SNJ54LS132FK [TI]
QUADRUPLE 2-INPUT POSITIVE-NAND SCHMITT TRIGGERS; 四路2输入正与非施密特触发器型号: | SNJ54LS132FK |
厂家: | TEXAS INSTRUMENTS |
描述: | QUADRUPLE 2-INPUT POSITIVE-NAND SCHMITT TRIGGERS |
文件: | 总23页 (文件大小:928K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢂꢃ ꢈ ꢀꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢂ ꢃꢀ ꢄꢅ ꢆꢇ
ꢀꢁꢉ ꢃ ꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢉꢃ ꢈ ꢀꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢉ ꢃꢀ ꢄꢅ ꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
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Copyright 1988, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢉ ꢃꢄ ꢅꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢈ ꢀꢄ ꢅꢆ ꢇ ꢀꢁ ꢉ ꢃ ꢈꢀ ꢄ ꢅꢆ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢈ ꢐ ꢆ ꢑꢒ ꢁ ꢏꢋ ꢓ ꢏ ꢔꢀ ꢒ ꢓꢒ ꢕ ꢐꢑ ꢁꢌꢁ ꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓ ꢎꢒꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢀ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢉ ꢃꢀ ꢄꢅ ꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙꢐ ꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢉ ꢃꢄ ꢅꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢉ ꢃꢄ ꢅꢆ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢈ ꢐ ꢆ ꢑꢒ ꢁꢏ ꢋꢓ ꢏ ꢔꢀ ꢒ ꢓꢒ ꢕ ꢐꢑ ꢁꢌꢁ ꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓ ꢎꢒꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢈ ꢀꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢉꢃ ꢈꢀ ꢄꢅ ꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙꢐ ꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢈ ꢀꢄ ꢅꢆ ꢇ ꢀꢁ ꢉ ꢃ ꢈꢀ ꢄ ꢅꢆ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢈ ꢐ ꢆ ꢑꢒ ꢁ ꢏꢋ ꢓ ꢏ ꢔꢀ ꢒ ꢓꢒ ꢕ ꢐꢑ ꢁꢌꢁ ꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓ ꢎꢒꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢂꢃ ꢈ ꢀꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢂ ꢃꢀ ꢄꢅ ꢆꢇ
ꢀꢁꢉ ꢃ ꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢉꢃ ꢈ ꢀꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢉ ꢃꢀ ꢄꢅ ꢆ
ꢊ ꢋꢌꢍꢎ ꢋꢏꢈ ꢐ ꢆ ꢑꢒꢁ ꢏꢋꢓ ꢏꢔ ꢀꢒ ꢓ ꢒꢕꢐ ꢑꢁꢌꢁꢍ ꢀꢖ ꢗꢘꢒ ꢓꢓ ꢓꢎ ꢒ ꢙ ꢙ ꢐꢎ ꢀ
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
7600401CA
7600401DA
ACTIVE
ACTIVE
J
W
W
J
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
7600401DA
ACTIVE
CFP
A42
JM38510/31303BCA
JM38510/31303BCA
SN54132J
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
PDIP
PDIP
PDIP
SOIC
A42 SNPB
A42 SNPB
Call TI
ACTIVE
J
OBSOLETE
OBSOLETE
ACTIVE
J
SN54132J
J
Call TI
Call TI
SN54LS132J
SN54LS132J
SN54S132J
J
1
1
1
1
A42 SNPB
A42 SNPB
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
J
ACTIVE
J
SN54S132J
ACTIVE
J
SN74132N
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
N
N
N
N
D
SN74132N
Call TI
Call TI
SN74132N3
SN74132N3
SN74LS132D
Call TI
Call TI
Call TI
Call TI
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS132D
SN74LS132DE4
SN74LS132DE4
SN74LS132DG4
SN74LS132DG4
SN74LS132DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
D
D
D
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS132DR
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS132DRE4
SN74LS132DRE4
SN74LS132DRG4
SN74LS132DRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS132J
SN74LS132J
SN74LS132N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS132N
SN74LS132N3
ACTIVE
PDIP
PDIP
N
N
14
14
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
OBSOLETE
TBD
Call TI
Call TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
PDIP
Drawing
SN74LS132N3
SN74LS132NE4
OBSOLETE
ACTIVE
N
N
14
14
TBD
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS132NE4
SN74LS132NSR
SN74LS132NSR
SN74LS132NSRE4
SN74LS132NSRE4
SN74LS132NSRG4
SN74LS132NSRG4
SN74S132D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
N
NS
NS
NS
NS
NS
NS
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S132D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S132DE4
SN74S132DE4
SN74S132DG4
SN74S132DG4
SN74S132DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S132DR
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S132DRE4
SN74S132DRE4
SN74S132DRG4
SN74S132DRG4
SN74S132N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S132N
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S132N3
SN74S132N3
SN74S132NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S132NE4
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
LCCC
LCCC
CDIP
CDIP
CFP
Drawing
SNJ54132J
SNJ54132J
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
14
14
20
20
14
14
14
14
20
20
14
14
14
14
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
SNJ54LS132FK
SNJ54LS132FK
SNJ54LS132J
SNJ54LS132J
SNJ54LS132W
SNJ54LS132W
SNJ54S132FK
SNJ54S132FK
SNJ54S132J
SNJ54S132J
SNJ54S132W
SNJ54S132W
FK
FK
J
1
1
1
1
1
1
1
1
1
1
1
1
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
FK
FK
J
CFP
A42
LCCC
LCCC
CDIP
CDIP
CFP
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
CFP
A42
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
SN74LS132DR
SN74LS132NSR
SN74S132DR
D
NS
D
14
14
14
SITE 41
SITE 41
SITE 41
6.5
8.2
6.5
9.0
10.5
9.0
2.1
2.5
2.1
8
12
8
16
16
16
Q1
Q1
Q1
330
16
330
16
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74LS132DR
SN74LS132NSR
SN74S132DR
D
NS
D
14
14
14
SITE 41
SITE 41
SITE 41
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
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