
Output enable time to high level
Output enable time to low level
Output disable time from high level
Output disable time from low level
35
30
35
30
See Figure 7
SWITCHING CHARACTERISTICS (SN55LBC180)
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
tPHL
tPLH
tsk(p)
tsk(p)t
tPZH
tPHZ
tPZL
tPLZ
Propagation delay time, high- to low-level output
Propagation delay time, low- to high-level output
Pulse skew (| tPHL – tPLH|)
26
23
3
ns
ns
ns
ns
ns
ns
ns
ns
VID = –1.5 V to 1.5 V,
See Figure 6
Transition time
4
Output enable time to high level
Output disable time from high level
Output enable time to low level
Output disable time from low level
30
26
30
30
See Figure 4
Copyright © 1994–2009, Texas Instruments Incorporated
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SN55LBC180
SN65LBC180
SN75LBC180
SLLS174G–FEBRUARY 1994–REVISED APRIL 2009................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
Y
R
L
2
D
V
OD
0 V or 3 V
R
L
2
V
OC
DE at 3 V
Z
Figure 1. Differential and Common-Mode Output Voltages
V
test
–7 V < V
< 12 V
test
R1
375 Ω
Y
D
R
L
= 60 Ω
V
OD
0 V or 3 V
Z
DE at 3 V
R2
375 Ω
V
test
Figure 2. Driver VOD Test Circuit
3 V
0 V
Input
t
1.5 V
1.5 V
Y
C
= 50 pF
L
t
d(OD)
d(OD)
(see Note B)
≈ 2.5 V
90%
50%
10%
90%
Generator
R
L
= 54 Ω
Output
50%
10%
Output
50 Ω
(see Note A)
≈ – 2.5 V
Z
DE at 3 V
t
t
t(OD)
t(OD)
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR > 1 MHz, 50% duty cycle, t ≤ 6 ns, t ≤ 6 ns,
r
f
Z
O
= 50 Ω.
B. C includes probe and jig capacitance.
L
Figure 3. Driver Test Circuit and Differential Output Delay and Transition Time Voltage Waveforms
6
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SN55LBC180
SN65LBC180
SN75LBC180
www.ti.com................................................................................................................................................... SLLS174G–FEBRUARY 1994–REVISED APRIL 2009
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
Y
S1
1.5 V
1.5 V
D
Input
Output
0 V or 3 V
Z
0 V
0.5 V
t
PZH
DE
R
L
= 110 Ω
V
C
= 50 pF
OH
L
Input
Generator
(see Note A)
(see Note B)
Output
50 Ω
2.3 V
V
off
≈ 0
t
PHZ
TEST CIRCUIT
VOLTAGE WAVEFORMS
Figure 4. Driver Test Circuit and Enable and Disable Time Waveforms
5 V
3 V
0 V
1.5 V
1.5 V
Input
Y
Z
R
L
= 110 Ω
S1
D
Output
0 V or 3 V
t
PZL
C
= 50 pF
L
DE
t
PLZ
Input
(see Note B)
Generator
(see Note A)
5 V
50 Ω
0.5 V
2.3 V
Output
V
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
Figure 5. Driver Test Circuit and Enable and Disable Time Voltage Waveforms
3 V
Input
1.5 V
1.5 V
Input
A
B
0 V
R
Generator
(see Note A)
t
t
PHL
Output
PLH
50 Ω
V
V
RE
1.5 V
OH
90%
1.3 V
10%
90%
C
= 15 pF
(see Note B)
L
1.3 V
10%
Output
0 V
OL
t
t
t
t
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t ≤ 6 ns, t ≤ 6 ns,
r
f
Z
O
= 50 Ω.
B. C includes probe and jig capacitance.
L
Figure 6. Receiver Test Circuit and Propagation Delay Time Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION (continued)
Output
S1
1.5 V
A
B
S2
R
2 kΩ
− 1.5 V
5 V
IN916 or Equivalent
(4 places)
C
= 15 pF
RE
L
5 kΩ
(see Note B)
Input
Generator
(see Note A)
50 Ω
S3
TEST CIRCUIT
3 V
S1 to − 1.5 V
S2 Closed
S3 Open
3 V
S1 to 1.5 V
S2 Open
Input
Input
1.5 V
1.5 V
S3 Closed
0 V
0 V
t
PZH
t
PZL
V
OH
≈ 4.5 V
Output
Output
1.5 V
0 V
1.5 V
V
OL
3 V
3 V
0 V
S1 to − 1.5 V
S2 Closed
S3 Closed
S1 to 1.5 V
S2 Closed
S3 Closed
Input
Input
1.5 V
1.5 V
0 V
t
PHZ
t
PLZ
V
OH
≈ 1.3 V
Output
Output
0.5 V
≈ 1.3 V
V
OL
0.5 V
VOLTAGE WAVEFORMS
NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t ≤ 6 ns, t ≤ 6 ns,
r
f
Z
O
= 50 Ω.
B. C includes probe and jig capacitance.
L
Figure 7. Receiver Output Enable and Disable Times
8
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SN55LBC180
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SN75LBC180
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TYPICAL CHARACTERISTICS
SCHEMATICS OF INPUTS AND OUTPUTS
EQUIVALENT OF D, DE, AND RE INPUTS
RECEIVER A INPUT
V
CC
V
CC
100 kΩ
NOM
18 kΩ
3 kΩ
22 kΩ
NOM
NOM
Input
Input
12 kΩ
1.1 kΩ
NOM
DRIVER OUTPUT
TYPICAL OF RECEIVER OUTPUT
V
RECEIVER B INPUT
V
CC
CC
V
CC
3 kΩ
NOM
18 kΩ
NOM
Input
R Output
Output
100 kΩ
12 kΩ
NOM
1.1 kΩ
NOM
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DRIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
DRIVER
LOW-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT CURRENT
5
4.5
4
5
4.5
4
V
= 5 V
V
= 5 V
CC
CC
T = 25°C
A
T = 25°C
A
3.5
3.5
3
3
2.5
2.5
2
2
1.5
1.5
1
1
0.5
0
0.5
0
0
10 20 30 40 50 60 70 80 90 100
0
20
40
60
80
100
120
I
− High-Level Output Current − mA
I
− Low-Level Output Current − mA
OH
OL
Figure 8.
Figure 9.
DRIVER
DRIVER
DIFFERENTIAL OUTPUT VOLTAGE
DIFFERENTIAL OUTPUT VOLTAGE
vs
vs
OUTPUT CURRENT
FREE-AIR TEMPERATURE
4
3.5
3
2.4
2.3
2.2
2.1
2
V
= 5 V
CC
T = 25°C
A
2.5
2
1.9
1.8
1.5
1
1.7
1.6
1.5
0.5
0
0
10 20 30 40 50 60 70 80 90 100
-60 -40 -20
T
0 20 40 60 80 100 120
- Ambient Temperature - °C
I
O
− Output Current − mA
A
Figure 10.
Figure 11.
10
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SN75LBC180
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DRIVER
DIFFERENTIAL DELAY TIMES
vs
DRIVER
OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
20
80
60
R
L
= 54 Ω
18
16
I
OL
40
20
14
12
10
0
−20
−40
−60
−80
8
6
I
OH
-60 -40 -20
T
0 20 40 60 80 100 120
- Ambient Temperature - °C
0
1
2
3
4
5
6
A
V
CC
− Supply Voltage − V
Figure 12.
Figure 13.
RECEIVER
RECEIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT CURRENT
6
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
ID
= 200 mV
V
CC
= 5 V
T
A
= 25°C
V
ID
= − 200 mV
5
4
3
2
1
0
0
5
10
15
20
25
30
35
40
0
−10
− 20
− 30
− 40
− 50
I
− Low-Level Output Current − mA
OL
I
− High-Level Output Current − mA
OH
Figure 14.
Figure 15.
Copyright © 1994–2009, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): SN55LBC180 SN65LBC180 SN75LBC180
SN55LBC180
SN65LBC180
SN75LBC180
SLLS174G–FEBRUARY 1994–REVISED APRIL 2009................................................................................................................................................... www.ti.com
RECEIVER
OUTPUT VOLTAGE
vs
AVERAGE SUPPLY CURRENT
vs
DIFFERENTIAL INPUT VOLTAGE
FREQUENCY
60
55
50
45
40
35
30
25
6
5
T
V
= 25°C
A
= 5 V
CC
DRVR and RCVR Enabled
Driver Load = Receiver Inputs
Receiver Load = 50 pF
V
= 12 V
IC
4
3
2
V
IC
= 0 V
20
15
10
5
V
= −7 V
IC
1
0
0
10 k
− 80 − 60 − 40 − 20
0
20
40
60
80
100 k
1 M
10 M
100 M
V
ID
− Differential Input Voltage − mV
f − Frequency − Hz
Figure 17.
Figure 16.
RECEIVER
BUS INPUT CURRENT
vs
RECEIVER
PROPAGATION DELAY TIME
vs
INPUT VOLTAGE
(COMPLEMENTARY INPUT AT 0 V)
FREE-AIR TEMPERATURE
30
29
28
27
1
0.8
T
V
= 25°C
A
= 5 V
CC
0.6
0.4
0.2
26
25
0
− 0.2
− 0.4
− 0.6
− 0.8
− 1
24
23
22
21
20
The shaded region of this graph represents
more than 1 unit load per RS-485.
− 8 − 6 − 4 − 2
0
2
4
6
8
10 12
-60 -40 -20
T
0 20 40 60 80 100 120
- Ambient Temperature - °C
V − Input Voltage − V
I
A
Figure 18.
Figure 19.
12
Submit Documentation Feedback
Copyright © 1994–2009, Texas Instruments Incorporated
Product Folder Link(s): SN55LBC180 SN65LBC180 SN75LBC180
SN55LBC180
SN65LBC180
SN75LBC180
www.ti.com................................................................................................................................................... SLLS174G–FEBRUARY 1994–REVISED APRIL 2009
APPLICATION INFORMATION
Master Node
Slave Node
Slave Node
Slave Node
Figure 20. Full Duplex Application Circuit
Copyright © 1994–2009, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): SN55LBC180 SN65LBC180 SN75LBC180
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jul-2009
PACKAGING INFORMATION
Orderable Device
SN55LBC180RSAR
SN55LBC180RSAT
SN65LBC180D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RSA
16
16
14
14
14
14
14
14
16
16
16
16
14
14
14
14
14
14
16
16
16
16
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
QFN
QFN
QFN
QFN
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
QFN
QFN
QFN
QFN
RSA
D
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65LBC180DG4
SN65LBC180DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65LBC180DRG4
SN65LBC180N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65LBC180NE4
SN65LBC180RSAR
SN65LBC180RSARG4
SN65LBC180RSAT
SN65LBC180RSATG4
SN75LBC180D
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
RSA
RSA
RSA
RSA
D
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75LBC180DG4
SN75LBC180DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75LBC180DRG4
SN75LBC180N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75LBC180NE4
SN75LBC180RSAR
SN75LBC180RSARG4
SN75LBC180RSAT
SN75LBC180RSATG4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
RSA
RSA
RSA
RSA
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jul-2009
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN55LBC180, SN65LBC180, SN75LBC180 :
Automotive: SN65LBC180-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN55LBC180RSAR
SN55LBC180RSAT
SN65LBC180DR
QFN
QFN
SOIC
QFN
QFN
SOIC
QFN
QFN
RSA
RSA
D
16
16
14
16
16
14
16
16
3000
250
330.0
180.0
330.0
330.0
180.0
330.0
330.0
180.0
12.4
12.4
16.4
12.4
12.4
16.4
12.4
12.4
4.25
4.25
6.5
4.25
4.25
9.0
1.15
1.15
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
16.0
12.0
12.0
16.0
12.0
12.0
Q2
Q2
Q1
Q2
Q2
Q1
Q2
Q2
2500
3000
250
SN65LBC180RSAR
SN65LBC180RSAT
SN75LBC180DR
RSA
RSA
D
4.25
4.25
6.5
4.25
4.25
9.0
1.15
1.15
2.1
2500
3000
250
SN75LBC180RSAR
SN75LBC180RSAT
RSA
RSA
4.25
4.25
4.25
4.25
1.15
1.15
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN55LBC180RSAR
SN55LBC180RSAT
SN65LBC180DR
QFN
QFN
SOIC
QFN
QFN
SOIC
QFN
QFN
RSA
RSA
D
16
16
14
16
16
14
16
16
3000
250
367.0
210.0
333.2
367.0
210.0
333.2
367.0
210.0
367.0
185.0
345.9
367.0
185.0
345.9
367.0
185.0
35.0
35.0
28.6
35.0
35.0
28.6
35.0
35.0
2500
3000
250
SN65LBC180RSAR
SN65LBC180RSAT
SN75LBC180DR
RSA
RSA
D
2500
3000
250
SN75LBC180RSAR
SN75LBC180RSAT
RSA
RSA
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
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Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
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www.ti.com/computers
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www.ti.com/energy
dsp.ti.com
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www.ti.com/clocks
interface.ti.com
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www.ti.com/medical
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Logic
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www.ti.com/security
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Microcontrollers
RFID
power.ti.com
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www.ti.com/space-avionics-defense
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microcontroller.ti.com
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TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
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Copyright © 2012, Texas Instruments Incorporated
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