SNJ54HC241WR [TI]
HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20;
| 型号： | SNJ54HC241WR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 驱动器 输出元件 |
| 文件： | 总14页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCLS300C − JANUARY 1996 − REVISED AUGUST 2003
D
D
Wide Operating Voltage Range of 2 V to 6 V
D
D
D
6-mA Output Drive at 5 V
High-Current Outputs Drive Up To 15
LSTTL Loads
Low Input Current of 1 µA Max
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
D
Low Power Consumption, 80-µA Max I
CC
D
Typical t = 11 ns
pd
SN54HC241 . . . J OR W PACKAGE
SN74HC241 . . . DW, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HC241 . . . FK PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
3
2
1
20 19
18
1A2
2Y3
1A3
2Y2
1A4
1Y1
2A4
1Y2
2A3
4
5
6
7
8
17
16
15
14 1Y3
9 10 11 12 13
description/ordering information
These octal buffers and line drivers are designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC241
devices are organized as two 4-bit buffers/drivers with separate output-enable (1OE and 2OE) inputs. When
1OE is low or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1OE
is high or 2OE is low, the outputs for the respective buffers/drivers are in the high-impedance state.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 70
SN74HC241N
SN74HC241N
SN74HC241DW
SN74HC241DWR
SN74HC241NSR
SN74HC241PW
SN74HC241PWR
SN74HC241PWT
SNJ54HC241J
SOIC − DW
SOP − NS
HC241
HC241
−40°C to 85°C
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
TSSOP − PW
HC241
CDIP − J
CFP − W
LCCC − FK
SNJ54HC241J
SNJ54HC241W
SNJ54HC241FK
SNJ54HC241W
SNJ54HC241FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢊꢅ ꢋꢌ ꢍ ꢎ ꢏꢐ ꢐ ꢑ ꢒꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢋ ꢄ ꢗ ꢘꢀꢋꢌꢋ ꢑ ꢊꢏꢋ ꢙꢏ ꢋꢀ
SCLS300C − JANUARY 1996 − REVISED AUGUST 2003
FUNCTION TABLES
INPUTS
OUTPUT
1Y
1OE
1A
H
L
L
H
L
L
H
X
Z
INPUTS
OUTPUT
2Y
2OE
H
2A
H
H
L
H
L
L
X
Z
logic diagram (positive logic)
1
19
2OE
1OE
2
11
13
15
17
18
9
7
1Y1
1Y2
1Y3
1A1
2Y1
2Y2
2A1
2A2
4
16
14
12
1A2
5
3
6
2A3
2A4
2Y3
2Y4
1A3
8
1Y4
1A4
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS300C − JANUARY 1996 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC241
MIN NOM
SN74HC241
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC241
SN74HC241
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V = V or V
IH
V
OH
OL
I
IL
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V
V = V or V
V
I
IH
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
I
or 0
6 V
1000
10
nA
µA
µA
pF
I
CC
V
O
= V
or 0
6 V
0.01
OZ
CC
CC
V = V
I
or 0,
I
O
= 0
6 V
160
10
80
CC
C
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢃ ꢇ
ꢊꢅ ꢋꢌ ꢍ ꢎ ꢏꢐ ꢐ ꢑ ꢒꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢋ ꢄ ꢗ ꢘꢀꢋꢌꢋ ꢑ ꢊꢏꢋ ꢙꢏ ꢋꢀ
SCLS300C − JANUARY 1996 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
39
SN54HC241
SN74HC241
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
115
23
MIN
MAX
170
34
MIN
MAX
145
29
2 V
4.5 V
6 V
12
t
t
t
t
A
Y
Y
Y
Y
ns
pd
en
dis
t
11
20
29
25
2 V
60
150
30
225
45
190
38
4.5 V
6 V
17
OE or OE
OE or OE
ns
ns
ns
15
26
38
32
2 V
40
150
30
225
45
190
38
4.5 V
6 V
18
17
26
38
32
2 V
28
60
90
75
4.5 V
6 V
8
12
18
15
6
10
15
13
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
50
SN54HC241
SN74HC241
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
165
33
MIN
MAX
245
49
MIN
MAX
210
42
2 V
4.5 V
6 V
16
t
t
t
A
Y
Y
Y
ns
pd
en
t
14
28
42
35
2 V
100
20
200
40
300
60
250
50
4.5 V
6 V
OE or OE
ns
ns
17
34
51
43
2 V
45
210
42
315
63
265
53
4.5 V
6 V
17
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
No load
35
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢃ
ꢄ
ꢅ
ꢆ
ꢃ
ꢇ
ꢀ
ꢀ
ꢖ ꢔꢋ ꢄ ꢗ ꢘꢀꢋꢌꢋ ꢑ ꢊ ꢏꢋ ꢙꢏ ꢋ
SCLS300C − JANUARY 1996 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
t
S1
S2
Open
Closed
Closed
Open
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
L
t
t
t
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PLH
PHL
90%
V
V
OH
In-Phase
Output
90%
50%
10%
50%
10%
OL
t
Output
Control
(Low-Level
Enabling)
t
r
f
f
V
CC
t
t
PLH
PHL
90%
50%
50%
V
V
OH
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
≈V
CC
r
Output
Waveform 1
(See Note B)
50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
V
OL
OH
t
t
PZH
PHZ
V
CC
V
Output
Waveform 2
(See Note B)
90%
t
90%
90%
Input
50%
10%
50%
10%
50%
0 V
≈0 V
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
SOIC
Drawing
JM38510/65704BRA
SN54HC241J
ACTIVE
ACTIVE
ACTIVE
J
J
20
20
20
1
1
TBD
TBD
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
SN74HC241DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC241DWE4
SN74HC241DWR
SN74HC241DWRE4
SN74HC241N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC241NE4
SN74HC241NSR
SN74HC241NSRE4
SN74HC241PW
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SO
NS
NS
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC241PWE4
SN74HC241PWR
SN74HC241PWRE4
SN74HC241PWT
SN74HC241PWTE4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HC241FK
SNJ54HC241J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
20
1
1
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Copyright 2006, Texas Instruments Incorporated
相关型号：
SNJ54HC245FKR
HC/UH SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CQCC20, HERMETIC SEALED, CERAMIC, LCC-20
TI
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