SN75LVPE802RTJR [TI]
双通道 8.0Gbps SATA Express 转接驱动器 | RTJ | 20 | 0 to 85;型号: | SN75LVPE802RTJR |
厂家: | TEXAS INSTRUMENTS |
描述: | 双通道 8.0Gbps SATA Express 转接驱动器 | RTJ | 20 | 0 to 85 驱动 商用集成电路 驱动器 |
文件: | 总37页 (文件大小:2049K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
SN75LVPE802 双通道 8Gbps SATA Express 均衡器和转接驱动器
1 特性
3 说明
1
•
SATA Express 支持
可选均衡和去加重功能
支持热插拔功能
SN75LVPE802 是一款通用型双通道 SATA Express
信号调节器,最高可支持 8Gbps 的数据速率。此器件
支持 SATA Gen 1、2 和 3 规范以及 PCIe 1、2 和
3。SN75LVPE802 由 3.3V 单电源供电运行,并且配
有带自偏置特性的 100Ω 线路端接电阻,适用于交流
耦合。输入端包含一个带外 (OOB) 检测器,可在输入
差分电压低于阈值时自动抑制输出端噪声,同时保持一
个稳定的共模电压。此外,该器件还被设计成依据
SATA 标准处理扩频时钟 (SSC) 传输。
•
•
•
•
•
接收器检测与带外 (OOB) 支持
集成输出静噪
多速率运行
–
–
SATA:1.5Gbps、3Gbps、6Gbps
PCIe:2.5Gbps、5Gbps、8Gbps
•
•
出色的抖动和损耗补偿功能,支持长达 24 英寸
(61cm) 以上的 FR4 走线
SN75LVPE802 通过可选均衡设置来处理其输入端的
互连损耗,能够通过编程来匹配通道中的损耗。对于
3Gbps 及以下的数据速率,SN75LVPE802 可为最大
规格达 50 英寸的 FR4 电路板材料提供信号均衡。对
于 8Gbps 的数据速率,该器件可为最大规格达 40 英
寸的 FR4 材料提供补偿。均衡级别通过设置信号控制
引脚 EQ 来控制。
低功耗
–
–
–
< 220mW(典型值)
< 50mW(在自动低功耗模式下)
< 5mW(在待机模式下)
•
•
20 引脚 4mm x 4mm 四方扁平无引线 (QFN) 封装
较高水平的静电放电 (ESD) 瞬态保护
–
–
–
人体模型 (HBM):10,000V
组件充电模式 (CDM):1500V
机器放电模式 (MM):200V
发送侧有两个去加重级别可供选择,用于为输出端提供
0 或 1.2dB 的附加高频损耗补偿。
器件信息(1)
•
扩展商业级温度范围为 0°C 至 85°C
器件型号
封装
封装尺寸(标称值)
2 应用
超薄四方扁平无引线
(WQFN) (20)
SN75LVPE802
4.00mm x 4.00mm
•
•
•
•
平板电脑
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
笔记本电脑
台式机
扩展坞
简化电路原理图
Connector
330
330
Host
VCC
Controller
U1
220nF
220nF
RX1P
RX1N
GND
TX2N
TX2P
DEW2
EN
VCC
EQ2
GND
220nF
220nF
EQ1
DEW1
TX1P
TX1N
GND
Device
220nF
220nF
220nF
220nF
DE2
470nF
470nF
220nF
220nF
VCC
DE1
RX2N
RX2P
VCC
SN75LVPE802
330
330
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLLSET1
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
目录
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 18
Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical SATA Application ....................................... 19
9.3 SATA Express Applications .................................... 25
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 (续).............................................................. 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 6
7.7 Switching Characteristics.......................................... 7
7.8 Typical Characteristics.............................................. 9
Detailed Description ............................................ 15
8.1 Overview ................................................................. 15
8.2 Functional Block Diagram ....................................... 15
9
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 27
11.1 Layout Guidelines ................................................. 27
11.2 Layout Example .................................................... 28
12 器件和文档支持 ..................................................... 29
12.1 接收文档更新通知 ................................................. 29
12.2 社区资源................................................................ 29
12.3 商标....................................................................... 29
12.4 静电放电警告......................................................... 29
12.5 Glossary................................................................ 29
13 机械、封装和可订购信息....................................... 29
8
4 修订历史记录
Changes from Revision A (September 2016) to Revision B
Page
•
•
•
•
•
•
•
Changed 图 27 note From: Input Trace Length = 53 in. To: Input Trace Length = 3 in....................................................... 22
Changed title of 图 35 From: Output Eye (TP2) to: Input Eye (TP2) .................................................................................. 23
Changed 图 37 note From: Input Trace Length = 36 in. To: Input Trace Length = 48 in. .................................................. 23
Changed 图 38 note From: Input Trace Length = 36 in. To: Input Trace Length = 48 in. .................................................. 23
Changed title of 图 38 From: Input Eye (TP4) To: Output Eye (TP4) .................................................................................. 23
Changed note in 图 40 From: Output Trace Length = 0 in To: Output Trace Length = 3 in................................................ 24
Changed note in 图 42 From: Output Trace Length = 6 in To: Output Trace Length = 12 in.............................................. 24
Changes from Original (January 2016) to Revision A
Page
•
已将器件状态从“产品预览”更改为“量产数据” .......................................................................................................................... 1
5 说明 (续)
该器件支持热插拔功能(要求在差分输入和输出使用交流耦合电容),能够防止器件在热插入(例如,异步信号插/
拔、不带电插/拔、带电插/拔或意外插/拔)情况下遭到损坏。
2
Copyright © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
6 Pin Configuration and Functions
RTJ Package
20 Pin (WQFN)
Top View
RX1P
RX1N
GND
1
2
3
4
5
15 TX1P
14 TX1N
13 GND
12 RX2N
11 RX2P
LVPE802
TX2N
TX2P
Package Thermal Pad
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Control Pins
DE1(1)
DE2(1)
9
8
I, LVCMOS
I, LVCMOS
Selects de-emphasis settings for CH 1 and CH 2 per 表 1.
Internally tied to VCC / 2.
DEW1
16
I, LVCMOS De-emphasis width control for CH 1 and CH 2.
0 = De-emphasis pulse duration, short
DEW2
6
I, LVCMOS
1 = De-emphasis pulse duration, long (default)
Device enable and disable pin, internally pulled to VCC
I, LVCMOS 0 = Device in standby mode
1 = Device enabled (default)
.
EN
7
EQ1(1)
EQ2(1)
17
19
I, LVCMOS
Select equalization settings for CH 1 and CH 2 per 表 1.
Internally tied to VCC / 2.
I, LVCMOS
High Speed Differential I/O
RX1N
RX1P
RX2N
RX2P
TX1N
TX1P
TX2N
TX2P
POWER
GND
2
1
I, CML
I, CML
I, CML
I, CML
O, VML
O, VML
O, VML
O, VML
Non-inverting and inverting CML differential input for CH 1 and CH 2. These pins connect to
an internal voltage bias via a dual termination resistor circuit.
12
11
14
15
4
Non-inverting and inverting VML differential input for CH 1 and CH 2. These pins connect to
an internal voltage bias via a dual termination resistor circuit.
5
3, 13, 18
10, 20
Power
Power
Supply ground
VCC
Positive supply must be 3.3V ± 10%
(1) Internally biased to VCC / 2 with >200-Ωk pullup or pulldown. When 3-state pins are left as NC, board leakage at the pin pad must be < 1
µA; otherwise, drive to VCC / 2 to assert mid-level state.
Copyright © 2016–2017, Texas Instruments Incorporated
3
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
MAX
UNIT
Supply Voltage Range(2), VCC
4
4
V
V
V
Differential I/O
Voltage Range
Control I/O
VCC + 0.5
Continuous power dissipation
Storage temperature, Tstg
See Thermal Information
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±10000
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
Machine model(3)
V(ESD)
Electrostatic discharge
±1500
±200
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Tested in accordance with JEDEC Standard 22, Test Method A115-A
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
3.3
MAX
UNIT
V
VCC
Supply Voltage
3
3.6
C(coupling)
TA
Coupling Capacitor
12
nF
Operating free-air temperature
0
85
°C
7.4 Thermal Information
SN75LVPE802
THERMAL METRIC(1)
RTJ (WQFN)
UNIT
20 PINS
38
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
40
10
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.5
ψJB
0.9
RθJC(bot)
15.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DEWX = EN = VCC, EQX = DEX = NC,
K28.5 pattern at 6 Gbps, VID = 700 mVpp
PD
Power dissipation in active mode
188
205
mW
EN = 0 V, DEWX = EQX = DEX = NC,
K28.5 pattern at 6 Gbps, VID = 700 mVpp
PSD
Power dissipation in standby mode
Active mode supply current
4
mW
mA
EN = 3.3 V, DEWX = EQX = DEX = NC,
K28.5 pattern at 6 Gbps, VID = 700 mVpp
ICC
57
78
62
ICC(STDBY)
Standby mode supply current
Maximum data rate
EN = 0 V
1
8
mA
Gbps
OOB
V(OOB)
Input OOB threshold
F = 750 MHz
50
150
25
mVpp
mV
DVdiff(OOB)
DVCM(OOB)
OOB differential delta
OOB common-mode delta
50
mV
CONTROL LOGIC
VIH
High-level input voltage
For all control pins
1.4
V
V
VIL
Low-level input voltage
Input hysteresis
0.5
VIN(HYS)
115
mV
µA
µA
µA
µA
EQx, DEx = VCC
EN, DEWx = VCC
EQx, DEx = GND
EN, DEWx = GND
30
1
IIH
High-level input current
–30
–10
IIL
RECEIVER AC/DC
Low-level input current
Z(DIFFRX)
Z(SERX)
VCM(RX)
Differential-Input Impedance
85
40
100
115
Ω
Ω
Single-Ended Input Impedance
Common-mode voltage
1.8
28
17
12
9
V
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 GHz – 3 GHz
f = 3 GHz – 5 GHz
22
14
10
8
dB
dB
dB
RL(DiffRX)
Differential mode return Loss (RL)
dB
7
9
dB
6
8
dB
RX(DiffRLSlope) Differential mode RL slope
f = 300 MHz – 6 GHz
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 GHz – 3 GHz
f = 3 GHz – 5 GHz
14
10
17
23
16
12
6
dB/dec
dB
9
14
15
13
10
4
dB
dB
RL(CMRX)
Common mode return loss
Differential input voltage PP
dB
dB
dB
V(diffRX)
f = 1.5 GHz and 3 GHz
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 GHz – 3 GHz
f = 3 GHz – 5 GHz
120
30
30
20
10
10
4
1600
mVppd
dB
41
38
32
26
25
20
17
dB
dB
IB(RX)
Impedance Balance
dB
dB
dB
f = 5 GHz – 6.5 GHz
4
dB
TRANSMITTER AC/DC
Z(diffTX) Pair differential impedance
Z(SETX)
85
40
100
122
1.2
Ω
Ω
Single-Ended input Impedance
Sequencing transient voltage
Transient voltages on the serial data bus
during power sequencing (lab load)
V(TXtrans)
–1.2
V
Copyright © 2016–2017, Texas Instruments Incorporated
5
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
19
17
11
8
TYP
25
19
14
10
10
10
14
20
19
17
12
11
7
MAX
UNIT
dB
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 GHz – 3 GHz
f = 3 GHz – 5 GHz
f = 300 MHz to 3 GHz
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 GHz – 3 GHz
f = 3 GHz – 5 GHz
f = 150 MHz – 300 MHz
f = 300 MHz – 600 MHz
f = 600 MHz – 1.2 GHz
f = 1.2 GHz – 2.4 GHz
f = 2.4 MHz – 3 GHz
f = 3 GHz – 5 GHz
f = 5 GHz – 6.5 GHz
DE1 0r DE2 = 0
dB
dB
RL(DiffTX)
Diff Mode return Loss
dB
8
dB
8
dB
TX(DiffRLSlope) Differential-mode RL slope
dB/dec
dB
16
15
14
10
9
dB
dB
RL(CMTX)
Common Mode return Loss
dB
dB
6
dB
30
30
20
10
10
4
41
38
33
24
26
22
21
0
dB
dB
dB
I(BTX)
Impedance Balance
dB
dB
dB
4
dB
dB
Output de-emphasis
(relative to transition bit)
DE
DE1 0r DE2 = 1
–2
–4
550
830
630
20
12
13
1.8
6%
2%
dB
DE1 0r DE2 = NC
DE1 0r DE2 = 0
dB
mV
mV
mV
mVppd
Diff(VppTX_DE) Differential output-voltage swing dc level
DE1 0r DE2 = 1
DE1 0r DE2 = NC
At 1.5 GHz
50
V(CMAC_TX)
TX AC CM Voltage
At 3 GHz
26 dBmV (rms)
30 dBmV (rms)
V
At 6 GHz
V(CMTX)
Common-Mode Voltage
TX rise-fall imbalance
TX amplitude imbalance
TX(R/FImb)
TX(AmpImb)
At 3 GHz
20%
10%
V
V
7.6 Timing Requirements
MIN
NOM
MAX UNIT
DEVICE PARAMETERS
Auto low-power entry time
Auto low-power exit time
TRANSMITTER AC/DC
Electrical idle at input (see 图 24)
80
105
42
130
50
ps
ps
After first signal activity (see 图 24)
tDE
Input OOB threshold
DEW1 or DEW2 = 0
DEW1 or DEW2 = 1
94
ps
ps
215
OUT-OF-BAND (OOB)
tOOB1
tOOB2
OOB mode enter
OOB mode exit
3
3
5
5
ns
ns
See 图 23
6
Copyright © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
7.7 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
DEVICE PARAMETERS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Measured using K28.5 pattern
(see 图 1)
tPDelay
Propagation delay
323
400
ps
tENB
tDIS
Device enable time
Device disable time
EN 0 → 1
EN 1 → 0
5
2
µs
µs
RECEIVER AC/DC
Rise times and fall times measured
between 20% and 80% of the signal.
SATA 6-Gbps speed measured 1 in,
(2.5 cm) from device pin.
t20-80RX
Rise/fall time
62
75
30
ps
ps
Difference between the single-ended
midpoint of the RX+ signal rising or
falling edge, and the single-ended
midpoint of the RX– signal falling or
rising edge.
tSKEWRX
Differential skew
TRANSMITTER AC/DC
Rise times and fall times measured
between 20% and 80% of the signal.
At 6 Gbps under no load conditions.
t20-80TX
Rise/fall time
42
55
6
75
20
ps
ps
Difference between the single-ended
midpoint of the TX+ signal rising or
falling edge, and the single-ended
midpoint of the TX– signal falling or
rising edge.
tSKEWTX
Differential skew
TRANSMITTER JITTER
VID = 500 mVpp, UI = 333 ps, K28.5
control character
DJTX
RJTX
DJTX
RJTX
DJTX
RJTX
Deterministic jitter (1) at CP in
0.06
0.01
0.08
0.09
0.1
5
5
UIp-p
ps-rms
UIp-p
VID = 500 mVpp, UI = 333 ps, K28.7
control character
Residual Random jitter(1)
VID = 500 mVpp, UI = 167 ps, K28.5
control character
Deterministic jitter (1) at CP in
0.16
2
VID = 500 mVpp, UI = 167 ps, K28.7
control character
(1)
Residual random jitter
ps-rms
UIp-p
VID = 500 mVpp, UI = 125 ps, K28.5
control character
Deterministic jitter (1) at CP in
Residual random jitter(1)
0.2
1.5
VID = 500 mVpp, UI = 125 ps, K28.7
control character
0.3
ps-rms
(1) (1) TJ = (14.1 x RJSD + DJ), where RJSD is one standard deviation value
版权 © 2016–2017, Texas Instruments Incorporated
7
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
IN
tPDELAY
tPDELAY
OUT
Copyright © 2016, Texas Instruments Incorporated
图 1. Propagation Delay Timing Diagram
8
版权 © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
7.8 Typical Characteristics
Input signal characteristics:
•
•
•
Data rate = 8 Gbps 6 bps, 3 Gbps, 1.5 Gbps
Amplitude = 500 mVpp
o Data pattern = K28.5
SN75LVPE802 device setup:
•
•
•
•
Temperature = 25°C
Voltage = 3.3 V
De-emphasis duration = 117 ps (short)
Equalization and de-emphasis set to optimize performance at 6 Gbps
With LVPE802
16-in, 4-mil FR4 Trace
8-in, 4-mil FR4 Trace
+ 2-in, 9.5-mil FR4 Trace
+2-in, 9.5-mil FR4 Trace
Agilent
ParBERT
Agilent
DCA-J
LVPE802
TP1
TP2
TP3
TP4
Without LVPE802
16-in, 4-mil FR4 Trace
+ 4-in, 9.5-mil FR4 Trace
+ 8in, 4-mil FR4 Trace
Agilent
ParBERT
Agilent
DCA-J
TP1
TP4
Copyright © 2016, Texas Instruments Incorporated
图 2. Performance Curve Measurement Setup
版权 © 2016–2017, Texas Instruments Incorporated
9
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
Typical Characteristics (接下页)
图 3. Jitter Measurement Test Condition
10
版权 © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
7.8.1 Jitter and VOD results: Case 1 at 6 Gbps
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
29
3.3
1.88
412.4
159.2
350.52
91.8
65.4
1.93
240
28.9
81.24
图 4. Test Point 1
图 5. Test Point 2
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
42
(σ-σ)
ps
15.9
(rms)
ps
1.91
Amplitude
mV
788.8
Width
ps
141.3
Opening
(mV)
623.02
(1e-12)
ps
39
(σ-σ)
ps
12.7
(rms)
ps
1.92
Amplitude
mV
557.1
Width
ps
149.7
Opening
(mV)
459.62
图 6. Test Point 3
图 7. Test Point 4 With LVPE802
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12) ps
56.7
(σ-σ) ps
29.8
(rms) ps
2
Amplitude mV
165.4
Width ps
101
Opening (mV)
13.24
图 8. Test Point 4 Without LVPE802
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7.8.2 Jitter and VOD Results: Case 2 at 3 Gbps
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
72.7
(σ-σ)
ps
46.8
(rms)
ps
1.89
Amplitude
mV
314.9
Width
ps
237
Opening
(mV)
222.36
(1e-12)
ps
29.7
(σ-σ)
ps
3.8
(rms)
ps
1.89
Amplitude
mV
430.9
Width
ps
326
Opening
(mV)
392.84
图 10. Test Point 2
图 9. Test Point 1
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
47.9
(σ-σ)
ps
20.3
(rms)
ps
1.99
Amplitude
mV
615.3
Width
ps
305.0
Opening
(mV)
463.42
(1e-12)
ps
39.6
(σ-σ)
ps
12.8
(rms)
ps
1.96
Amplitude
mV
714.5
Width
ps
321
Opening
(mV)
611.62
图 12. Test Point 4 With LVPE802
图 11. Test Point 3
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12) ps
128.6
(σ-σ) ps
101.8
(rms) ps
1.96
Amplitude mV
258.8
Width ps
118
Opening (mV
122.26
图 13. Test Point 4 Without LVPE802
12
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7.8.3 Jitter and VOD Results: Case 3 at 1.5 Gbps
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
34.3
3.4
2.26
448
659
417.28
67.5
38.6
2.11
363.4
595
318.48
图 14. Test Point 1
图 15. Test Point 2
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
44.9
(σ-σ)
ps
13.2
(rms)
ps
2.31
Amplitude
mV
753.1
Width
ps
649
Opening
(mV)
604.02
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
57.3
21.5
2.62
672.8
632
442.42
图 16. Test Point 3
图 17. Test Point 4 With LVPE802
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12) ps
113.3
(σ-σ) ps
81.9
(rms) ps
2.3
Amplitude mV
322.8
Width ps
493
Opening (mV)
217.48
图 18. Test Point 4 Without LVPE802
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7.8.4 Jitter and VOD Results: Case 4 at 8 Gbps
图 21 Test Point 3 and 图 22 Test Point 4 were taken without pre-emphasis.
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
14.4
10.1
0.31
580
108
274
78.1
68.9
0.67
310
45
48
图 19. Test Point 1
图 20. Test Point 2
TJ
DJ
RJ
Eye
Eye
Eye
TJ
DJ
RJ
Eye
Eye
Eye
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
(1e-12)
ps
(σ-σ)
ps
(rms)
ps
Amplitude
mV
Width
ps
Opening
(mV)
30.6
23.6
0.51
406
86
292
34.4
26.8
0.56
262
85
95
图 21. Test Point 3
图 22. Test Point 4
14
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8 Detailed Description
8.1 Overview
The SN75LVPE802 is a dual channel equalizer and redriver. The device operates over a wide range of signaling
rates, supporting operation from DC to 8 Gbps. The wide operating range supports SATA Gen 1, 2, 3 (1.5 Gbps,
3.0 Gbps, and 6.0 Gbps respectively) as well as PCI Express 1.0, 2.0, 3.0 (2.5 Gbps, 5.0 Gbps, and 8.0 Gbps).
The device also supports SATA Express (SATA 3.2) which is a form factor specification that allows for SATA and
PCI Express signaling over a single connector.
8.2 Functional Block Diagram
GND[3,13,18]
V
= 1.7 V TYP
BB
wÇ
RX1P [1]
RX1N [2]
TX1P [15]
TX1N [14]
wÇ
VBB
wÇ
wÇ
RX2N [12]
RX2P [11]
TX2N [4]
TX2P [5]
DEW1 [16]
DEW2 [6]
CTRL
EQ1[17]
EQ2[19]
DE1[9]
DE2[8]
VCC[10,20]
EN[7]
Copyright © 2016, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 SATA Express
SATA Express (sometimes SATAe) is an electro-mechanical standard that supports both SATA and PCI Express
storage devices. SATAe is standardized in the SATA 3.2 standard. The standard is concerned with providing a
smooth transition from SATA to PCIe storage devices. The standard provides for standardized cables and
connectors, and muxes the PCIe and SATA lanes at the host side so that either SATA compliant or PCIe
compliant devices may operate with a host.
SATAe provides support for SATA1, SATA2 and SATA3 devices (operating from 1.5 Gbps to 6.0 Gbps), as well
as PCIe1, PCIe2 and PCIe3 devices (operating from 2.5 Gbps to 8.0 Gbps).
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Feature Description (接下页)
The SN75LVPE802 provides for equalization and re-drive of a single channel input signal complying with any of
the SATA or PCIe standards available with SATAe.
The SATAe standard provides for a mechanism for a host to recognize and detect whether a SATA or PCIe
device is plugged into the host. See the Typical SATA Application section for the details of the SATA Express
Interface Detect operation.
8.3.2 Receiver Termination
The receiver has integrated terminations to an internal bias voltage. The receiver differential input impedance is
nominally 100 Ω, with a ±15% variation.
8.3.3 Receiver Internal Bias
The SN75LVPE802 receiver is internally biased to 1.7 V, providing support for AC coupled inputs.
8.3.4 Input Equalization
The SN75LVPE802 incorporates programmable equalization. The EQ input controls the level of equalization that
is used to open the eye of the received input signal. If the EQ input is left open, or pulled LO, 6 dB (at 3 GHz) of
equalization is applied. When the EQ input is HIGH, the equalization is set to 13 dB (again at 3 GHz). 表 1 shows
the equalization values discussed.
表 1. EQ and DE Settings
CH1 OR CH2 EQUALIZATION
CH1 OR CH2 EQUALIZATION
CH1 OR CH2 DE-EMPHASIS
EQ1 OR EQ2
dB
dB
DE1 OR DE2
dB
(at 6 Gbps)
(at 8 Gbps)
(at 6 Gbps)
NC (default)
0
6
0
7
NC (default)
-4
0
0
1
0
1
13
15
-2
8.3.5 OOB/Squelch
The SN75LVPE802 receiver incorporates an Out-Of-Band (OOB) detection circuit in addition to the main signal
chain receiver. The OOB detector continuously monitors the differential input signal to the device. The OOB
detector has a 50-mVpp entry threshold. If the differential signal at the receiver input is less than the OOB entry
threshold, the device transmitter transitions to squelch. The SN75LVPE802 enters squelch within 5 ns of the
input signal falling below the OOB entry threshold. The SN75LVPE802 continues to monitor the input signal while
in squelch. While in squelch, if the OOB detector determines that the input signal now exceeds the 90 mVpp exit
threshold, the SN75LVPE802 exits squelch within 5 ns.
IN+
50 mV
Vcm
IN-
t
t
OOB1
OOB2
OUT+
Vcm
OUT-
图 23. OOB Enter and Exit Timing Receiver Input Termination Is Disabled
When the SN75LVPE802 enters squelch state the transmitter output is squelched. The transmitter non-inverting
(TX+) output and the transmitter inverting output (TX-) are both driven to the transmitter nominal common mode
voltage which is 1.7 V.
16
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8.3.6 Auto Low Power
The SN75LVPE801 also includes an Auto Low Power Mode (ALP). ALP is entered when the differential input
signal has been less than 50 mV for > 10 µs. The device enters and exits Low Power Mode by actively
monitoring the input signal level. In this state the device selectively shuts off internal circuitry to lower power by >
90% of its normal operating power. While in ALP mode the device continues to actively monitor input signal
levels. When the input signal exceeds the OOB exit threshold level, the device reverts to the active state. Exit
time from Auto Low Power Mode is < 50 ns (max).
RX1,2P
VCM
RX
RX1,2N
TX1,2P
TX1,2N
t
OOB1
AutoLP
EXIT
VCM
TX
Power Saving
Mode
AutoLP
ENTRY
图 24. Auto Low Power Mode Entry and Exit Timing
8.3.7 Transmitter Output Signal
The SN75LVPE802 differential output signal is 650 mVpp when de-emphasis is disabled (DE input is open or
pulled low).
8.3.8 Transmitter Common Mode
The SN75LVPE802 transmitter common mode output is set to 1.7 V.
8.3.9 De-Emphasis
The SN75LVPE802 device provides the de-emphasis settings shown in 表 2. De-emphasis control is
independent for each channel, controlled by the DE1 and DE2 pin settings as shown in 表 2. The reference for
the de-emphasis settings available in the device is the transition bit amplitude for each given configuration; this
transition bit amplitude is different at 0 dB than the –2-dB and –4-dB settings by design. DEW1 and DEW2
control the DE durations for channels one and two, respectively. 表 2 lists the recommended settings for these
control pins. Output de-emphasis is capable of supporting FR4 trace at the output anywhere from 2 in. (5.1 cm)
to 12 in. (30.5 cm) at SATA 3G/6G speed.
表 2. TX and Rx EQ and DE Pulse-Duration Settings
DEW1 OR DEW2
DEVICE FUNCTION → DE WIDTH FOR CH1/CH2
De-emphasis pulse duration, short
0
1 (default)
De-emphasis pulse duration, long
8.3.10 Transmitter Termination
The SN75LVPE802 transmitter includes integrated terminations. The receiver differential output impedance is
nominally 100 Ω, with a ≤ 22% variation.
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8.4 Device Functional Modes
8.4.1 Low-Power Mode
There are two low-power modes supported by the SN75LVPE802 device, listed as follows:
1. Standby mode (triggered by the EN pin, EN = 0 V)
–
The enable (EN) pin controls th low-power mode. Pulling this pin LOW puts the device in standby mode
within 2 µs (max). In this mode, the device drives all its active components to their quiescent level, and
differential outputs Hi-Z (open). Maximum power dissipation in this mode is 5 mW. Exiting from this mode
to normal operation requires a maximum latency of 5 µs.
2. Auto low-power mode (triggered when a given channel is in the electrically idle state for more than 100 µs
and EN = VCC)
–
The device enters and exits low-power mode by actively monitoring the input signal (VIDp-p) level on each
of its channels independently. When the input signal on either or both channels is in the electrically idle
state, that is, VIDp-p < 50 mV and stays in this state for > 100 µs, the associated channel enters into the
low-power state. In this state, output of the associated channel goes to VCM and the device selectively
shuts off some circuitry to lower power by > 80% of its normal operating power. Exit time from the auto
low-power mode is < 50 ns.
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN75LVPE802 can be used for SATA applications as well as SATA Express applications. The device
supports SATA Gen1, Gen2, and Gen3 applications with data rates from 1.5 to 6 Gbps. The built-in equalization
circuits provide up to 13 dB of equalization at 3 GHz. This equalization can support SATA GEN2 (3 Gbps)
applications over up to 50 inches of FR-4 material. The same 13 dB equalizer is suited to SATA Gen3 (6 Gbps)
applications up to 40 inches of FR4.
In addition to SATA applications, the SN75LVPE802 can support SATA Express applications. SATA Express
provides a standardized interface to support both SATA (Gen1, Gen2, and Gen3) and PCI Express (PCIe 1, 2
and 3).
All applications of the SN75LVPE802 share some common applications issues. For example, power supply
filtering, board layout, and equalization performance with varying interconnect losses. Other applications issues
are specific, such as implementing receiver detection for SATA Express applications. The Typical Application
examples demonstrate common implementations of the SN75LVPE802 supporting SATA, as well as SATA
Express applications.
9.2 Typical SATA Application
This typical application describes how to configure the EQ, DE, and DEW configuration pins of the
SN75LVPE802 device based on board trace length between the SATA Host and the SN75LVPE802 and the
SN75LVPE802 and SATA Device. Actual configuration settings may differ due to additional factors such as
board layout, trace widths, and connectors used in the signal path.
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Typical SATA Application (接下页)
3.3 V
10 nF
10 nF
1
1 5
1 4
1 3
1 2
1 1
RX1P
TX1P
TX1N
2
3
4
5
RX1N
10 nF
10 nF
10 nF
10 nF
LVPE802
RX2N
RX2P
TX2N
TX2P
10 nF
10 nF
Copyright © 2016, Texas Instruments Incorporated
(1) Place supply caps close to device pin
(2) EN can be left open or tied to supply when no external control is implemented
(3) Output de-emphasis selection is set at -3 dB, EQ at 7 dB and DE width for SATA I/II/III operation for both channels.
(4) Actual EQ/DE/DE width settings will depend on device placement relative to host and SATA connector.
图 25. Typical Device Implementation
9.2.1 Design Requirements
Typically, system trace length from the SATA host to the SN75LVPE802 device and trace length from the
SN75LVPE802 device to a SATA device differ and require different equalization and de-emphasis settings for the
host side and device side.
For example:
•
A system with a 6-inch trace from the SN75LVPE802 device to a SATA host may set EQ1 (Rx1±) to 7 dB,
and DE2 (Tx2±) to –2 dB and DEW2 (Tx2±) to long pulse duration.
•
The same system with a 1-inch trace from the SN75LVPE802 device to a SATA HDD may set EQ2 (Rx2±) to
0 dB, and DE1 (Tx1±) to 0 dB and DEW1 (Tx1±) to short pulse duration.
Refer to
Application Curves for recommended EQ, DE and DEW settings based on trace length. It is highly
recommended to add both pullup- and pulldown-resistor options in the layout to fine-tune the settings if needed.
Input Signal Characteristics:
•
•
•
•
•
Data Rate: 6 Gbps
Pattern: PRBS7
No pre-emphasis
Signal amplitude: 500 mVpp
18-inch SMA cable from test equipment to input and output trace
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Typical SATA Application (接下页)
Lecroy PERT3
SN75LVPE802
25-GHz Scope
TP1
TP2
TP3
TP4
图 26. Measurement Set-up
9.2.2 Detailed Design Procedure
9.2.2.1 Equalization Configuration
Each differential input of the SN75LVPE802 device has programmable equalization in the front stage. The
equalization setting is shown in 表 1. The input equalizer is designed to recover a signal even when no eye is
present at the receiver and effectively supports FR4 trace input from 3 inches to greater than 24 inches at SATA
6 Gbps speed.
9.2.3 De-emphasis Configuration
The SN75LVPE802 device provides the de-emphasis settings shown in 表 1 and 表 2. TX and Rx EQ and DE
Pulse-Duration Settings. De-emphasis is controlled independently for each channel and is set by the DE1, DE2,
DEW1 and DEW2 pins of the SN75LVPE802 device.
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Typical SATA Application (接下页)
9.2.4 Application Curves
Typical application curves correspond to SATA application at 6 Gbps.
9.2.4.1 SN75LVPE802 Equalization Settings for Various Input Trace Length
Input Trace Length = 3 in.
Input Trace Length = 3 in.
EQ1, EQ2 Setting = NC (0 dB)
EQ1, EQ2 Setting = NC (0 dB)
图 28. Output Eye (TP4)
图 27. Input Eye (TP2)
Input Trace Length = 6 in.
Input Trace Length = 6 in.
EQ1, EQ2 Setting = 0 (7 dB)
EQ1, EQ2 Setting = 0 (7 dB)
图 29. Input Eye (TP2)
图 30. Output Eye (TP4)
Input Trace Length = 12 in.
EQ1, EQ2 Setting = 0 (7 dB)
Input Trace Length = 12 in.
EQ1, EQ2 Setting = 0 (7 dB)
图 31. Input Eye (TP2)
图 32. Output Eye (TP4)
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Typical SATA Application (接下页)
Input Trace Length = 24 in.
EQ1, EQ2 Setting = 0 (7 dB)
Input Trace Length = 24 in.
EQ1, EQ2 Setting = 0 (7 dB)
图 33. Input Eye (TP2)
图 34. Output Eye (TP4)
Input Trace Length = 36 in.
Input Trace Length = 36 in.
EQ1, EQ2 Setting = 1 (14 dB)
EQ1, EQ2 Setting = 1 (14 dB)
图 35. Input Eye (TP2)
图 36. Output Eye (TP4)
Input Trace Length = 48 in.
Input Trace Length = 48 in.
EQ1, EQ2 Setting = 1 (14 dB)
EQ1, EQ2 Setting = 1 (14 dB)
图 37. Input Eye (TP2)
图 38. Output Eye (TP4)
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Typical SATA Application (接下页)
9.2.4.2 SN75LVCP802 De-emphasis Settings For various Output Trace Lengths
Output Trace Length = 0 in.
DE, DE2 Setting = 0 (0 dB)
Output Trace Length = 3 in.
DE, DE2 Setting = 0 (0 dB)
DEW1, DEW2 Setting = 0 (Short pulse duration)
DEW1, DEW2 Setting = 0 (Short pulse duration)
图 39. Output Eye (TP4)
图 40. Output Eye (TP4)
Output Trace Length = 6 in.
DE, DE2 Setting = 1 (-2 dB)
Output Trace Length = 12 in.
DE, DE2 Setting = 1 (-2 dB)
DEW1, DEW2 Setting = 1 (Long pulse duration)
DEW1, DEW2 Setting = 1 (Long pulse duration)
图 41. Output Eye (TP4)
图 42. Output Eye (TP4)
Output Trace Length = 12 in.
DE, DE2 Setting = NC (-4 dB)
DEW1, DEW2 Setting = 1 (Long pulse duration)
图 43. Output Eye (TP4)
24
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9.3 SATA Express Applications
Connector
330
330
Host
VCC
Controller
U1
220nF
220nF
RX1P
RX1N
GND
TX2N
VCC
EQ2
GND
220nF
220nF
EQ1
DEW1
TX1P
TX1N
GND
Device
TX2P
220nF
220nF
220nF
220nF
DEW2
EN
DE2
DE1
VCC
470nF
470nF
220nF
220nF
VCC
RX2N
RX2P
SN75LVPE802
330
330
Copyright © 2017, Texas Instruments Incorporated
图 44. SATAe Reference Schematic
9.3.1 Detailed Design Procedure
图 44 is a reference schematic of a SATAe implementation using the SN75LVPE802. With a SATAe design, both
SATA and PCI Express must be supported. SATAe supports both cabled and direct connections. Using a cabled
application as an example, the SATAe power connector includes an Interface Detect (IFDet, power connector pin
P4) signal that indicates whether a SATA client or a PCIe client is connected.
When the SATAe host determines that a PCIe client is connected, the SATAe host performs receiver detection.
Receiver detection determines the presence of a client by detecting the load impedance. The transmitter
performs a common mode voltage shift, and measures the rate at which the voltage at the transmitter output
changes. The rate of change indicates if a client is present (fast charging when a low impedance load is present,
or slow charging when the load is open or high impedance). With the implementation in 图 44, 330-Ω pulldowns
have been inserted between the host and the SN75LVPE802. The pulldown resistors indicate to the host that a
client is present. While an actual client would be expected to have an active load of 50 Ω single ended, the 330
Ω is chosen here to meet two requirements. The 330 Ω is low enough to force the SATAe host to decide that a
receiver is present, while also high enough to only marginally affect the load when the SN75LVPE802 is active,
and presenting a 50-Ω load. With the 50 Ω and 330 Ω are both present, the parallel combination of 43 Ω is
satisfactory for most applications.
Assuming that the SATAe host has detected (via IFDet) that a SATA client is present, the SATAe host
communicates with the client via the SN75LVPE802. The SATA standard does not have a receiver detection
mode as is present in PCIe. A SATA host does use OOB signaling to communicate identification information. The
SN75LVPE802 incorporates an OOB detector in order to support OOB signaling through the device. The OOB
detector drives a squelch circuit on the SN75LVPE802 output transmitter. (See OOB/Squelch for more details on
the OOB/Squelch circuitry.)
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SATA Express Applications (接下页)
Returning to 图 44, there is a 200-nF AC coupling capacitors on the device or client side of the interface. These
capacitors allow interfacing to both SATA and PCIe clients. In the case of a PCIe client, the 200 nF is within the
acceptable range for all PCIe devices. When a SATA client is present, the 200 nF capacitor has little effect on
the overall link, as it appears in series with the 12-nF (max) AC coupling capacitor incorporated into the SATA
client. The 200 nF in series with the 12 nF presents an effective capacitance of 11.3 nF, as expected less than
the 12-nF maximum permitted.
9.3.2 PCIe Applications
PCIe-only applications are implemented in a manner very similar to SATA Express applications as covered in
Detailed Design Procedure. Looking at 图 45 and comparing it to the SATA Express application in Figure 8 20
SATAe Reference Schematic, a single change is noted. For PCIe applications the 220 nF AC-coupling
capacitors on the Host-to-Device link are relocated from the Device side of the connector to the Host side. No
other changes are required.
Connector
330
330
Host
VCC
Controller
U1
RX1P
220nF
220nF
VCC
EQ2
GND
RX1N
GND
220nF
220nF
TX2N
TX2P
DEW2
EN
EQ1
DEW1
TX1P
Device
220nF
220nF
TX1N
GND
DE2
470nF
470nF
220nF
220nF
VCC
DE1
RX2N
RX2P
VCC
SN75LVPE802
330
330
Copyright © 2017, Texas Instruments Incorporated
图 45. SN75LVPE802 PCIe Reference Schematic
10 Power Supply Recommendations
The design of SN75LVPE802 device is for operation from one 3.3-V supply. Always practice proper power supply
sequencing procedure. Apply VCC first, before application of any input signals to the device. The power down
sequence is in reverse order.
26
版权 © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
11 Layout
11.1 Layout Guidelines
24"
SATA
connector
Redriver
SATA Host
8"
16"
Redriver on Motherboard
24"
SATA Host
Redriver
Main Board
Dock Board
SATA
connector
8"
16"
Redriver on Dock Board
Copyright © 2016, Texas Instruments Incorporated
(1) Trace lengths are suggested values based on TI spice simulations (done over programmable limits of input EQ and
output de-emphasis) to meet SATA loss and jitter spec.
Actual trace length supported by the LVPE802 may be more or less than suggested values and will depend on board
layout, trace widths and number of connectors used in the SATA signal path.
图 46. Trace Length Example for LVPE802
版权 © 2016–2017, Texas Instruments Incorporated
27
SN75LVPE802
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
www.ti.com.cn
11.2 Layout Example
图 47. Example Layout
28
版权 © 2016–2017, Texas Instruments Incorporated
SN75LVPE802
www.ti.com.cn
ZHCSFG1B –JANUARY 2016–REVISED FEBRUARY 2017
12 器件和文档支持
12.1 接收文档更新通知
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。
12.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2016–2017, Texas Instruments Incorporated
29
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN75LVPE802RTJR
SN75LVPE802RTJT
ACTIVE
ACTIVE
QFN
QFN
RTJ
RTJ
20
20
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
0 to 85
0 to 85
LVP802
LVP802
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN75LVPE802RTJR
SN75LVPE802RTJT
QFN
QFN
RTJ
RTJ
20
20
3000
250
330.0
180.0
12.4
12.4
4.25
4.25
4.25
4.25
1.15
1.15
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN75LVPE802RTJR
SN75LVPE802RTJT
QFN
QFN
RTJ
RTJ
20
20
3000
250
346.0
210.0
346.0
185.0
33.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RTJ 20
4 x 4, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224842/A
www.ti.com
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