SNJ54HC139FK [TI]
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS; 双路2号线至4线解码器/多路解复用器
| 型号： | SNJ54HC139FK |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS |
| 文件： | 总18页 (文件大小：679K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
SN54HC139 . . . J OR W PACKAGE
SN74HC139 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
D
Targeted Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
D
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
V
CC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
Low Power Consumption, 80-µA Max I
CC
Typical t = 10 ns
pd
4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
SN54HC139 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
The ’HC139 devices are designed for
high-performance
memory-decoding
or
data-routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can minimize
the effects of system decoding. When employed
with high-speed memories utilizing a fast enable
circuit, the delay time of these decoders and the
enable time of the memory usually are less than
the typical access time of the memory. This means
that the effective system delay introduced by the
decoders is negligible.
3
2
1
20 19
18
2A
2B
NC
1B
1Y0
NC
4
5
6
7
8
17
16
15 2Y0
14
9 10 11 12 13
1Y1
1Y2
2Y1
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
†
T
A
PACKAGE
PDIP − N
PACKAGE
Tube of 25
Tube of 40
SN74HC139N
SN74HC139N
SN74HC139D
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
SN74HC139DR
SN74HC139DT
SN74HC139NSR
SN74HC139DBR
SN74HC139PW
SN74HC139PWR
SN74HC139PWT
SNJ54HC139J
SOIC − D
HC139
SOP − NS
HC139
HC139
−40°C to 85°C
SSOP − DB
Reel of 2000
Reel of 250
Tube of 25
TSSOP − PW
HC139
CDIP − J
CFP − W
LCCC − FK
SNJ54HC139J
SNJ54HC139W
SNJ54HC139FK
Tube of 150
Tube of 55
SNJ54HC139W
SNJ54HC139FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢔ ꢛ ꢦ ꢞ ꢝꢩ ꢤꢣ ꢡꢢ ꢣꢝ ꢟꢦ ꢨꢚ ꢠꢛ ꢡ ꢡꢝ ꢗꢑ ꢎꢐ ꢘꢕ ꢰ ꢐꢇꢱꢂ ꢇꢂꢉ ꢠꢨꢨ ꢦꢠ ꢞ ꢠ ꢟꢥ ꢡꢥꢞ ꢢ ꢠ ꢞ ꢥ ꢡꢥ ꢢꢡꢥ ꢩ
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ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ
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ꢤ ꢛꢨ ꢥꢢꢢ ꢝ ꢡꢫꢥ ꢞ ꢭꢚ ꢢꢥ ꢛ ꢝꢡꢥ ꢩꢪ ꢔ ꢛ ꢠꢨ ꢨ ꢝ ꢡꢫꢥ ꢞ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢢ ꢉ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢚꢝ ꢛ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢊ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢋ ꢌꢍꢎ ꢏ ꢐꢎ ꢑ ꢁꢒ ꢓꢔ ꢃ ꢐꢎꢑ ꢁ ꢒ ꢋꢒ ꢅꢔ ꢋꢒ ꢕꢀ ꢖ ꢋ ꢒꢗ ꢌꢎꢓ ꢑꢘ ꢎꢒ ꢙꢒꢕꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
The ’HC139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable
(G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully
buffered inputs, each of which represents only one normalized load to its driving circuit.
FUNCTION TABLE
INPUTS
OUTPUTS
SELECT
G
B
X
L
A
X
L
Y0
H
L
Y1
H
H
L
Y2
H
H
H
L
Y3
H
H
H
H
L
H
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
H
logic diagram (positive logic)
4
5
1Y0
1Y1
1Y2
1Y3
1
1G
6
2
1A
7
3
1B
12
11
10
9
2Y0
2Y1
15
2G
2Y2
2Y3
14
2A
13
2B
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC139
MIN NOM
SN74HC139
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢊ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢋ ꢌꢍꢎ ꢏ ꢐꢎ ꢑ ꢁꢒ ꢓꢔ ꢃ ꢐꢎꢑ ꢁ ꢒ ꢋꢒ ꢅꢔ ꢋꢒ ꢕꢀ ꢖ ꢋ ꢒꢗ ꢌꢎꢓ ꢑꢘ ꢎꢒ ꢙꢒꢕꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC139
SN74HC139
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −4 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −5.2 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
I
IH
IL
I
I
= 4 mA
4.5 V
6 V
0.4
0.33
0.33
1000
80
OL
= 5.2 mA
0.4
OL
I
I
V = V
I
or 0
6 V
1000
160
10
nA
µA
pF
I
CC
V = V
I
or 0,
I
O
= 0
6 V
CC
CC
C
2 V to 6 V
3
10
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
47
SN54HC139
SN74HC139
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
175
35
MIN
MAX
255
51
MIN
MAX
220
44
2 V
4.5 V
6 V
14
A or B
Y
Y
Y
12
30
44
38
t
pd
ns
2 V
39
175
35
255
51
220
44
4.5 V
6 V
11
G
10
30
44
38
2 V
38
75
110
22
95
t
t
4.5 V
6 V
8
15
19
ns
6
13
19
16
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per decoder
No load
25
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
From Output
Under Test
Test
Point
Input
50%
50%
0 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
50%
10%
50%
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
90%
t
90%
OH
Input
50%
10%
50%
10%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
0 V
OL
t
r
f
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
5962-8409201VEA
5962-8409201VFA
84092012A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
W
FK
J
16
16
20
16
16
16
16
16
16
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
8409201EA
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
8409201FA
W
J
JM38510/65803BEA
JM38510/65803BFA
SN54HC139J
CDIP
CFP
A42 SNPB
A42
W
J
CDIP
SOIC
A42 SNPB
SN74HC139D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139DBR
SN74HC139DBRE4
SN74HC139DBRG4
SN74HC139DE4
SN74HC139DG4
SN74HC139DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
DB
D
16
16
16
16
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139DRE4
SN74HC139DRG4
SN74HC139DT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139DTE4
SN74HC139DTG4
SN74HC139N
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC139N3
SN74HC139NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC139NSR
SN74HC139NSRE4
SN74HC139NSRG4
SN74HC139PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139PWE4
SN74HC139PWG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN74HC139PWLE
SN74HC139PWR
OBSOLETE TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139PWRE4
SN74HC139PWRG4
SN74HC139PWT
PW
PW
PW
PW
PW
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC139PWTE4
SN74HC139PWTG4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HC139FK
SNJ54HC139J
SNJ54HC139W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
16
16
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
(mm)
16
SN74HC139DBR
SN74HC139DR
SN74HC139NSR
SN74HC139PWR
DB
D
16
16
16
16
SITE 41
SITE 27
SITE 41
SITE 41
8.2
6.5
8.2
7.0
6.6
10.3
10.5
5.6
2.5
2.1
2.5
1.6
12
8
16
16
16
12
Q1
Q1
Q1
Q1
16
NS
PW
16
12
8
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74HC139DBR
SN74HC139DR
SN74HC139NSR
SN74HC139PWR
DB
D
16
16
16
16
SITE 41
SITE 27
SITE 41
SITE 41
346.0
342.9
346.0
346.0
346.0
336.6
346.0
346.0
33.0
28.58
33.0
NS
PW
29.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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