SN75LBC776DBR [TI]

SINGLE-CHIP GeoPort TRANSCEIVER;
SN75LBC776DBR
型号: SN75LBC776DBR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE-CHIP GeoPort TRANSCEIVER

驱动 信息通信管理 光电二极管 接口集成电路 驱动器
文件: 总17页 (文件大小:544K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B – NOVEMBER 1995 – REVISED MARCH 2002  
DB or DW PACKAGE  
(TOP VIEW)  
Single-Chip Interface Solution for the  
9-terminal GeoPort Host (DTE)  
Designed to Operate up to 4 Mbit/s Full  
Duplex  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
DA1  
GND  
V
V
EE  
CC  
Single 5-V Supply Operation  
C–  
C+  
DY1  
RY3  
RB3  
RA2  
RY2  
RB1  
RA1  
RY1  
6-kV ESD Protection on All Terminals  
SHDN  
DZ2  
DY2  
GND  
DEN  
DA2  
Backward compatible With AppleTalk and  
LocalTalk  
Combines Multiple Components into a  
Single-chip Solution  
Complements the SN75LBC777 9-Terminal  
GeoPort Peripheral (DCE) Interface Device  
LinBiCMOS Process Technology  
description  
The SN75LBC776 is a low-power LinBiCMOS device that incorporates the drivers and receivers for a 9-pin  
GeoPort host interface. GeoPort combines hybrid EIA/TIA-422-B and EIA/TIA-423-B drivers and receivers to  
transmit data up to four megabits per second (Mbit/s) full duplex. GeoPort is a serial communications standard  
that is intended to replace the RS-232, Appletalk, and LocalTalk printer ports all in one connector in addition  
to providing real-time data transfer capability. It provides point-to-point connections between  
GeoPort-compatible devices with data transmission rates up to 4 Mbit/s full duplex and a hot-plug feature.  
Applications include connection to telephony, integrated services digital network (ISDN), digital sound and  
imaging, fax-data modems, and other serial and parallel connections. The GeoPort is backwardly compatible  
to both LocalTalk and AppleTalk.  
WhiletheSN75LBC776ispowered-off(V =0)theoutputsareinahigh-impedancestate. Whentheshutdown  
CC  
(SHDN) terminal is high, the charge pump is powered down and the outputs are in a high-impedance state. The  
driver enable (DEN) terminal sends the outputs of the differential driver into a high-impedance state with a high  
input signal. All drivers and receivers have fail-safe mechanisms to ensure a high output state when the inputs  
are left open.  
A switched-capacitor voltage converter generates the negative voltage required from a single 5-V supply using  
four 0.1-µF capacitors, two capacitors between the C+ and C- terminals and two capacitors between V and  
EE  
ground.  
The SN75LBC776 is characterized for operation over the 0°C to 70°C temperature range.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
GeoPort, LocalTalk, and AppleTalk are trademarks of Apple Computer, Incorporated.  
LinBiCMOS is a trademark of Texas Instruments Incorporated.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
DRIVER FUNCTION TABLE  
OUTPUT  
INPUT  
DA1  
INPUT  
DA2  
ENABLE  
SHDN  
ENABLE  
DEN  
OUTPUT  
DY1  
DY2  
DZ2  
X
H
X
L
X
L
H
X
X
L
X
X
H
L
L
X
L
X
X
X
H
L
L
L
X
L
L
L
H
L
OPEN  
OPEN  
L
L
X
H
Z
Z
Z
X
X
X
X
X
X
H
X
Z
X
Z
Z
H
Z
OPEN  
OPEN  
Z
H = high level L = low level  
X = irrelevant  
? = indeterminate Z = high impedance (off)  
RECEIVER FUNCTION TABLE  
INPUT  
RA1 RB1  
INPUT  
RA2 & RB3  
ENABLE  
SHDN  
OUTPUT  
RY1  
OUTPUT  
RY2  
OUTPUT  
RY3  
H
L
L
H
L
L
H
L
H
L
L
H
L
H
OPEN  
OPEN  
L
H
?
H
?
H
SHORT  
SHORT  
L
H
?
X
X
X
X
X
Z
Z
Z
Z
Z
X
OPEN  
Z
H = high level L = low level  
0.2 V < V < 0.2 V  
X = irrelevant  
? = indeterminate Z = high impedance (off)  
ID  
function logic diagram (positive logic)  
7
DY2  
10  
DA2  
6
DZ2  
9
DEN  
12  
RA1  
11  
RY1  
13  
RB1  
1
18  
DY1  
DA1  
15  
RA2  
14  
RY2  
17  
RY3  
16  
RB3  
5
SHDN  
19  
V
Charge  
Pump  
CC  
2
V
EE  
(5 V)  
20  
GND  
2
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Positive supply voltage range, V  
Negative supply voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 to 0.5 V  
Receiver input voltage range (RA, RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V to 15 V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 to 7 V  
CC  
EE  
Receiver differential input voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 to 12 V  
ID  
Receiver output voltage range (RY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 5.5 V  
Driver output voltage range (Power Off) (DY1, DY2, DZ2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V to 15 V  
Driver output voltage range (Power On) (DY1, DY2, DZ2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 V to 11 V  
Driver input voltage range (DA, SHND, DEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
0.4 V  
CC+  
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
Electrostatic discharge (see Note 2): (Bus terminals), Class 3, A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 kV  
(Bus terminals), Class 3, B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V  
(All terminals), Class 3, A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 kV  
(All terminals), Class 3, B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V  
Operating free-air temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values are with respect to network ground terminal unless otherwise noted.  
2. This parameter is measured in accordance with MIL-STD-883C, Method 3015.7.  
DISSIPATION RATING TABLE  
T
25°C  
OPERATING FACTOR  
T = 70°C  
A
POWER RATING  
A
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
A
DB  
1035 mW  
8.3 mW/°C  
9.0 mW/°C  
660 mW  
DW  
1125 mW  
720 mW  
3
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
recommended operating conditions  
MIN NOM  
MAX  
5.25  
5.25  
0.8  
7
UNIT  
V
Supply voltage, V  
CC  
4.75  
2
5
High-level input voltage, V  
IH  
DA, SHDN, DEN  
DA, SHDN, DEN  
V
Low-level input voltage, V  
V
IL  
Receiver common-mode input voltage, V  
IC  
7  
12  
0.2  
V
Receiver differential input voltage, V  
Voltage-converter filter capacitance  
12  
V
ID  
µF  
Voltage-converter filter-capacitor equivalent series resistance (ESR)  
Operating free-air temperature, T  
0.2  
70  
0
°C  
A
driver electrical characteristics over operating free-air temperature range (unless otherwise  
noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
3.6  
2
TYP  
4.53  
MAX  
UNIT  
R
R
R
R
= 12 kΩ  
= 120 Ω  
= 12 kΩ  
= 120 Ω  
V
V
V
V
L
L
L
L
V
V
High-level output voltage  
OH  
3.63  
Single ended,  
See Figure 1  
4.53  
2.7  
3.6  
1.8  
Low-level output voltage  
OL  
Magnitude of differential output voltage  
|V  
|
4
V
OD  
|(V  
V  
|
(DZ)  
(DY)  
R
= 120 Ω,  
See Figure 2  
L
|V  
|
Change in differential voltage magnitude  
Common-mode output voltage  
250  
3
mV  
V
OD  
V
OC  
1  
Magnitude of change, common-mode steady  
state output voltage  
|V  
|
|
200  
mV  
mV  
OC(SS)  
OC(PP)  
See Figure 3  
Magnitude of change, common-mode  
peak-to-peak output voltage  
|V  
700  
7
SHDN = DEN = 0 V,  
SHDN = DEN = 5 V,  
No load  
No load  
15  
100  
mA  
µA  
I
Supply current  
CC  
I
I
High-impedance output current  
V
= 10 V to 10 V,  
= 5 V to 5 V  
V = 0 or 5 V  
CC  
±100  
µA  
OZ  
O
O
Short-circuit output current (see Note 3)  
V
±170 ±450  
mA  
OS  
NOTE 3: Not more than one output should be shorted at one time.  
4
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
driver switching characteristics over operating free-air temperature range (unless otherwise  
noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
42  
41  
25  
25  
28  
37  
25  
23  
40  
42  
25  
29  
25  
35  
28  
34  
37  
34  
27  
26  
MAX  
75  
UNIT  
ns  
ns  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
ns  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
t
t
t
t
t
t
t
t
t
Propagation delay time, high-to-low level output  
Propagation delay time, low-to-high level output  
Driver output enable time to low-level output  
Driver output enable time to high-level output  
Driver output disable time from low-level output  
Driver output disable time from high-level output  
Rise time  
PHL  
PLH  
PZL  
PZH  
PLZ  
PHZ  
r
75  
100  
100  
100  
100  
75  
Single ended,  
See Figure 4  
SHDN  
10  
10  
Fall time  
75  
f
Propagation delay time, high-to-low level output  
Propagation delay time, low-to-high level output  
75  
PHL  
PLH  
75  
SHDN  
DEN  
100  
150  
100  
150  
100  
100  
100  
100  
75  
t
t
t
t
Driver output enable time to low-level output  
Driver output enable time to high-level output  
Driver output disable time from low-level output  
Driver output disable time from high-level output  
PZL  
PZH  
PLZ  
PHZ  
SHDN  
DEN  
Differential,  
See Figure 5  
SHDN  
DEN  
SHDN  
DEN  
t
t
t
Rise time  
Fall time  
10  
10  
r
75  
f
Pulse skew, |t  
t  
|
22  
SK(p)  
PLH PHL  
receiver electrical characteristics over operating free-air temperature range (unless otherwise  
noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
200  
2
TYP  
MAX  
UNIT  
V
IT+  
V
IT–  
V
hys  
V
OH  
V
OL  
Positive-going input threshold voltage  
Negative-going input threshold voltage  
200  
mV  
See Figure 6  
Differential input voltage hysteresis (V  
High-level output voltage (see Note 4)  
Low-level output voltage  
V  
)
IT–  
50  
4.9  
0.2  
45  
47  
mV  
V
IT+  
V
V
V
V
V
= 0,  
= 0,  
= 0  
I
I
= 2 mA, See Figure 6  
IC  
IC  
O
OH  
= 2 mA,  
See Figure 6  
0.8  
V
OL  
85  
I
Short-circuit output current  
Input resistance  
mA  
OS  
= V  
+85  
O
CC  
= 0 or 5.25 V,  
V = 12 V to 12 V  
CC  
R
6
30  
kΩ  
I
I
NOTE 4: When the inputs are left unconnected, receivers one and two interpret these as high-level inputs and receiver three interprets these  
as low-level inputs so that all outputs are at a high level.  
5
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
receiver switching characteristics over operating free-air temperature range (unless otherwise  
noted)  
PARAMETER  
Propagation delay time, high-to-low-level output  
Propagation delay time, low-to-high level output  
Rise time  
TEST CONDITIONS  
MIN  
TYP  
31  
MAX  
75  
UNIT  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
µs  
ns  
ns  
t
t
t
t
t
t
t
t
t
t
t
t
t
PHL  
PLH  
r
30  
75  
R
= 2 kΩ,  
See Figure 6  
C
= 15 pF,  
L
L
15  
30  
Fall time  
15  
30  
f
Pulse skew |t  
t  
|
20  
SK(P)  
PZL  
PZH  
PLZ  
PHZ  
PZL  
PZH  
PLZ  
PHZ  
PLH PHL  
Receiver output enable time to low level output  
Receiver output enable time to high level output  
Receiver output disable time from low level output  
Receiver output disable time from high level output  
Receiver output enable time to low level output  
Receiver output enable time to high level output  
Receiver output disable time from low level output  
Receiver output disable time from high level output  
35  
32  
100  
100  
100  
100  
25  
Differential,  
See Figure 7  
C
C
=50 pF,  
=50 pF,  
L
L
21  
21  
12  
12  
25  
Single ended,  
See Figure 7  
25  
100  
400  
125  
6
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
PARAMETER MEASUREMENT INFORMATION  
C
C
L
L
I
O
R
R
L
L
C
R
L
L
DY2  
DZ2  
I
I
O
I
DY1  
I
I
V
V
O
DA1  
DA2  
I
O
V
V
V
I
I
O
SHDN  
O
SHDN  
or  
DEN  
NOTE A: C = 50 pF  
L
TEST CIRCUIT  
Figure 1. Single-Ended Driver DC Parameter Test  
DY2  
DZ2  
60 Ω  
60 Ω  
I
I
O
I
V
OD  
DA2  
V
I
50 pF  
SHDN  
or  
DEN  
TEST CIRCUIT  
Figure 2. Differential Driver DC Parameter Test  
DY2  
DZ2  
60 Ω  
60 Ω  
V
OD  
DA2  
V
I
V
OC  
15 pF  
SHDN  
or  
DEN  
TEST CIRCUIT (see Note A)  
3 V  
0 V  
V
I
1.5 v  
1.5 v  
V
OC  
0 V  
V
OC(SS)  
V
OC(PP)  
VOLTAGE WAVEFORM  
NOTE A: Measured 3dB bandwidth = 300 MHz  
Figure 3. Differential-Driver Common-Mode Output Voltage Tests  
7
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
PARAMETER MEASUREMENT INFORMATION  
C
C
L
L
I
O
R
R
L
L
C
= 50 pF  
L
DY2  
DZ2  
I
I
V
V
O
DY1  
DA1  
DA2  
R
= 120 Ω  
L
I
O
V
O
V
I
SHDN  
O
SHDN  
or  
DEN  
TEST CIRCUIT  
(see Note A)  
3 V  
0 V  
SHDN  
or  
DEN  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
3 V  
0 V  
1.5 V  
1.5 V  
DA  
t
PLH  
t
t
t
PZL  
t
PHL  
PLZ  
PHZ  
V
OH  
90%  
90%  
90%  
DY1, DZ2  
10%  
90%  
0 V  
50%  
10%  
50%  
10%  
10%  
V
OL  
t
PZH  
t
PLZ  
t
f
t
r
t
t
PHL  
PHZ  
t
PLH  
t
PZH  
90%  
V
OH  
DY2  
90%  
90%  
10%  
90%  
50%  
0 V  
50%  
10%  
10%  
10%  
V
OL  
t
t
f
t
PZL  
r
VOLTAGE WAVEFORM  
(see Note B)  
NOTES: A.  
C = 50 pF, R = 120 Ω  
L L  
B. The input waveform t , t 10 ns.  
r
f
Figure 4. Single-Ended Driver Propagation and Transition Times  
8
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
PARAMETER MEASUREMENT INFORMATION  
DY2  
DZ2  
R
R
60 Ω  
60 Ω  
L =  
L =  
V
OD  
DA2  
V
I
50 pF  
SHDN  
or  
DEN  
TEST CIRCUIT  
3 V  
0 V  
SHDN  
or  
DEN  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
3 V  
0 V  
1.5 V  
1.5 V  
DA  
t
PHL  
t
t
t
t
PLH  
PHZ  
90%  
PZH  
90%  
PLZ  
V
OD(H)  
90%  
V
OD  
10%  
50%  
10%  
50%  
10%  
0 V  
90%  
10%  
V
OD(L)  
t
PZL  
t
f
t
r
VOLTAGE WAVEFORM  
(see Note A)  
Figure 5. Differential Driver Propagation and Transition Times  
V
CC  
2 kΩ  
2.5 V  
V
0 V  
0 V  
I
I
I
2.5 V  
RA  
RB  
I
O
+
_
Input  
t
t
RY  
PLH  
PHL  
Output  
V
OH  
V
I
90%  
90%  
V
O
V
O
1.5 V  
15 pF  
10%  
10%  
V
OL  
SHDN  
t
t
f
r
TEST CIRCUIT  
VOLTAGE WAVEFORM  
(see Note A)  
Figure 6. Receiver Propagation and Transition Times  
NOTE A: The input waveform t , t 10 ns.  
r
f
9
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
RA  
RB  
R
= 500 Ω  
+
_
L
2.5 V or 2.5 V  
RY  
S1  
C
= 50 pF  
L
SHDN  
TEST CIRCUIT  
3 V  
0 V  
SHDN  
1.5 V  
1.5 V  
90%  
t
t
PZL  
PLZ  
V
CC  
S1 at V  
CC  
10%  
90%  
V
OL  
OH  
V
O
t
t
PZH  
PHZ  
V
S1 at GND  
10%  
0 V  
VOLTAGE WAVEFORM  
(see Note A)  
NOTE A: The input waveform t , t 10 ns.  
r
f
Figure 7. Receiver Enable and Disable Test Circuit and Waveforms  
10  
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
APPLICATION INFORMATION  
RxD  
11  
13  
12  
RxD–  
GeoPort  
Host  
SN75LBC776  
9-Terminal  
DTE  
GeoPort  
Peripheral  
Device  
9-Pin  
RxD+  
TxD+  
7
6
10  
5
TxD  
SHDN  
DTR  
TxD–  
DCE  
GeoPort  
Controller  
and USART  
GND  
1
RESET/ATT  
SCLK  
18  
15  
RESET/ATT  
SCLK  
14  
17  
9
RTXC  
CTS  
Power  
TxHS/WAKE-UP  
16  
RTS  
TxHS/WAKE-UP  
V
CC  
RxD–  
13  
12  
Standard  
Host  
SN75LBC776  
9-Terminal  
DTE  
19  
RxD+  
16 TxHS/WAKE-UP  
4
3
+
+
+
7
6
TxD+  
0.1 µF  
0.1 µF  
6
7
8
V
CC  
TxD–  
3
4
1
9
2
5
5 V  
(see Note A)  
V
EE  
GND  
2
Power  
0.1 µF  
0.1 µF  
18  
15  
RESET/ATT  
SCLK  
+
8
20  
NOTE A: The AVX 0603YC104MATXA or equivalent is one of the possible capacitors that can be used as the charge pump capacitor.  
Figure 8. GeoPort 9-Terminal DTE Connection Application  
11  
www.ti.com  
SN75LBC776  
SINGLE-CHIP GeoPort TRANSCEIVER  
SLLS221B NOVEMBER 1995 REVISED MARCH 2002  
APPLICATION INFORMATION  
generator characteristics  
EIA/TIA-232/V.28  
EIA/TIA-423/V.10  
562  
MIN  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN  
MAX  
25  
MIN  
4
MAX  
MAX  
Open circuit  
6
13.2  
V
V
V
|V  
|
Output voltage magnitude  
3 kΩ ≤ R 7 kΩ  
5
NA  
NA  
15  
NA  
3.6  
3.7  
NA  
O
L
R
= 450 Ω  
L
V
Output voltage ringing  
10%  
150  
5%  
60  
O(RING)  
I
Short-circuit output current  
V
V
V
= 0  
100  
mA  
OS  
O(OFF)  
O
= 0, |V | < 2 V  
300  
NA  
NA  
300  
NA  
4
CC  
CC  
O
I
Power-off output current  
Output voltage slew rate  
= 0, |V | < 6 V  
±100  
µA  
O
SR  
30  
NA  
NA  
NA  
30  
V/µs  
µs  
±3.3 V to ±3.3 V  
±3 V to ±3 V  
10% to 90%  
NA  
NA  
0.22  
NA  
NA  
2.1  
t
t
Transition time  
0.04  
ui  
ui  
0.3  
ui is the unit interval and is the inverse of the signaling rate (bit transmit time).  
receiver characteristics  
EIA/TIA-232/V.28  
EIA/TIA-423/V.10  
562  
PARAMETER  
TEST CONDITIONS  
UNIT  
V
MIN  
MAX  
25  
MIN  
MAX  
MIN  
MAX  
25  
|V |  
I
Input voltage magnitude  
Input voltage threshold  
10  
|V | < 15 V  
3  
NA  
3
3
NA  
0.2  
NA  
4
3  
NA  
3
3
I
V
IT  
V
|V | < 10 V  
0.2  
I
3 V < |V | < 15 V  
7
7
kΩ  
kΩ  
I
R
Input resistance  
I
|V | < 10 V  
NA  
NA  
I
12  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Jul-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
SN75LBC776DBR  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
DB  
DB  
20  
20  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
SN75LBC776DBRG4  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN75LBC776DBR  
SSOP  
DB  
20  
2000  
330.0  
16.4  
8.2  
7.5  
2.5  
12.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SSOP DB 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 38.0  
SN75LBC776DBR  
2000  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All  
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time  
of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which  
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such  
components to meet such requirements.  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
Logic  
Security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  

相关型号:

SN75LBC776DBRG4

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SSOP-20
TI

SN75LBC776DW

SINGLE-CHIP GeoPortE TRANSCEIVER
TI

SN75LBC776DW

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20
ROCHESTER

SN75LBC776DWG4

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20
TI

SN75LBC776DWR

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20
ROCHESTER

SN75LBC776DWR

SINGLE-CHIP GeoPort TRANSCEIVER
TI

SN75LBC776DWRG4

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20
TI

SN75LBC777

SINGLE CHIP GEOPORTE/AppleTalkE TRANSCEIVER
TI

SN75LBC777CDW

LINE TRANSCEIVER, PDSO20
TI

SN75LBC777DW

SINGLE CHIP GEOPORTE/AppleTalkE TRANSCEIVER
TI

SN75LBC777DWR

DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20
TI

SN75LBC784

QUADRUPLE RS-423-B DRIVER/RECEIVER
TI