SNJ54F244FKR [TI]
F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20;
| 型号： | SNJ54F244FKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 驱动 输出元件 逻辑集成电路 |
| 文件： | 总12页 (文件大小：431K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
54F240,54F241,54F244,74F240,74F241,
74F244
54F240/54F241/54FF244 Octal Buffers/Line Drivers with TRI-STATE(RM) Outputs
Literature Number: SNOS175A
May 1995
54F/74F240 54F/74F241 54F/74F244
#
#
Octal Buffers/Line Drivers with TRI-STATE Outputs
É
General Description
Features
Y
TRI-STATE outputs drive bus lines or buffer memory
address registers
The ’F240, ’F241 and ’F244 are octal buffers and line driv-
ers designed to be employed as memory and address driv-
ers, clock drivers and bus-oriented transmitters/receivers
which provide improved PC and board density.
Y
Y
Y
Y
Outputs sink 64 mA (48 mA mil)
12 mA source current
Input clamp diodes limit high-speed termination effects
Guaranteed 4000V minimum ESD protection
Package
Number
Commercial
74F240PC
Military
Package scrition
N20A
J20A
20-Lead (0.300 Wide) Molded al-In-Line
×
54F240DM (Note 2)
20-Lead Ceramic Dual-In-Line
74F240SC (Note 1)
74F240SJ (Note 1)
M20B
M20D
W20A
E20A
N20A
J20A
20-Lead (0.300 Small Ouine, JEDEC
×
20-Ld (0.300 lded Sall Outline, EIAJ
×
54F240FM (Note 2)
54F240LM (Note 2)
20-Lead rpack
20-Lead Ceric Leadip Carrier, Type C
74F241PC
20.300 de) Molded Dual-In-Line
×
54F241DM (Note 2)
mic Dul-In-Line
74F241SC (Note 1)
74F241SJ (Note 1)
M20B
M
W20A
E2
N20A
J20A
Wide) Molded Small Outline, JEDEC
×
0 Wide) Molded Small Outline, EIAJ
×
54F241FM (Note 2)
54F241LM (Note 2)
20-Lead Cerpack
0-Lead Ceramic Leadless Chip Carrier, Type C
74F244PC
0-Lead (0.300 Wide) Molded Dual-In-Line
×
5444D
20-Lead Ceramic Dual-In-Line
74F244SC (Note 1)
74F244SJ (Note
74F244MSA
20B
20D
MSA20
W20A
E20A
20-Lead (0.300 Wide) Molded Small Outline, JEDEC
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ
×
20-Lead Molded Shrink Small Outline, EIAJ Type II
M (Note 2)
(Note 2)
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 1: Devices alse Suffix
SCX, SJX and MSAX.
Note 2: Military grade mental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9501
RRD-B30M75/Printed in U. S. A.
Connection Diagrams
Pin Assignment for LCC
’F241
’F240
’F244
TL/F/9501–6
TL/F/9501–4
TL/F/9501–2
Pin Assignment for DIP, SOIC, SSOP and Flatpak
TL/F/9501–1
TL/F/9501–3
TL/F/9501–5
Logic Symbols
IEEE/IEC
’F240
IEEE/IEC
’F241
IEEE/IEC
’F244
TL/F/9501–7
TL/F/9501–8
TL/F/9501–9
2
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
b
20 mA/ 1 mA
b
20 mA/ 1 mA
b
20 mA/ 1 mA
OE , OE
1
TRI-STATE Output Enable Input (Active LOW)
TRI-STATE Output Enable Input (Active HIGH)
Inputs (’F240)
1.0/1.667
1.0/1.667
2
OE
2
I –I
0
1.0/1.667*
1.0/2.667*
600/106.6 (80)
7
7
b
I –I
0
Inputs (’F241, ’F244)
20 mA/ 1.6 mA
b
O –O , O –O
7
Outputs
12 mA/64 mA (48 mA)
0
7
0
*Worst-case ’F240 enabled; ’F241, ’F244 disabled
Truth Tables
’F240
’F244
OE
1
D
1n
O
OE
2
D
2n
O
OE
1
D
1n
O
OE
2
D
2n
O
2n
1n
2n
1n
H
L
L
X
Z
H
L
L
X
Z
H
L
L
X
Z
H
Z
H
L
L
H
L
L
H
L
H
L
L
H
L
H
H
e
e
e
e
H
L
HIGH Voltage Level
LOW Voltage Level
Immaterial
’F241
X
Z
OE
1
D
1n
O
OE
2
D
2n
O
2n
1n
High Impedance
H
L
L
X
H
L
Z
H
L
L
H
H
X
H
L
Z
H
L
3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
TRI-STATE Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
ESD Last Passing Voltage (Min)
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Typ
Symbol
Parameter
Unit
V
CC
Coitions
Min
Max
V
V
V
V
Input HIGH Voltage
2.0
V
V
Reczed as HIGH Signal
ecognized as a LOW Signal
IH
Input LOW Voltage
0.8
IL
b
b
18 mA
Input Clamp Diode Voltage
1.2
I
IN
CD
OH
e b
e b
e b
e b
e b
Output HIGH
Voltage
54F 10% V
2.4
2.0
2.4
2.0
2.7
I
I
I
I
I
3 mA
12 mA
3 mA
15 mA
3 mA
CC
CC
CC
CC
OH
OH
OH
OH
OH
54F 10% V
74F 10% V
74F 10% V
74F 5% V
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
5
0.55
I
I
48 mA
OL
CC
OL
V
Min
Max
Max
Max
0.0
64 mA
CC
OL
e
I
I
I
Input HIGH
Current
54F
74F
.0
5.0
V
V
V
2.7V
IH
IN
mA
mA
mA
V
e
Input HIGH Current 54F
100
7.0
7.0V
BVI
IN
Breakdown Test
e
V
CC
Output HIGH
250
50
CEX
OUT
Leakage Cu
e
All Other Pins Grounded
V
Input Leaka
Test
I
ID
1.9 mA
ID
OD
IL
4.75
e
All Other Pins Grounded
I
I
Output Leakag
Circuit Current
V
150 mV
IOD
3.75
mA
mA
0.0
b
b
e
e
Input LOW Current
1.0
1.6
V
V
0.5V (OE , OE , OE , D (’F240))
1 2 2 n
0.5V (D (’F241, ’F244))
IN
Max
IN
n
e
I
I
I
I
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Bus Drainage Test
50
mA
mA
mA
mA
Max
Max
Max
0.0V
V
OUT
V
OUT
V
OUT
V
OUT
2.7V
0.5V
0V
OZH
OZL
OS
b
e
e
e
50
b
b
225
500
100
5.25V
ZZ
4
DC Electrical Characteristics (Continued)
54F/74F
Typ
19
Symbol
Parameter
Units
V
Conditions
CC
Min
Max
29
e
e
e
e
I
I
I
I
Power Supply Current (’F240)
Power Supply Current (’F240)
Power Supply Current (’F240)
mA
mA
mA
Max
Max
Max
V
O
V
O
V
O
V
O
HIGH
LOW
CCH
CCL
CCZ
CCH
50
75
42
63
HIGH Z
HIGH
Power Supply Current
(’F241, ’F244)
40
60
60
60
90
90
mA
mA
mA
Max
Max
Max
e
e
I
I
Power Supply Current
(’F241, ’F244)
V
O
V
O
LOW
CCL
CCZ
Power Supply Current
(’F241, ’F244)
HIGH Z
AC Electrical Characteristics
74F
e a
54F
CC
T
25 C
§
5.0V
A
e
e
T
, V
Mil
T
Com
e
50 pF
A
e a
Symbol
Parameter
V
Units
CC
e
C
50 p
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
t
t
Propagation Delay
3.0
2.0
5.1
3.5
7.0
4.7
3.0
2.
2.0
8.0
5.7
PLH
ns
ns
Data to Output (’F240)
PHL
t
t
Output Enable Time (’F240)
Output Disable Time (’F240)
2.0
4.0
3.5
6.9
9.0
2
4.
6.5
2.0
4.0
5.7
PZH
10.5
10.0
PZL
t
t
2.0
2.0
4.0
6.0
5.3
8.0
2.0
0
2.0
2.0
6.3
9.5
PHZ
12.5
PLZ
t
t
Propagation Delay
2.5
2.5
4.0
4.0
2.0
2.0
6.5
7.0
2.5
2.5
6.2
6.5
PLH
ns
ns
Data to Output (’F241, ’F244)
PHL
t
t
Output Enable Time
(’F241, ’F244)
2.0
2.0
4.3
5.4
2.0
2.0
7.0
8.5
2.0
2.0
6.7
8.0
PZH
PZL
t
t
Output Disable Time
(’F241, ’F244)
2.
2
4.5
5
6.0
6.0
2.0
2.0
7.0
7.5
2.0
2.0
7.0
7.0
PHZ
PLZ
Ordering Informaon
The device number is used to ffied purchasing code where the package type and temperature range are
defined as follows:
240/241/244*
S
C
X
Tempe
54F
Special Variations
e
74F
QB
Military grade device with
environmental and burn-in
processing
Device T
e
X
devices shipped in 13 reel
×
Package Cod
Temperature Range
e
e
e
e
e
e
e
P
D
F
L
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline SOIC JEDEC
Shrink Small Outline Package (EIAJ SSOP)
(’244 only)
Small Outline SOIC EIAJ
a
C
Commercial (0 C to 70 C)
§
§
e
NOTE:
b a
Military ( 55 C to 125 C)
M
§
§
Not required for MSA package
code
S
*MSA
e
SJ
5
6
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Car(L)
NS Package NA
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
7
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300 Wide) Molded Small Outline Packe, JEDEC (S)
×
NS Package Numbe
20-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)
×
NS Package Number M20D
8
Physical Dimensions inches (millimeters) (Continued)
20-Lead Molded Shrink Small Outline, AJ Type
NS Package Number MSA
20-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N20A
9
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W2
LIFE SUPPORT
NATIONAL’S AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCAs used herein:
1. Life support ms are devices or
systems which, (ed for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Tel: 1(800) 272-9959
TWX: (910) 339-9240
National Semiconductor
GmbH
Livry-Gargan-Str. 10
D-82256 Furstenfeldbruck
Germany
Tel: (81-41) 35-0
Telex: 527649
Fax: (81-41) 35-1
National Semiconductor National Semiconductor
National Semiconductores
Do Brazil Ltda.
Rue Deputado Lacorda Franco
120-3A
Sao Paulo-SP
Brazil 05418-000
Tel: (55-11) 212-5066
Telex: 391-1131931 NSBR BR
Fax: (55-11) 212-1181
National Semiconductor
(Australia) Pty, Ltd.
Building 16
Business Park Drive
Monash Business Park
Nottinghill, Melbourne
Victoria 3168 Australia
Tel: (3) 558-9999
Japan Ltd.
Hong Kong Ltd.
Sumitomo Chemical
Engineering Center
Bldg. 7F
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
1-7-1, Nakase, Mihama-Ku Hong Kong
Chiba-City,
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Ciba Prefecture 261
Tel: (043) 299-2300
Fax: (043) 299-2500
Fax: (3) 558-9998
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明