SNJ54ACT32W [TI]
QUADRUPLE 2-INPUT POSITIVE-OR GATES; 四路2输入正或门型号: | SNJ54ACT32W |
厂家: | TEXAS INSTRUMENTS |
描述: | QUADRUPLE 2-INPUT POSITIVE-OR GATES |
文件: | 总12页 (文件大小:355K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋ ꢌꢄꢍꢎ ꢌꢏꢐ ꢑ ꢈ ꢒꢓꢁ ꢏꢌꢆ ꢏꢔ ꢀꢓ ꢆ ꢓꢕꢑ ꢒꢔꢎ ꢖ ꢄꢆꢑ ꢀ
SCAS530C − AUGUST 1995 − REVISED OCTOBER 2003
D
D
4.5-V to 5.5-V V
Operation
D Max t of 10 ns at 5 V
CC
pd
Inputs Accept Voltages to 5.5 V
D Inputs Are TTL-Voltage Compatible
SN54ACT32 . . . J OR W PACKAGE
SN74ACT32 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54ACT32 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
1A
1B
1Y
2A
2B
V
CC
3
2
1
20 19
18
4B
4A
4Y
3B
3A
3Y
1Y
NC
2A
4A
4
5
6
7
8
NC
17
16 4Y
15
NC
2B
NC
3B
2Y
GND
14
8
9 10 11 12 13
NC − No internal connection
description/ordering information
The ’ACT32 devices are quadruple 2-input positive-OR gates. The devices perform the Boolean function
Y = A + B or Y = A • B in positive logic.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube
SN74ACT32N
SN74ACT32N
Tube
SN74ACT32D
ACT32
Tape and reel
Tape and reel
Tape and reel
Tube
SN74ACT32DR
SN74ACT32NSR
SN74ACT32DBR
SN74ACT32PW
SN74ACT32PWR
SNJ54ACT32J
SNJ54ACT32W
SNJ54ACT32FK
SOP − NS
ACT32
AD32
−40°C to 85°C
SSOP − DB
TSSOP − PW
AD32
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54ACT32J
SNJ54ACT32W
SNJ54ACT32FK
Tube
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
Y
A
B
X
H
L
H
X
L
H
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢈ
ꢋꢌ ꢄ ꢍꢎ ꢌ ꢏꢐ ꢑ ꢈ ꢒꢓ ꢁ ꢏꢌ ꢆ ꢏ ꢔꢀ ꢓ ꢆꢓ ꢕ ꢑꢒ ꢔꢎ ꢖ ꢄꢆ ꢑꢀ
SCAS530C − AUGUST 1995 − REVISED OCTOBER 2003
logic diagram, each gate (positive logic)
A
B
Y
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54ACT32
SN74ACT32
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
0.8
V
0
0
V
V
0
0
V
V
V
I
CC
CC
Output voltage
V
O
CC
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
−24
24
−24
24
8
mA
mA
ns/V
°C
OH
OL
∆t/∆v
8
T
−55
125
−40
85
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
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2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢈ
ꢋ ꢌꢄꢍꢎ ꢌꢏꢐ ꢑ ꢈ ꢒꢓꢁ ꢏꢌꢆ ꢏꢔ ꢀꢓ ꢆ ꢓꢕꢑ ꢒꢔꢎ ꢖ ꢄꢆꢑ ꢀ
SCAS530C − AUGUST 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
SN54ACT32
SN74ACT32
PARAMETER
TEST CONDITIONS
UNIT
V
CC
MIN
4.4
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
I
I
= −50 µA
OH
5.4
5.4
5.4
3.86
4.86
3.7
3.76
4.76
V
OH
= −24 mA
V
OH
4.7
†
†
I
I
= −50 mA
3.86
OH
= −75 mA
3.85
OH
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 µA
OL
OL
0.36
0.36
0.5
0.44
0.44
V
OL
I
= 24 mA
V
0.5
†
†
I
I
= 50 mA
1.65
OL
= 75 mA
1.65
1
OL
I
I
V = V
or GND
or GND,
0.1
2
1
µA
µA
I
I
CC
V = V
I = 0
O
40
20
CC
I
CC
One input at 3.4 V,
Other inputs at V
‡
nI
CC
5.5 V
5 V
0.6
2.6
1.6
1.5
mA
pF
or GND
CC
or GND
C
V = V
I CC
i
†
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range,
= 5 V " 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
6.5
SN54ACT32
MIN MAX
SN74ACT32
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1
MAX
MIN
1
MAX
10
t
t
9
9
PLH
A or B
Y
ns
1
6.5
1
10
PHL
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
Power dissipation capacitance
TEST CONDITIONS
= 50 pF, f = 1 MHz
L
TYP
UNIT
C
C
40
pF
pd
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3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢈ
ꢋꢌ ꢄ ꢍꢎ ꢌ ꢏꢐ ꢑ ꢈ ꢒꢓ ꢁ ꢏꢌ ꢆ ꢏ ꢔꢀ ꢓ ꢆꢓ ꢕ ꢑꢒ ꢔꢎ ꢖ ꢄꢆ ꢑꢀ
SCAS530C − AUGUST 1995 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
TEST
/t
S1
Input
(see Note B)
1.5 V
1.5 V
t
Open
PLH PHL
t
t
t
PHL
PLH
PHL
2 × V
CC
V
OH
In-Phase
Output
50% V
50% V
S1
50% V
CC
CC
500 Ω
Open
From Output
Under Test
V
OL
t
PLH
C
= 50 pF
L
500 Ω
V
OH
(see Note A)
Out-of-Phase
Output
50% V
CC
CC
V
OL
LOAD CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74ACT32D
ACTIVE
SOIC
D
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT32DBLE
SN74ACT32DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT32DBRE4
SN74ACT32DE4
SN74ACT32DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
D
14
14
14
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT32DRE4
SN74ACT32N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74ACT32NE4
SN74ACT32NSR
SN74ACT32NSRE4
SN74ACT32PW
SN74ACT32PWE4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT32PWLE
SN74ACT32PWR
OBSOLETE TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
ACTIVE
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT32PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
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Copyright 2006, Texas Instruments Incorporated
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