SNJ54BCT646FK [TI]

OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS; 八路总线收发器和寄存器具有三态输出
SNJ54BCT646FK
型号: SNJ54BCT646FK
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS
八路总线收发器和寄存器具有三态输出

总线收发器 输出元件
文件: 总18页 (文件大小:386K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢊ ꢅꢆꢋꢌ ꢄꢍꢀ ꢆ ꢎꢋꢁꢀ ꢅꢏꢐ ꢑꢏꢎꢀ ꢋꢁꢒ ꢎꢏꢓ ꢐ ꢀ ꢆꢏ ꢎ  
ꢔ ꢐꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊ ꢍꢆ ꢘꢍ ꢆ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
D
State-of-the-Art BiCMOS Design  
Significantly Reduces I  
D
Multiplexed Real-Time and Stored Data  
CCZ  
D
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
D
Bus Transceivers/Registers  
D
Independent Registers and Enables for  
A and B Buses  
SN54BCT646 . . . JT OR W PACKAGE  
SN74BCT646 . . . DW OR NT PACKAGE  
(TOP VIEW)  
SN54BCT646 . . . FK PACKAGE  
(TOP VIEW)  
CLKAB  
SAB  
DIR  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
GND  
V
CC  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
CLKBA  
SBA  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
2
3
4
3
2
1 28 27 26  
25  
A1  
A2  
A3  
NC  
A4  
A5  
A6  
OE  
B1  
B2  
NC  
B3  
B4  
B5  
5
4
24  
23  
22  
21  
20  
19  
6
5
7
6
8
7
9
8
10  
11  
9
10  
11  
12  
12 13 14 15 16 17 18  
B8  
NC − No internal connection  
description/ordering information  
These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed  
transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked  
into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1  
illustrates the four fundamental bus-management functions that can be performed with the ’BCT646 devices.  
Output-enable (OE) and direction-control (DIR) inputs are provided to control the transceiver functions. In the  
transceiver mode, data present at the high-impedance port can be stored in either register or in both.  
The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. The  
direction control (DIR) determines which bus will receive data when OE is low. In the isolation mode (OE high),  
A data can be stored in one register and/or B data can be stored in the other register.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP − NT  
SOIC − DW  
Tube  
SN74BCT646NT  
SN74BCT646DW  
SN74BCT646DWR  
SNJ54BCT646JT  
SNJ54BCT646W  
SNJ54BCT646FK  
SN74BCT646NT  
Tube  
0°C to 70°C  
BCT646  
Tape and reel  
Tube  
CDIP − JT  
CFP − W  
SNJ54BCT646JT  
SNJ54BCT646W  
SNJ54BCT646FK  
−55°C to 125°C  
Tube  
LCCC − FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2004, Texas Instruments Incorporated  
ꢊ ꢚ ꢥ ꢝ ꢜꢨ ꢣꢢ ꢠꢡ ꢢꢜ ꢞꢥ ꢧꢙ ꢟꢚ ꢠ ꢠꢜ ꢯꢐ ꢌꢗ ꢘꢎ ꢰ ꢗꢖꢱꢂ ꢖꢂꢈ ꢟꢧꢧ ꢥꢟ ꢝ ꢟ ꢞꢤ ꢠꢤꢝ ꢡ ꢟ ꢝ ꢤ ꢠꢤ ꢡꢠꢤ ꢨ  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
ꢣ ꢚꢧ ꢤꢡꢡ ꢜ ꢠꢪꢤ ꢝ ꢬꢙ ꢡꢤ ꢚ ꢜꢠꢤ ꢨꢩ ꢊ ꢚ ꢟꢧ ꢧ ꢜ ꢠꢪꢤ ꢝ ꢥꢝ ꢜ ꢨꢣꢢ ꢠꢡ ꢈ ꢥꢝ ꢜ ꢨꢣꢢ ꢠꢙꢜ ꢚ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢇ  
ꢊꢅ ꢆꢋ ꢌ ꢄ ꢍ ꢀ ꢆ ꢎ ꢋꢁ ꢀꢅ ꢏꢐ ꢑ ꢏ ꢎꢀ ꢋꢁ ꢒ ꢎꢏ ꢓ ꢐꢀ ꢆꢏ ꢎꢀ  
ꢔꢐ ꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊꢍꢆ ꢘ ꢍꢆꢀ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
description/ordering information(continued)  
When an output function is disabled, the input function still is enabled and can be used to store and transmit  
data. Only one of the two buses, A or B, can be driven at a time.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢆꢋ  
ꢏ ꢋ  
ꢔ ꢐꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊ ꢍꢆ ꢘ ꢍꢆ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
21  
OE  
L
3
1
23  
2
22  
SBA  
21  
OE  
L
3
DIR  
1
23  
2
22  
SBA  
DIR CLKAB CLKBA SAB  
CLKAB CLKBA SAB  
L
X
X
X
L
H
X
X
L
X
REAL-TIME TRANSFER  
BUS B TO BUS A  
REAL-TIME TRANSFER  
BUS A TO BUS B  
21  
3
1
23  
2
22  
21  
OE  
L
3
DIR  
L
1
23  
2
22  
SBA  
H
DIR CLKAB CLKBA SAB  
SBA  
X
CLKAB CLKBA SAB  
OE  
X
X
X
X
X
X
X
X
X
X
H or L  
X
X
H
X
H
X
X
L
H
H or L  
X
STORAGE FROM  
A, B, OR A AND B  
TRANSFER STORED DATA  
TO A AND/OR B  
Pin numbers shown are for the DW, JT, NT, and W packages.  
Figure 1. Bus-Management Functions  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢇ  
ꢊꢅ ꢆꢋ ꢌ ꢄ ꢍ ꢀ ꢆ ꢎ ꢋꢁ ꢀꢅ ꢏꢐ ꢑ ꢏ ꢎꢀ ꢋꢁ ꢒ ꢎꢏ ꢓ ꢐꢀ ꢆꢏ ꢎꢀ  
ꢔꢐ ꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊꢍꢆ ꢘ ꢍꢆꢀ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
FUNCTION TABLE  
DATA I/O  
INPUTS  
OPERATION OR FUNCTION  
OE  
X
X
H
H
L
DIR  
X
CLKAB  
CLKBA  
SAB  
X
SBA  
X
A1 THRU A8  
B1 THRU B8  
X
Input  
Unspecified  
Store A, B unspecified  
X
X
X
X
Unspecified  
Input  
Store B, A unspecified  
X
H or L  
X
H or L  
X
X
X
Input  
Input disabled  
Output  
Input  
Store A and B data  
Isolation, hold storage  
Real-time B data to A bus  
Stored B data to A bus  
Real-time A data to B bus  
Stored A data to B bus  
X
X
X
Input disabled  
Input  
L
X
L
L
L
X
H or L  
X
X
H
Output  
Input  
L
H
H
X
L
X
Input  
Output  
L
H or L  
X
H
X
Input  
Output  
The data output functions can be enabled or disabled by various signals at the OE and DIR inputs. Data input functions always are enabled, i.e.,  
data at the bus pins is stored on every low-to-high transition of the clock inputs.  
logic diagram (positive logic)  
21  
OE  
3
DIR  
23  
CLKBA  
22  
SBA  
1
CLKAB  
2
SAB  
One of Eight  
Channels  
1D  
C1  
4
A1  
20  
B1  
1D  
C1  
To Seven Other Channels  
Pin numbers shown are for the DW, JT, NT, and W packages.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢊ ꢅꢆꢋꢌ ꢄꢍꢀ ꢆ ꢎꢋꢁꢀ ꢅꢏꢐ ꢑꢏꢎꢀ ꢋꢁꢒ ꢎꢏꢓ ꢐ ꢀ ꢆꢏ ꢎ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range: Control inputs (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V  
Voltage range applied to any output in the disabled or power-off state, V . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Voltage range applied to any output in the high state, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
O
CC  
Current into any output in the low state: SN54BCT646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA  
SN74BCT646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W  
JA  
(see Note 3): NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
3. The package thermal impedance is calculated in accordance with JESD 51-3.  
recommended operating conditions (see Note 4)  
SN54BCT646  
MIN NOM MAX  
SN74BCT646  
UNIT  
MIN NOM  
MAX  
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.5  
2
5
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input clamp current  
0.8  
−18  
−12  
48  
0.8  
−18  
−15  
64  
V
I
I
I
mA  
mA  
mA  
°C  
IK  
High-level output current  
Low-level output current  
Operating free-air temperature  
OH  
OL  
T
A
55  
125  
0
70  
NOTE 4: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢇ  
ꢊꢅ ꢆꢋ ꢌ ꢄ ꢍ ꢀ ꢆ ꢎ ꢋꢁ ꢀꢅ ꢏꢐ ꢑ ꢏ ꢎꢀ ꢋꢁ ꢒ ꢎꢏ ꢓ ꢐꢀ ꢆꢏ ꢎꢀ  
ꢔꢐ ꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊꢍꢆ ꢘ ꢍꢆꢀ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54BCT646  
SN74BCT646  
PARAMETER  
TEST CONDITIONS  
I = −18 mA  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
V
V
V
= 4.5 V,  
= 4.5 V  
−1.2  
−1.2  
V
IK  
CC  
I
I
I
I
I
I
= 3 mA  
= −12 mA  
= −15 mA  
= 48 mA  
= 64 mA  
2.4  
2
3.3  
3.2  
2.4  
2
3.3  
3.1  
OH  
OH  
OH  
OL  
OL  
V
OH  
CC  
0.38  
0.55  
V
OL  
V
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
V
0.42  
0.55  
1
A or B port  
1
1
I
I
I
V = 5.5 V  
I
mA  
µA  
mA  
I
Control inputs  
A or B port  
1
70  
70  
V = 2.7 V  
I
IH  
Control inputs  
A or B port  
20  
20  
0.7  
0.7  
0.7  
0.7  
225  
67  
V = 0.5 V  
I
IL  
Control inputs  
§
I
I
I
I
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5 V,  
V = 0  
O
100  
225 100  
mA  
mA  
mA  
mA  
pF  
OS  
A or B port  
V = GND  
I
42  
5.6  
10  
6
67  
9
42  
5.6  
10  
6
CCL  
CCH  
CCZ  
A or B port  
A or B port  
Control inputs  
A or B port  
V = 4.5 V  
I
9
V = GND  
I
16  
16  
C
C
V = 2.5 V or 0.5 V  
I
i
= 5 V,  
V
O
= 2.5 V or 0.5 V  
12  
14  
pF  
io  
§
All typical values are at V  
For I/O ports, the parameters I and I include the off-state output current.  
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
= 5 V, T = 25°C.  
A
CC  
IH  
IL  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted)  
V
T
= 5 V,  
= 25°C  
CC  
A
SN54BCT646  
SN7BCT646  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
f
t
t
t
Clock frequency  
83  
83  
83  
MHz  
ns  
clock  
Pulse duration, CLK high or low  
Setup time, A or B before CLKABor CLKBA↑  
Hold time, A or B after CLKABor CLKBA↑  
6
6
6
7
6
6
w
ns  
su  
h
0.5  
0.5  
0.5  
ns  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢊ ꢅꢆꢋꢌ ꢄꢍꢀ ꢆ ꢎꢋꢁꢀ ꢅꢏꢐ ꢑꢏꢎꢀ ꢋꢁꢒ ꢎꢏꢓ ꢐ ꢀ ꢆꢏ ꢎ  
ꢔ ꢐꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊ ꢍꢆ ꢘ ꢍꢆ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, C = 50 pF (unless otherwise noted) (see Figure 2)  
L
V
T
= 5 V,  
= 25°C  
CC  
A
SN54BCT646 SN74BCT646  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
83  
TYP  
MAX  
MIN  
83  
MAX  
MIN  
83  
MAX  
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PZH  
PZL  
PHZ  
PLZ  
3.6  
3.9  
3.1  
3.7  
4.5  
3.3  
3.9  
4.7  
4
7
7
9.4  
9.2  
3.6  
3.9  
3.1  
3.7  
4.5  
3.3  
3.9  
4.7  
4
12.4  
11.5  
11.1  
12.1  
15.2  
9.8  
3.6  
3.9  
3.1  
3.7  
4.5  
3.3  
3.9  
4.7  
4
11.2  
10.6  
9.5  
CLKBA or CLKAB  
A or B  
A or B  
B or A  
A or B  
A or B  
A or B  
A or B  
A or B  
A or B  
6
8.1  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
6.8  
8.8  
6
8.9  
10.5  
13.8  
9.1  
11.2  
8.1  
SAB or SBA  
(with A or B high)  
7.7  
8.3  
7.9  
8.8  
7.2  
7
10.2  
10.8  
10.7  
11.8  
9.4  
13.3  
13.7  
14  
12  
SAB or SBA  
(with A or B low)  
12.9  
13.2  
14.4  
10.9  
10.5  
13.1  
14.6  
12.6  
11.8  
OE  
4.6  
4
4.6  
4
15.4  
12  
4.6  
4
OE  
DIR  
DIR  
3.4  
2.8  
3.8  
3.8  
3.2  
9.3  
3.4  
2.8  
3.8  
3.8  
3.2  
11.6  
14  
3.4  
2.8  
3.8  
3.8  
3.2  
7.8  
8.9  
8.4  
7.3  
10.7  
11.9  
10.7  
9.9  
15.6  
13.2  
12.6  
These parameters are measured with the internal output state of the storage register opposite that of the bus input.  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢇꢈ ꢀꢁꢉ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢇ  
ꢊꢅ ꢆꢋ ꢌ ꢄ ꢍ ꢀ ꢆ ꢎ ꢋꢁ ꢀꢅ ꢏꢐ ꢑ ꢏ ꢎꢀ ꢋꢁ ꢒ ꢎꢏ ꢓ ꢐꢀ ꢆꢏ ꢎꢀ  
ꢔꢐ ꢆ ꢕ ꢖ ꢗꢀꢆꢋꢆ ꢏ ꢊꢍꢆ ꢘ ꢍꢆꢀ  
SCBS037D − AUGUST 1989 − REVISED MAY 2004  
PARAMETER MEASUREMENT INFORMATION  
7 V (t  
, t  
, O.C.)  
PZL PLZ  
Open  
(all others)  
S1  
From Output  
Under Test  
Test  
Point  
C
L
R1  
R1  
(see Note A)  
From Output  
Under Test  
Test  
Point  
C
L
R2  
(see Note A)  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
R
= R1 = R2  
L
LOAD CIRCUIT FOR  
3-STATE AND OPEN-COLLECTOR OUTPUTS  
High-Level  
Pulse  
(see Note B)  
3 V  
0 V  
1.5 V  
1.5 V  
3 V  
Timing Input  
(see Note B)  
1.5 V  
t
w
0 V  
3 V  
0 V  
3 V  
0 V  
t
h
Low-Level  
Pulse  
t
1.5 V  
su  
1.5 V  
Data Input  
(see Note B)  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
Output  
Control  
(low-level enable)  
3 V  
1.5 V  
1.5 V  
Input  
(see Note B)  
1.5 V  
1.5 V  
0 V  
PHL  
t
t
PZL  
t
t
PLZ  
t
PLH  
3.5 V  
In-Phase  
Output  
(see Note D)  
V
OH  
1.5 V  
Waveform 1  
(see Notes C and D)  
1.5 V  
1.5 V  
1.5 V  
t
V
OL  
V
OL  
0.3 V  
t
PHZ  
PLH  
t
PHL  
PZH  
V
OH  
V
OH  
Out-of-Phase  
Output  
(see Note D)  
Waveform 2  
(see Notes C and D)  
1.5 V  
1.5 V  
0.3 V  
0 V  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES (see Note D)  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, t = t 2.5 ns, duty cycle = 50%.  
r
f
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. When measuring propagation delay times of 3-state outputs, switch S1 is open.  
F. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-May-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CFP  
Drawing  
5962-9155501M3A  
5962-9155501MKA  
5962-9155501MLA  
SN74BCT646DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
FK  
28  
24  
24  
24  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
W
A42  
N / A for Pkg Type  
N / A for Pkg Type  
CDIP  
SOIC  
JT  
A42 SNPB  
DW  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74BCT646DWE4  
SN74BCT646DWG4  
SN74BCT646DWR  
SN74BCT646DWRE4  
SN74BCT646DWRG4  
SN74BCT646NT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
DW  
DW  
DW  
DW  
DW  
NT  
24  
24  
24  
24  
24  
24  
24  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
15  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
SN74BCT646NTE4  
NT  
15  
Pb-Free  
(RoHS)  
SNJ54BCT646FK  
SNJ54BCT646JT  
SNJ54BCT646W  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
JT  
W
28  
24  
24  
1
1
1
TBD  
TBD  
TBD  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-May-2007  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
(mm)  
SN74BCT646DWR  
DW  
24  
TAI  
330  
24  
10.75  
15.7  
2.7  
12  
24  
Q1  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
TAI  
Length (mm) Width (mm) Height (mm)  
SN74BCT646DWR  
DW  
24  
346.0  
346.0  
41.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MCER004A – JANUARY 1995 – REVISED JANUARY 1997  
JT (R-GDIP-T**)  
CERAMIC DUAL-IN-LINE  
24 LEADS SHOWN  
PINS **  
A
24  
28  
DIM  
13  
24  
1.280  
(32,51) (37,08)  
1.460  
A MAX  
1.240  
(31,50) (36,58)  
1.440  
B
A MIN  
B MAX  
B MIN  
0.300  
(7,62)  
0.291  
(7,39)  
1
12  
0.070 (1,78)  
0.030 (0,76)  
0.245  
(6,22)  
0.285  
(7,24)  
0.320 (8,13)  
0.290 (7,37)  
0.015 (0,38) MIN  
0.100 (2,54) MAX  
0.200 (5,08) MAX  
Seating Plane  
0.130 (3,30) MIN  
0.023 (0,58)  
0.015 (0,38)  
0°–15°  
0.014 (0,36)  
0.008 (0,20)  
0.100 (2,54)  
4040110/C 08/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification.  
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MCFP007 – OCTOBER 1994  
W (R-GDFP-F24)  
CERAMIC DUAL FLATPACK  
0.375 (9,53)  
0.340 (8,64)  
Base and Seating Plane  
0.006 (0,15)  
0.004 (0,10)  
0.045 (1,14)  
0.026 (0,66)  
0.090 (2,29)  
0.045 (1,14)  
0.395 (10,03)  
0.360 (9,14)  
0.360 (9,14)  
0.240 (6,10)  
0.360 (9,14)  
0.240 (6,10)  
0.019 (0,48)  
0.015 (0,38)  
1
24  
0.050 (1,27)  
0.640 (16,26)  
0.490 (12,45)  
0.030 (0,76)  
0.015 (0,38)  
12  
13  
30° TYP  
1.115 (28,32)  
0.840 (21,34)  
4040180-5/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD  
E. Index point is provided on cap for terminal identification only.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDI004 – OCTOBER 1994  
NT (R-PDIP-T**)  
PLASTIC DUAL-IN-LINE PACKAGE  
24 PINS SHOWN  
A
PINS **  
24  
28  
DIM  
24  
13  
1.260  
(32,04) (36,20)  
1.425  
A MAX  
1.230  
(31,24) (35,18)  
1.385  
A MIN  
B MAX  
B MIN  
0.280 (7,11)  
0.250 (6,35)  
0.310  
(7,87)  
0.315  
(8,00)  
1
12  
0.290  
(7,37)  
0.295  
(7,49)  
0.070 (1,78) MAX  
B
0.020 (0,51) MIN  
0.200 (5,08) MAX  
Seating Plane  
0.125 (3,18) MIN  
0.100 (2,54)  
0.010 (0,25)  
0°15°  
0.021 (0,53)  
0.015 (0,38)  
M
0.010 (0,25) NOM  
4040050/B 04/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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