TAS2564YBGT [TI]
具有 I/V 感应扬声器保护和集成 13V H 类升压的 7W 数字输入智能放大器 | YBG | 36 | -40 to 85;
| 型号： | TAS2564YBGT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 I/V 感应扬声器保护和集成 13V H 类升压的 7W 数字输入智能放大器 | YBG | 36 | -40 to 85 放大器 商用集成电路 |
| 文件： | 总121页 (文件大小：1786K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TAS2564
SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
TAS2564 7-W Class-D Smart Amp With Integrated 13-V Class-H boost &I/V Sense for
Speaker Protection
1 Features
2 Applications
1
•
Key Features
•
•
•
•
•
Mobile phones
Tablets
–
–
–
256 Level, 13-V Class-H Boost
Bluetooth speakers
Consumer audio devices
Wireless speakers
Speaker Current and Voltage Sense
Inter Chip Alignment (ICLA) of gain across
devices.
•
•
Output Power
7-W 0.1% THD+N (8 Ω at 3.8 V)
Power Consumption (1% THD+N, 4.2 V into 8 Ω)
3 Description
–
The TAS2564 is a digital input, Class-D audio
amplifier with a 256 level, 13 V Class-H boost. The
robust 13 V Class-H boost provides the power
needed for peak output while the algorithmically-
controlled 256 level boost reduces the average power
consumption. The boost is easily configured with
PurePath Console GUI.
–
–
83.5% efficiency at 1 W
<1uA HW shutdown VBAT Current
•
Power Supplies
–
–
–
VBAT: 2.7 V to 5.5 V
VDD: 1.65 V to 1.95 V
The Class-D amplifier is capable of delivering 7 W of
peak power into an 8 Ω. TAS2564 is 83.5% efficient
at 1 W output level. Integrated speaker voltage and
current sense provides real time monitoring to keep
speakers in the safe operation area.
Digital (1.5 V) is internally generated from
VDD.
–
IO and Analog supplies are internally shorted
to VDD.
•
•
Protections
Battery tracking peak voltage limiter with brown-out
prevention optimizes amplifier headroom over the
entire battery discharge. Up to four devices can share
a common bus via I2S/TDM + I 2C interfaces.
–
–
–
–
Battery: Advanced Brown Out
Clipping: VBAT Tracking Peak Voltage Limiter
Transducer: DC Detection and Prevention
Device: Thermal and Over Current Protection
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
Interfaces and Control
TAS2564
DSBGA
2.63 mm x 2.46 mm
–
I2S/TDM: 8 Channels of 32 bit each up to 96
KSPS
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
–
–
–
I2C: 4 selectable addresses
16 KSPS to 192 KSPS Sample Rates
MCLK Free operation
Simplified Schematic
L1
•
Performance
VBAT
3
2
SW
–
Speaker/Receiver Mode with Dynamic Noise
C1
GREG
VBST
Control of Idle Channel Noise (ICN)
Receiver Mode: 10 µVrms ICN
Speaker Mode: 15 µVrms ICN
Spread Spectrum Low EMI Mode
110 dB SNR at 1% THD+N(8Ω)
–
–
–
–
3
PVDD
C2
+
3
Ferrite bead
(optional)
I2S
TAS2564
OUT_P
OUT_N
4
To Speaker
I2C
-
Ferrite bead
(optional)
2
SDZ
VSNS_P
VSNS_N
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS2564
SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
www.ti.com
Table of Contents
8.5 Register Maps......................................................... 52
Application and Implementation ........................ 97
9.1 Application Information............................................ 97
9.2 Typical Application ................................................. 97
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 I2C Timing Requirements........................................ 11
6.7 TDM Port Timing Requirements ............................. 11
6.8 Typical Characteristics............................................ 13
Parameter Measurement Information ................ 17
Detailed Description ............................................ 18
8.1 Overview ................................................................. 18
8.2 Functional Block Diagram ....................................... 18
8.3 Feature Description................................................. 18
8.4 Device Functional Modes........................................ 25
9
10 Power Supply Recommendations ................... 100
10.1 Power Supplies ................................................... 100
10.2 Power Supply Sequencing.................................. 100
11 Layout................................................................. 101
11.1 Layout Guidelines ............................................... 101
11.2 Layout Example .................................................. 102
12 Device and Documentation Support ............... 106
12.1 Documentation Support ..................................... 106
12.2 Receiving Notification of Documentation
Updates.................................................................. 106
12.3 Community Resources........................................ 106
12.4 Trademarks......................................................... 106
12.5 Electrostatic Discharge Caution.......................... 106
12.6 Glossary.............................................................. 106
7
8
13 Mechanical, Packaging, and Orderable
Information ......................................................... 107
13.1 Package Option Addendum ................................ 111
4 Revision History
Changes from Original (October 2019) to Revision A
Page
•
Changed device status to Production Data............................................................................................................................ 1
2
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Product Folder Links: TAS2564
TAS2564
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SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
5 Pin Configuration and Functions
YFP Package
36-Pin DSBGA
Top View
A1
SDZ
A2
SBCLK
A3
FSYNC
A4
SCL
A5
SDA
A6
DREG
B1
SDOUT
B2
SDIN
B3
AD1
B4
AD0
B5
IRQZ
B6
VDD
C5
VS1_P/
VS2_N
C1
VBAT
C2
VBAT
C3
VS1_N
C4
GREG
C6
VS2_P
D1
BGND
D2
BGND
D3
BGND
D4
GND
D5
PGND
D6
PGND
E1
SW
E2
SW
E3
SW
E4
GND
E5
OUT_P
E6
OUT_N
F1
VBST
F2
VBST
F3
VBST
F4
PVDD
F5
PVDD
F6
PVDD
Pin Functions
PIN
I/O
DESCRIPTION
NAME
AD0
NUMBER
B4
B3
D1
D2
D3
I
I
I2C address pin LSB.
AD1
I2C address pin LSB+1.
BGND
P
Boost ground. Connect to PCB GND plane.
Digital core voltage regulator output. Bypass to GND with a cap. Do not connect to external
load.
DREG
A6
P
FSYNC
GREG
A3
C4
D4
E4
IO
P
I2S word clock or TDM frame sync.
High-side gate CP regulator output. Do not connect to external load.
GND
IRQZ
P
Digital ground. Connect to PCB GDN plane.
Open drain, active low interrupt pin. Pull up to VDDD with resistor if optional internal pull up
is not used.
B5
O
OUT_N
OUT_P
E6
E5
O
O
Class-D negative output.
Class-D positive output.
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SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
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Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NUMBER
D5
D6
F4
PGND
P
Power stage ground. Connect to PCB GND plane.
Power stage supply.
PVDD
F5
P
F6
SBCLK
SCL
A2
IO
I
I2S/TDM serial bit clock.
A4
I2C Clock Pin. Pull up to VDD with a resistor.
I2C Data Pin. Pull up to VDD with a resistor.
I2S/TDM serial data input.
SDA
A5
IO
I
SDIN
SDOUT
SDZ
B2
B1
IO
I
I2S/TDM serial data output.
A1
Low = Hardware Shutdown. High= Device Enabled
E1
SW
E2
P
P
P
Boost converter switch input.
E3
C1
C2
F1
VBAT
VBST
Battery power supply input. Connect to 2.7 V to 5.5 V supply and decouple with a cap.
Boost converter output. Do not connect to external load.
F2
F3
Analog, digital, and IO power supply. Connect to 1.8 V supply and decouple to GND with
cap.
VDD
B6
C3
C5
C6
P
I
VSNS1_N
Voltage sense negative input. Connect to Class-D OUT_N output after Ferrite bead filter.
VSNS1_P/VS
NS2_N
I
Voltage sense Center input. Connect to Speaker Center Tap.
VSNS2_P
I
Voltage sense positive input. Connect to Class-D OUT_P output after Ferrite bead filter.
4
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SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
–0.3
–0.3
-0.3
-0.3
-0.7
-0.3
-0.3
–0.3
–40
–40
–65
MAX
2
UNIT
V
Analog / IO Supply Voltage VDD
Battery Supply Voltage
Boost Pin
VBAT
VBST(2)
6
V
18.5
18.5
16
V
Power Supply Voltage
Switching Pin
PVDD(2)
V
SW
V
High Side Regulator Pin
Digital Regular Pin
Input voltage(3)
GREG
PVDD+6
1.65
VDD+0.3
85
V
DREG
V
Digital IOs referenced to VDD supply
V
Operating free-air temperature, TA
Operating junction temperature, TJ
Storage temperature, Tstg
°C
°C
°C
150
150
(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Procedures. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) PVDD can handle 19V transients for less than 10ns
(3) All digital inputs and IOs are failsafe.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 OUT_N / OUT_P /
VSNS_N / VSNS_P Pins(1)
±4000
V
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±2000
±500
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
NOM
3.6
MAX
5.5
UNIT
V
VBAT
VDD
PVDD
VIH
Supply voltage
Supply voltage
1.65
VBAT
1.8
1.95
16
V
Supply voltage - external boost mode
High-level digital input voltage
Low-level digital input voltage
Minimum speaker impedance
Minimum speaker inductance
V
VDD
V
VIL
0
8
V
RSPK
LSPK
6.4
10
Ω
µH
6.4 Thermal Information
TAS2564
THERMAL METRIC(1)
YFF (WCSP)
36 PINS
54.3
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
0.2
Junction-to-board thermal resistance
11.8
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
ψJB
11.7
RθJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
TA = 25 °C, VBAT = 3.8 V, (External PVDD = 12 V), VDD = 1.8 V, RL = 8Ω + 33 µH, fin = 1 kHz, SSM, fs = 48 kHz, Gain =
17.5 dBV (External PVDD Gain=18 dBV), SDZ = 1, Thermal Foldback Disabled, Measured filter free with an Audio Precision
with a 22 Hz to 20 kHz un-weighted bandwidth (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT
and OUTPUT
High-level digital input logic voltage
threshold
VIH
All digital pins except SDA and SCL
All digital pins except SDA and SCL
SDA and SCL
0.65 × VDD
V
V
V
V
V
Low-level digital input logic voltage
threshold
VIL
0.35 × VDD
0.3 × VDD
High-level digital input logic voltage
threshold
VIH(I2C)
VIL(I2C)
VOH
0.7 × VDD
Low-level digital input logic voltage
threshold
SDA and SCL
All digital pins except SDA, SCL and
IRQZ; IOH = 2 mA.
VDD – 0.45
V
High-level digital output voltage
All digital pins except SDA, SCL and
IRQZ; IOL = –2 mA.
VOL
Low-level digital output voltage
Low-level digital output voltage
0.45
0.2 × VDD
0.45
V
V
V
VOL(I2C)
VOL(IRQZ)
SDA and SCL; IOL(I2C) = –2 mA.
IRQZ; IOL(IRQZ) = –2 mA.
Low-level digital output voltage for IRQZ
open drain Output
IIH
Input logic-high leakage for digital inputs
Input logic-low leakage for digital inputs
Input capacitance for digital inputs
All digital pins; Input = VDD.
All digital pins; Input = GND.
All digital pins
–5
–5
0.1
0.1
5
5
5
µA
µA
pF
IIL
CIN
Pull down resistance for digital input/IO
pins when asserted on
RPD
SDOUT, SDIN, FSYNC, SBCLK
50
kΩ
AMPLIFIER PERFORMANCE - Internal Boost
Measured at -6 dB FS input and scaled
by 6dB
Output Voltage for Full-scale digital Input
7.5
Vrms
W
RL = 32Ω + 33 µH, THD+N = 0.03 %, fin
1 kHz
=
1.75
POUT
Maximum Continuous Output Power
RL = 8 Ω + 33 µH, THD+N = 0.03 %, fin
1 kHz
=
7
83
W
%
%
%
%
RL = 8 Ω + 33 µH, fin = 1 kHz
System efficiency at POUT = 1 W
System efficiency at POUT =0.5 W
RL = 8 Ω + 33 µH, fin = 1 kHz, VBAT = 4.2
V
83.5
85
RL = 8 Ω + 33 µH, fin = 1 kHz
RL = 8 Ω + 33 µH, fin = 1 kHz, VBAT = 4.2
V
85.5
System efficiency at 0.1% THD+N power
level
RL = 8 Ω + 33 µH, POUT = 7W, fin = 1 kHz,
81
%
%
POUT = 0.25 W, RL = 32Ω + 33 µH, fin = 1
kHz
0.01
THD+N
VN
Total harmonic distortion + noise
Idle channel noise
POUT = 1 W, RL = 8 Ω + 33 µH, fin = 1 kHz
0.01
14.8
%
A-Weighted, 20 Hz - 20 kHz
µV
Average frequency in Spread Spectrum
Mode, CLASSD_SYNC=0
384
384
kHz
kHz
Fixed Frequency Mode,
CLASSD_SYNC=0
FPWM
Class-D PWM switching frequency
Fixed Frequency Mode,
CLASSD_SYNC=1, fs = 44.1, 88.2, 174.6
kHz
352.8
384
kHz
kHz
Fixed Frequency Mode,
CLASSD_SYNC=1, fs = 48, 96, 192 kHz
VOS
Output offset voltage
Dynamic range
-1.2
1.2
mV
dB
DNR
A-Weighted, -60 dBFS Method
110
110
A-Weighted, Referenced to 1 % THD+N
Output Level
SNR
Signal to noise ratio
dB
6
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TAS2564
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SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
Electrical Characteristics (continued)
TA = 25 °C, VBAT = 3.8 V, (External PVDD = 12 V), VDD = 1.8 V, RL = 8Ω + 33 µH, fin = 1 kHz, SSM, fs = 48 kHz, Gain =
17.5 dBV (External PVDD Gain=18 dBV), SDZ = 1, Thermal Foldback Disabled, Measured filter free with an Audio Precision
with a 22 Hz to 20 kHz un-weighted bandwidth (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Into and out of Mute, Shutdown, Power
Up, Power Down and audio clocks
starting and stopping. Measured with APx
Plugin.
KCP
Click and pop performance
3.4
mV
Programmable digital gain range
Programmable digital gain step size
Amplifier gain error
0
23
dBV
dB
0.5
AVERROR
POUT = 1 W
±0.1
dB
Device in Shutdown or Muted in Normal
Operation
Mute attenuation
110
dB
VBAT = 3.8 V + 200 mVpp, fripple = 217 Hz
VBAT = 3.8 V + 200 mVpp, fripple = 20 kHz
VDD = 1.8 V + 200 mVpp, fripple = 217 Hz
VDD = 1.8 V + 200 mVpp, fripple = 20 kHz
No Volume Ramping
108
90
dB
dB
dB
dB
ms
ms
ms
ms
VBAT power-supply rejection ratio
98
AVDD power-supply rejection ratio
93
1.8
4.5
0.75
12.5
Turn on time from release of SW
shutdown
Volume Ramping
No Volume Ramping
Turn off time from assertion of SW
shutdown to amp Hi-Z
Volume Ramping
AMPLIFIER PERFORMANCE - Receiver Mode
Measured at -6 dB FS input and scaled
by 6dB
Output Voltage for Full-scale digital Input
2
Vrms
mW
RL = 32Ω + 33 µH, THD+N = 0.03 %, fin
1 kHz
=
124.4
POUT
Maximum Continuous Output Power
RL = 8 Ω + 33 µH, THD+N = 0.03 %, fin
1 kHz
=
0.45
63.5
65.5
84.5
85
W
%
%
%
%
%
µV
RL = 8 Ω + 33 µH, fin = 1 kHz
System efficiency at POUT = 100 mW
System efficiency at POUT =0.45 W
RL = 8 Ω + 33 µH, fin = 1 kHz, VBAT = 4.2
V
RL = 8 Ω + 33 µH, fin = 1 kHz
RL = 8 Ω + 33 µH, fin = 1 kHz, VBAT = 4.2
V
THD+N
VN
Total harmonic distortion + noise
Idle channel noise
POUT = 1 W, RL = 8 Ω + 33 µH, fin = 1 kHz
.01
A-Weighted, 20 Hz - 20 kHz, DAC
Modulator Running
10
Average frequency in Spread Spectrum
Mode, CLASSD_SYNC=0
384
384
kHz
kHz
Fixed Frequency Mode,
CLASSD_SYNC=0
FPWM
Class-D PWM switching frequency
Fixed Frequency Mode,
CLASSD_SYNC=1, fs = 44.1, 88.2, 174.6
kHz
352.8
384
kHz
kHz
Fixed Frequency Mode,
CLASSD_SYNC=1, fs = 48, 96, 192 kHz
VOS
Output offset voltage
Dynamic range
-1
1
mV
dB
DNR
A-Weighted, -60 dBFS Method
101.2
A-Weighted, Referenced to 1 % THD+N
Output Level
SNR
Signal to noise ratio
105.73
dB
Into and out of Mute, Shutdown, Power
Up, Power Down and audio clocks
starting and stopping. Measured with APx
Plugin.
KCP
Click and pop performance
3.4
mV
Programmable digital gain range
Programmable digital gain step size
Amplifier gain error
0
23
dBV
dB
0.5
AVERROR
POUT = 1 W
±0.1
dB
Device in Shutdown or Muted in Normal
Operation
Mute attenuation
113
dB
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Electrical Characteristics (continued)
TA = 25 °C, VBAT = 3.8 V, (External PVDD = 12 V), VDD = 1.8 V, RL = 8Ω + 33 µH, fin = 1 kHz, SSM, fs = 48 kHz, Gain =
17.5 dBV (External PVDD Gain=18 dBV), SDZ = 1, Thermal Foldback Disabled, Measured filter free with an Audio Precision
with a 22 Hz to 20 kHz un-weighted bandwidth (unless otherwise noted).
PARAMETER
TEST CONDITIONS
VBAT = 3.8 V + 200 mVpp, fripple = 217 Hz
VBAT = 3.8 V + 200 mVpp, fripple = 20 kHz
VDD = 1.8 V + 200 mVpp, fripple = 217 Hz
VDD = 1.8 V + 200 mVpp, fripple = 20 kHz
No Volume Ramping
MIN
TYP
110
95
MAX
UNIT
dB
VBAT power-supply rejection ratio
dB
102
102
1.8
dB
AVDD power-supply rejection ratio
dB
ms
ms
ms
ms
Turn on time from release of SW
shutdown
Volume Ramping
4.5
No Volume Ramping
0.75
12.5
Turn off time from assertion of SW
shutdown to amp Hi-Z
Volume Ramping
BOOST
CONVERTER
0.1A DC load, Average voltage (w/o
including ripple)
Max Output Voltage
13
V
Startup inrush current limit
Startup inrush limit time
default setting
1.5
0.45
50
A
default setting
ms
PFM mode
kHz
MHz
KHz
A
Switching Frequency
Current Control Mode
Current Control Mode
default setting
4
Minimum Switching Frequency
Inductor Peak Current Limit
400
5
DIE TEMPERATURE
SENSOR
Resolution
8
bits
°C
°C
°C
Die temperature measurement range
Die temperature resolution
-40
150
0.75
±5
Die temperature accuracy
VOLTAGE
MONITOR
Resolution
10
bits
V
VBAT measurement range
VBAT resolution
VBAT accuracy
2
6
6
mV
mV
±25
TDM SERIAL AUDIO
PORT
PCM Sample Rates & FSYNC Input
Frequency
16
192
kHz
I2S/TDM Operation
SBCLK Input Frequency
0.512
24.57
MHz
RMS Jitter below 40 kHz that can be
tolerated without performance
degradation
1
ns
SBCLK Maximum Input Jitter
RMS Jitter above 40 kHz that can be
tolerated without performance
degradation
10
ns
SBCLK Cycles per FSYNC in I2S and
TDM Modes
Values: 64, 96, 128, 192, 256, 384 and
512
64
512
Cycles
PCM PLAYBACK
CHARACTERISTICS to fs ≤ 48 kHz
fs
Sample Rates
16
48
kHz
fs
Passband LPF Corner
Passband Ripple
0.454
20 Hz to LPF cutoff
≥ 0.55 fs
-0.3
0.3
dB
dB
dB
1/fs
60
65
Stop Band Attenuation
Group Delay
≥ 1 fs
DC to 0.454 fs
8.6
8
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SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
Electrical Characteristics (continued)
TA = 25 °C, VBAT = 3.8 V, (External PVDD = 12 V), VDD = 1.8 V, RL = 8Ω + 33 µH, fin = 1 kHz, SSM, fs = 48 kHz, Gain =
17.5 dBV (External PVDD Gain=18 dBV), SDZ = 1, Thermal Foldback Disabled, Measured filter free with an Audio Precision
with a 22 Hz to 20 kHz un-weighted bandwidth (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PCM PLAYBACK
CHARACTERISTICS fs > 48 kHz
fs
Sample Rates
88.2
192
kHz
fs
fs = 96 kHz
0.42
0.21
Passband LPF Corner
Passband Ripple
Stop Band Attenuation
Group Delay
fs = 192 kHz
DC to LPF cutoff
≥ 0.55 fs
fs
-0.5
0.5
8.6
dB
dB
dB
1/fs
60
65
≥ 1 fs
DC to 0.375 fs for 96 kHz
CURRENT
SENSE
DNR
Dynamic range
Un-Weighted, Relative to 0 dBFS
69
-56
3.3
dB
dB
A
THD+N
Total harmonic distortion + noise
Full-scale input current
RL = 8 Ω + 33 µH, fin = 1 kHz, POUT = 1 W
RL = 8 Ω + 33 µH, IOUT = 354 mARMS
(POUT = 1 W @ 1kHz)
Current-sense accuracy
±1
±1
%
%
%
Current-sense gain error over
temperature
0°C to 70°C, 8 Ω, using a 60Hz -40dB
pilot tone
Current-sense gain error over output
power
50mW to 0.1 % THD+N level, fin = 1 kHz,
8 Ω, using a 60Hz -40dB pilot tone
±1.5
fs = 16 kHz to 48 kHz
fs = 96 kHz
0.417
0.208
0.104
fs
fs
LPF passband corner
fs = 192 kHz
fs
LPF passband ripple
LPF stopband attenuation
LPF group delay
-0.05
0.05
5.7
dB
dB
1/fs
0.55 fs
60
DC to 0.417 fs
VOLTAGE
SENSE
DNR
Dynamic range
Un-Weighted, Relative 0 dBFS
69
-60
14
dB
dB
THD+N
Total harmonic distortion + noise
Full-scale input voltage
RL = 8 Ω + 33 µH, fin = 1 kHz, POUT = 1W
VPK
RL = 8 Ω + 33 µH, IOUT = 354 mARMS
(POUT = 1 W)
Voltage-sense accuracy
±0.5%
±0.5%
±0.5%
Voltage-sense gain error over
temperature
0°C to 70°C, 8 Ω, using a 60Hz -40dB
pilot tone
Voltage-sense gain error over output
power
50mV to 0.1 % THD+N level, 8 Ω, using a
60Hz -40dB pilot tone
fs = 16 kHz to 48 kHz
fs = 96 kHz
0.417
0.208
0.104
fs
fs
LPF passband corner
fs = 192 kHz
fs
LPF passband ripple
LPF stopband attenuation
LPF group delay
-0.05
0.05
5.7
dB
dB
1/fs
0.55 fs
60
DC to 0.417 fs
VOLTAGE/CURRENT
SENSE RATIO
10uW to 0.1% THD+N level, fin = 1 kHz,
8Ω, using a 60Hz -40dB pilot tone
Gain ratio error over output power
±3%
±2%
250uW to 0.1 % THD+N level, fin = 1
kHz, 8Ω, using a 60Hz -40dB pilot tone
Gain ratio error over output power
50mW to 0.1 % THD+N level, fin = 1 kHz,
8Ω, using a 60Hz -40dB pilot tone
Gain ratio error over output power
Gain ratio drift over temperature
±1%
±1%
0°C to 70°C
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Electrical Characteristics (continued)
TA = 25 °C, VBAT = 3.8 V, (External PVDD = 12 V), VDD = 1.8 V, RL = 8Ω + 33 µH, fin = 1 kHz, SSM, fs = 48 kHz, Gain =
17.5 dBV (External PVDD Gain=18 dBV), SDZ = 1, Thermal Foldback Disabled, Measured filter free with an Audio Precision
with a 22 Hz to 20 kHz un-weighted bandwidth (unless otherwise noted).
PARAMETER
V/I phase error
TYPICAL CURRENT
CONSUMPTION
TEST CONDITIONS
MIN
TYP
MAX
UNIT
300
ns
SDZ = 0, VBAT
0.1
1
µA
µA
Current consumption in hardware
shutdown
SDZ = 0, VDD
All Clocks Stopped, VBAT
All Clocks Stopped, VDD
Clocking 0s PCM mode, VBAT
Clocking 0s PCM mode, VDD
fs = 48 kHz, VBAT
0.5
10
µA
Current consumption in software
shutdown
µA
2.7
8.9
4.6
8.9
4.6
11.4
mA
mA
mA
mA
mA
mA
Current consumption in idle channel
Current consumption during active
operation with IV sense disabled
fs = 48 kHz, VDD
fs = 48 kHz, VBAT
Current consumption during active
operation with IV sense enabled
fs = 48 kHz, VDD
PROTECTION
CIRCUITRY
Thermal shutdown temperature
Thermal shutdown retry
140
1.5
°C
s
UVLO is asserted
UVLO is released
2
V
VBAT undervoltage lockout threshold
(UVLO)
2.55
V
Output to Output, Output to GND, Output
to VBST or Output to VBAT Short
Output short circuit limit
4.5
A
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6.6 I2C Timing Requirements
TA = 25 °C, VDD = 1.8 V (unless otherwise noted)
MIN
NOM
MAX
UNIT
Standard-Mode
fSCL
SCL clock frequency
0
4
100
kHz
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
tHD;STA
μs
tLOW
LOW period of the SCL clock
HIGH period of the SCL clock
Setup time for a repeated START condition
Data hold time: For I2C bus devices
Data set-up time
4.7
4
μs
μs
μs
μs
ns
ns
ns
μs
μs
pF
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
tr
4.7
0
3.45
250
SDA and SCL rise time
1000
300
tf
SDA and SCL fall time
tSU;STO
tBUF
Set-up time for STOP condition
Bus free time between a STOP and START condition
Capacitive load for each bus line
4
4.7
Cb
400
400
Fast-Mode
fSCL
SCL clock frequency
0
kHz
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
tHD;STA
0.6
μs
tLOW
LOW period of the SCL clock
HIGH period of the SCL clock
Setup time for a repeated START condition
Data hold time: For I2C bus devices
Data set-up time
1.3
0.6
40.6
0
μs
μs
μs
μs
ns
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
0.9
100
20 + 0.1 ×
Cb
tr
tf
SDA and SCL rise time
SDA and SCL fall time
300
300
ns
ns
20 + 0.1 ×
Cb
tSU;STO
tBUF
Set-up time for STOP condition
0.6
1.3
μs
μs
pF
Bus free time between a STOP and START condition
Capacitive load for each bus line
Cb
400
Fast-Mode
Plus
fSCL
SCL clock frequency
0
1000
kHz
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
tHD;STA
0.26
μs
tLOW
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
tr
LOW period of the SCL clock
HIGH period of the SCL clock
Setup time for a repeated START condition
Data hold time: For I2C bus devices
Data set-up time
0.5
0.26
0.26
0
μs
μs
μs
μs
ns
ns
ns
μs
μs
pF
50
SDA and SCL Rise Time
120
120
tf
SDA and SCL Fall Time
tSU;STO
tBUF
Set-up time for STOP condition
Bus free time between a STOP and START condition
Capacitive load for each bus line
0.5
Cb
400
6.7 TDM Port Timing Requirements
TA = 25 °C, VDD = 1.8 V, 20 pF load on all outputs (unless otherwise noted)
MIN
20
20
8
NOM
MAX
UNIT
ns
tH(SBCLK)
tL(SBCLK)
tSU(FSYNC)
SBCLK high period
SBCLK low period
FSYNC setup time
ns
ns
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TDM Port Timing Requirements (continued)
TA = 25 °C, VDD = 1.8 V, 20 pF load on all outputs (unless otherwise noted)
MIN
8
NOM
MAX
UNIT
ns
tHLD(FSYNC)
tSU(FSYNC)
tHLD(SDIN)
FSYNC hold time
SDIN setup time
SDIN hold time
8
ns
8
ns
td(DO-SBCLK) SBCLK to SDOUT delay
50% of FSYNC to 50% of SDOUT
10% - 90 % Rise Time
21
8
ns
tr(SBCLK)
tf(SBCLK)
SBCLK rise time
SBCLK fall time
ns
90% - 10 % Fall Time
8
ns
SDA
SCL
tBUF
tLOW
th(STA)
tr
th(STA)
th(DAT)
tHIGH
tsu(STA)
tsu(STO)
STO
STA
tf
tsu(DAT)
STA
STO
Figure 1. I2C Timing Diagram
FSYNC
tSU(FSYNC)
td(DO-FSYNC)
tHLD(FSYNC)
tL(SBCLK)
SBCLK
SDIN
tH(SBCLK)
tHLD(SDIN)
tr(SBCLK)
tf(SBCLK)
tSU(SDIN)
td(DO-SBCLK)
SDOUT
Figure 2. TDM Timing Diagram
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6.8 Typical Characteristics
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for Load Resistance is 30
µH, unless otherwise noted.
10
5
10
5
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
2
1
2
1
0.5
0.5
0.2
0.1
0.2
0.1
0.05
0.05
0.02
0.01
0.02
0.01
0.005
0.005
0.002
0.001
0.002
0.001
0.001
0.010.02 0.05 0.1 0.2 0.5
Pout(W)
1
2
3 45 7 10
0.001
0.010.02 0.05 0.1 0.2 0.5
Pout(W)
1
2 3 45 7 10
D001
D002
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 6.667 kHz
Figure 3. THD+N vs Output Power
Figure 4. THD+N vs Output Power
10
5
10
5
VBAT=3.1V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
2
1
2
1
0.5
0.5
0.2
0.1
0.2
0.1
0.05
0.05
0.02
0.01
0.02
0.01
0.005
0.005
0.002
0.001
0.002
0.001
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency(Hz)
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency(Hz)
D003
D004
FIN = 20 Hz – 20 kHz
POUT = 0.1 W
RL = 8 Ω
FIN = 20 Hz – 20 kHz
POUT = 1 W
RL = 8 Ω
Figure 5. THD+N vs Frequency
Figure 6. THD+N vs Frequency
10
5
15
14.8
14.6
14.4
14.2
14
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
2
1
0.5
0.2
0.1
0.05
13.8
13.6
13.4
13.2
13
0.02
0.01
0.005
0.002
0.001
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency(Hz)
2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7
VBAT Supply (V)
D006
D006
D005
FIN = 20 Hz – 20 kHz
POUT = 5 W
RL = 8 Ω + 30 µH
Figure 7. THD+N vs Frequency
Figure 8. Idle Channel Noise (A-Weighted) vs VBAT
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Typical Characteristics (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for Load Resistance is 30
µH, unless otherwise noted.
15
9.14
14
9.12
13
9.1
12
9.08
11
9.06
10
9
9.04
9.02
9
8
8.98
8.96
8.94
7
6
5
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency (Hz)
3
3.25 3.5 3.75
4 4.25 4.5 4.75
VBAT Supply (V)
5
5.25 5.5
D007
DD00620a06
FS = 48 kHz
VBAT = 3.8 V
Figure 10. Amplitude vs Frequency
Figure 9. Receiver Idle Channel Noise (A-Weighted) vs
VBAT
100
90
80
70
60
50
40
30
20
10
0
9
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
8.75
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
8.5
8.25
8
7.75
7.5
7.25
7
6.75
6.5
0.1
0.2
0.3 0.4 0.5 0.6 0.7 0.8
THD+N (%)
1
0.0005
0.01
0.05
Pout (W)
0.2 0.5
1
2 3 45 710
D008
D009
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 1 kHz
Figure 11. Max Output Power vs THD+N
Figure 12. Efficiency vs Output Power
150
145
140
135
130
125
120
115
110
105
100
95
120
115
110
105
100
95
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
AVDD=1.8V
90
85
90
85
80
80
75
75
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency(Hz)
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency(Hz)
D010
D011
AVDD=1.8V
Figure 13. AVDD PSRR vs Frequency
Figure 14. VBAT PSRR vs Frequency
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Typical Characteristics (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for Load Resistance is 30
µH, unless otherwise noted.
11
10.8
10.6
10.4
10.2
10
4.5
4.25
4
3.75
3.5
3.25
3
9.8
9.6
2.75
2.5
2.25
2
9.4
9.2
9
1.65
1.695
1.74
1.785
AVDD
1.83
1.875
1.92
2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7
VBAT Voltage (V)
D012
D013
Figure 15. AVDD Idle Current vs AVDD
Figure 16. VBAT Idle Current vs VBAT
4
3.2
2.4
1.6
0.8
0
50
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
30
20
10
5
3
2
-0.8
-1.6
-2.4
-3.2
-4
1
0.5
0.3
0.2
0.1
0.001
0.010.02 0.05 0.1 0.2 0.5
Pout (W)
1
2 3 45 7 10
0.05
0.1
0.2 0.3 0.5 0.7
1
2
3 4 5 6 78 10
Pout (W)
D0301054
D05145
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 1 kHz
Figure 17. I-sense THD+N vs Output Power
Figure 18. I-sense Linearity vs Output Power
10
5
50
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
30
20
3
2
10
5
1
3
2
0.5
0.3
0.2
1
0.1
0.5
0.3
0.2
0.05
0.03
0.02
0.1
0.01
0.05
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency (Hz)
0.001
0.010.02 0.05 0.1 0.2 0.5
Pout (W)
1
2 3 45 7 10
D03106
D001457
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 1 kHz
Figure 19. I-sense THD+N vs Frequency
Figure 20. V-sense THD+N vs Output Power
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Typical Characteristics (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for Load Resistance is 30
µH, unless otherwise noted.
4
3.2
2.4
1.6
0.8
0
10
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
5
3
2
1
0.5
0.3
0.2
-0.8
-1.6
-2.4
-3.2
-4
0.1
0.05
0.03
0.02
0.01
0.01 0.02
0.05 0.1 0.2 0.3 0.5
Pout (W)
1
2
3 4 567 10
20 30 50 70100 200
500 1000 2000 5000 1000020000
Frequency (Hz)
D018
D03010459
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 1 kHz
Figure 21. V-sense Linearity vs Output Power
Figure 22. V-sense THD+N vs Frequency
4
3.2
2.4
1.6
0.8
0
4
3.2
2.4
1.6
0.8
0
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
-0.8
-1.6
-2.4
-3.2
-4
-0.8
-1.6
-2.4
-3.2
-4
0.05
0.1
0.2 0.3 0.5 0.7
Pout (W)
1
2
3
4
5 6 7
-25
0
25
Temperature (C)
50
75
D020
D05291
RL = 8 Ω
FIN = 1 kHz
RL = 8Ω
P = 1W
Figure 23. V/I-sense Linearity vs Output Power
Figure 24. I-sense Linearity vs Temperature
4
3.2
2.4
1.6
0.8
0
4
3.2
2.4
1.6
0.8
0
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
VBAT=3.1V
VBAT=3.8V
VBAT=4.2V
VBAT=5.5V
-0.8
-1.6
-2.4
-3.2
-4
-0.8
-1.6
-2.4
-3.2
-4
-25
0
25
Temperature (C)
50
75
-25
0
25
Temperature (C)
50
75
D022
D023
RL = 8 Ω
FIN = 1 kHz
RL = 8 Ω
FIN = 1 kHz
Figure 25. V-sense Linearity vs Temperature
Figure 26. V/I-sense Linearity vs Temperature
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7 Parameter Measurement Information
All typical characteristics for the devices are measured using the Bench EVM and an Audio Precision SYS-2722
Audio Analyzer. A PSIA interface is used to allow the I2S interface to be driven directly into the SYS-2722.
Speaker output terminals are connected to the Audio-Precision analyzer analog inputs through a differential-to-
single ended (D2S) filter as shown below. The D2S filter contains a 1st order Passive pole at 120 kHz. The D2S
filter ensures the TAS2564 high performance class-D amplifier sees a fully differential matched loading at its
outputs. This prevents measurement errors due to loading effects of AUX-0025 filter on the class-D outputs.
1kΩ
0.01%
1kΩ
0.01%
-
1kΩ
SPK_P
+
-
AP
680pF
AUX-0025
SYS-2772
+
SPK_N
1kΩ
0.01%
+
-
1kΩ
1kΩ
0.01%
Figure 27. Differential To Single Ended (D2S) Filter
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8 Detailed Description
8.1 Overview
The TAS2564 is a mono digital input Class-D amplifier optimized for mobile applications where efficient battery
operation and small solution size are crucial. It integrates speaker voltage and current sensing and battery
tracking limiting with brown out prevention.
8.2 Functional Block Diagram
2.7V œ 5.5V
1.8V
10uF
4.7uF
1uF
VBAT
VDD
DREG
1uH
SDZ
Power Management
SW
Boost
BGND
VBST
OTP Trim
VBAT
TEMP
Brown Out &
Protection
SAR
ADC
IRQZ
To
Ports
10uF
Gate
Drive
CP
GREG
PVDD
100nF
SDIN
SDOUT
FSYNC
SBCLK
DAC
Digital
Filters
TDM Port
Class-D +
I-V Sense
I-V Sense
ADCs
VSENSE_P
OUTP
Clock
Watchdog
& Timers
OUTN
Reference
& Temp
Protection
VSENESE_N
Addr Det
I2C Port
PLL
AD0
AD1
SDA
SCL
PGND
GND
8.3 Feature Description
8.3.1 PurePath™ Console 3 Software
The TAS2564 advanced features and device configuration should be performed using PurePath Console 3
(PPC3) software. The base software PPC3 is downloaded and installed from the TI website. Once installed the
TAS2564 application can be download from with-in PPC3. The PCC3 tool will calculate necessary register
coefficients that are described in the following sections. It is the recommended method to configure the device.
Once the TAS2564 application calculates and updates the device, the registers values can be read back using
the PPC3 tool for final system integration.
8.3.2 Device Mode and Address Selection
The TAS2564 can operate using one of four selectable device addresses. In TDM/I2S Mode, audio input and
output are provided via the FSYNC, SBCLK, SDIN and SDOUT pins using formats including I2S, Left Justified
and TDM. Configuration and status are provided via the SDA and SCL pins using the I2C protocol. Table 1 below
illustrates how to select the device I2C address. I2C slave addresses are shown as 7-bit address format.
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Table 1. I2C Mode Address Selection
I2C SLAVE ADDRESS
AD1 PIN
AD0 PIN
0x48 (global
address)
NA
NA
0x4C
0x4D
0x4E
0x4F
GND
GND
VDD
VDD
GND
VDD
GND
VDD
The TAS2564 has a global 7-bit I2C address 0x48. When enabled the device will additionally respond to I2C
commands at this address regardless of the AD1 and AD0 pin settings. This is used to speed up device
configuration when using multiple TAS2564 devices and programming similar settings across all devices. The I2C
ACK / NACK cannot be used during the multi-device writes since multiple devices are responding to the I2C
command. The I2C CRC function should be used to ensure each device properly received the I2C commands. At
the completion of writing multiple devices using the global address, the CRC at I2C_CKSUM register should be
checked on each device using the local address for a proper value. The global I2C address can be disabled
using I2C_GBL_EN register. The I2C address is detected by sampling the address pins when SDZ pin is
released. Additionally, the address may be re-detected by setting I2C_AD_DET high after power up and the pins
will be resampled.
Table 2. I2C Global Address Enable
I2C_GBL_EN
SETTING
Disabled
0
1
Enabled (default)
Table 3. I2C Global Address Enable
I2C_AD_DET
SETTING
normal (default)
Re-detect
0
1
8.3.3 General I2C Operation
The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system using serial data transmission. The address and data 8-bit bytes are transferred most-significant bit
(MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an
acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and
ends with the master device driving a stop condition on the bus. The bus uses transitions on the data terminal
(SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on SDA
indicates a start, and a low-to-high transition indicates a stop. Normal data-bit transitions must occur within the
low time of the clock period. shows a typical sequence.
The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The device holds SDA low during the acknowledge clock
period to indicate acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each
device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same
signals via a bi-directional bus using a wired-AND connection.
Use external pull-up resistors for the SDA and SCL signals to set the logic-high level for the bus. Use pull-up
resistors between 2 kΩ and 4.7 kΩ. Do not allow the SDA and SCL voltages to exceed the device supply voltage,
VDD. The I2C pins are fault tolerant and will not load the I2C bus when the device is powered down.
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8- Bit Data for
Register (N)
8- Bit Data for
Register (N+1)
Figure 28. Typical I2C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. Figure 28 shows a generic data
transfer sequence.
8.3.4 Single-Byte and Multiple-Byte Transfers
The serial control interface supports both single-byte and multiple-byte read/write operations for all registers.
During multiple-byte read operations, the TAS2564 responds with data, a byte at a time, starting at the register
assigned, as long as the master device continues to respond with acknowledges.
The TAS2564 supports sequential I2C addressing. For write transactions, if a register is issued followed by data
for that register and all the remaining registers that follow, a sequential I2C write transaction has taken place. For
I2C sequential write transactions, the register issued then serves as the starting point, and the amount of data
subsequently transmitted, before a stop or start is transmitted, determines to how many registers are written.
8.3.5 Single-Byte Write
As shown in Figure 29, a single-byte data-write transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a write-data transfer, the read/write bit must be set to 0. After receiving the correct I2C
device address and the read/write bit, the TAS2564 responds with an acknowledge bit. Next, the master
transmits the register byte corresponding to the device internal memory address being accessed. After receiving
the register byte, the device again responds with an acknowledge bit. Finally, the master device transmits a stop
condition to complete the single-byte data-write transfer.
Start
Condition
Acknowledge
Acknowledge
Acknowledge
R/W
ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
A6 A5 A4
A3 A2 A1 A0
Stop
2
I C Device Address and
Read/Write Bit
Register
Data Byte
Condition
Figure 29. Single-Byte Write Transfer
8.3.6 Multiple-Byte Write and Incremental Multiple-Byte Write
A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes
are transmitted by the master device to the TAS2564 as shown in Figure 30. After receiving each data byte, the
device responds with an acknowledge bit.
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Register
Figure 30. Multi-Byte Write Transfer
8.3.7 Single-Byte Read
As shown in Figure 31, a single-byte data-read transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. For the data-read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte of the internal memory
address to be read. As a result, the read/write bit is set to a 0.
After receiving the TAS2564 address and the read/write bit, the device responds with an acknowledge bit. The
master then sends the internal memory address byte, after which the device issues an acknowledge bit. The
master device transmits another start condition followed by the TAS2564 address and the read/write bit again.
This time, the read/write bit is set to 1, indicating a read transfer. Next, the TAS2564 transmits the data byte from
the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge
followed by a stop condition to complete the single-byte data read transfer.
Repeat Start
Condition
Not
Start
Acknowledge
Condition
Acknowledge
Acknowledge
A0 ACK
Acknowledge
A6 A5
A1 A0 R/W ACK A7 A6 A5 A4
A6 A5
A1 A0 R/W ACK D7 D6
D1 D0 ACK
2
2
Stop
Condition
I C Device Address and
Read/Write Bit
Register
I C Device Address and
Read/Write Bit
Data Byte
Figure 31. Single-Byte Read Transfer
8.3.8 Multiple-Byte Read
A multiple-byte data-read transfer is identical to a single-byte data-read transfer except that multiple data bytes
are transmitted by the TAS2564 to the master device as shown in Figure 32. With the exception of the last data
byte, the master device responds with an acknowledge bit after receiving each data byte.
Repeat Start
Condition
Not
Start
Acknowledge
Condition
Acknowledge
Acknowledge
Acknowledge
Acknowledge
Acknowledge
D0 ACK D7
A6
A0 R/W ACK A7 A6 A5
A0 ACK
A6
A0 R/W ACK D7
D0 ACK D7
D0 ACK
2
2
Register
Stop
Condition
I C Device Address and
Read/Write Bit
I C Device Address and
Read/Write Bit
First Data Byte
Other Data Bytes
Last Data Byte
Figure 32. Multi-Byte Read Transfer
8.3.9 Register Organization
Device configuration and coefficients are stored using a page and book scheme. Each page contains 128 bytes
and each book contains 256 pages. All device configuration registers are stored in book 0, page 0, which is the
default setting at power up (and after a software reset). The book and page can be set by the BOOK[7:0] and
PAGE[7:0] registers respectively.
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8.3.10 Operational Modes
8.3.10.1 Hardware Shutdown
The device enters Hardware Shutdown mode if the SDZ pin is asserted low. In Hardware Shutdown mode, the
device consumes the minimum quiescent current from VDD and VBAT supplies. All registers loose state in this
mode and I2C communication is disabled.
In normal shutdown mode if SDZ is asserted low while audio is playing, the device will ramp down volume on the
audio, stop the Class-D switching, power down analog and digital blocks and finally put the device into Hardware
Shutdown mode. If configured in normal with timeout shutdown mode the device will force a hard shutdown after
a timeout of the configurable shutdown timer. Finally the device can be configured for hard shutdown and will not
attempt to gracefully stop the audio channel.
Table 4. Shutdown Control
SDZ_MODE[1:0]
SETTING
00
Normal Shutdown with Timer
(default)
01
10
11
Immediate Shutdown
Normal Shutdown
Reserved
Table 5. Shutdown Control
SDZ_TIMEOUT[1:0]
SETTING
2 ms
00
01
10
11
4 ms
6 ms (default)
23.8 ms
When SDZ is released, the device will sample the AD0 and AD1 pins and enter the software shutdown mode.
8.3.10.2 Software Shutdown
Software Shutdown mode powers down all analog blocks required to playback audio, but does not cause the
device to loose register state. Software Shutdown is enabled by asserting the MODE[1:0] register bits to 2'b10. If
audio is playing when Software Shutdown is asserted, the Class-D will volume ramp down before shutting down.
When deasserted, the Class-D will begin switching and volume ramp back to the programmed digital volume
setting.
8.3.10.3 Mute
The TAS2564 will volume ramp down the Class-D amplifier to a mute state by setting the MODE[1:0] register bits
to 2'b01. During mute the Class-D still switches, but transmits no audio content. If mute is deasserted, the device
will volume ramp back to the programmed digital volume setting.
8.3.10.4 Active
In Active Mode the Class-D switches and plays back audio. Speaker voltage and current sensing are operational
if enabled. Set the MODE[1:0] register bits to 2'b00 to enter active mode.
8.3.10.5 Perform Load Diagnostics
In Load Diagnostics Mode, chip runs diagnostics on load. Speaker voltage and current sensing are operational.
Set the MODE[1:0] register bits to 2'b11 to enter this mode.
8.3.10.6 Mode Control and Software Reset
The TAS2564 mode can be configured by writing the MODE[1:0] bits.
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Table 6. Mode Control
MODE[1:0]
SETTING
00
01
10
11
Active
Mute
Software Shutdown (default)
A software reset can be accomplished by asserting the SW_RESET bit, which is self clearing. This will restore all
registers to their default values.
Table 7. Software Reset
SW_RESET
SETTING
Don't reset (default)
Reset
0
1
8.3.11 Faults and Status
During the power-up sequence, the power-on-reset circuit (POR) monitoring the VDD and VBAT pins will hold
the device in reset (including all configuration registers) until the supply is valid. The device will not exit hardware
shutdown until VDD and VBAT are valid and the SDZ pin is released. Once SDZ is released, the digital core
voltage regulator will power up, enabling detection of the operational mode. If VDD dips below the POR
threshold, the device will immediately be forced into a reset state.
The device also monitors the VBAT supply and holds the analog core in power down if the supply is below the
UVLO threshold. If the TAS2564 is in active operation and a UVLO fault occurs, the analog supplies will
immediately power down to protect the device. These faults are latching and require a transition through HW/SW
shutdown to clear the fault. The live and latched registers will report UVLO faults.
The device transitions into software shutdown mode if it detects any faults with the TDM clocks such as:
• Invalid SBCLK to FSYNC ratio
• Invalid FSYNC frequency
• Halting of SBCLK or FSYNC clocks
Upon detection of a TDM clock error, the device transitions into software shutdown mode as quickly as possible
to limit the possibility of audio artifacts. Once all TDM clock errors are resolved, the device volume ramps back to
its previous playback state. During a TDM clock error, the IRQZ pin will assert low if the clock error interrupt
mask register bit is set low (INT_MASK[2]). The clock fault is also available for readback in the live or latched
fault status registers (INT_LIVE[2] and INT_LTCH[2]). Reading the latched fault status register (INT_LTCH[7:0])
clears the register.
The TAS2564 also monitors die temperature and Class-D load current and will enter software shutdown mode if
either of these exceed safe values. As with the TDM clock error, the IRQZ pin will assert low for these faults if
the appropriate fault interrupt mask register bit is set low (INT_MASK[0] for over temp and INT_MASK[1] for over
current). The fault status can also be monitored in the live and latched fault registers as with the TDM clock error.
Die over temp and Class-D over current errors can either be latching (for example the device will enter software
shutdown until a HW/SW shutdown sequence is applied) or they can be configured to automatically retry after a
prescribed time. This behavior can be configured in the OTE_RETRY and OCE_RETRY register bits (for over
temp and over current respectively). Even in latched mode, the Class-D will not attempt to retry after an over
temp or over current error until the retry time period (1.5 s) has elapsed. This prevents applying repeated stress
to the device in a rapid fashion that could lead to device damage. If the device has been cycled through SW/HW
shutdown, the device will only begin to operate after the retry time period.
The status registers (and IRQZ pin if enabled via the status mask register) also indicates limiter behavior
including when the limiter is activity, when VBAT is below the inflection point, when maximum attenuation has
been applied, when the limiter is in infinite hold and when the limiter has muted the audio.
Interrupts can be queried using the INT_LIVE[9:0] and INT_LTCH[13:0] registers and correspond to the
INT_MASK[10:0] Interrupts. The latched registers are cleared by writing the self clearing register
INT_CLR_LTCH high.
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The IRQZ pin is an open drain output that asserts low during unmasked fault conditions and therefore must be
pulled up with a resistor to IOVDDVDD. An internal pull up resistor is provided in the TAS2564 and can be
accessed by setting the IRQZ_PU register bit high. Figure 33 below highlights the IRQZ pin circuit.
IOVDD
IOVDD
IRQZ_PU
To
System
Master
IRQZ
Interrupt
Figure 33. IRQZ Pin
Table 8. Fault Interrupt Mask
INT_MASK[10:0] BIT
INTERRUPT
Over Temp Error
Over Current Error
TDM Clock Error
Limiter Active
DEFAULT (1 = Mask)
0
1
2
3
4
0
0
1
1
1
Limter Voltage < Inf
Point
5
6
7
8
Limiter Max Atten
Limiter Inf Hold
Limiter Mute
1
1
1
0
Brown Out on VBAT
Supply
9
10
Brown Out Protection
Active
1
Brown Out Power
1
Down (Latched Only)
11:12
13
Speaker Open Load
(Latched Only)
00
1
Load Diagnostic
Complete (Latched
Only)
Table 9. IRQ Clear Latched
INT_CLR_LTCH
STATE
Don't Clear
0
1
Clear (self clearing)
Table 10. IRQZ Internal Pull Up Enable
IRQZ_PU
STATE
Disabled (default)
Enabled
0
1
Table 11. IRQZ Polarity
IRQZ_POL
STATE
0
1
Active High
Active Low (default)
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Table 12. IRQZ Assert Interrupt Configuration
IRQZ_PIN_CFG[1:0]
VALUE
00
01
On any unmasked live interrupts
On any unmasked latched
interrupts (default)
10
11
For 2-4 ms one time on any
unmasked live interrupt event
For 2-4 ms every 4 ms on any
unmasked latched interrupts
Table 13. Retry after Over Current Event
OCE_RETRY
STATE
Disabled (default)
Enabled
0
1
Table 14. Retry after Over Temperature Event
OTE_RETRY
VALUE
0
1
Do not retry (default)
Retry after 1.5 s
8.3.12 Power Sequencing Requirements
There are no other power sequencing requirements for order of rate of ramping up or down.
8.3.13 Digital Input Pull Downs
Each digital input and IO has an optional weak pull down to prevent the pin from floating. Pull downs are not
enabled during HW shutdown.
8.4 Device Functional Modes
8.4.1 TDM Port
The TAS2564 provides a flexible TDM serial audio port. The port can be configured to support a variety of
formats including stereo I2S, Left Justified and TDM. Mono audio playback is available via the SDIN pin. The
SDOUT pin is used to transmit sample streams including speaker voltage and current sense, VBAT voltage, die
temperature and channel gain.
The TDM serial audio port supports up to 16 32-bit time slots at 44.1/48 kHz, 8 32-bit time slots at a 88.2/96 kHz
sample rate and 4 32-bit time slots at a 176.4/192 kHz sample rate. The device supports 2 time slots at 32 bits in
width and 4 or 8 time slots at 16, 24 or 32 bits in width. Valid SBCLK to FSYNC ratios are 64, 96, 128, 192, 256,
384 and 512. The device will automatically detect the number of time slots and this does not need to be
programmed.
By default, the TAS2564 will automatically detect the PCM playback sample rate. This can be disabled by setting
the AUTO_RATE register bit high and manually configuring the device.
The SAMP_RATE register bits set the PCM audio sample rate when AUTO_RATE is enabled. The TAS2564
employs a robust clock fault detection engine that will automatically volume ramp down the playback path if
FSYNC does not match the configured sample rate (AUTO_RATE enabled) or the ratio of SBCLK to FSYNC is
not supported (minimizing any audible artifacts). Once the clocks are detected to be valid in both frequency and
ratio, the device will automatically volume ramp the playback path back to the configured volume and resume
playback.
When using the auto rate detection the sampling rate and SBCLK to FSYNC ration detected on the TDM bus is
reported back on the read-only register FS_RATE and FS_RATIO respectively.
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Device Functional Modes (continued)
While the sampling rate of 192 kHz is supported, it is internally down-sampled to 96 kHz. Therefore audio
content greater than 40 kHz should not be applied to prevent aliasing. This additionally effects all processing
blocks like BOP and limiter which should use 96 kHz fs when accepting 192 kHz audio. It is recommend to use
PurePath™ Console 3 Software to configure the device.
Table 15. PCM Auto Sample Rate Detection
AUTO_RATE
SETTING
Enabled (default)
Disabled
0
1
Table 16. PCM Audio Sample Rates
SAMP_RATE[2:0]
FS_RATE(read only)
SAMPLE RATE
000
001
010
011
100
000
001
010
011
100
14.7kHz / 16kHz
22.05 kHz / 24 kHz
29.4 kHz / 32 kHz
44.1 kHz / 48 kHz
(default)
101
110
111
101
110
111
88.2 kHz / 96 kHz
176.4 kHz / 192 kHz
Reserved
Table 17. PCM SBCLK to FSYNC Ratio Rates
FS_RATIO[3:0]
0x0-0x3
SAMPLE RATE
Reserved
0x4
64
0x5
96
128
0x6
0x7
192
0x8
256
0x9
384
0xA
512
0xB-0xE
0xF
Reserved
Error Condition
Figure 34 and Figure 35 below illustrates the receiver frame parameters required to configure the port for
playback. A frame begins with the transition of FSYNC from either high to low or low to high (set by the
FRAME_START register bit). FSYNC and SDIN are sampled by SBCLK using either the rising or falling edge
(set by the RX_EDGE register bit). The RX_OFFSET register bits define the number of SBCLK cycles from the
transition of FSYNC until the beginning of time slot 0. This is typically set to a value of 0 for Left Justified format
and 1 for an I2S format.
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SBCLK
FSYNC
SDIN
MSB
MSB-1
LSB+1
LSB
RX_OFFSET
RX_WLEN
RX_SLEN
Figure 34. TDM RX Time Slot with Left Justification
SBCLK
FSYNC
SDIN
Slot 0
Bit 31
Slot0
Bit 0
Slot 1
Bit 31
Slot1
Bit 0
Slot2
Bit 31
RX_OFFSET
Time Slot 0
Time Slot 1
Figure 35. TDM RX Time Slots
Table 18. TDM Start of Frame Polarity
FRAME_START
POLARITY
0
1
Low to High on FSYNC(1)
High to Low on FSYNC (default)(2)
(1) When Low to High is used RX_EDGE and TX_EDGE cannot both
simultaneously be set to rising edge.
(2) When High to Low is used RX_EDGE and TX_EDGE cannot both
simultaneously be set to falling edge.
Table 19. TDM RX Capture Polarity
RX_EDGE
FSYNC AND SDIN CAPTURE
EDGE
0
1
Rising edge of SBCLK (default)
Falling edge of SBCLK
Table 20. TDM RX Start of Frame to Time Slot 0 Offset
RX_OFFSET[4:0]
SBCLK CYCLES
0x00
0x01
0x02
...
0
1 (default)
2
...
0x1E
0x1F
30
31
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The RX_SLEN[1:0] register bits set the length of the RX time slot. The length of the audio sample word within the
time slot is configured by the RX_WLEN[1:0] register bits. The RX port will left justify the audio sample within the
time slot by default, but this can be changed to right justification via the RX_JUSTIFY register bit. The TAS2564
supports mono and stereo down mix playback ([L+R]/2) via the left time slot, right time slot and time slot
configuration register bits (RX_SLOT_L[3:0], RX_SLOT_R[3:0] and RX_SCFG[1:0] respectively). By default the
device will playback mono from the time slot equal to the I2C base address offset for playback. The
RX_SCFG[1:0] register bits can be used to override the playback source to the left time slot, right time slot or
stereo down mix set by the RX_SLOT_L[3:0] and RX_SLOT_R[3:0] register bits.
If time slot selections places reception either partially or fully beyond the frame boundary, the receiver will return
a null sample equivalent to a digitally muted sample.
Table 21. TDM RX Time Slot Length
RX_SLEN[1:0]
TIME SLOT LENGTH
16-bits
00
01
10
11
24-bits
32-bits (default)
reserved
Table 22. TDM RX Sample Word Length
RX_WLEN[1:0]
LENGTH
16-bits
00
01
10
11
20-bits
24-bits (default)
32-bits
Table 23. TDM RX Sample Justification
RX_JUSTIFY
JUSTIFICATION
Left (default)
Right
0
1
Table 24. TDM RX Time Slot Select Configuration
RX_SCFG[1:0]
CONFIG ORIGIN
00
Mono with Time Slot equal to I2C
Address Offset (default)
01
10
10
Mono Left Channel
Mono Right Channel
Stereo Down Mix [L+R]/2
Table 25. TDM RX Left Channel Time Slot
RX_SLOT_L[3:0]
TIME SLOT
0x0
0x1
...
0xE
0xF
0 (default)
1
...
14
15
Table 26. TDM RX Right Channel Time Slot
RX_SLOT_R[3:0]
TIME SLOT
0
0x0
0x1
1 (default)
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Table 26. TDM RX Right Channel Time Slot (continued)
RX_SLOT_R[3:0]
TIME SLOT
...
0xE
0xF
...
14
15
The TDM port can transmit a number sample streams on the SDOUT pin includingboth speaker voltage sense,
speaker current sense, VBAT voltage, die temperature and channel gain. Figure 36 below illustrates the
alignment of time slots to the beginning of a frame and how a given sample stream is mapped to time slots.
Either the rising or falling edge of SBCLK can be used to transmit data on the SDOUT pin, which can be
configured by setting the TX_EDGE register bit. The TX_OFFSET register defines the number SBCLK cycles
between the start of a frame and the beginning of time slot 0. This would typically be programmed to 0 for Left
Justified format and 1 for I2S format. The TDM TX can either transmit logic 0 or Hi-Z depending on the setting of
the TX_FILL register bit setting. An optional bus keeper will weakly hold the state of SDOUT when all devices
driving are Hi-Z. Since only one bus keeper is required on SDOUT, this feature can be disabled via the
TX_KEEPEN register bit. The bus-keeper can additionally be configured to be enabled for only 1LSB cycle or
always using TX_KEEPLN and to drive the full or half cycle of the LSB using TX_KEEPCY.
Each sample stream is composed of either one or two 8-bit time slots. Speaker voltage sense and speaker
current sense sample streams are 16-bit precision, so they will always utilize two TX time slots. The VBAT
voltage stream is 10-bit precision, and can either be transmitted left justified in a 16-bit word (using two time
slots) or can be truncated to 8-bits (the top 8 MSBs) and be transmitted in a single time slot. This is configured
by setting VBAT_SLEN register bit. The Die temperature and gain are both 8-bit precision and are transmitted in
a single time slot.
SBCLK
FSYNC
Slot 0
Bit 7
Slot0
Bit 0
Slot 1
Bit 7
Slot1
Bit 0
Slot2
Bit 7
SDOUT
TX_OFFSET
Time Slot 0
Time Slot 1
Ex: V_SENSE[15:0]
Figure 36. TDM Port TX Diagram
Table 27. TDM TX Transmit Polarity
TX_EDGE
SDOUT TRANSMIT EDGE
Rising edge of SBCLK
0
1
Falling edge of SBCLK (default)
Table 28. TDM TX Start of Frame to Time Slot 0 Offset
TX_OFFSET[2:0]
SBCLK CYCLES
0x0
0x1
0x2
...
0x6
0x7
0
1 (default)
2
...
6
7
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Table 29. TDM TX Unused Bit Field Fill
TX_FILL
SDOUT UNUSED BIT FIELDS
Transmit 0
0
1
Transmit Hi-Z (default)
Table 30. TDM TX SDOUT Bus Keeper Enable
TX_KEEPEN
SDOUT BUS KEEPER
Disable bus keeper
0
1
Enable bus keeper (default)
Table 31. TDM TX SDOUT Bus Keeper Length
TX_KEEPLN
SDOUT BUS KEEPER ENABLED
FOR
0
1
1 LSB cycle (default)
Always
Table 32. TDM TX SDOUT Bus Keeper LSB Cycle
TX_KEEPCY
SDOUT BUS KEEPER DRIVEN
full-cycle (default)
0
1
half-cycle
The time slot register for each sample stream defines where the MSB transmission begins. For instance, if
VSNS_SLOT is set to 2, the upper 8 MSBs will be transmitted in time slot 2 and the lower 8 LSBs will be
transmitted in time slot 3. Each sample stream can be individually enabled or disabled. This is useful to manage
limited TDM bandwidth since it may not be necessary to transmit all streams for all devices on the bus.
It is important to ensure that time slot assignments for actively transmitted sample streams do not conflict. For
instance, if VSNS_SLOT is set to 2 and ISNS_SLOT is set to 3, the lower 8 LSBs of voltage sense will conflict
with the upper 8 MSBs of current sense. This will produce unpredictable transmission results in the conflicting bit
slots (for example the priority is not defined).
The current and voltage values are transmitted at the full 16-bit measured values by default. The IVMON_LEN
register can be used to transmit only the 8 MSB bits in one slot or 12 MSB bits values across multiple slots. The
special 12-bit mode is used when only 24-bit I2S/TDM data can be processed by the host processor. The device
should be configured with the voltage-sense slot and current-sense slot off by 1 slot and will consume 3
consecutive 8-bit slots. In this mode the device will transmit the first 12 MSB bits followed by the second 12 MSB
bits specified by the preceding slot.
If time slot selections place transmission beyond the frame boundary, the transmitter will truncate transmission at
the frame boundary.
It is recommended to keep the following slot ordering:
ISNS_SLOT<VSNS_SLOT<VBAT_SLOT<TEMP_SLOT<GAIN_SLOT<BIL_ILIM_SLOT.
Table 33. TDM Voltage/Current Length
IVMON_LEN[1:0]
LENGTH BITS
16 bits (default)
12 bits
00
01
10
11
8 bits
Reserved
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Table 34. TDM Voltage Sense Time Slot
VSNS_SLOT[5:0]
SLOT
0x00
0x01
0x02
...
0
1
2 (default)
...
62
63
0x3E
0x3F
Table 35. TDM Voltage Sense Transmit Enable
VSNS_TX
STATE
Disabled (default)
Enabled
0
1
Table 36. TDM Current Sense Time Slot
ISNS_SLOT[5:0]
SLOT
0x00
0x01
0x02
...
0 (default)
1
2
...
62
63
0x3E
0x3F
Table 37. TDM Current Sense Transmit Enable
ISNS_TX
STATE
Disabled (default)
Enabled
0
1
Table 38. TDM VBAT Time Slot
VBAT_SLOT[5:0]
SLOT
0x00
0x01
...
0
1
...
0x04
...
4 (default)
...
62
63
0x3E
0x3F
Table 39. TDM VBAT Time Slot Length
VBAT_SLEN
SLOT LENGTH
Truncate to 8-bits (default)
Left justify to 16-bits
0
1
Table 40. TDM VBAT Transmit Enable
VBAT_TX
STATE
Disabled (default)
Enabled
0
1
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Table 41. TDM Temp Sensor Time Slot
TEMP_SLOT[5:0]
SLOT
0x00
0x01
...
0
1
...
0x05
...
5 (default)
...
62
63
0x3E
0x3F
Table 42. TDM Temp Sensor Transmit Enable
TEMP_TX
STATE
Disabled (default)
Enabled
0
1
The following sample streams are part of the Inter Chip Limiter Alignment system. These data streams can be
routed over the audio TDM bus.
Table 43. TDM Limiter Gain Reduction Time Slot
GAIN_SLOT[5:0]
SLOT
0x00
0x01
...
0
1
...
0x06
...
6 (default)
...
62
63
0x3E
0x3F
Table 44. TDM Limiter Gain Reduction Transmit Enable
GAIN_TX
STATE
Disabled (default)
Enabled
0
1
Table 45. TDM Boost Sync Time Slot
BST_SLOT[5:0]
SLOT
0x00
0x01
...
0
1
...
0x07
...
7 (default)
...
62
63
0x3E
0x3F
Table 46. TDM Boost Sync Enable
BST_TX
STATE
Disabled (default)
Enabled
0
1
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8.4.2 Playback Signal Path
8.4.2.1 High Pass Filter
Excessive DC and low frequency content in audio playback signal can damage loudspeakers. The TAS2564
employs a high-pass filter (HPF) to prevent this from occurring for the PCM playback path. The HPF can be
disabled using register HPF_EN. The HPF Bi-Quad filter coefficients can be changed from the default 2 Hz using
the HPFC_N0, HPFC_N1, HPFC_D1 registers using the equation [N, D] = butter(1, fc/(fs/2), 'high');
round(N(0)*2^31);. These coefficients should be calculated and set using PurePath™ Console 3 Software.
Table 47. HPF Enable
HPF_EN
STATE
Enabled (default)
Disabled
0
1
8.4.2.2 Digital Volume Control and Amplifier Output Level
The gain from audio input to speaker terminals is controlled by setting the amplifier’s output level and digital
volume control (DVC).
Amplifier output level settings are presented in dBV (dB relative to 1 Vrms) with a full scale digital audio input (0
dBFS) and the digital volume control set to 0 dB. It should be noted that these levels may not be achievable
because of analog clipping in the amplifier, so they should be used to convey gain only. below shows gain
settings that can be programmed via the AMP_LEVEL register.
Table 48. Amplifier Output Level Settings
AMP_LEVEL[4:0]
dBV
9.7
VPEAK (V)
4.32
0x00
0x01
0x02
...
10.2
10.7
...
4.58
4.85
...
0x10
...
17.7
...
10.85
...
0x1B
0x1C
23.2
23.7
Reserved
20.44
21.65
Reserved
0x1D-0x1F
Equation 1 calculates the amplifiers output voltage.
V
= Input + A
+ A
dBV
AMP
AMP
dvc
where
•
•
•
•
VAMP is the amplifier output voltage in dBV
Input is the digital input amplitude in dB with respect to 0 dBFS
Advc is the digital volume control setting, 0 dB to -100 dB in 0.5 dB steps
AAMP is the amplifier output level setting in dBV
(1)
Settings greater than 0xC8 are interpreted as mute. When a change in digital volume control occurs, the device
ramps the volume to the new setting based on the DVC_RAMP register bits. If DVC_RAMP is set to 0x0000
0000, volume ramping is disabled. This can be used to speed up startup, shutdown and digital volume changes
when volume ramping is handled by the system master.
The digital voltage control registers DVC_PCM represent the volume in a 2.X format. To calculate the value to
write to these 4 registers apply the following formula to the desired dB DVC_PCM = round(10^(dB/20)*2^30).
A volume ramp rate can be set using DVC_RAMP and represents a rate in 1.X format. To calculate the value to
write to these 4 registers apply the following formula DVC_RAMP = round((1-exp(-1/(0.2*fs*time in
seconds)))*2^31).
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Table 49. PCM Digital Volume Control
DVC_PCM[31:0]
VOLUME (dB)
0x0000 0D43 (MIN)
...
-110
...
0x4000 0000
...
0 (default)
...
2
0x5092 BEE4 (MAX)
Table 50. Digital Volume Ramp Rate
DVC_RAMP[31:0]
0x0000 0D43
RAMP RATE @ 48kHz (s)
0
...
0x7FFC 963B
1 s
8.4.2.3 Auto-Mute During Idle Channel Mode
Device will stop playing audio if the input audio level drops below the programmable threshold for a
programmable timer window. If this behavior is not preferred, threshold level can be kept at very low levels.
8.4.2.4 Auto-Start/Stop on Audio Clocks
The TAS2564 can enter low power software shutdown when the TDM clocks are stopped instead of going into
clock error. The device will resume operation when the clocks resume.
8.4.2.5 Supply Tracking Limiters with Brown Out Prevention
The TAS2564 monitors battery voltage (VBAT) and along with the audio signal to automatically decrease gain
when the audio signal peaks exceed a programmable threshold. This helps prevent clipping and extends
playback time through end of charge battery conditions. The limiters threshold can be configured to track the
monitored voltage below a programmable inflection point with a programmable slope. A minimum threshold sets
the limit of threshold reduction from the voltage tracking. Configurable attack rate, hold time and release rate are
provided to shape the dynamic response of each limiter. If the ICLA is enabled the actual attenuation is based on
the ICLA configuration using the calculated attenuation value of all devices on the selected ICLA bus.
BOP ACTIVE PHASE (BOP_GAIN ≠ 0dB)
PAUSE LIMITER UPDATES
ICLA_MODE
LIMITER
ICLA
CALC
ATTACK/
RELEASE
ICLA
1
0
LIMITER
ATTACK/
RELEASE
ICLA_EN
LIMITER
PUBLISHED ON
ICLA
LIM_MAX_ATN
LIM_MAX_ATN
+
+
ATTNUATION
APPLIED
BOP ATTACK/
RELEASE
VBATT<BOP_TH
BOP
ATTN
Figure 37. Limiter and Brown Out Prevention Interaction Diagram
A Brown Out Prevention (BOP) feature provides a priority input to provide a fast response to transient dips in the
battery supply (VBAT) which at end of charge conditions that can cause system level brown out. When the
selected supply dips below the brown-out threshold the BOP will begin reducing gain at a configurable attack
rate. When the VBAT supply rises above the brownout threshold, the BOP will begin to release after the
programmed hold time. During a BOP event the limiter updates will be paused. This is to prevent a limiter from
releasing during a BOP event. The VBAT limiter is enabled by setting the LIMB_EN bit high.
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Table 51. VBAT Tracking Limiter Enable
LIMB_EN
VALUE
0
1
Disabled (default)
Enabled
The limiter has a configurable attack rate, hold time and release rate, which are available via the
LIMB_ATK_RT[2:0], LIMB_HLD_TM[2:0], LIMB_RLS_RT[2:0] register bits. The limiter attack and release step
sizes can be set by configuring the LIMB_ATK_ST[1:0] and LIMB_RLS_ST[1:0] register bits. The rates are based
on the number of audio samples and actual time values can be calculated by multiplying by 1/fs. For example the
attack rate of 4 samples at 48 ksps would be approximately 83 µs.
Table 52. Limiter Attack Rate
LIMB_ATK_RT[2:0]
ATTACK RATE
(samples/step)
ATTACK RATE @ 48
ksps (~µs)
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
1
20
42
2 (default)
4
8
83
167
333
666
1300
2700
16
32
64
128
Table 53. Limiter Hold Time
LIMB_HLD_TM[2:0]
HOLD TIME
HOLD TIME @
(samples/step)
48ksps (ms)
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0
1920
0
40
4800
100
200
400
1000
2000
4000
9600
19200
48000
96000 (default)
192000
Table 54. Limiter Release Rate
LIMB_RLS_RT[2:0]
Release Rate
(samples/step)
RELEASE RATE @
48 ksps (ms)
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
10
0.2
0.4
20
40
0.8
80
1.7
160
3.3
320
6.7
640 (default)
1280
13.3
26.7
Table 55. Limiter Attack Step Size
LIMB_ATK_ST[1:0]
STEP SIZE (dB)
00
01
0.25
0.5 (default)
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Table 55. Limiter Attack Step Size (continued)
LIMB_ATK_ST[1:0]
STEP SIZE (dB)
10
11
1
2
Table 56. Limiter Release Step Size
LIMB_RLS_ST[1:0]
STEP SIZE (dB)
00
01
10
11
0.25
0.5 (default)
1
2
A maximum level of attenuation applied by the limiters and brown out prevention feature is configurable via the
LIM_MAX_ATN register. This attenuation limit is shared between the features. For instance, if the maximum
attenuation is set to 6 dB and the limiters have reduced gain by 4 dB, the brown out prevention feature will only
be able to reduce the gain further by another 2 dB. If the limiter or brown out prevention feature is attacking and
it reaches the maximum attenuation, gain will not be reduced any further.
The limiter max attenuation LIM_MAX_ATN represent the limit in a 1.X format. To calculate the value to write to
the 4 registers by apply the following formula to the desired dB using equation LIMB_MAX_ATN = round(10^(-
dB/20)*2^31).
Table 57. Limiter Max Attenuation
LIM_MAX_ATN[31:0]
0x7214 82C0
ATTENUATION (dB)
-1
...
...
0x2D6A 866F
...
-9 (default)
...
0x1326 DD71
-16.5
The limiter begins reducing gain when the output signal level is greater than the limiter threshold. The limiter can
be configured to track selected supply below a programmable inflection point with a minimum threshold value.
Figure 38 below shows the limiter configured to limit to a constant level regardless of the selected supply level.
To achieve this behavior, set the limiter maximum threshold to the desired level using LIM_TH_MAX. Set the
limiter inflection point using LIM_INF_PT below the minimum allowable supply setting. The limiter minimum
threshold register LIM_TH_MIN does not impact limiter behavior in this use case.
LIM_TH_MAX
Brown
Out
BOP_TH
VSUP (V)
Figure 38. Limiter with Fixed Threshold
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The VBAT limiter threshold max LIMB_TH_MAX and min LIMB_TH_MIN registers represent the limit in a 5.X
format. To calculate the value to write to the 4 registers by apply the following formula to the desired threshold
voltage using the equation LIMB_TH_MAX or LIMB_TH_MIN = round(Volts*2^27).
Table 58. VBAT Limiter Maximum Threshold
LIMB_TH_MAX[31:0]
0x1400 0000
THRESHOLD (V)
2.5
...
...
0x4800 0000
...
9 (default)
...
0x7C00 0000
15.5
Table 59. VBAT Limiter Minimum Threshold
LIMB_TH_MIN[31:0]
0x1400 0000
THRESHOLD (V)
2.5
...
...
0x2000 0000
...
4 (default)
...
0x7C00 0000
15.5
The VBAT limiter inflection point LIMB_INF_PT represent the limit in a 4.X format. To calculate the value to write
to the 4 registers by apply the following formula to the desired infection voltage using the equation LIMB_INF_PT
= round(Volts*2^28).
Table 60. VBAT Limiter Inflection Point
LIMB_INF_PT[31:0]
0x2000 0000
THRESHOLD (V)
2
...
...
0x34CC CCCD
...
3.3 (default)
...
6
0x3000 0000
Figure 39 shows how to configure the limiter to track selected supply below a threshold without a minimum
threshold. Set the LIM_TH_MAX register to the desired threshold and LIM_INF_PT register to the desired
inflection point where the limiter will begin reducing the threshold with the selected supply. The
LIMP_SLOPE[1:0] and LIMB_SLOPE[1:0] register bits can be used to change the slope of the limiter tracking the
respective PVDD and VBAT supply.The LIMB_SLOPE[1:0] register bits can be used to change the slope of the
limiter tracking the VBAT supply. The default value of 1 V/V will reduce the threshold 1 V for every 1 V of drop in
the supply voltage. More aggressive tracking slopes can be programmed if desired. Program the LIM_TH_MIN
below the minimum the selected supply to prevent the limiter from having a minimum threshold reduction when
tracking the selected supply.
The VBAT limiter tracking slope LIMB_SLOPE[31:0] represent the limit in a 4.X format. To calculate the value to
write to the 4 registers by apply the following formula to the desired infection voltage using equation
LIMB_SLOPE = round(slope(V/V)*2^28).
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Inflection
Point
LIM_TH_MAX
slope
Brown
Out
BOP_TH LIM_INF_PT
VSUP (V)
Figure 39. Limiter with Inflection Point
Table 61. Limiter VBAT Tracking Slope
LIMB_SLOPE[31:0]
0x1000 0000
SLOPE (V/V)
1 (default)
...
...
4
0x4000 0000
To achieve a limiter that tracks the selected supply below a threshold, configure the limiter as explained in the
previous example, except program the LIM_TH_MIN register to the desired minimum threshold. This is shown in
Figure 40 below.
Inflection
Point
LIM_TH_MAX
slope
LIM_TH_MIN
Brown
Out
BOP_TH LIM_INF_PT
VSUP (V)
Figure 40. Limiter with Inflection Point and Minimum Threshold
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The TAS2564 also employs a Brown Out Prevention (BOP) feature that serves as a low latency priority input to
the limiter engine that begins attacking the VBAT supply dipping below the programmed BOP threshold. This
feature can be enabled by setting the BOP_EN register bit high. It should be noted that the BOP feature is
independent of the limiter and will function if enabled, even if the limiter is disabled. The BOP threshold is
configured by setting the threshold with register bits BOP_TH.
AUDIO_IN
AUDIO_OUT
Limiter
&
Brown
Out
Prevention
Temp
Sensor
SAR
ADC
VBAT
SETTINGS
Figure 41. Limiter Block Diagram
Table 62. Brown Out Prevention Enable
BOP_EN
VALUE
Disabled
0
1
Enabled (default)
The Brownout prevention threshold BOP_TH represent a threshold in a 4.X format. To calculate the value to
write to the 4 registers by apply the following formula to the desired brownout threshold using equation BOP_TH
= round(Volts*2^28).
Table 63. Brown Out Prevention Threshold
BOP_TH[31:0]
0x0000 000 - 0x1FFF FFFF
0x2000 0000
...
VBAT THRESHOLD (V)
Reserved
2.5
...
0x2E66 6666
...
2.9 (default)
...
4
0x2000 0000
0x2000 0001 -
0xFFFF FFFF
Reserved
The BOP feature has a separate attack rate BOP_ATK_RT, attack step size BOP_ATK_ST and hold time
BOP_HLD_TM from the battery tracking limiter. The BOP feature uses the LIMB_RLS_RT register setting to
release after a brown out event. The rates are based on the number of audio samples and actual time values
can be calculated by multiplying by 1/fs. For example the attack rate of 4 samples at 48 ksps would be
approximately 83 µs.
Table 64. Brown Out Prevention Attack Rate
BOP_ATK_RT[2:0]
ATTACK RATE
(samples/step)
ATTACK RATE @ 48
ksps (~µs)
0x0
0x1
0x2
0x3
0x4
0x5
1
2
20
42
4
83
8
167
333
666
16
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Table 64. Brown Out Prevention Attack
Rate (continued)
BOP_ATK_RT[2:0]
ATTACK RATE
(samples/step)
ATTACK RATE @ 48
ksps (~µs)
0x6
0x7
64
1300
2700
128
Table 65. Brown Out Prevention Attack Step Size
BOP_ATK_ST[1:0]
STEP SIZE (dB)
00
01
10
11
0.5
1 (default)
1.5
2
Table 66. Brown Out Prevention Hold Time
BOP_HLD_TM[2:0]
HOLD TIME (ms)
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0
10
25
50
100
250
500 (default)
1000
The TAS2564 can also shutdown the device when a brown out event occurs if the BOP_MUTE register bit is set
high. For the device to continue playing audio again, the device must transition through a SW/HW shutdown
state. Setting the BOP_INF_HLD high will cause the limiter to stay in the hold state (for example never release)
after a cleared brown out event until either the device transitions through a mute or SW/HW shutdown state or
the register bit BOP_HLD_CLR is written to a high value (which will cause the device to exit the hold state and
begin releasing). This bit is self clearing and will always readback low. Figure 42 below illustrates the entering
and exiting from a brown out event.
VBAT
BOP Thresh
BOP Active
BOP
Attacking
BOP
Holding
Limiter Releasing
(BOP Inactive)
BOP Inactive
BOP Inactive
BOP Mode
Figure 42. Brown Out Prevention Event
Table 67. Shutdown on Brown Out Event
BOP_MUTE
VALUE
0
1
Don't Shutdown (default)
Mute then shutdown
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Table 68. Infinite Hold on Brown Out Event
BOP_INF_HLD
VALUE
0
1
Use BOP_HLD_TM after Brown
Out event (default)
Do not release until
BOP_HLD_CLR is asserted high
If the TAS2564 is configured to hold the brownout event until cleared the attenuation will remain until
BOP_HLD_CLR register clear is performed. This should be performed by setting the BOP_HLR_CLR bit high,
reading the register and then setting the BOP_HLD_CLR back to low.
Table 69. BOP Infinite Hold Clear
BOP_HLD_CLR
VALUE
Don't clear (default)
Clear event
0
1
A hard brownout level can be set to shutdown the TAS2564 if the BOP cannot mitigate the drop in battery
voltage VBAT. This will shutdown the device and should not be used if the BOP_MUTE is enable. The brownout
shutdown will only function if brownout engine is enabled using BOP_EN.
Table 70. Brown Out Shutdown Enable
BOSD_EN
VALUE
Disabled (default)
Enabled
0
1
The Brownout prevention shutdown threshold BOSD_TH represent a threshold in a 5.X format. To calculate the
value to write to the 4 registers by apply the following formula to the desired brownout threshold using equation
BOSD_TH = round(Volts*2^27).
Table 71. Brown Out Shutdown Threshold
BOSD_TH[31:0]
0x2000 0000
VBAT THRESHOLD (V)
2.5
...
...
2.7 (default)
...
0x2B33 3333
...
0x3FFF FFFF
3.99
8.4.2.6 Inter Chip Limiter Alignment
8.4.2.6.1 TDM Mode
The TAS2564 supports alignment of limiter (including brown out prevention) dynamics across devices that share
the same TDM bus. This ensures consistent gain between channels during limiting or brown out events since
these dynamics are dependent on audio content, which can vary across channels. Each device can be
configured to align to a specified number of other devices, which allows creation of groupings of devices that
align only to each other. All devices in the same group must use the same setting.
Limiter activity is communicated via the limiter gain reduction parameter that can be optionally transmitted by
each device on SDOUT in an 8-bit time slot. Gain reduction should be transmitted in adjacent time slots for all
devices that are to be aligned beginning with the first slot that is specified by the ICLA_SLOT register. The order
of the devices is not important as long as they are adjacent. The time slot for limiter gain reduction is configured
by the GAIN_SLOT register and enabled by the GAIN_TX register bit.
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The ICLA_SEN register specify which time slots should be listened to for gain alignment. This allows any number
of devices between two and eight to be grouped together. At least two of these bits should be enabled for
alignment to take place. The ICLA_USE_MAX register bit determines whether alignment is based on the
maximum or minimum gain reduction value from the group of enabled devices. If the BIL_ICLA_EN is enabled
the # of slots will be double what is selected. For example if time-slot 0,1, and 2 are used for gain alignment.
Then time-slots 3, 4, and 5 will be used for brownout-current alignment.
To enable the inter chip limiter alignment feature, the ICLA_GAIN_EN register bit should be asserted high and all
devices should be configured with identical limiter and brown out prevention settings. Limiter gain reduction
transmission should be enabled on all devices as described above.
Table 72. Inter Chip Limiter Alignment
ICLA_GAIN_EN
VALUE
Disabled (default)
Enabled
0
1
Table 73. ICLA Gain Alignment Configuration
ICLA_MODE
VALUE
00
Use the maximum gain reduction
of the ICLA group (default)
01
Use the minimum gain reduction of
the ICLA group
10-11
Reserved
Table 74. Inter Chip Limiter Gain Alignment Starting
Time Slot
ICLA_GAIN_SLOT[5:0]
0x00
STARTING TIME SLOT
Time Slot 0
Time Slot 1
Time Slot 2
...
0x01
0x02
...
0x3F
Time Slot 63
Table 75. Inter Chip Limiter Alignment Time Slots Enable
REGISTER BIT
DESCRIPTION
BIT VALUE
STATE
Disabled (default)
Enabled
0
1
0
1
0
1
0
1
Time Slot = ICLA_GAIN_SLOT. When enabled, the limiter will
ICLA_GAIN_SEN[0]
include this time slot in the alignment group.
Disabled (default)
Enabled
Time Slot = ICLA_GAIN_SLOT + 1. When enabled, the limiter
ICLA_GAIN_SEN[[1]
ICLA_GAIN_SEN[[2]
ICLA_GAIN_SEN[3]
will include this time slot in the alignment group.
Disabled (default)
Enabled
Time Slot = ICLA_GAIN_SLOT + 2. When enabled, the limiter
will include this time slot in the alignment group.
Disabled (default)
Enabled
Time Slot = ICLA_GAIN_SLOT + 3. When enabled, the limiter
will include this time slot in the alignment group.
8.4.2.7 Class-D Settings
The TAS2564 Class-D amplifier supports spread spectrum PWM modulation, which can be enabled by setting
the AMP_SS register bit high. This can help reduce EMI in some systems.
Table 76. Low EMI Spread Spectrum Mode
AMP_SS
SPREAD SPECTRUM
Disabled
0
1
Enabled (default)
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By default the Class-D amplifier's switching frequency is based on the device's trimmed internal oscillator. To
synchronize switching to the audio sample rate, set the CLASSD_SYNC register bit high. When the Class-D is
synchronized to the audio sample rate, the RATE_RAMP register bit must be set based whether the audio
sample rate is based on a 44.1 kHz or 48 kHz frequency. For 44.1, 88.2 and 176.4 kHz, set this bit high. for 48,
96 and 192 kHz, set this bit low. This ensures that the internal ramp generator has the appropriate slope.
Table 77. Class-D Synchronization Mode
CLASSD_SYNC
SYNCHRONIZATION MODE
0
1
Not synchronized to audio clocks
(default)
Synchronized to audio clocks
Table 78. Sample Rate for Class-D Synchronized Mode
RAMP_RATE
PLAYBACK SAMPLE RATE
multiples of 48 kHz(default)
multiples of 44.1 kHz
0
1
TAS2564 also supports low noise receiver mode which can be enabled by ICN_MODE. In this mode, device gain
should be limited to 6dBV. It is recommended to use the device in internal Boost configuration to achieve best
noise performance in receiver mode
Table 79. Receiver Mode
ICN_MODE
MODE
0
1
Speaker Mode (default)
Receiver Mode
8.4.3 SAR ADC
A 10-bit SAR ADC monitors VBAT voltage VBAT_CNV and die temperature TMP_CNV. VBAT voltage
conversions are also used by the limiter and brown out prevention features.
TEMP SENSOR
SAR
ADC
VBAT
Figure 43. SAR Block Diagram
Actual VBAT voltage is calculated by dividing the VBAT_CNV register by 64. Actual die temperature is calculated
by subtracting 93 from TMP_CNV register. The battery voltage VBAT can be filtered using VBAT_FLT register
but will increase the latency. The VBAT_CNV registers should be read VBAT_MSB followed by VBAT_LSB.
Table 80. VBAT Filtering
VBAT_FLT[0]
FILTER POLE
100 kHz (default)
Bypass
0
1
Table 81. ADC VBAT Voltage Conversion
VBAT_CNV[9:0]
VBAT VOLTAGE (V)
0x000
0x001
...
0 V
0.0156 V
...
0x100
4.0 V
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Table 81. ADC VBAT Voltage Conversion (continued)
VBAT_CNV[9:0]
VBAT VOLTAGE (V)
...
...
0x17F
0x180
5.9844 V
6.0 V
Table 82. ADC Die Temperature Conversion
TMP_CNV[7:0]
DIE TEMPERATURE (°C)
0x00
0x01
...
-93 °C
-92 °C
...
0x76
...
25 °C
...
0xFE
0xFF
161 °C
162 °C
8.4.4 Boost
The TAS2564 internal processing algorithm automatically enables the boost when needed. A look-ahead
algorithm monitors the battery voltage and the digital audio stream. When the speaker output approaches the
battery voltage the boost is enabled in-time to supply the required speaker output voltage. When the boost is no
longer required it is disabled and bypassed to maximize efficiency. The boost can be configured in one of two
modes. The first is low in-rush (Class-G) supporting only boost on-off and has the lowest in-rush current. The
second is high-efficiency (Class-H) where the boost voltage level is adjusted to a value just above what is
needed. This mode is more efficient but has a higher in-rush current to quickly transition the levels. This can be
configured using Table 83.
Class-G
Class-H
Time
Figure 44. Boost Mode Signal Tracking Example
Table 83. Boost Mode
BST_MODE[1:0]
BOOST MODE
Class-H - High efficiency (default)
Class-G - Low in-rush
Always On
00
01
10
11
Always Off - Pass-through
The boost can be enabled and disabled using BST_EN register. When driving the Class-D amplifier using an
external supply through the PVDD pin, the boost should be disabled and the VBST pin can be left floating. Do
not drive an external voltage on the VBST pin. When suppling and external PVDD voltage the VBAT voltage
must also be supplied to the device. While VBAT supply must be present it will not carry current to the speaker
load.
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Table 84. Boost Enable
BST_EN
BOOST IS
0
1
Disabled
Enabled (default)
Table 85. Active Mode PFM Lower Frequency Limit
BST_PFML[1:0]
LOWER LIMIT (Hz)
No lower limit
25 kHz
00
01
10
11
50 kHz (default)
100 kHz
The boost has a soft-start to limit in-rush current during the initial charge. The current limit and soft-start timer are
configurable to adjust to system component selection.
Table 86. Soft-Start Current Limit
BST_SSL[1:0]
CURRENT LIMIT (A)
Disabled - Boost Normal Limit
1.2 A(default)
00
01
10
11
1.83 A
2.44 A
The boost inductor and decoupling capacitor range needs to be specified using BST_IR and BST_LR registers.
These setting optimize the boost to ensure current limit accuracy and avoid clipping in class-H operation.
Table 87. Boost Inductor Range
BST_IR[1:0]
INDUCTANCE (H)
< 0.6 µH
00
01
10
11
0.6 µH-1.3 µH (default)
1.3 µH - 2.5 µH
Reserved
Table 88. Boost Load Regulation
BST_LR
VALUE
00
01
10
11
4.4A/V; load regulation = 0.9 V
3.67 A/V; load regulation = 1.1 V
2.93 A/V; load regulation = 1.37 V
1.95A/V; load regulation=2.06V
The maximum boost voltage regulation is set by BST_VREG. When operating in class-G mode the boost when
needed will be at this voltage. In class-H mode of operation the boost voltage is automatically selected based on
the audio signal but, will not exceed this set value.
Table 89. Boost Max Regulation Voltage
BST_VREG[4:0]
0x00-0x06
BOOST VOLTAGE (V)
Reserved
0x7
6 V
6.5 V
0x8
...
...
0x13
0x14
0x15
12 V
12.5 V (default)
13 V
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Table 89. Boost Max Regulation Voltage (continued)
BST_VREG[4:0]
0x16-0X1F
BOOST VOLTAGE (V)
Reserved
The peak current limits the boost current drawn from the VBAT supply. This setting allows flexibility in the
inductor selection for various saturation currents. The current limit can be adjust in 45 mA steps with register
BST_ILIM[5:0]. The peak current limit setting is the maximum and may be temporarily reduced if the and ICLA
current limit is active.
The peak current limits the boost current drawn from the VBAT supply. This setting allows flexibility in the
inductor selection for various saturation currents. The current limit can be adjust in 45 mA steps with register
BST_ILIM[5:0]. The peak current limit setting is the maximum and may be temporarily reduced if the and ICLA
current limit is active.
Table 90. Peak Current Limit
BST_ILIM[5:0]
CURRENT (A)
1.206 A
1.273 A
1.340 A
...
0x00
0x01
0x02
...
0x39
...
5.025 A (default)
...
0x3F
5.427A
8.4.5 IV Sense
The TAS2564 provides speaker voltage and current sense for real time monitoring of loudspeaker behavior. The
VSNS_P and VSNS_N pins should be connected after any ferrite bead filter (or directly to the OUT_P and
OUT_N connections if no EMI filter is used). The V-Sense connections eliminate IR drop error due to packaging,
PCB interconnect or ferrite bead filter resistance. It should be noted that any interconnect resistance after the V-
Sense terminals will not be corrected for, so it is advised to connect the sense connections as close to the load
as possible.
OUT_P
fb
OUT_N
fb
VS1_N
VS1_P/VS2_N
Figure 45. V-Sense Connections
TAS2564 also supports Dual V-Sense Channel. Second V-Sense Channel can be used with dual voice coil
speakers. Similar to Conventional Speakers, two of the connections driven by speaker, should be connected
after any ferrite bead and as close to load as possible. Center tap can be tapped directly from center terminal of
speaker available for dual voice coils.
OUT_P
fb
OUT_N
fb
VS1_N
VS1_P/VS2_N
VS2_P
Figure 46. Dual V-Sense Connections
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I-Sense and V-Sense can be powered down by asserting the ISNS_PD, VSNS_PD and VSNS2_PD register bits.
When powered down, the device will return null samples for the powered down block. The IV-sense is High
Passed Filtered and the Bi-Quad filter coefficients can be changed from the default 2 Hz using the IVHPF_N0,
IVHPF_N1, IVHPF_D1 registers using the equations [N, D] = butter(1, fc/(fs/2), 'high'); round(N(0)*2^31);. These
coefficients can be calculated and set using PurePath™ Console 3 Software.
Table 91. I-Sense Power Down
ISNS_PD
SETTING
0
1
I-Sense is active
I-Sense is powered down (default)
Table 92. V-Sense Power Down
VSNS_PD
SETTING
0
1
V-Sense is active
V-Sense is powered down (default)
Table 93. V-Sense2 Power Down
VSNS2_PD
SETTING
0
1
V-Sense 2 is active
V-Sense 2 is powered down
(default)
8.4.6 DC Detect
TAS2564 supports DC Playback, detection and protection against High DC playback. To enable DC Playback,
High Pass Filter in Playback path needs to be disabled by setting HPF_DIS. Device also offers protection against
potentially damaging DC Voltages across speaker load if the DC Playback is enabled. DC playback higher than
threshold set by DC_DET_TH for time greater than DC_DET_TM, TAS2564 will detect DC and shutdown the
device. Device shutdown on high DC detection can be disabled byDC_DET_PD. DC detection feature itself can
be disabled by DC_DET_EN. It is recommended to use PurePath™ Console 3 Software to configure the DC
Detection and Protection feature as the software will perform the necessary math for each register.
Table 94. DC Detection Enable
DC_DET_EN
Setting
0
1
DC Detection is disabled(default)
DC Detection is enabled
Table 95. HPF Disable
HPF_DIS
SETTING
0
1
HPF is enabled(default)
HPF is disabled.
Table 96. DC Detection Timer
DC_DET_TM
Delay
20 ms
00
01
10
11
50 ms(default)
75 ms
100 ms
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Table 97. Shutdown on DC Detection
DC_DET_PD
SETTING
0
1
No Powerdown on High DC detection (default)
Device powerdown on High DC detection
It is worth noting that DC Detection inside the device is implemented with a Low Pass Filter which will cause low
frequencies to cause some measurement errors in DC. DC detection filter offers 25 dB attenuation at 20 Hz and
greater than 40dB attenuation for frequencies greater than 40 Hz. DC Detection Threshold should be selected
while taking care of these constraints.
8.4.7 Load Diagnostics
The TAS2564 can check the speaker terminal for an open or short. This can be used to determine if a problem
exists with the speaker or trace to the speaker. The entire operation is performed by the TAS2564 and results
reported using the IRQZ pin or read over I2C bus on completion. The load diagnostics can be performed using
external audio clock or the internal oscillator.
Open Load
LDG_RES_UT
LDG_RES_LT
Short Load
Figure 47. Load Diagnostics
The speaker open and short thresholds are configured using the respective LDG_RES_UT and LDG_RES_LT
registers using equation round (Ω/7*2^22). The load diagnostic mode can be run in two ways. First if the device
is in Software Shutdown the load diagnostic mode can be run but setting LDG_MODE high. The diagnostic will
be run and the device will return to Software Shutdown. The load diagnostics can also be run before transitioning
to Active. This is done by setting the MODE register to . If the load is within the specified range the device will
transition to Active otherwise it will transition to Software Shutdown. When the load diagnostics is run it will play a
22 kHz at -35 dBFS for 100 ms and measure the resistance of the speaker trace. The result is averaged over the
time specified by the IVSNS_AVG register. The measured speaker impedance can be read from
LDS_RES_VAL1 using the equations Impedance = 7*(LD_RES_VAL1)/2^22) Ω.
Table 98. IV-Sense Averaging
IVSNS_AVG[1:0]
SETTING
5 ms (default)
10 ms
00
01
10
11
50 ms
100 ms
Table 99. Load Diagnostic Mode
LDG_MODE
SETTING
0
1
Load Diagnostic Not Running
(default)
Run Load Diagnostic
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Table 100. Load Diagnostic Clock Source
LDG_CLK
SETTING
0
1
External TDM
Internal Oscillator (default)
8.4.8 Clocks and PLL
In TMD/I2C Mode, the device operates from SBCLK. Table 101 and Table 102 below shows the valid SBCLK
frequencies for each sample rate and SBCLK to FSYNC ratio (for 44.1 kHz and 48 kHz family frequencies
respectively.
If the sample rate is properly configured via the SAMP_RATE[1:0] bits, no additional configuration is required as
long as the SBCLK to FSYNC ratio is valid. The device will detect improper SBCLK frequencies and SBCLK to
FSYNC ratios and volume ramp down the playback path to minimize audible artifacts. After the clock error is
detected the device will enter a low power halt mode after CLK_HALT_TIMER if CLK_HALT_EN is enabled.
Additionally the device can automatically power up and down on valid clock signals if CLK_ERR_PWR_EN is set.
The device sampling rate should not be changed while this feature is enabled. Additionally, the CLK_HALT_EN
should be set when CLK_ERR_PWR_EN is set for this feature to work properly.
Table 101. Supported SBCLK Frequencies (48 kHz based sample rates)
SBCLK TO FSYNC RATIO
192
SAMPLE
RATE (kHz)
64
96
128
256
384
512
16 kHz
32 kHz
48 kHz
96 kHz
1.024 MHz
2.048 MHz
3.072 MHz
6.144 MHz
1.536 MHz
3.072 MHz
4.608 MHz
9.216 MHz
2.048 MHz
4.0960 MHz
6.144 MHz
12.288 MHz
3.072 MHz
6.144 MHz
9.216 MHz
18.432 MHz
4.096 MHz
8.192 MHz
12.288 MHz
24.576 MHz
6.144 MHz
12.288 MHz
18.432 MHz
-
8.192 MHz
16.384 MHz
24.576 MHz
-
Table 102. Supported SBCLK Frequencies (44.1 kHz based sample rates)
SBCLK TO FSYNC RATIO
SAMPLE
RATE (kHz)
64
96
128
192
256
384
512
14.7 kHz
29.4 kHz
44.1 kHz
88.2 kHz
940.8 kHz
1.8816 MHz
2.8224 MHz
5.6448 MHz
1.4112 MHz
2.8224 MHz
4.2336 MHz
8.4672 MHz
1.8816 MHz
3.7632 MHz
5.6448 MHz
11.2896 MHz
2.8224 MHz
5.6448 MHz
8.4672 MHz
16.9344 MHz
3.7632 MHz
7.5264 MHz
11.2896 MHz
22.5792 MHz
5.6448 MHz
11.2896 MHz
16.9344 MHz
-
7.5264 MHz
15.0528 MHz
22.5792 MHz
-
Table 103. Clock Power Up/Down on Valid ASI Clocks
CLK_ERR_PWR_EN
SETTING
Disabled (default)
Enabled
0
1
Table 104. Clock Halt(Sleep) After Errors Longer Than
Halt Timer
CLK_HALT_EN
SETTING
Enabled (default)
Disabled
0
1
Table 105. Clock Halt Timer
CLK_HALT_TIMER[2:0]
SETTING
1 ms
000
001
010
011
100
3.27 ms
26.21 ms
52.42 ms (default)
104.85 ms
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Table 105. Clock Halt Timer (continued)
CLK_HALT_TIMER[2:0]
SETTING
209.71 ms
419.43 ms
838.86 ms
101
110
111
8.4.9 Thermal Foldback
The TAS2564 monitors the die temperature and can automatically limit the audio signal when the die
temperature reaches a set threshold. It is recommended to use PurePath™ Console 3 Software to configure the
thermal foldback as the software will perform the necessary math for each register.
Thermal foldback can be disabled using TF_EN. If the die temperature reaches TF_TEMP_TH this feature will
begin to attenuate the audio signal to prevent the device from shutting down due to over-temperature. It will
attenuate the audio signal by TF_LIMS db per degree of temperature over TF_TEMP_TH. The thermal foldback
with attack at a fixed rate of 0.25 dB per sample. A maximum attenuation of TF_MAX_ATTN can be specified.
However if the device continue to heat up eventually the device over-temperature will be triggered. The
attenuation will be held for TF_HOLD_CNT samples before the attenuation will begin releasing.
Table 106. Thermal Foldback Enable
TF_EN
SETTING
Disabled
0
1
Enabled (default)
Table 107. Thermal Foldback Registers
REGISTER
DESCRIPTION
CALCULATION
TF_LIMS
Thermal foldback
limiter slope (in db/°C)
round(10^(-slope /
20)*2^31)
TF_HOLD_CNT
TF_REL_RATE
Thermal foldback hold round(seconds * 1000)
count (samples)
Thermal foldback
limiter release rate
(db/samples)
round(10^(dB per
sample / 20)*2^30)
TF_TEMP_TH
TF_MAX_ATTN
Thermal foldback
limiter temperature
threshold (°C)
round(°C * 2^23)
Thermal foldback max
gain reduction (dB)
round(10^(max attn
dB/20)*2^31)
8.4.10 Internal Tone Generator
The TAS2564 has two internal tone generators that can be used for pilot tone, ultrasonic tone, or diagnostic
purposes. It is recommended to use PurePath™ Console 3 Software to configure the tone generators as the
software will perform the necessary math for each register.
The frequency and amplitude or each generator can be set independently. Each tone generator is enabled using
TGx_EN and will soft-ramp to the level set by registers TGx_AMP if corresponding register TGx_SR is set. The
frequency using registers TGx_FREQ and amplitude using registers TGx_AMP. These amplitude and frequency
should be set only when the tone generator is disabled. Additionally the first tone-generator can be configured to
enable and disable the tone using a pin selected by TG1_PINEN pin. When enabled the pin will be logically
ORed with the TG1_EN register to play the tone. This can be used for audible diagnostic tones or other alerting
functions.
When the tone generator is configured to operate in pin-triggered mode, the sampling rate used in the TG1
equations should be 96 kHz. The range of frequencies that can be generated in this mode is 20 Hz to 38 kHz.
For ASI bus sample rates of 192 kHz the tone generator 1 and 2 will run only at 96 kHz and this sampling rate
should be used in the calculation. When not in pin trigger TG1 can generate tones up to fs/2.
The max frequency for tone generator 2 is based on the sampling rate and shown in Table 114.
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Table 108. Tone Generator Clock Source
TG_CLK
SETTING
0
1
External TDM (default)
Internal Oscillator
Table 109. Tone Generator 1 Enable
TG1_EN
TONE GENERATOR OUTPUT
00
01
10
11
disabled / pin trigger (default)
enabled - play tone always
audio level enabled
reserved
Table 110. Tone Generator 1 Pin Enable
TG1_PINEN[1:0]
TONE GENERATOR OUTPUT
disabled (default)
SDIN pin
00
01
10
11
MCLK pin
AD1 pin
Table 111. Tone Generator 1 Soft-Ramp
TG1_SR
SOFT RAMPUP
disabled
0
1
enabled (default)
The pilot tone frequency and amplitude can be programmed using the following register. The equations are used
to calculate the register settings for a given gain, frequency, and audio sampling rate.
fc = frequency of the tone
fs = sampling rate
TG1_FREQ1[1-4] = 2 * cos(2 * pi * fc / fs)
TG1_FREQ2[1-4] = sin(2 * pi * fc / fs)
TG1_FREQ3[1-4] = (lcm(fs,fc) / fc) - 1
TG1_AMP = 10 ^ (dB/20)
Equations for tone generator 2 are
TG2_FREQ1[1-4] = 2 * cos(2 * pi * fc / (n*fs))
TG2_FREQ2[1-4] = sin(2 * pi * fc / (n*fs))
TG2_FREQ3[1-4] = (lcm(n*fs,fc) / fc) - n
TG2_AMP = (10 ^ (dB/20)) / 4
Table 112. Tone Generator Defaults
REGISTER
DEFAULT VALUE
DEFAULT
REGISTERVALUE
TG1_FREQ1[1-4]
TG1_FREQ2[1-4]
TG1_FREQ3[1-4]
TG1_AMP
0
0x0000 0000
0x0000 0000
0x0000 0000
0x0147 AE14
0x0000 0000
0x0000 0000
0x0000 0000
0
0
-40 dBFS
TG2_FREQ1[1-4]
TG2_FREQ2[1-4]
TG2_FREQ3[1-4]
0
0
0
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Table 112. Tone Generator Defaults (continued)
REGISTER
DEFAULT VALUE
DEFAULT
REGISTERVALUE
TG2_AMP
-12 dBFS
0x2026 F310
Table 113. Tone Generator 2 Enable
TG2_EN
TONE GENERATOR OUTPUT
0
1
disabled (default)
enabled - play tone
Table 114. Tone Generator 2 n Value and Range
fs
n
MAX TONE
FREQUENCY
96 kHz
1
2
4
8
< fs /2
< fs
48 kHz, 32 kHz
24 kHz
< 2*fs
< 4 * fs
16 kHz, 8 kHz
Table 115. Tone Generator 2 Soft-Ramp
TG2_SR
SOFT RAMPUP
disabled
0
1
enabled (default)
8.5 Register Maps
8.5.1 Register Summary Table Page=0x00
Addr
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x18
0x19
Register
Description
Section
PAGE0
Device Page
PAGE0 (page=0x00 address=0x00) [reset=0h]
SW_RESET (page=0x00 address=0x01) [reset=1h]
PWR_CTL (page=0x00 address=0x02) [reset=8Eh]
PB_CFG1 (page=0x00 address=0x03) [reset=20h]
MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
TDM_CFG2 (page=0x00 address=0x08) [reset=Ah]
TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
TDM_DET (page=0x00 address=0x11) [reset=7Fh]
LIM_CFG_0 (page=0x00 address=0x12) [reset=12h]
LIM_CFG_1 (page=0x00 address=0x13) [reset=76h]
BOP_CFG_0 (page=0x00 address=0x14) [reset=1h]
BOP_CFG_1 (page=0x00 address=0x15) [reset=2Eh]
GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=Ch]
ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
SW_RESET
PWR_CTL
Software Reset
Power Control
PB_CFG1
Playback Configuration 1
Misc Configuration 1
MISC_CFG1
MISC_CFG2
TDM_CFG0
TDM_CFG1
TDM_CFG2
TDM_CFG3
TDM_CFG4
TDM_CFG5
TDM_CFG6
TDM_CFG7
TDM_CFG8
TDM_CFG9
TDM_CFG10
TDM_DET
Misc Configuration 2
TDM Configuration 0
TDM Configuration 1
TDM Configuration 2
TDM Configuration 3
TDM Configuration 4
TDM Configuration 5
TDM Configuration 6
TDM Configuration 7
TDM Configuration 8
TDM Configuration 9
TDM Configuration 10
TDM Clock detection monitor
Limiter Configuration 0
Limiter Configuration 1
Brown Out Prevention 0
Brown Out Prevention 1
Inter Chip Limiter Alignment 0
Inter Chip Limiter Alignment 1
LIM_CFG_0
LIM_CFG_1
BOP_CFG_0
BOP_CFG_1
GAIN_ICLA_CFG0
ICLA_CFG1
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Register Maps (continued)
0x1A
0x1B
0x1E
0x24
0x25
0x28
0x2A
0x2B
0x2C
0x30
0x31
0x32
0x33
0x34
0x35
0x3D
0x3F
0x40
0x41
0x42
0x43
0x44
0x48
0x7D
0x7E
0x7F
INT_MASK0
INT_MASK1
INT_MASK6
INT_LTCH0
INT_LTCH1
INT_LTCH6
VBAT_MSB
VBAT_LSB
TEMP
Interrupt Mask 0
INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
INT_MASK6 (page=0x00 address=0x1E) [reset=80h]
INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
INT_LTCH6 (page=0x00 address=0x28) [reset=0h]
VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
TEMP (page=0x00 address=0x2C) [reset=0h]
Interrupt Mask 1
Interrupt Mask 6- Interrupt masks.
Latched Interrupt Readback 0
Latched Interrupt Readback 1
Latched Interrupt Readback 6
SAR ADC Conversion 0
SAR ADC Conversion 1
SAR ADC Conversion 2
Interrupt and Clock Error
Digital Input Pin Pull Down
Misc Configuration 3
INT_CLK
INT_CLK (page=0x00 address=0x30) [reset=19h]
DIN_PD (page=0x00 address=0x31) [reset=40h]
MISC_CFG3 (page=0x00 address=0x32) [reset=80h]
BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
BOOST_CFG2 (page=0x00 address=0x34) [reset=40h]
BOOST_CFG3 (page=0x00 address=0x35) [reset=78h]
MISC_CFG4 (page=0x00 address=0x3D) [reset=8h]
TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
BOOST_CFG4 (page=0x00 address=0x40) [reset=79h]
TDM_CFG11 (page=0x00 address=0x41) [reset=48h]
IO_DRV1 (page=0x00 address=0x42) [reset=0h]
IO_DRV2 (page=0x00 address=0x43) [reset=0h]
IO_DRV3 (page=0x00 address=0x44) [reset=0h]
MISC_CFG5 (page=0x00 address=0x48) [reset=A0h]
REV_ID (page=0x00 address=0x7D) [reset=0h]
I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
BOOK (page=0x00 address=0x7F) [reset=0h]
DIN_PD
MISC_CFG3
BOOST_CFG1
BOOST_CFG2
BOOST_CFG3
MISC_CFG4
TG_CFG0
Boost Configure 1
Boost Configure 2
Boost Configure 3
Misc Configuration 4
Tone Generator
BOOST_CFG4
TDM_CFG11
IO_DRV1
Boost Configure 4
TDM Configuration 11
PAD drain strength control 1
PAD drain strength control 2
PAD drain strength control 3
Boost and Class-D Settings
Revision and PG ID
IO_DRV2
IO_DRV3
MISC_CFG5
REV_ID
I2C_CKSUM
BOOK
I2C Checksum
Device Book
8.5.2 Register Summary Table Page=0x01
Addr
0x00
0x08
0x24
Register
Description
Section
PAGE1
Device Page
PAGE1 (page=0x01 address=0x00) [reset=0h]
TF_CFG (page=0x01 address=0x08) [reset=0h]
LDG_CFG2 (page=0x01 address=0x24) [reset=0h]
TF_CFG
Thermal Folder Configure
Load Diagnostic 1
LDG_CFG2
8.5.3 Register Summary Table Page=0x02
Addr
0x00
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
Register
Description
Section
PAGE2
Device Page
PAGE2 (page=0x02 address=0x00) [reset=0h]
DVC_CFG1 (page=0x02 address=0x0C) [reset=40h]
DVC_CFG2 (page=0x02 address=0x0D) [reset=0h]
DVC_CFG3 (page=0x02 address=0x0E) [reset=0h]
DVC_CFG4 (page=0x02 address=0x0F) [reset=0h]
DVC_CFG5 (page=0x02 address=0x10) [reset=3h]
DVC_CFG6 (page=0x02 address=0x11) [reset=4Ah]
DVC_CFG7 (page=0x02 address=0x12) [reset=51h]
DVC_CFG8 (page=0x02 address=0x13) [reset=6Ch]
LIM_CFG1 (page=0x02 address=0x14) [reset=2Dh]
LIM_CFG2 (page=0x02 address=0x15) [reset=6Ah]
DVC_CFG1
DVC_CFG2
DVC_CFG3
DVC_CFG4
DVC_CFG5
DVC_CFG6
DVC_CFG7
DVC_CFG8
LIM_CFG1
LIM_CFG2
Digital Volume Control 1
Digital Volume Control 2
Digital Volume Control 3
Digital Volume Control 4
Digital Volume Control 5
Digital Volume Control 6
Digital Volume Control 7
Digital Volume Control 8
Limiter Configuration 1
Limiter Configuration 2- Sets limiter max
attenuation
0x16
0x17
0x18
LIM_CFG3
LIM_CFG4
LIM_CFG5
Limiter Configuration 3- Sets limiter max
attenuation
LIM_CFG3 (page=0x02 address=0x16) [reset=86h]
LIM_CFG4 (page=0x02 address=0x17) [reset=6Fh]
LIM_CFG5 (page=0x02 address=0x18) [reset=56h]
Limiter Configuration 4- Sets limiter max
attenuation
Limiter Configuration 5
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LIM_CFG6 (page=0x02 address=0x19) [reset=B7h]
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
0x41
0x42
0x43
0x44
0x45
0x46
0x47
0x48
0x49
0x4A
0x4B
0x5C
0x5D
0x5E
LIM_CFG6
LIM_CFG7
LIM_CFG8
LIM_CFG9
LIM_CFG10
LIM_CFG11
LIM_CFG12
LIM_CFG13
LIM_CFG14
LIM_CFG15
LIM_CFG16
LIM_CFG17
LIM_CFG18
LIM_CFG19
LIM_CFG20
BOP_CFG1
BOP_CFG2
BOP_CFG3
BOP_CFG4
BOP_CFG5
BOP_CFG6
BOP_CFG7
BOP_CFG8
HPFC_CFG1
HPFC_CFG2
HPFC_CFG3
HPFC_CFG4
HPFC_CFG5
HPFC_CFG6
HPFC_CFG7
HPFC_CFG8
HPFC_CFG9
HPFC_CFG10
HPFC_CFG11
HPFC_CFG12
TG_CFG1
Limiter Configuration 6
Limiter Configuration 7
LIM_CFG7 (page=0x02 address=0x1A) [reset=96h]
LIM_CFG8 (page=0x02 address=0x1B) [reset=FFh]
LIM_CFG9 (page=0x02 address=0x1C) [reset=16h]
LIM_CFG10 (page=0x02 address=0x1D) [reset=66h]
LIM_CFG11 (page=0x02 address=0x1E) [reset=66h]
LIM_CFG12 (page=0x02 address=0x1F) [reset=66h]
LIM_CFG13 (page=0x02 address=0x20) [reset=34h]
LIM_CFG14 (page=0x02 address=0x21) [reset=CCh]
LIM_CFG15 (page=0x02 address=0x22) [reset=CCh]
LIM_CFG16 (page=0x02 address=0x23) [reset=CDh]
LIM_CFG17 (page=0x02 address=0x24) [reset=10h]
LIM_CFG18 (page=0x02 address=0x25) [reset=0h]
LIM_CFG19 (page=0x02 address=0x26) [reset=0h]
LIM_CFG20 (page=0x02 address=0x27) [reset=0h]
BOP_CFG1 (page=0x02 address=0x28) [reset=2Eh]
BOP_CFG2 (page=0x02 address=0x29) [reset=66h]
BOP_CFG3 (page=0x02 address=0x2A) [reset=66h]
BOP_CFG4 (page=0x02 address=0x2B) [reset=66h]
BOP_CFG5 (page=0x02 address=0x2C) [reset=2Bh]
BOP_CFG6 (page=0x02 address=0x2D) [reset=33h]
BOP_CFG7 (page=0x02 address=0x2E) [reset=33h]
BOP_CFG8 (page=0x02 address=0x2F) [reset=33h]
HPFC_CFG1 (page=0x02 address=0x30) [reset=7Fh]
HPFC_CFG2 (page=0x02 address=0x31) [reset=FBh]
HPFC_CFG3 (page=0x02 address=0x32) [reset=B6h]
HPFC_CFG4 (page=0x02 address=0x33) [reset=14h]
HPFC_CFG5 (page=0x02 address=0x34) [reset=80h]
HPFC_CFG6 (page=0x02 address=0x35) [reset=4h]
HPFC_CFG7 (page=0x02 address=0x36) [reset=49h]
HPFC_CFG8 (page=0x02 address=0x37) [reset=ECh]
HPFC_CFG9 (page=0x02 address=0x38) [reset=7Fh]
HPFC_CFG10 (page=0x02 address=0x39) [reset=7Fh]
HPFC_CFG11 (page=0x02 address=0x3A) [reset=6Ch]
HPFC_CFG12 (page=0x02 address=0x3B) [reset=28h]
TG_CFG1 (page=0x02 address=0x3C) [reset=3Fh]
TG_CFG2 (page=0x02 address=0x3D) [reset=FFh]
TG_CFG3 (page=0x02 address=0x3E) [reset=7Ah]
TG_CFG4 (page=0x02 address=0x3F) [reset=E3h]
TG_CFG5 (page=0x02 address=0x40) [reset=1h]
TG_CFG6 (page=0x02 address=0x41) [reset=1h]
TG_CFG7 (page=0x02 address=0x42) [reset=5Bh]
TG_CFG8 (page=0x02 address=0x43) [reset=4Ch]
TG_CFG9 (page=0x02 address=0x44) [reset=0h]
TG_CFG10 (page=0x02 address=0x45) [reset=0h]
TG_CFG11 (page=0x02 address=0x46) [reset=3h]
TG_CFG12 (page=0x02 address=0x47) [reset=1Fh]
TG_CFG13 (page=0x02 address=0x48) [reset=2h]
TG_CFG14 (page=0x02 address=0x49) [reset=46h]
TG_CFG15 (page=0x02 address=0x4A) [reset=B4h]
TG_CFG16 (page=0x02 address=0x4B) [reset=E4h]
LD_CFG0 (page=0x02 address=0x5C) [reset=2h]
LD_CFG1 (page=0x02 address=0x5D) [reset=80h]
LD_CFG2 (page=0x02 address=0x5E) [reset=0h]
Limiter Configuration 8
Limiter Configuration 9
Limiter Configuration 10
Limiter Configuration 11
Limiter Configuration 12
Limiter Configuration 13
Limiter Configuration 14
Limiter Configuration 15
Limiter Configuration 16
Limiter Configuration 1
Limiter Configuration 2
Limiter Configuration 3
Limiter Configuration 4
Brown Out Prevention 1
Brown Out Prevention 2
Brown Out Prevention 3
Brown Out Prevention 4
Brown Out Prevention 5
Brown Out Prevention 6
Brown Out Prevention 7
Brown Out Prevention 8
HPF Coefficient 1
HPF Coefficient 2
HPF Coefficient 3
HPF Coefficient 4
HPF Coefficient 5
HPF Coefficient 6
HPF Coefficient 7
HPF Coefficient 8
HPF Coefficient 9
HPF Coefficient 10
HPF Coefficient 11
HPF Coefficient 12
Tone Generator 1 Freq Calc 1
Tone Generator 1 Freq Calc 1
Tone Generator 1 Freq Calc 1
Tone Generator 1 Freq Calc 1
Tone Generator 1 Freq Calc 2
Tone Generator 1 Freq Calc 2
Tone Generator 1 Freq Calc 2
Tone Generator 1 Freq Calc 2
Tone Generator 1 Freq Calc 3
Tone Generator 1 Freq Calc 3
Tone Generator 1 Freq Calc 3
Tone Generator 1 Freq Calc 3
Tone Generator 1 Amplitude Calc
Tone Generator 1 Amplitude Calc
Tone Generator 1 Amplitude Calc
Tone Generator 1 Amplitude Calc
Load Diagnostics Resistance Upper Threshold
Load Diagnostics Resistance Upper Threshold
Load Diagnostics Resistance Upper Threshold
TG_CFG2
TG_CFG3
TG_CFG4
TG_CFG5
TG_CFG6
TG_CFG7
TG_CFG8
TG_CFG9
TG_CFG10
TG_CFG11
TG_CFG12
TG_CFG13
TG_CFG14
TG_CFG15
TG_CFG16
LD_CFG0
LD_CFG1
LD_CFG2
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0x5F
0x60
0x61
0x62
0x63
0x64
0x65
0x66
0x67
0x68
0x69
0x6A
0x6B
0x6C
0x6D
0x6E
0x6F
0x70
0x71
0x72
0x73
0x74
0x75
0x76
0x77
0x78
0x79
0x7A
0x7B
0x7C
0x7D
0x7E
0x7F
LD_CFG3
Load Diagnostics Resistance Upper Threshold
Load Diagnostics Resistance Lower Threshold
Load Diagnostics Resistance Lower Threshold
Load Diagnostics Resistance Lower Threshold
Load Diagnostics Resistance Lower Threshold
Idle channel detection threshold
Idle channel detection threshold
Idle channel detection threshold
Idle channel detection threshold
MID Power Threshold
LD_CFG3 (page=0x02 address=0x5F) [reset=0h]
LD_CFG4 (page=0x02 address=0x60) [reset=0h]
LD_CFG5 (page=0x02 address=0x61) [reset=19h]
LD_CFG6 (page=0x02 address=0x62) [reset=99h]
LD_CFG7 (page=0x02 address=0x63) [reset=9Ah]
IDC_CFG0 (page=0x02 address=0x64) [reset=0h]
IDC_CFG1 (page=0x02 address=0x65) [reset=20h]
IDC_CFG2 (page=0x02 address=0x66) [reset=C4h]
IDC_CFG3 (page=0x02 address=0x67) [reset=9Ch]
IDC_CFG4 (page=0x02 address=0x68) [reset=2h]
IDC_CFG5 (page=0x02 address=0x69) [reset=46h]
IDC_CFG6 (page=0x02 address=0x6A) [reset=B4h]
IDC_CFG7 (page=0x02 address=0x6B) [reset=E4h]
IDC_CFG8 (page=0x02 address=0x6C) [reset=0h]
IDC_CFG9 (page=0x02 address=0x6D) [reset=0h]
IDC_CFG10 (page=0x02 address=0x6E) [reset=12h]
IDC_CFG11 (page=0x02 address=0x6F) [reset=C0h]
IVHPFC_CFG1 (page=0x02 address=0x70) [reset=7Fh]
IVHPFC_CFG2 (page=0x02 address=0x71) [reset=FBh]
IVHPFC_CFG3 (page=0x02 address=0x72) [reset=B6h]
IVHPFC_CFG4 (page=0x02 address=0x73) [reset=14h]
IVHPFC_CFG5 (page=0x02 address=0x74) [reset=80h]
IVHPFC_CFG6 (page=0x02 address=0x75) [reset=4h]
IVHPFC_CFG7 (page=0x02 address=0x76) [reset=49h]
IVHPFC_CFG8 (page=0x02 address=0x77) [reset=ECh]
IVHPFC_CFG9 (page=0x02 address=0x78) [reset=7Fh]
IVHPFC_CFG10 (page=0x02 address=0x79) [reset=F7h]
IVHPFC_CFG11 (page=0x02 address=0x7A) [reset=6Ch]
IVHPFC_CFG12 (page=0x02 address=0x7B) [reset=28h]
TF_CFG_1 (page=0x02 address=0x7C) [reset=72h]
TF_CFG_2 (page=0x02 address=0x7D) [reset=14h]
TF_CFG_3 (page=0x02 address=0x7E) [reset=82h]
TF_CFG_4 (page=0x02 address=0x7F) [reset=C0h]
LD_CFG4
LD_CFG5
LD_CFG6
LD_CFG7
IDC_CFG0
IDC_CFG1
IDC_CFG2
IDC_CFG3
IDC_CFG4
IDC_CFG5
MID Power Threshold
IDC_CFG6
MID Power Threshold
IDC_CFG7
MID Power Threshold
IDC_CFG8
Hystersis for idle channel detection
Hystersis for idle channel detection
Hystersis for idle channel detection
Hystersis for idle channel detection
IVSENSE HPF N0 coefficient
IDC_CFG9
IDC_CFG10
IDC_CFG11
IVHPFC_CFG1
IVHPFC_CFG2
IVHPFC_CFG3
IVHPFC_CFG4
IVHPFC_CFG5
IVHPFC_CFG6
IVHPFC_CFG7
IVHPFC_CFG8
IVHPFC_CFG9
IVHPFC_CFG10
IVHPFC_CFG11
IVHPFC_CFG12
TF_CFG_1
IVSENSE HPF N0 coefficient
IVSENSE HPF N0 coefficient
IVSENSE HPF N0 coefficient
IVSENSE HPF N1 coefficient
IVSENSE HPF N1 coefficient
IVSENSE HPF N1 coefficient
IVSENSE HPF N1 coefficient
IVSENSE HPF D1 coefficient
IVSENSE HPF D1 coefficient
IVSENSE HPF D1 coefficient
IVSENSE HPF D1 coefficient
Thermal foldback limiter slope (in db/C)
Thermal foldback limiter slope (in db/C)
Thermal foldback limiter slope (in db/C)
Thermal foldback limiter slope (in db/C)
TF_CFG_2
TF_CFG_3
TF_CFG_4
8.5.4 Register Summary Table Page=0x03
Addr
0x00
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
Register
Description
Section
PAGE3
Device Page
PAGE3 (page=0x03 address=0x00) [reset=0h]
DC_DET_THR1
DC_DET_THR2
DC_DET_THR3
DC_DET_THR4
DC_DET_HYST1
DC_DET_HYST2
DC_DET_HYST3
DC_DET_HYST4
CLS_H_CFG1
CLS_H_CFG2
CLS_H_CFG3
CLS_H_CFG4
CLS_H_CFG5
CLS_H_CFG6
CLS_H_CFG7
CLS_H_CFG8
DC detection threshold 1
DC detection threshold 2
DC detection threshold 3
DC detection threshold 4
DC detection hysteresis time 1
DC detection hysteresis time 2
DC detection hysteresis time 3
DC detection hysteresis time 4
ClassH
DC_DET_THR1 (page=0x03 address=0x1C) [reset=18h]
DC_DET_THR2 (page=0x03 address=0x1D) [reset=2Ah]
DC_DET_THR3 (page=0x03 address=0x1E) [reset=FFh]
DC_DET_THR4 (page=0x03 address=0x1F) [reset=53h]
DC_DET_HYST1 (page=0x03 address=0x20) [reset=0h]
DC_DET_HYST2 (page=0x03 address=0x21) [reset=0h]
DC_DET_HYST3 (page=0x03 address=0x22) [reset=27h]
DC_DET_HYST4 (page=0x03 address=0x23) [reset=10h]
CLS_H_CFG1 (page=0x03 address=0x24) [reset=Ah]
CLS_H_CFG2 (page=0x03 address=0x25) [reset=3Bh]
CLS_H_CFG3 (page=0x03 address=0x26) [reset=C7h]
CLS_H_CFG4 (page=0x03 address=0x27) [reset=DCh]
CLS_H_CFG5 (page=0x03 address=0x28) [reset=0h]
CLS_H_CFG6 (page=0x03 address=0x29) [reset=0h]
CLS_H_CFG7 (page=0x03 address=0x2A) [reset=0h]
CLS_H_CFG8 (page=0x03 address=0x2B) [reset=0h]
ClassH
ClassH
ClassH
ClassH
ClassH
ClassH
ClassH
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CLS_H_CFG9 (page=0x03 address=0x74) [reset=0h]
0x74
0x75
0x76
0x77
CLS_H_CFG9
CLS_H_CFG10
CLS_H_CFG11
CLS_H_CFG12
ClassH Minimum boost level in Voltage
ClassH Minimum boost level in Voltage
ClassH Minimum boost level in Voltage
ClassH Minimum boost level in Voltage
CLS_H_CFG10 (page=0x03 address=0x75) [reset=0h]
CLS_H_CFG11 (page=0x03 address=0x76) [reset=2h]
CLS_H_CFG12 (page=0x03 address=0x77) [reset=0h]
8.5.5 Register Summary Table Page=0x04
Addr
0x00
0x18
Register
Description
Section
PAGE4
Device Page
PAGE4 (page=0x04 address=0x00) [reset=0h]
LD_CFG8 (page=0x04 address=0x18) [reset=0h]
LD_CFG8
Load Resistance Value after load diagnostics
is completed
0x19
0x1A
0x1B
LD_CFG9
Load Resistance Value after load diagnostics
is completed
LD_CFG9 (page=0x04 address=0x19) [reset=0h]
LD_CFG10 (page=0x04 address=0x1A) [reset=0h]
LD_CFG11 (page=0x04 address=0x1B) [reset=0h]
LD_CFG10
LD_CFG11
Load Resistance Value after load diagnostics
is completed
Load Resistance Value after load diagnostics
is completed
0x58
0x59
0x5A
0x5B
0x5C
TF_CFG4
TF_CFG5
TF_CFG6
TF_CFG7
TF_CFG8
Thermal foldback hold count (samples)
Thermal foldback hold count (samples)
Thermal foldback hold count (samples)
Thermal foldback hold count (samples)
TF_CFG4 (page=0x04 address=0x58) [reset=0h]
TF_CFG5 (page=0x04 address=0x59) [reset=0h]
TF_CFG6 (page=0x04 address=0x5A) [reset=0h]
TF_CFG7 (page=0x04 address=0x5B) [reset=64h]
TF_CFG8 (page=0x04 address=0x5C) [reset=40h]
Thermal foldback limiter release rate
(db/samples)
0x5D
0x5E
0x5F
0x60
0x61
0x62
0x63
TF_CFG9
Thermal foldback limiter release rate
(db/samples)
TF_CFG9 (page=0x04 address=0x5D) [reset=BDh]
TF_CFG10 (page=0x04 address=0x5E) [reset=B7h]
TF_CFG11 (page=0x04 address=0x5F) [reset=B0h]
TF_CFG12 (page=0x04 address=0x60) [reset=39h]
TF_CFG13 (page=0x04 address=0x61) [reset=82h]
TF_CFG14 (page=0x04 address=0x62) [reset=60h]
TF_CFG16 (page=0x04 address=0x63) [reset=7Fh]
TF_CFG10
TF_CFG11
TF_CFG12
TF_CFG13
TF_CFG14
TF_CFG16
Thermal foldback limiter release rate
(db/samples)
Thermal foldback limiter release rate
(db/samples)
Thermal foldback limiter temperature
threshold
Thermal foldback limiter temperature
threshold
Thermal foldback limiter temperature
threshold
Thermal foldback limiter temperature
threshold
0x64
0x65
0x66
0x67
0x6C
0x6D
0x6E
0x6F
0x70
0x71
0x72
0x73
TF_CFG17
TF_CFG18
TF_CFG19
TF_CFG20
DVC_SR1
DVC_SR2
DVC_SR3
DVC_SR4
CD_CFG1
CD_CFG2
CD_CFG3
CD_CFG4
Thermal foldback max gain reduction (dB)
Thermal foldback max gain reduction (dB)
Thermal foldback max gain reduction (dB)
Thermal foldback max gain reduction (dB)
Volume Control slew rate for 16kHz fs
Volume Control slew rate for 16kHz fs
Volume Control slew rate for 16kHz fs
Volume Control slew rate for 16kHz fs
Class D gain
TF_CFG17 (page=0x04 address=0x64) [reset=2Dh]
TF_CFG18 (page=0x04 address=0x65) [reset=6Ah]
TF_CFG19 (page=0x04 address=0x66) [reset=86h]
TF_CFG20 (page=0x04 address=0x67) [reset=6Fh]
DVC_SR1 (page=0x04 address=0x6C) [reset=2h]
DVC_SR2 (page=0x04 address=0x6D) [reset=79h]
DVC_SR3 (page=0x04 address=0x6E) [reset=CAh]
DVC_SR4 (page=0x04 address=0x6F) [reset=5Eh]
CD_CFG1 (page=0x04 address=0x70) [reset=56h]
CD_CFG2 (page=0x04 address=0x71) [reset=B7h]
CD_CFG3 (page=0x04 address=0x72) [reset=96h]
CD_CFG4 (page=0x04 address=0x73) [reset=FFh]
Class D gain
Class D gain
Class D gain
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8.5.6 PAGE0 (page=0x00 address=0x00) [reset=0h]
The device's memory map is divided into pages and books. This register sets the page.
Table 116. Device Page Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PAGE[7:0]
RW
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.5.7 SW_RESET (page=0x00 address=0x01) [reset=1h]
Asserting Software Reset will place all register values in their default POR (Power on Reset) state.
Table 117. Software Reset Field Descriptions
Bit
7-1
0
Field
Type
R
Reset
0h
Description
Reserved
SW_RESET
Reserved
RW
1h
Software reset. Bit is self clearing.
0b = Don't reset
1b = Reset
8.5.8 PWR_CTL (page=0x00 address=0x02) [reset=8Eh]
Sets device's mode of operation and power down of IV sense blocks.
Table 118. Power Control Field Descriptions
Bit
Field
Type
Reset
Description
7
VSNS2_PD
RW
1h
Voltage sense power down.
0b = voltage sense is active
1b = Voltage sense is powered down
6
LDG_MODE
RW
0h
Load Diagnostic is
0b = Not Running
1b = Running (self clearing)
5
4
3
Reserved
Reserved
ISNS_PD
RW
RW
RW
0h
0h
1h
Reserved
Reserved
Current sense power down.
0b = Current sense active
1b = Current sense is powered down
2
VSNS_PD
MODE[1:0]
RW
RW
1h
2h
Voltage sense power down.
0b = voltage sense is active
1b = Voltage sense is powered down
1-0
Device operational mode.
00b = Active
01b = Mute
10b = Software Shutdown
11b = Load Diagnostics
8.5.9 PB_CFG1 (page=0x00 address=0x03) [reset=20h]
Sets playback high pass filter corner (PCM playback only).
Table 119. Playback Configuration 1 Field Descriptions
Bit
Field
Type
Reset
Description
7
RX_SPKR_mode
RW
0h
Register write option for the device to go into Low Noise mode
0b = SPKR Mode [Normal Mode, 17.5 dB]
1b = RX Mode [Low Noise Mode, 5.8 dB]
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Table 119. Playback Configuration 1 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6
HPF_EN
RW
0h
Disable DC Blocker
0b = Enabled
1b = Disabled
5-1
AMP_LEVEL[4:0]
RW
10h
1Dh-1Fh - Reserved
01h = 10.0 dBV (4.58 Vpk)
02h = 10.5 dBV (4.85 Vpk)
03h = 11.0 dBV (5.13 Vpk)
04h = 11.5 dBV (5.44 Vpk)
05h = 12.0 dBV (5.76 Vpk)
06h = 12.5 dBV (6.1 Vpk)
07h = 13.0 dBV (6.46 Vpk)
08h = 13.5 dBV (6.85 Vpk)
09h = 14.0 dBV (7.25 Vpk)
0Ah = 14.5 dBV (7.68 Vpk)
0Bh = 15.0 dBV (8.14 Vpk)
0Ch = 15.5 dBV (8.62 Vpk)
0Dh = 16.0 dBV (9.13 Vpk)
0Eh = 16.5 dBV (9.67 Vpk)
0Fh = 17.0 dBV (10.25 Vpk)
10h = 17.5 dBV (10.85 Vpk)
11h = 18.0 dBV (11.5 Vpk)
12h = 18.5 dBV (12.18 Vpk)
13h = 19.0 dBV (12.9 Vpk)
14h = 19.5 dBV (13.66 Vpk)
15h = 20.0 dBV (14.47 Vpk)
16h = 20.5 dBV (15.33 Vpk)
17h = 21.0 dBV (16.24 Vpk)
18h = 21.5 dBV (17.2 Vpk)
19h = 22.0 dBV (18.22 Vpk)
1Ah = 22.5 dBV (19.3 Vpk)
1Bh = 23.0 dBV (20.44 Vpk)
1Ch = 23.5 dBV (21.65 Vpk)
1Dh-1Fh - Reserved
0
Reserved
RW
0h
Reserved
8.5.10 MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
Sets OTE/OCE retry, IRQZ pull up, and amp spread spectrum.
Table 120. Misc Configuration 1 Field Descriptions
Bit
7
Field
Type
RW
RW
RW
Reset
1h
Description
Reserved
Reserved
Reserved
Reserved
OCE_RETRY
6
1h
5
0h
Retry after over current event.
0b = Do not retry
1b = Retry after 1.5 s
4
3
OTE_RETRY
IRQZ_PU
AMP_SS
RW
RW
RW
RW
0h
0h
1h
2h
Retry after over temperature event.
0b = Do not retry
1b = Retry after 1.5 s
IRQZ internal pull up enable.
0b = Disabled
1b = Enabled
2
Low EMI spread spectrum enable.
0b = Disabled
1b = Enabled
1-0
Reserved
Reserved
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8.5.11 MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
Set shutdown, VBAT filter, and I2C options.
Table 121. Misc Configuration 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
SDZ_MODE[1:0]
RW
0h
SDZ Mode configuration.
00b = Initiates normal shutdown; force shutdown after timeout
01b = Immediate force shutdown
10b = Normal shutdown only
11b = Reserved
5-4
SDZ_TIMEOUT[1:0]
RW
2h
SDZ Timeout value
00b = 2 ms
01b = 4 ms
10b = 6 ms
11b = 23.8 ms
3
2
Reserved
RW
RW
0h
0h
Reserved
VBAT_FLT
VBAT filter into SAR ADC.
0b = 100kHz cut off
1b = Bypass
1
0
I2C_GBL_EN
I2C_AD_DET
RW
RW
1h
0h
I2C global address is
0b = Disabled
1b = Enabled
Re-detect I2C slave address (self clearing bit).
0b = normal
1b = Re-detect address
8.5.12 TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
Sets the TDM frame start, TDM sample rate, TDM auto rate detection and whether rate is based on 44.1 kHz or
48 kHz frequency.
Table 122. TDM Configuration 0 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
CLASSD_SYNC
Reserved
6
RW
0h
Class-D synchronization mode.
0b = Not synchronized to audio clocks
1b = Synchronized to audio clocks
5
RAMP_RATE
RW
0h
Sample rate based on 44.1kHz or 48kHz when
CLASSD_SYNC=1.
0b = 48kHz
1b = 44.1kHz
4
AUTO_RATE
RW
RW
0h
4h
Auto detection of TDM sample rate.
0b = Enabled
1b = Disabled
3-1
SAMP_RATE[2:0]
Sample rate of the TDM bus.
000b = Reserved
001b = 14.7/16 kHz
010b = 22.05/24 kHz
011b = 29.4/32 kHz
100b = 44.1/48 kHz
101b = 88.2/96 kHz
110b = 176.4/192 kHz
111b = Reserved
0
FRAME_START
RW
1h
TDM frame start polarity.
0b = Low to High on FSYNC
1b = High to Low on FSYNC
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8.5.13 TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
Sets TDM RX justification, offset and capture edge.
Table 123. TDM Configuration 1 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
RX_JUSTIFY
Reserved
6
RW
0h
TDM RX sample justification within the time slot.
0b = Left
1b = Right
5-1
0
RX_OFFSET[4:0]
RX_EDGE
RW
RW
1h
0h
TDM RX start of frame to time slot 0 offset (SBCLK cycles).
TDM RX capture clock polarity.
0b = Rising edge of SBCLK
1b = Falling edge of SBCLK
8.5.14 TDM_CFG2 (page=0x00 address=0x08) [reset=Ah]
Sets TDM RX time slot select, word length and time slot length.
Table 124. TDM Configuration 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
IVMON_LEN[1:0]
RW
0h
Sets the current and voltage data to length of
00b = 16 bits
01b = 12 bits
10b = 8 bits
11b = Reserved
5-4
3-2
1-0
RX_SCFG[1:0]
RX_WLEN[1:0]
RX_SLEN[1:0]
RW
RW
RW
0h
2h
2h
TDM RX time slot select config.
00b = Mono with time slot equal to I2C address offset
01b = Mono left channel
10b = Mono right channel
11b = Stereo downmix (L+R)/2
TDM RX word length.
00b = 16-bits
01b = 20-bits
10b = 24-bits
11b = 32-bits
TDM RX time slot length.
00b = 16-bits
01b = 24-bits
10b = 32-bits
11b = Reserved
8.5.15 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
Sets TDM RX left and right time slots.
Table 125. TDM Configuration 3 Field Descriptions
Bit
7-4
3-0
Field
Type
RW
Reset
1h
Description
RX_SLOT_R[3:0]
RX_SLOT_L[3:0]
TDM RX Right Channel Time Slot.
TDM RX Left Channel Time Slot.
RW
0h
8.5.16 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
Sets TDM TX bus keeper, fill, offset and transmit edge.
Table 126. TDM Configuration 4 Field Descriptions
Bit
Field
Type
Reset
Description
7
TX_KEEPCY
RW
0h
TDM TX SDOUT LSB data will be driven for
0b = full-cycle
1b = half-cycle
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Table 126. TDM Configuration 4 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6
TX_KEEPLN
RW
0h
TDM TX SDOUT will hold the bus for the following when
TX_KEEPEN is enabled
0b = 1 LSB cycle
1b = always
5
4
TX_KEEPEN
TX_FILL
RW
RW
0h
1h
TDM TX SDOUT bus keeper enable.
0b = Disable bus keeper
1b = Enable bus keeper
TDM TX SDOUT unused bitfield fill.
0b = Transmit 0
1b = Transmit Hi-Z
3-1
0
TX_OFFSET[2:0]
TX_EDGE
RW
RW
1h
1h
TDM TX start of frame to time slot 0 offset.
TDM TX launch clock polarity.
0b = Rising edge of SBCLK
1b = Falling edge of SBCLK
8.5.17 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
Sets TDM TX V-Sense time slot and enable.
Table 127. TDM Configuration 5 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
VSNS_TX
Reserved
6
RW
0h
TDM TX voltage sense transmit enable.
0b = Disabled
1b = Enabled
5-0
VSNS_SLOT[5:0]
RW
2h
TDM TX voltage sense time slot.
8.5.18 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
Sets TDM TX I-Sense time slot and enable.
Table 128. TDM Configuration 6 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
ISNS_TX
Reserved
6
RW
0h
TDM TX current sense transmit enable.
0b = Disabled
1b = Enabled
5-0
ISNS_SLOT[5:0]
RW
0h
TDM TX current sense time slot.
8.5.19 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
Sets TDM TX VBAT time slot and enable.
Table 129. TDM Configuration 7 Field Descriptions
Bit
Field
Type
Reset
Description
7
VBAT_SLEN
RW
0h
TDM TX VBAT time slot length.
0b = Truncate to 8-bits
1b = Left justify to 16-bits
6
VBAT_TX
RW
RW
0h
4h
TDM TX VBAT transmit enable.
0b = Disabled
1b = Enabled
5-0
VBAT_SLOT[5:0]
TDM TX VBAT time slot.
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8.5.20 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
Sets TDM TX temp time slot and enable.
Table 130. TDM Configuration 8 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
TEMP_TX
Reserved
6
RW
0h
TDM TX temp sensor transmit enable.
0b = Disabled
1b = Enabled
5-0
TEMP_SLOT[5:0]
RW
5h
TDM TX temp sensor time slot.
8.5.21 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
Sets ICLA bus, TDM TX limiter gain reduction time slot and enable.
Table 131. TDM Configuration 9 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
GAIN_TX
Reserved
6
RW
0h
TDM TX limiter gain reduction transmit enable.
0b = Disabled
1b = Enabled
5-0
GAIN_SLOT[5:0]
RW
6h
TDM TX limiter gain reduction time slot.
8.5.22 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
Sets boost current limiter slot and enable
Table 132. TDM Configuration 10 Field Descriptions
Bit
Field
Type
Reset
Description
7
BST_TX
RW
0h
TDM TX boost current limiter enable.
0b = Disabled
1b = Enabled
6
BST_SYNC_TX
BST_SLOT[5:0]
RW
RW
0h
7h
TDM TX boost clock sync enable.
0b = Disabled
1b = Enabled
5-0
TDM TX boost sync and current limit time slot.
8.5.23 TDM_DET (page=0x00 address=0x11) [reset=7Fh]
Readback of internal auto-rate detection.
Table 133. TDM Clock detection monitor Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
FS_RATIO[3:0]
Reserved
6-3
R
Fh
Detected SBCLK to FSYNC ratio.
00h = 16
01h = 24
02h = 32
03h = 48
04h = 64
05h = 96
06h = 128
07h = 192
08h = 256
09h = 384
0Ah = 512
0Bh-0Eh = Reserved
0F = Invalid ratio
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Table 133. TDM Clock detection monitor Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2-0
FS_RATE[2:0]
R
7h
Detected sample rate of TDM bus.
000b = Reserved
001b = 14.7/16 KHz
010b = 22.05/24 KHz
011b = 29.4/32 KHz
100b = 44.1/48 KHz
101b = 88.2/96 kHz
110b = 176.4/192 kHz
111b = Error condition
8.5.24 LIM_CFG_0 (page=0x00 address=0x12) [reset=12h]
Sets Limiter attack step size, attack rate and enable.
Table 134. Limiter Configuration 0 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
Reserved
6
VBAT_LIM_TH_SELECTION
RW
0h
Select source of threshold for VBAT based limiting
0b = User configured Thresholds
1b = PVDD based thresholds
5-4
3-1
LIMB_ATK_ST[1:0]
LIMB_ATK_RT[2:0]
RW
RW
1h
1h
VBAT Limiter/ICLA attack step size.
00b = 0.25 dB
01b = 0.5 dB
10b = 1 dB
11b = 2 dB
VBAT Limiter/ICLA attack rate.
000b = 1 step in 1 sample
001b = 1 step in 2 samples
010b = 1 step in 4 samples
011b = 1 step in 8 samples
100b = 1 step in 16 samples
101b = 1 step in 32 samples
110b = 1 step in 64 samples
111b = 1 step in 128 samples
0
LIMB_EN
RW
0h
Limiter enable.
0b = Disabled
1b = Enabled
8.5.25 LIM_CFG_1 (page=0x00 address=0x13) [reset=76h]
Sets VBAT limiter release step size, release rate and hold time.
Table 135. Limiter Configuration 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
LIMB_RLS_ST[1:0]
RW
1h
VBAT Limiter/BOP/ICLA release step size.
00b = 0.25 dB
01b = 0.5 dB
10b = 1 dB
11b = 2 dB
5-3
LIMB_RLS_RT[2:0]
RW
6h
VBAT Limiter/BOP/ICLA release rate.
000b = 1 step in 10 samples
001b = 1 step in 20 samples
010b = 1 step in 40 samples
011b = 1 step in 80 samples
100b = 1 step in 160 samples
101b = 1 step in 320 samples
110b = 1 step in 640 samples
111b = 1 step in 1280 samples
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Table 135. Limiter Configuration 1 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2-0
LIMB_HLD_TM[2:0]
RW
6h
VBAT Limiter hold time in samples.
000b = 0 samples
001b = 1920 samples
010b = 4800 samples
011b = 9600 samples
100b = 19200 samples
101b = 48000 samples
110b = 96000 samples
111b = 192000 samples
8.5.26 BOP_CFG_0 (page=0x00 address=0x14) [reset=1h]
Sets BOP infinite hold clear, infinite hold enable, mute on brown out and enable.
Table 136. Brown Out Prevention 0 Field Descriptions
Bit
7-5
4
Field
Type
R
Reset
0h
Description
Reserved
BOSD_EN
Reserved
RW
0h
Brown out prevention shutdown enable.
0b = Disabled
1b = Enabled
3
2
1
0
BOP_HLD_CLR
BOP_INF_HLD
BOP_MUTE
BOP_EN
RW
RW
RW
RW
0h
0h
0h
1h
BOP infinite hold clear (self clearing).
0b = Don't clear
1b = Clear
Infinite hold on brown out event.
0b = Use BOP_HLD_TM after brown out event
1b = Don't release until BOP_HLD_CLR is asserted high
Mute on brown out event.
0b = Don't mute
1b = Mute followed by device shutdown
Brown out prevention enable.
0b = Disabled
1b = Enabled
8.5.27 BOP_CFG_1 (page=0x00 address=0x15) [reset=2Eh]
BOP attack rate, attack step size and hold time.
Table 137. Brown Out Prevention 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-5
BOP_ATK_RT[2:0]
RW
1h
Brown out prevention attack rate.
000b = 1 step in 1 sample
001b = 1 step in 2 samples
010b = 1 step in 4 samples
011b = 1 step in 8 samples
100b = 1 step in 16 samples
101b = 1 step in 32 samples
110b = 1 step in 64 samples
111b = 1 step in 128 samples
4-3
BOP_ATK_ST[1:0]
RW
1h
Brown out prevention attack step size.
00b = 0.5 dB
01b = 1 dB
10b = 1.5 dB
11b = 2 dB
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Table 137. Brown Out Prevention 1 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2-0
BOP_HLD_TM[2:0]
RW
6h
Brown out prevention hold time.
000b = 0 samples
001b = 1920 samples
010b = 4800 samples
011b = 9600 samples
100b = 19200 samples
101b = 48000 samples
110b = 96000 samples
111b = 192000 samples
8.5.28 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=Ch]
ICLA starting time slot and enable.
Table 138. Inter Chip Limiter Alignment 0 Field Descriptions
Bit
7
Field
Type
Reset
0h
Description
Reserved
Reserved
R
6-1
0
ICLA_GAIN_SLOT[5:0]
ICLA_GAIN_EN
RW
RW
6h
0h
Inter chip limiter alignment gain starting time slot.
Inter chip limiter alignment gain enable.
0b = Disabled
1b = Enabled
8.5.29 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
ICLA time slot enables.
Table 139. Inter Chip Limiter Alignment 1 Field Descriptions
Bit
Field
Type
Reset
Description
7
ICLA_GAIN_SEN[3]
RW
0h
Time slot equals ICLA_GAIN_SLOT[5:0]+3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
6
5
4
ICLA_GAIN_SEN[2]
ICLA_GAIN_SEN[1]
ICLA_GAIN_SEN[0]
RW
RW
RW
0h
0h
0h
Time slot equals ICLA_GAIN_SLOT[5:0]+2. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
Time slot equals ICLA_GAIN_SLOT[5:0]+1. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
Time slot equals ICLA_GAIN_SLOT[5:0]+0. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
3
2
1
0
Reserved
Reserved
Reserved
Reserved
RW
RW
RW
RW
0h
0h
0h
0h
Reserved
Reserved
Reserved
Reserved
8.5.30 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
Interrupt masks.
Table 140. Interrupt Mask 0 Field Descriptions
Bit
Field
Type
Reset
Description
7
INT_MASK[7]
RW
1h
Limiter mute mask.
0b = Don't Mask
1b = Mask
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Table 140. Interrupt Mask 0 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6
INT_MASK[6]
RW
1h
Limiter infinite hold mask.
0b = Don't Mask
1b = Mask
5
4
3
2
1
0
INT_MASK[5]
INT_MASK[4]
INT_MASK[3]
INT_MASK[2]
INT_MASK[1]
INT_MASK[0]
RW
RW
RW
RW
RW
RW
1h
1h
1h
1h
0h
0h
Limiter max attenuation mask.
0b = Don't Mask
1b = Mask
VBAT below limiter inflection point mask.
0b = Don't Mask
1b = Mask
Limiter active mask.
0b = Don't Mask
1b = Mask
TDM clock error mask.
0b = Don't Mask
1b = Mask
Over current error mask.
0b = Don't Mask
1b = Mask
Over temp error mask.
0b = Don't Mask
1b = Mask
8.5.31 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
Interrupt masks.
Table 141. Interrupt Mask 1 Field Descriptions
Bit
7
Field
Type
RW
RW
RW
Reset
1h
Description
Reserved
Reserved
Reserved
Reserved
INT_MASK[13]
6
0h
5
1h
Load Diagnostic Completion Mask
0b = Don't Mask
1b = Masked
4-3
INT_MASK[12_11]
RW
0h
Speaker open load mask
00b = Don't Mask
01b = Mask open Load detection
10b = Mask Short Load detection
11b = Mask both Open,Short Load detection
2
1
0
INT_MASK[10]
INT_MASK[9]
INT_MASK[8]
RW
RW
RW
1h
1h
0h
Brownout device power down start mask
0b = Don't Mask
1b = Mask
Brownout Protection Active mask
0b = Don't Mask
1b = Mask
VBAT Brown out detected mask
0b = Don't Mask
1b = Mask
8.5.32 INT_MASK6 (page=0x00 address=0x1E) [reset=80h]
Interrupt Mask 6- Interrupt masks.
Table 142. Interrupt Mask 6- Interrupt masks. Field Descriptions
Bit
Field
Type
Reset
Description
7
INT_MASK6[7]
RW
1h
DSP DC detect flag mask
0b = Don't Mask
1b = Mask
6
Reserved
R
0h
Reserved
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Table 142. Interrupt Mask 6- Interrupt masks. Field Descriptions (continued)
Bit
5
Field
Type
R
Reset
0h
Description
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
4
R
0h
3
R
0h
2
R
0h
1
R
0h
0
R
0h
8.5.33 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
Latched interrupt readback.
Table 143. Latched Interrupt Readback 0 Field Descriptions
Bit
Field
Type
Reset
Description
7
INT_LTCH0[7]
R
0h
Interrupt due to limiter mute.
0b = No interrupt
1b = Interrupt
6
5
4
3
2
1
0
INT_LTCH0[6]
INT_LTCH0[5]
INT_LTCH0[4]
INT_LTCH0[3]
INT_LTCH0[2]
INT_LTCH0[1]
INT_LTCH0[0]
R
R
R
R
R
R
R
0h
0h
0h
0h
0h
0h
0h
Interrupt due to limiter infinite hold.
0b = No interrupt
1b = Interrupt
Interrupt due to limiter max attenuation.
0b = No interrupt
1b = Interrupt
Interrupt due to VBAT below limiter inflection point.
0b = No interrupt
1b = Interrupt
Interrupt due to limiter active
0b = No interrupt
1b = Interrupt
Interrupt due to TDM clock error
0b = No interrupt
1b = Interrupt
Interrupt due to over current error
0b = No interrupt
1b = Interrupt
Interrupt due to over temp error
0b = No interrupt
1b = Interrupt
8.5.34 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
Latched interrupt readback.
Table 144. Latched Interrupt Readback 1 Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
Reserved
Reserved
Reserved
INT_LTCH1[5]
6
R
0h
5
R
0h
Interrupt due to load diagnostic completion.
0b = Not completed
1b = Completed
4-3
2
INT_LTCH1[4_3]
INT_LTCH1[2]
R
R
0h
0h
Interrupt due to Load Diagnostic Mode Fault Status.
00b = Normal Load
01b = Open Load Detected
10b = Short Load Detected
11b = Reserved
Interrupt due to Brownout Protection Triggered shutdown.
0b = No interrupt
1b = Interrupt
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Table 144. Latched Interrupt Readback 1 Field Descriptions (continued)
Bit
Field
Type
Reset
Description
1
INT_LTCH1[1]
R
0h
Interrupt due to Brownout Protection Active flag.
0b = No interrupt
1b = Interrupt
0
INT_LTCH1[0]
R
0h
Interrupt due to VBAT brown out detected flag.
0b = No interrupt
1b = Interrupt
8.5.35 INT_LTCH6 (page=0x00 address=0x28) [reset=0h]
Latched interrupt readback.
Table 145. Latched Interrupt Readback 6 Field Descriptions
Bit
Field
Type
Reset
Description
7
INT_LTCH6[7]
R
0h
Interrupt due to DSP DC detect flag
0b = No interrupt
1b = Interrupt
6
5
4
3
2
1
0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
R
R
R
R
R
R
R
0h
0h
0h
0h
0h
0h
0h
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
8.5.36 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
MSBs of SAR ADC VBAT conversion.
Table 146. SAR ADC Conversion 0 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
VBAT_CNV_MEMRD[9:2]
R
0h
Returns SAR ADC VBAT conversion MSBs.
8.5.37 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
LSBs of SAR ADC VBAT conversion.
Table 147. SAR ADC Conversion 1 Field Descriptions
Bit
7-6
5-0
Field
Type
R
Reset
0h
Description
VBAT_CNV_MEMRD[1:0]
Reserved
Returns SAR ADC VBAT conversion LSBs.
Reserved
R
0h
8.5.38 TEMP (page=0x00 address=0x2C) [reset=0h]
SARD ADC Temp conversion.
Table 148. SAR ADC Conversion 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TMP_CNV_MEMRD[7:0]
R
0h
Returns SAR ADC temp sensor conversion.
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8.5.39 INT_CLK (page=0x00 address=0x30) [reset=19h]
Sets ASI clock error handeling and interrupt configuration.
Table 149. Interrupt and Clock Error Field Descriptions
Bit
Field
Type
Reset
Description
7
CLK_ERR_PWR_EN
RW
0h
Power up/down based on valid ASI clocks is
0b = Disable
1b = Enabled
6
CLK_HALT_EN
RW
RW
0h
3h
Put device to sleep(halt) after clock error lasts longer than
CLK_HALT_TIMER is
0b = Enable
1b = Disable
5-3
CLK_HALT_TIMER[2:0]
If CLK_HALT_EN device will goto sleep after
000b = 1 ms
001b = 3.27 ms
010b = 26.21ms
011b = 52.42ms
100b = 104.85ms
101b = 209.71ms
110b = 419.43ms
111b = 838.86ms
2
INT_CLR_LTCH
RW
RW
0h
1h
Clear INT_LTCH registers
0b = Don't clear
1b = Clear (self clearing bit)
1-0
IRQZ_PIN_CFG[1:0]
IRQZ interrupt configuration. IRQZ will assert
00b = on any unmasked live interrupts
01b = on any unmasked latched interrupts
10b = for 2-4ms one time on any unmasked live interrupt event
11b = for 2-4ms every 4ms on any unmasked latched interrupts
8.5.40 DIN_PD (page=0x00 address=0x31) [reset=40h]
Sets enables of input pin weak pull down.
Table 150. Digital Input Pin Pull Down Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
Reserved
Reserved
Reserved
DIN_PD[5]
6
RW
RW
1h
5
0h
Weak pull down for AD1.
0b = Disabled
1b = Enabled
4
3
2
1
0
DIN_PD[4]
DIN_PD[3]
DIN_PD[2]
DIN_PD[1]
DIN_PD[0]
RW
RW
RW
RW
RW
0h
0h
0h
0h
0h
Weak pull down for AD0.
0b = Disabled
1b = Enabled
Weak pull down for SDOUT.
0b = Disabled
1b = Enabled
Weak pull down for SDIN.
0b = Disabled
1b = Enabled
Weak pull down for FSYNC.
0b = Disabled
1b = Enabled
Weak pull down for SBCLK.
0b = Disabled
1b = Enabled
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8.5.41 MISC_CFG3 (page=0x00 address=0x32) [reset=80h]
Set IRQZ pin active state
Table 151. Misc Configuration 3 Field Descriptions
Bit
Field
Type
Reset
Description
7
IRQZ_POL
RW
1h
IRQZ pin polarity for interrupt.
0b = Active high (IRQ)
1b = Active low (IRQZ)
6-4
3-2
1
Reserved
Reserved
Reserved
Reserved
RW
R
0h
0h
0h
0h
Reserved
Reserved
Reserved
Reserved
RW
R
0
8.5.42 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
Boost Configure 1
Table 152. Boost Configure 1 Field Descriptions
Bit
7
Field
Type
RW
Reset
0h
Description
BST_MODE
BST_MODE
Boost Mode
6
RW
0h
Boost Mode
00b = Class-H
01b = Class-G
10b = Always ON
11b = Always OFF(Passthrough)
5
BST_EN
RW
1h
Boost enable
0b = Disabled
1b = Enabled
4-3
2-1
Reserved
RW
RW
2h
2h
Reserved
BST_PFML[1:0]
Boost active mode PFM lower limit
00b = No lower limit
01b = 25 kHz
10b = 50 kHz
11b = 100 kHz
0
Reserved
RW
0h
Reserved
8.5.43 BOOST_CFG2 (page=0x00 address=0x34) [reset=40h]
Boost Configure 2
Table 153. Boost Configure 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
BST_IR[1:0]
RW
1h
Boost inductor range
00b = less than 0.6 uH
01b = 0.6 uH to 1.3 uH
10b = 1.3 uH to 2.5 uH
11b = Reserved
5
4
Reserved
Reserved
Reserved
RW
RW
R
0h
0h
0h
Reserved
Reserved
Reserved
3-0
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8.5.44 BOOST_CFG3 (page=0x00 address=0x35) [reset=78h]
Boost Configure 3
Table 154. Boost Configure 3 Field Descriptions
Bit
7-4
3-2
Field
Type
RW
Reset
7h
Description
Reserved
BST_LR[1:0]
Reserved
RW
2h
Slope of boost load regulation
00b = 4.4 A/V, load regulation = 0.914 V
01b = 3.67 A/V, load regulation = 1.095 V
10b = 2.93 A/V, load regulation = 1.37 V
11b = 1.95 A/V, load regulation = 2.056 V
1
0
Reserved
Reserved
RW
R
0h
0h
Reserved
Reserved
8.5.45 MISC_CFG4 (page=0x00 address=0x3D) [reset=8h]
Tone gen clocking, load diagnostic clocking, VI averaging.
Table 155. Misc Configuration 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-4
Reserved
R
0h
Clock source for tone generator beep mode
0b = External TDM
1b = Internal Oscillator
3
LDG_CLK
RW
RW
0h
1h
Clock source for load diagnostic
0b = External TDM
1b = Internal Oscillator
2-1
IVSNS_AVG[1:0]
Duration of Averaging done by the firmware on V/I data
00b = 5ms
01b = 10ms
10b = 50ms
11b = 100ms
0
Reserved
RW
0h
Reserved
8.5.46 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
Tone Generator
Table 156. Tone Generator Field Descriptions
Bit
Field
Type
Reset
Description
7-6
TG1_EN[1:0]
RW
0h
Tone Generator 1 is
00b = Disabled or pin triggered
01b = Enabled - play tone
10b = audio level enabled
11b = Reserved
5-4
TG1_PINEN[1:0]
RW
0h
Tone pin trigger
00b = Disabled
01b = SDIN
10b = Reserved
11b = AD1
3
TG2_EN
RW
R
0h
0h
Tone Generator 2 is
0b = Disabled
1b = Enabled
2-0
Reserved
Reserved
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8.5.47 BOOST_CFG4 (page=0x00 address=0x40) [reset=79h]
Boost Configure 4
Table 157. Boost Configure 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-6
BST_SSL[1:0]
RW
1h
Boost Soft Start Current Limit
00b = Disabled- no limit
01b = 1.2A
10b = 1.83A
11b = 2.44A
5-0
BST_ILIM[5:0]
RW
39h
Boost peak current limit
00h = 1.206 A
01h = 1.273 A
02h = 1.340 A
...
0x3Dh = 5.293 A
0x3Eh = 5.36 A
0x3Fh = 5.427A
8.5.48 TDM_CFG11 (page=0x00 address=0x41) [reset=48h]
Sets VSNS2 slot, enable and slot width
Table 158. TDM Configuration 11 Field Descriptions
Bit
Field
Type
Reset
Description
7
vsns2_tx
RW
0h
TDM TX VSNS2 transmit enable.
0b = Disabled
1b = Enabled
6
vsns2_slen
RW
RW
1h
8h
TDM TX VSNS2 time slot length.
0b = Truncate to 8-bits
1b = Left justify to 16-bits
5-0
vsns2_slot[5:0]
TDM TX VSNS2 time slot.
8.5.49 IO_DRV1 (page=0x00 address=0x42) [reset=0h]
PAD drain strength control 1
Table 159. PAD drain strength control 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
bclk_ds[7:0]
RW
0h
Drain strength control register for AD1 pad
2b00 = 2mA drive setting
2b01 = 4mA drive setting
2b10 = 6mA drive setting
2b11 = 8mA drive setting
8.5.50 IO_DRV2 (page=0x00 address=0x43) [reset=0h]
PAD drain strength control 2
Table 160. PAD drain strength control 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
dout_ds[7:0]
RW
0h
Drain strength control register for SDZ pad
2b00 = 2mA drive setting
2b01 = 4mA drive setting
2b10 = 6mA drive setting
2b11 = 8mA drive setting
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8.5.51 IO_DRV3 (page=0x00 address=0x44) [reset=0h]
PAD drain strength control 3
Table 161. PAD drain strength control 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
sda_ds[7:0]
RW
0h
Reserved
8.5.52 MISC_CFG5 (page=0x00 address=0x48) [reset=A0h]
Boost and Class-D Settings
Table 162. Boost and Class-D Settings Field Descriptions
Bit
Field
Type
Reset
Description
7-3
BST_VREG[4:0]
RW
14h
Boost Maximum Voltage (Default 12.5V)
00000b - 00110 = RESERVED
00111b = 6V
01000b = 6.5V
01001b = 7V
.....
10110b = 13.5V
10111b - 11111b = RESERVED
2
1
0
Reserved
Reserved
Reserved
RW
RW
RW
0h
0h
0h
Reserved
Reserved
Reserved
8.5.53 REV_ID (page=0x00 address=0x7D) [reset=0h]
Returns REV and PG ID.
Table 163. Revision and PG ID Field Descriptions
Bit
7-4
3-0
Field
Type
R
Reset
0h
Description
REV_ID[3:0]
PG_ID[3:0]
Returns the revision ID.
Returns the PG ID.
R
0h
8.5.54 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
Returns I2C checksum.
Table 164. I2C Checksum Field Descriptions
Bit
Field
Type
Reset
Description
7-0
I2C_CKSUM[7:0]
RW
0h
Returns I2C checksum. Writing to this register will reset the
checksum to the written value. This register is updated on writes
to other registers on all books and pages.
8.5.55 BOOK (page=0x00 address=0x7F) [reset=0h]
Device's memory map is divided into pages and books. This register sets the book.
Table 165. Device Book Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOOK[7:0]
RW
0h
Sets the device book.
00h = Book 0
01h = Book 1
...
FFh = Book 255
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8.5.56 PAGE1 (page=0x01 address=0x00) [reset=0h]
Device Page
Table 166. Device Page Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PAGE[7:0]
RW
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.5.57 TF_CFG (page=0x01 address=0x08) [reset=0h]
Set the enable for thermal foldback
Table 167. Thermal Folder Configure Field Descriptions
Bit
7
Field
Type
R
Reset
0h
Description
Reserved
TF_EN
Reserved
6
RW
0h
Thermal Foldback is
0 = Disabled
1 = Enabled
5-0
Reserved
RW
0h
Reserved
8.5.58 LDG_CFG2 (page=0x01 address=0x24) [reset=0h]
Set number of iternations
Table 168. Load Diagnostic 1 Field Descriptions
Bit
7-4
3-0
Field
Type
R
Reset
0h
Description
Reserved
LDG_ITRC[3:0]
Reserved
RW
0h
Iterations of Load diagnostic mode
0000b = One time
0001b = Two times
0010b = Three times
...
1111b = Sixteen times
8.5.59 PAGE2 (page=0x02 address=0x00) [reset=0h]
The device's memory map is divided into pages and books. This register sets the page.
Table 169. Device Page Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PAGE[7:0]
RW
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.5.60 DVC_CFG1 (page=0x02 address=0x0C) [reset=40h]
Sets playback volume for PCM playback path.
Table 170. Digital Volume Control 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_PCM[31:24]
RW
40h
round(10^(volume in dB/20)*2^30)
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8.5.61 DVC_CFG2 (page=0x02 address=0x0D) [reset=0h]
Sets playback volume for PCM playback path.
Table 171. Digital Volume Control 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_PCM[23:16]
RW
0h
round(10^(volume in dB/20)*2^30)
8.5.62 DVC_CFG3 (page=0x02 address=0x0E) [reset=0h]
Sets playback volume for PCM playback path.
Table 172. Digital Volume Control 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_PCM[15:8]
RW
0h
round(10^(volume in dB/20)*2^30)
8.5.63 DVC_CFG4 (page=0x02 address=0x0F) [reset=0h]
Sets playback volume for PCM playback path.
Table 173. Digital Volume Control 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_PCM[7:0]
RW
0h
round(10^(volume in dB/20)*2^30)
8.5.64 DVC_CFG5 (page=0x02 address=0x10) [reset=3h]
Sets ramp rate for volume control
Table 174. Digital Volume Control 5 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_RAMP[31:24]
RW
3h
round((1-exp(-1/(0.2*fs*time in seconds)))*2^31)
8.5.65 DVC_CFG6 (page=0x02 address=0x11) [reset=4Ah]
Sets ramp rate for volume control
Table 175. Digital Volume Control 6 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_RAMP[23:16]
RW
4Ah
round((1-exp(-1/(0.2*fs*time in seconds)))*2^31)
8.5.66 DVC_CFG7 (page=0x02 address=0x12) [reset=51h]
Sets ramp rate for volume control
Table 176. Digital Volume Control 7 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_RAMP[15:8]
RW
51h
round((1-exp(-1/(0.2*fs*time in seconds)))*2^31)
8.5.67 DVC_CFG8 (page=0x02 address=0x13) [reset=6Ch]
Sets ramp rate for volume control
Table 177. Digital Volume Control 8 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_RAMP[7:0]
RW
6Ch
round((1-exp(-1/(0.2*fs*time in seconds)))*2^31)
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8.5.68 LIM_CFG1 (page=0x02 address=0x14) [reset=2Dh]
Sets limiter max attenuation
Table 178. Limiter Configuration 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIM_MAX_ATN[31:24]
RW
2Dh
round(10^(max attn dB/20)*2^31)
8.5.69 LIM_CFG2 (page=0x02 address=0x15) [reset=6Ah]
Limiter Configuration 2- Sets limiter max attenuation
Table 179. Limiter Configuration 2- Sets limiter max attenuation Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIM_MAX_ATN[23:16]
RW
6Ah
round(10^(max attn dB/20)*2^31)
8.5.70 LIM_CFG3 (page=0x02 address=0x16) [reset=86h]
Limiter Configuration 3- Sets limiter max attenuation
Table 180. Limiter Configuration 3- Sets limiter max attenuation Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIM_MAX_ATN[15:8]
RW
86h
round(10^(max attn dB/20)*2^31)
8.5.71 LIM_CFG4 (page=0x02 address=0x17) [reset=6Fh]
Limiter Configuration 4- Sets limiter max attenuation
Table 181. Limiter Configuration 4- Sets limiter max attenuation Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIM_MAX_ATN[7:0]
RW
6Fh
round(10^(max attn dB/20)*2^31)
8.5.72 LIM_CFG5 (page=0x02 address=0x18) [reset=56h]
Sets VBAT Limiter max threshold.
Table 182. Limiter Configuration 5 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MAX[31:24]
RW
56h
round(lim max peak voltage*2^27)
8.5.73 LIM_CFG6 (page=0x02 address=0x19) [reset=B7h]
Sets VBAT Limiter max threshold.
Table 183. Limiter Configuration 6 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MAX[23:16]
RW
B7h
round(lim max peak voltage*2^27)
8.5.74 LIM_CFG7 (page=0x02 address=0x1A) [reset=96h]
Sets VBAT Limiter max threshold.
Table 184. Limiter Configuration 7 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MAX[15:8]
RW
96h
round(lim max peak voltage*2^27)
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8.5.75 LIM_CFG8 (page=0x02 address=0x1B) [reset=FFh]
Sets VBAT Limiter max threshold.
Table 185. Limiter Configuration 8 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MAX[7:0]
RW
FFh
round(lim max peak voltage*2^27)
8.5.76 LIM_CFG9 (page=0x02 address=0x1C) [reset=16h]
Sets VBAT limiter min threshold.
Table 186. Limiter Configuration 9 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MIN[31:24]
RW
16h
round(lim min peak voltage*2^27)
8.5.77 LIM_CFG10 (page=0x02 address=0x1D) [reset=66h]
Sets VBAT limiter min threshold.
Table 187. Limiter Configuration 10 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MIN[23:16]
RW
66h
round(lim min peak voltage*2^27)
8.5.78 LIM_CFG11 (page=0x02 address=0x1E) [reset=66h]
Sets VBAT limiter min threshold.
Table 188. Limiter Configuration 11 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MIN[15:8]
RW
66h
round(lim min peak voltage*2^27)
8.5.79 LIM_CFG12 (page=0x02 address=0x1F) [reset=66h]
Sets VBAT limiter min threshold.
Table 189. Limiter Configuration 12 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_TH_MIN[7:0]
RW
66h
round(lim min peak voltage*2^27)
8.5.80 LIM_CFG13 (page=0x02 address=0x20) [reset=34h]
Sets VBAT limiter inflection point.
Table 190. Limiter Configuration 13 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_INF_PT[31:24]
RW
34h
round(Vbat at inflection point*2^28)
8.5.81 LIM_CFG14 (page=0x02 address=0x21) [reset=CCh]
Sets VBAT limiter inflection point.
Table 191. Limiter Configuration 14 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_INF_PT[23:16]
RW
CCh
round(Vbat at inflection point*2^28)
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8.5.82 LIM_CFG15 (page=0x02 address=0x22) [reset=CCh]
Sets VBAT limiter inflection point.
Table 192. Limiter Configuration 15 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_INF_PT[15:8]
RW
CCh
round(Vbat at inflection point*2^28)
8.5.83 LIM_CFG16 (page=0x02 address=0x23) [reset=CDh]
Sets VBAT limiter inflection point.
Table 193. Limiter Configuration 16 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_INF_PT[7:0]
RW
CDh
round(Vbat at inflection point*2^28)
8.5.84 LIM_CFG17 (page=0x02 address=0x24) [reset=10h]
Sets VBAT limiter slope
Table 194. Limiter Configuration 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_SLOPE[31:24]
RW
10h
round(slope*2^28)
8.5.85 LIM_CFG18 (page=0x02 address=0x25) [reset=0h]
Sets VBAT limiter slope
Table 195. Limiter Configuration 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_SLOPE[23:16]
RW
0h
round(slope*2^28)
8.5.86 LIM_CFG19 (page=0x02 address=0x26) [reset=0h]
Sets VBAT limiter slope
Table 196. Limiter Configuration 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_SLOPE[15:8]
RW
0h
round(slope*2^28)
8.5.87 LIM_CFG20 (page=0x02 address=0x27) [reset=0h]
Sets VBAT limiter slope
Table 197. Limiter Configuration 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LIMB_SLOPE[7:0]
RW
0h
round(slope*2^28)
8.5.88 BOP_CFG1 (page=0x02 address=0x28) [reset=2Eh]
BOP threshold.
Table 198. Brown Out Prevention 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOP_TH[31:24]
RW
2Eh
round(Vbat BOP threshold*2^28)
78
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8.5.89 BOP_CFG2 (page=0x02 address=0x29) [reset=66h]
BOP threshold.
Table 199. Brown Out Prevention 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOP_TH[23:16]
RW
66h
round(Vbat BOP threshold*2^28)
8.5.90 BOP_CFG3 (page=0x02 address=0x2A) [reset=66h]
BOP threshold.
Table 200. Brown Out Prevention 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOP_TH[15:8]
RW
66h
round(Vbat BOP threshold*2^28)
8.5.91 BOP_CFG4 (page=0x02 address=0x2B) [reset=66h]
BOP threshold.
Table 201. Brown Out Prevention 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOP_TH[7:0]
RW
66h
round(Vbat BOP threshold*2^28)
8.5.92 BOP_CFG5 (page=0x02 address=0x2C) [reset=2Bh]
BOSD threshold.
Table 202. Brown Out Prevention 5 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOSD_TH[31:24]
RW
2Bh
round(Vbat BOSD threshold*2^28)
8.5.93 BOP_CFG6 (page=0x02 address=0x2D) [reset=33h]
BOSD threshold.
Table 203. Brown Out Prevention 6 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOSD_TH[23:16]
RW
33h
round(Vbat BOSD threshold*2^28)
8.5.94 BOP_CFG7 (page=0x02 address=0x2E) [reset=33h]
BOSD threshold.
Table 204. Brown Out Prevention 7 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOSD_TH[15:8]
RW
33h
round(Vbat BOSD threshold*2^28)
8.5.95 BOP_CFG8 (page=0x02 address=0x2F) [reset=33h]
BOSD threshold.
Table 205. Brown Out Prevention 8 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BOSD_TH[7:0]
RW
33h
round(Vbat BOSD threshold*2^28)
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8.5.96 HPFC_CFG1 (page=0x02 address=0x30) [reset=7Fh]
HPF Biquad coefficients
Table 206. HPF Coefficient 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N0[31:24]
RW
7Fh
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.97 HPFC_CFG2 (page=0x02 address=0x31) [reset=FBh]
HPF Biquad coefficients
Table 207. HPF Coefficient 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N0[23:16]
RW
FBh
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.98 HPFC_CFG3 (page=0x02 address=0x32) [reset=B6h]
HPF Biquad coefficients
Table 208. HPF Coefficient 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N0[15:8]
RW
B6h
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.99 HPFC_CFG4 (page=0x02 address=0x33) [reset=14h]
HPF Biquad coefficients
Table 209. HPF Coefficient 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N0[7:0]
RW
14h
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.100 HPFC_CFG5 (page=0x02 address=0x34) [reset=80h]
HPF Biquad coefficients
Table 210. HPF Coefficient 5 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N1[31:24]
RW
80h
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.101 HPFC_CFG6 (page=0x02 address=0x35) [reset=4h]
HPF Biquad coefficients
Table 211. HPF Coefficient 6 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N1[23:16]
RW
4h
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.102 HPFC_CFG7 (page=0x02 address=0x36) [reset=49h]
HPF Biquad coefficients
Table 212. HPF Coefficient 7 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N1[15:8]
RW
49h
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
80
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8.5.103 HPFC_CFG8 (page=0x02 address=0x37) [reset=ECh]
HPF Biquad coefficients
Table 213. HPF Coefficient 8 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_N1[7:0]
RW
ECh
[N, D] = butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.104 HPFC_CFG9 (page=0x02 address=0x38) [reset=7Fh]
HPF Biquad coefficients
Table 214. HPF Coefficient 9 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_D1[31:24]
RW
7Fh
[N, D] = butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
8.5.105 HPFC_CFG10 (page=0x02 address=0x39) [reset=7Fh]
HPF Biquad coefficients
Table 215. HPF Coefficient 10 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_D1[23:16]
RW
7Fh
[N, D] = butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
8.5.106 HPFC_CFG11 (page=0x02 address=0x3A) [reset=6Ch]
HPF Biquad coefficients
Table 216. HPF Coefficient 11 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_D1[15:8]
RW
6Ch
[N, D] = butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
8.5.107 HPFC_CFG12 (page=0x02 address=0x3B) [reset=28h]
HPF Biquad coefficients
Table 217. HPF Coefficient 12 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
HPF_COEFF_D1[7:0]
RW
28h
[N, D] = butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
8.5.108 TG_CFG1 (page=0x02 address=0x3C) [reset=3Fh]
Tone Generator 1 Freq Calc 1
Table 218. Tone Generator 1 Freq Calc 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ1[31:24]
RW
3Fh
round((2*cos(2*pi*f_tone/fs))*2^29)
8.5.109 TG_CFG2 (page=0x02 address=0x3D) [reset=FFh]
Tone Generator 1 Freq Calc 1
Table 219. Tone Generator 1 Freq Calc 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ1[23:16]
RW
FFh
round((2*cos(2*pi*f_tone/fs))*2^29)
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8.5.110 TG_CFG3 (page=0x02 address=0x3E) [reset=7Ah]
Tone Generator 1 Freq Calc 1
Table 220. Tone Generator 1 Freq Calc 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ1[15:8]
RW
7Ah
round((2*cos(2*pi*f_tone/fs))*2^29)
8.5.111 TG_CFG4 (page=0x02 address=0x3F) [reset=E3h]
Tone Generator 1 Freq Calc 1
Table 221. Tone Generator 1 Freq Calc 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ1[7:0]
RW
E3h
round((2*cos(2*pi*f_tone/fs))*2^29)
8.5.112 TG_CFG5 (page=0x02 address=0x40) [reset=1h]
Tone Generator 1 Freq Calc 2
Table 222. Tone Generator 1 Freq Calc 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ2[31:24]
RW
1h
round((sin(2*pi*f_tone/fs))*2^31)
8.5.113 TG_CFG6 (page=0x02 address=0x41) [reset=1h]
Tone Generator 1 Freq Calc 2
Table 223. Tone Generator 1 Freq Calc 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ2[23:16]
RW
1h
round((sin(2*pi*f_tone/fs))*2^31)
8.5.114 TG_CFG7 (page=0x02 address=0x42) [reset=5Bh]
Tone Generator 1 Freq Calc 2
Table 224. Tone Generator 1 Freq Calc 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ2[15:8]
RW
5Bh
round((sin(2*pi*f_tone/fs))*2^31)
8.5.115 TG_CFG8 (page=0x02 address=0x43) [reset=4Ch]
Tone Generator 1 Freq Calc 2
Table 225. Tone Generator 1 Freq Calc 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ2[7:0]
RW
4Ch
round((sin(2*pi*f_tone/fs))*2^31)
8.5.116 TG_CFG9 (page=0x02 address=0x44) [reset=0h]
Tone Generator 1 Freq Calc 3
Table 226. Tone Generator 1 Freq Calc 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ3[31:24]
RW
0h
(LCM(fs,f_tone)/f_tone) - 1
82
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8.5.117 TG_CFG10 (page=0x02 address=0x45) [reset=0h]
Tone Generator 1 Freq Calc 3
Table 227. Tone Generator 1 Freq Calc 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ3[23:16]
RW
0h
(LCM(fs,f_tone)/f_tone) - 1
8.5.118 TG_CFG11 (page=0x02 address=0x46) [reset=3h]
Tone Generator 1 Freq Calc 3
Table 228. Tone Generator 1 Freq Calc 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ3[15:8]
RW
3h
(LCM(fs,f_tone)/f_tone) - 1
8.5.119 TG_CFG12 (page=0x02 address=0x47) [reset=1Fh]
Tone Generator 1 Freq Calc 3
Table 229. Tone Generator 1 Freq Calc 3 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_FREQ3[7:0]
RW
1Fh
(LCM(fs,f_tone)/f_tone) - 1
8.5.120 TG_CFG13 (page=0x02 address=0x48) [reset=2h]
Tone Generator 1 Amplitude Calc
Table 230. Tone Generator 1 Amplitude Calc Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_AMP[31:24]
RW
2h
round(10^(tone amplitude dB/20)*2^31)
8.5.121 TG_CFG14 (page=0x02 address=0x49) [reset=46h]
Tone Generator 1 Amplitude Calc
Table 231. Tone Generator 1 Amplitude Calc Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_AMP[23:16]
RW
46h
round(10^(tone amplitude dB/20)*2^31)
8.5.122 TG_CFG15 (page=0x02 address=0x4A) [reset=B4h]
Tone Generator 1 Amplitude Calc
Table 232. Tone Generator 1 Amplitude Calc Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_AMP[15:8]
RW
B4h
round(10^(tone amplitude dB/20)*2^31)
8.5.123 TG_CFG16 (page=0x02 address=0x4B) [reset=E4h]
Tone Generator 1 Amplitude Calc
Table 233. Tone Generator 1 Amplitude Calc Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TG1_AMP[7:0]
RW
E4h
round(10^(tone amplitude dB/20)*2^31)
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8.5.124 LD_CFG0 (page=0x02 address=0x5C) [reset=2h]
Load Diagnostics Resistance Upper Threshold
Table 234. Load Diagnostics Resistance Upper Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[31:24]
RW
2h
round((ohm/4.2424)*2^22)
8.5.125 LD_CFG1 (page=0x02 address=0x5D) [reset=80h]
Load Diagnostics Resistance Upper Threshold
Table 235. Load Diagnostics Resistance Upper Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[23:16]
RW
80h
round((ohm/4.2424)*2^22)
8.5.126 LD_CFG2 (page=0x02 address=0x5E) [reset=0h]
Load Diagnostics Resistance Upper Threshold
Table 236. Load Diagnostics Resistance Upper Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[15:8]
RW
0h
round((ohm/4.2424)*2^22)
8.5.127 LD_CFG3 (page=0x02 address=0x5F) [reset=0h]
Load Diagnostics Resistance Upper Threshold
Table 237. Load Diagnostics Resistance Upper Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[7:0]
RW
0h
round((ohm/4.2424)*2^22)
8.5.128 LD_CFG4 (page=0x02 address=0x60) [reset=0h]
Load Diagnostics Resistance Lower Threshold
Table 238. Load Diagnostics Resistance Lower Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[31:24]
RW
0h
round((ohm/4.2424)*2^22)
8.5.129 LD_CFG5 (page=0x02 address=0x61) [reset=19h]
Load Diagnostics Resistance Lower Threshold
Table 239. Load Diagnostics Resistance Lower Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[23:16]
RW
19h
round((ohm/4.2424)*2^22)
8.5.130 LD_CFG6 (page=0x02 address=0x62) [reset=99h]
Load Diagnostics Resistance Lower Threshold
Table 240. Load Diagnostics Resistance Lower Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[15:8]
RW
99h
round((ohm/4.2424)*2^22)
84
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8.5.131 LD_CFG7 (page=0x02 address=0x63) [reset=9Ah]
Load Diagnostics Resistance Lower Threshold
Table 241. Load Diagnostics Resistance Lower Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[7:0]
RW
9Ah
round((ohm/4.2424)*2^22)
8.5.132 IDC_CFG0 (page=0x02 address=0x64) [reset=0h]
Idle channel detection threshold
Table 242. Idle channel detection threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_DTH[31:24]
RW
0h
round(10^(idle channel threshold dB/20)*2^31)
8.5.133 IDC_CFG1 (page=0x02 address=0x65) [reset=20h]
Idle channel detection threshold
Table 243. Idle channel detection threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_DTH[23:16]
RW
20h
round(10^(idle channel threshold dB/20)*2^31)
8.5.134 IDC_CFG2 (page=0x02 address=0x66) [reset=C4h]
Idle channel detection threshold
Table 244. Idle channel detection threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_DTH[15:8]
RW
C4h
round(10^(idle channel threshold dB/20)*2^31)
8.5.135 IDC_CFG3 (page=0x02 address=0x67) [reset=9Ch]
Idle channel detection threshold
Table 245. Idle channel detection threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_DTH[7:0]
RW
9Ch
round(10^(idle channel threshold dB/20)*2^31)
8.5.136 IDC_CFG4 (page=0x02 address=0x68) [reset=2h]
MID Power Threshold
Table 246. MID Power Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_MTH[31:24]
RW
2h
round(10^(mid power mode threshold dB/20)*2^31)
8.5.137 IDC_CFG5 (page=0x02 address=0x69) [reset=46h]
MID Power Threshold
Table 247. MID Power Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_MTH[23:16]
RW
46h
round(10^(mid power mode threshold dB/20)*2^31)
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8.5.138 IDC_CFG6 (page=0x02 address=0x6A) [reset=B4h]
MID Power Threshold
Table 248. MID Power Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_MTH[15:8]
RW
B4h
round(10^(mid power mode threshold dB/20)*2^31)
8.5.139 IDC_CFG7 (page=0x02 address=0x6B) [reset=E4h]
MID Power Threshold
Table 249. MID Power Threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_MTH[7:0]
RW
E4h
round(10^(mid power mode threshold dB/20)*2^31)
8.5.140 IDC_CFG8 (page=0x02 address=0x6C) [reset=0h]
Hystersis for idle channel detection
Table 250. Hystersis for idle channel detection Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_HYST[31:24]
RW
0h
round(time in seconds*fs)
8.5.141 IDC_CFG9 (page=0x02 address=0x6D) [reset=0h]
Hystersis for idle channel detection
Table 251. Hystersis for idle channel detection Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_HYST[23:16]
RW
0h
round(time in seconds*fs)
8.5.142 IDC_CFG10 (page=0x02 address=0x6E) [reset=12h]
Hystersis for idle channel detection
Table 252. Hystersis for idle channel detection Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_HYST[15:8]
RW
12h
round(time in seconds*fs)
8.5.143 IDC_CFG11 (page=0x02 address=0x6F) [reset=C0h]
Hystersis for idle channel detection
Table 253. Hystersis for idle channel detection Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IDC_HYST[7:0]
RW
C0h
round(time in seconds*fs)
8.5.144 IVHPFC_CFG1 (page=0x02 address=0x70) [reset=7Fh]
IVSENSE HPF N0 coefficient
Table 254. IVSENSE HPF N0 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N0[31:24]
RW
7Fh
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
86
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8.5.145 IVHPFC_CFG2 (page=0x02 address=0x71) [reset=FBh]
IVSENSE HPF N0 coefficient
Table 255. IVSENSE HPF N0 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N0[23:16]
RW
FBh
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.146 IVHPFC_CFG3 (page=0x02 address=0x72) [reset=B6h]
IVSENSE HPF N0 coefficient
Table 256. IVSENSE HPF N0 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N0[15:8]
RW
B6h
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.147 IVHPFC_CFG4 (page=0x02 address=0x73) [reset=14h]
IVSENSE HPF N0 coefficient
Table 257. IVSENSE HPF N0 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N0[7:0]
RW
14h
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(1)*2^31);
8.5.148 IVHPFC_CFG5 (page=0x02 address=0x74) [reset=80h]
IVSENSE HPF N1 coefficient
Table 258. IVSENSE HPF N1 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N1[31:24]
RW
80h
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.149 IVHPFC_CFG6 (page=0x02 address=0x75) [reset=4h]
IVSENSE HPF N1 coefficient
Table 259. IVSENSE HPF N1 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N1[23:16]
RW
4h
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.150 IVHPFC_CFG7 (page=0x02 address=0x76) [reset=49h]
IVSENSE HPF N1 coefficient
Table 260. IVSENSE HPF N1 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N1[15:8]
RW
49h
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
8.5.151 IVHPFC_CFG8 (page=0x02 address=0x77) [reset=ECh]
IVSENSE HPF N1 coefficient
Table 261. IVSENSE HPF N1 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_N1[7:0]
RW
ECh
[N, D] - butter(1, fc/(fs/2), 'high'); round(N(2)*2^31);
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8.5.152 IVHPFC_CFG9 (page=0x02 address=0x78) [reset=7Fh]
IVSENSE HPF D1 coefficient
Table 262. IVSENSE HPF D1 coefficient Field Descriptions
Bit
Field
Type
Reset
Description
7-0
IVHPF_D1[31:24]
RW
7Fh
[N, D] - butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
8.5.153 IVHPFC_CFG10 (page=0x02 address=0x79) [reset=F7h]
IVSENSE HPF D1 coefficient
Table 263. IVSENSE HPF D1 coefficient Field Descriptions
Bit
Field
Type
RW
Reset
F7h
Description
[N, D] - butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
7-0
IVHPF_D1[23:16]
8.5.154 IVHPFC_CFG11 (page=0x02 address=0x7A) [reset=6Ch]
IVSENSE HPF D1 coefficient
Table 264. IVSENSE HPF D1 coefficient Field Descriptions
Bit
Field
Type
RW
Reset
6Ch
Description
[N, D] - butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
7-0
IVHPF_D1[15:8]
8.5.155 IVHPFC_CFG12 (page=0x02 address=0x7B) [reset=28h]
IVSENSE HPF D1 coefficient
Table 265. IVSENSE HPF D1 coefficient Field Descriptions
Bit
Field
Type
RW
Reset
28h
Description
[N, D] - butter(1, fc/(fs/2), 'high'); round(-D(2)*2^31);
7-0
IVHPF_D1[7:0]
8.5.156 TF_CFG_1 (page=0x02 address=0x7C) [reset=72h]
Thermal foldback limiter slope (in db/C)
Table 266. Thermal foldback limiter slope (in db/C) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[31:24]
RW
72h
round(10^(-slope/20)*2^31)
8.5.157 TF_CFG_2 (page=0x02 address=0x7D) [reset=14h]
Thermal foldback limiter slope (in db/C)
Table 267. Thermal foldback limiter slope (in db/C) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[23:16]
RW
14h
round(10^(-slope/20)*2^31)
8.5.158 TF_CFG_3 (page=0x02 address=0x7E) [reset=82h]
Thermal foldback limiter slope (in db/C)
Table 268. Thermal foldback limiter slope (in db/C) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[15:8]
RW
82h
round(10^(-slope/20)*2^31)
88
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8.5.159 TF_CFG_4 (page=0x02 address=0x7F) [reset=C0h]
Thermal foldback limiter slope (in db/C)
Table 269. Thermal foldback limiter slope (in db/C) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[7:0]
RW
C0h
round(10^(-slope/20)*2^31)
8.5.160 PAGE3 (page=0x03 address=0x00) [reset=0h]
The device's memory map is divided into pages and books. This register sets the page.
Table 270. Device Page Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PAGE[7:0]
RW
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.5.161 DC_DET_THR1 (page=0x03 address=0x1C) [reset=18h]
Forward path DC detection threshold.
Table 271. DC detection threshold 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DC_DET_THR[31:24]
RW
18h
round(dc_det_th*2^31)
8.5.162 DC_DET_THR2 (page=0x03 address=0x1D) [reset=2Ah]
Forward path DC detection threshold.
Table 272. DC detection threshold 2 Field Descriptions
Bit
Field
DC_DET_THR[23:16]
Type
RW
Reset
2Ah
Description
round(dc_det_th*2^31)
7-0
8.5.163 DC_DET_THR3 (page=0x03 address=0x1E) [reset=FFh]
Forward path DC detection threshold.
Table 273. DC detection threshold 3 Field Descriptions
Bit
Field
Type
RW
Reset
FFh
Description
round(dc_det_th*2^31)
7-0
DC_DET_THR[15:8]
8.5.164 DC_DET_THR4 (page=0x03 address=0x1F) [reset=53h]
Forward path DC detection threshold.
Table 274. DC detection threshold 4 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DC_DET_THR[7:0]
RW
53h
round(dc_det_th*2^31)
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8.5.165 DC_DET_HYST1 (page=0x03 address=0x20) [reset=0h]
DC detection hysteresis time 1
Table 275. DC detection hysteresis time 1 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DC_DET_TIM[31:24]
RW
0h
round(time in seconds*fs)
8.5.166 DC_DET_HYST2 (page=0x03 address=0x21) [reset=0h]
DC detection hysteresis time 2
Table 276. DC detection hysteresis time 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DC_DET_TIM[23:16]
RW
0h
round(time in seconds*fs)
8.5.167 DC_DET_HYST3 (page=0x03 address=0x22) [reset=27h]
DC detection hysteresis time 3
Table 277. DC detection hysteresis time 3 Field Descriptions
Bit
Field
DC_DET_TIM[15:8]
Type
RW
Reset
27h
Description
round(time in seconds*fs)
7-0
8.5.168 DC_DET_HYST4 (page=0x03 address=0x23) [reset=10h]
DC detection hysteresis time 4
Table 278. DC detection hysteresis time 4 Field Descriptions
Bit
Field
DC_DET_TIM[7:0]
Type
RW
Reset
10h
Description
round(time in seconds*fs)
7-0
8.5.169 CLS_H_CFG1 (page=0x03 address=0x24) [reset=Ah]
slope (ClassD out to Vboost mapping)
Table 279. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_SLOPE[31:24]
RW
Ah
round(slope*2^27)
8.5.170 CLS_H_CFG2 (page=0x03 address=0x25) [reset=3Bh]
slope (ClassD out to Vboost mapping)
Table 280. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_SLOPE[23:16]
RW
3Bh
round(slope*2^27)
8.5.171 CLS_H_CFG3 (page=0x03 address=0x26) [reset=C7h]
slope (ClassD out to Vboost mapping)
Table 281. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_SLOPE[15:8]
RW
C7h
round(slope*2^27)
90
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8.5.172 CLS_H_CFG4 (page=0x03 address=0x27) [reset=DCh]
slope (ClassD out to Vboost mapping)
Table 282. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_SLOPE[7:0]
RW
DCh
round(slope*2^27)
8.5.173 CLS_H_CFG5 (page=0x03 address=0x28) [reset=0h]
Y - intercept (ClassD out to Vboost mapping)
Table 283. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_INTERCEPT[31:24]
RW
0h
round(intercept*2^27)
8.5.174 CLS_H_CFG6 (page=0x03 address=0x29) [reset=0h]
Y - intercept (ClassD out to Vboost mapping)
Table 284. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_INTERCEPT[23:16]
RW
0h
round(intercept*2^27)
8.5.175 CLS_H_CFG7 (page=0x03 address=0x2A) [reset=0h]
Y - intercept (ClassD out to Vboost mapping)
Table 285. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_INTERCEPT[15:8]
RW
0h
round(intercept*2^27)
8.5.176 CLS_H_CFG8 (page=0x03 address=0x2B) [reset=0h]
Y - intercept (ClassD out to Vboost mapping)
Table 286. ClassH Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_INTERCEPT[7:0]
RW
0h
round(intercept*2^27)
8.5.177 CLS_H_CFG9 (page=0x03 address=0x74) [reset=0h]
ClassH Minimum boost level in Voltage
Table 287. ClassH Minimum boost level in Voltage Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_MIN_LEVEL[31:24]
RW
0h
round((22*Voutmax-52)*2^8)
8.5.178 CLS_H_CFG10 (page=0x03 address=0x75) [reset=0h]
ClassH Minimum boost level in Voltage
Table 288. ClassH Minimum boost level in Voltage Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_MIN_LEVEL[23:16]
RW
0h
round((22*Voutmax-52)*2^8)
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8.5.179 CLS_H_CFG11 (page=0x03 address=0x76) [reset=2h]
ClassH Minimum boost level in Voltage
Table 289. ClassH Minimum boost level in Voltage Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_MIN_LEVEL[15:8]
RW
2h
round((22*Voutmax-52)*2^8)
8.5.180 CLS_H_CFG12 (page=0x03 address=0x77) [reset=0h]
ClassH Minimum boost level in Voltage
Table 290. ClassH Minimum boost level in Voltage Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSH_MIN_LEVEL[7:0]
RW
0h
round((22*Voutmax-52)*2^8)
8.5.181 PAGE4 (page=0x04 address=0x00) [reset=0h]
The device's memory map is divided into pages and books. This register sets the page.
Table 291. Device Page Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PAGE[7:0]
RW
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.5.182 LD_CFG8 (page=0x04 address=0x18) [reset=0h]
Load Resistance Value after load diagnostics is completed
Table 292. Load Resistance Value after load diagnostics is completed Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LD_RES_VAL1[31:24]
RW
0h
4.2424*((LD_RES_VAL1)/2^22) ohms
8.5.183 LD_CFG9 (page=0x04 address=0x19) [reset=0h]
Load Resistance Value after load diagnostics is completed
Table 293. Load Resistance Value after load diagnostics is completed Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LD_RES_VAL1[23:16]
RW
0h
4.2424*((LD_RES_VAL1)/2^22) ohms
8.5.184 LD_CFG10 (page=0x04 address=0x1A) [reset=0h]
Load Resistance Value after load diagnostics is completed
Table 294. Load Resistance Value after load diagnostics is completed Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LD_RES_VAL1[15:8]
RW
0h
4.2424*((LD_RES_VAL1)/2^22) ohms
92
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8.5.185 LD_CFG11 (page=0x04 address=0x1B) [reset=0h]
Load Resistance Value after load diagnostics is completed
Table 295. Load Resistance Value after load diagnostics is completed Field Descriptions
Bit
Field
Type
Reset
Description
7-0
LD_RES_VAL1[7:0]
RW
0h
4.2424*((LD_RES_VAL1)/2^22) ohms
8.5.186 TF_CFG4 (page=0x04 address=0x58) [reset=0h]
Thermal foldback hold count (samples)
Table 296. Thermal foldback hold count (samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[31:24]
RW
0h
round(seconds * 1000)
8.5.187 TF_CFG5 (page=0x04 address=0x59) [reset=0h]
Thermal foldback hold count (samples)
Table 297. Thermal foldback hold count (samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[23:16]
RW
0h
round(seconds * 1000)
8.5.188 TF_CFG6 (page=0x04 address=0x5A) [reset=0h]
Thermal foldback hold count (samples)
Table 298. Thermal foldback hold count (samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[15:8]
RW
0h
round(seconds * 1000)
8.5.189 TF_CFG7 (page=0x04 address=0x5B) [reset=64h]
Thermal foldback hold count (samples)
Table 299. Thermal foldback hold count (samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[7:0]
RW
64h
round(seconds * 1000)
8.5.190 TF_CFG8 (page=0x04 address=0x5C) [reset=40h]
Thermal foldback limiter release rate (db/samples)
Table 300. Thermal foldback limiter release rate (db/samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[31:24]
RW
40h
round(10^(dB per sample/20)*2^30)
8.5.191 TF_CFG9 (page=0x04 address=0x5D) [reset=BDh]
Thermal foldback limiter release rate (db/samples)
Table 301. Thermal foldback limiter release rate (db/samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[23:16]
RW
BDh
round(10^(dB per sample/20)*2^30)
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8.5.192 TF_CFG10 (page=0x04 address=0x5E) [reset=B7h]
Thermal foldback limiter release rate (db/samples)
Table 302. Thermal foldback limiter release rate (db/samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[15:8]
RW
B7h
round(10^(dB per sample/20)*2^30)
8.5.193 TF_CFG11 (page=0x04 address=0x5F) [reset=B0h]
Thermal foldback limiter release rate (db/samples)
Table 303. Thermal foldback limiter release rate (db/samples) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[7:0]
RW
B0h
round(10^(dB per sample/20)*2^30)
8.5.194 TF_CFG12 (page=0x04 address=0x60) [reset=39h]
Thermal foldback limiter temperature threshold
Table 304. Thermal foldback limiter temperature threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[31:24]
RW
39h
round(temperature in degree C*2^23)
8.5.195 TF_CFG13 (page=0x04 address=0x61) [reset=82h]
Thermal foldback limiter temperature threshold
Table 305. Thermal foldback limiter temperature threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[23:16]
RW
82h
round(temperature in degree C*2^23)
8.5.196 TF_CFG14 (page=0x04 address=0x62) [reset=60h]
Thermal foldback limiter temperature threshold
Table 306. Thermal foldback limiter temperature threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[15:8]
RW
60h
round(temperature in degree C*2^23)
8.5.197 TF_CFG16 (page=0x04 address=0x63) [reset=7Fh]
Thermal foldback limiter temperature threshold
Table 307. Thermal foldback limiter temperature threshold Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[7:0]
RW
7Fh
round(temperature in degree C*2^23)
8.5.198 TF_CFG17 (page=0x04 address=0x64) [reset=2Dh]
Thermal foldback max gain reduction (dB)
Table 308. Thermal foldback max gain reduction (dB) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[31:24]
RW
2Dh
round(10^(max attn dB/20)*2^31)
94
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8.5.199 TF_CFG18 (page=0x04 address=0x65) [reset=6Ah]
Thermal foldback max gain reduction (dB)
Table 309. Thermal foldback max gain reduction (dB) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[23:16]
RW
6Ah
round(10^(max attn dB/20)*2^31)
8.5.200 TF_CFG19 (page=0x04 address=0x66) [reset=86h]
Thermal foldback max gain reduction (dB)
Table 310. Thermal foldback max gain reduction (dB) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[15:8]
RW
86h
round(10^(max attn dB/20)*2^31)
8.5.201 TF_CFG20 (page=0x04 address=0x67) [reset=6Fh]
Thermal foldback max gain reduction (dB)
Table 311. Thermal foldback max gain reduction (dB) Field Descriptions
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[7:0]
RW
6Fh
round(10^(max attn dB/20)*2^31)
8.5.202 DVC_SR1 (page=0x04 address=0x6C) [reset=2h]
Volume Control slew rate for 16kHz fs
Table 312. Volume Control slew rate for 16kHz fs Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_SLEW_LR[31:24]
RW
2h
round((1-exp(-1/(0.2*8*fs*time in seconds)))*2^31)
8.5.203 DVC_SR2 (page=0x04 address=0x6D) [reset=79h]
Volume Control slew rate for 16kHz fs
Table 313. Volume Control slew rate for 16kHz fs Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_SLEW_LR[23:16]
RW
79h
round((1-exp(-1/(0.2*8*fs*time in seconds)))*2^31)
8.5.204 DVC_SR3 (page=0x04 address=0x6E) [reset=CAh]
Volume Control slew rate for 16kHz fs
Table 314. Volume Control slew rate for 16kHz fs Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_SLEW_LR[15:8]
RW
CAh
round((1-exp(-1/(0.2*8*fs*time in seconds)))*2^31)
8.5.205 DVC_SR4 (page=0x04 address=0x6F) [reset=5Eh]
Volume Control slew rate for 16kHz fs
Table 315. Volume Control slew rate for 16kHz fs Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DVC_SLEW_LR[7:0]
RW
5Eh
round((1-exp(-1/(0.2*8*fs*time in seconds)))*2^31)
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8.5.206 CD_CFG1 (page=0x04 address=0x70) [reset=56h]
Class D gain
Table 316. Class D gain Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSD_GAIN[31:24]
RW
56h
round(10^(dB/20)*2^27)
8.5.207 CD_CFG2 (page=0x04 address=0x71) [reset=B7h]
Class D gain
Table 317. Class D gain Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSD_GAIN[23:16]
RW
B7h
round(10^(dB/20)*2^27)
8.5.208 CD_CFG3 (page=0x04 address=0x72) [reset=96h]
Class D gain
Table 318. Class D gain Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSD_GAIN[15:8]
RW
96h
round(10^(dB/20)*2^27)
8.5.209 CD_CFG4 (page=0x04 address=0x73) [reset=FFh]
Class D gain
Table 319. Class D gain Field Descriptions
Bit
Field
Type
Reset
Description
7-0
CLASSD_GAIN[7:0]
RW
FFh
round(10^(dB/20)*2^27)
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TAS2564 is a digital input high efficiency Class-D audio power amplifier with advanced battery current
management and an integrated Class-H boost converter. In auto passthrough mode, the Class-H boost converter
generates the Class-D amplifier supply rail. During low Class-D output power, the boost improves efficiency by
deactivating and connecting VBAT directly to the Class-D amplifier supply. When high power audio is required,
the boost quickly activates to provide louder audio than a stand-alone amplifier connected directly to the battery.
To enable load monitoring, the TAS2564 constantly measures the current and voltage across the load and
provides a digital stream of this information back to a processor. It is recommended to configure the TAS2564
using PurePath™ Console 3 Software.
9.2 Typical Application
1.65 Vœ
1.95 V
2.9 V œ
5.5 V
L1
1 mH
C1
10 mF
C5
4.7 mF
C6
1mF
3
DREG
VDD
SW
VBAT
GREG
C7
100 nF
VBST
PVDD
3
3
C2
10 mF
Enable
SDZ
L2 (opt.)
+
-
OUT_P
OUT_M
To
Speaker
AD1
AD0
L3 (opt.)
VSNS_P
VSNS_M
VSENSE
I2C Interface
I2S Interface
I2C
I2S
2
4
C4
1 nF
(opt.)
C3
1 nF
(opt.)
GND
BGND
PGND
3
2
Figure 48. Typical Application - Digital Audio Input
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Typical Application (continued)
TAS2564
SDZ
IRQZ
I2C
OUT_P/N
ASI
AD0
AD1
Host
Figure 49. Typical Application - Mono
TAS2564
VDD
AD1
AD0
ASI
OUT_P/N
I2C
IRQZ
SDZ
TAS2564
SDZ
IRQZ
I2C
OUT_P/N
ASI
Host
AD0
AD1
Figure 50. Typical Application - Stereo
Table 320. Recommended External Components
COMPONENT
DESCRIPTION
SPECIFICATION
Inductance, 20% Tolerance
Saturation Current
Impedance at 100 MHz
DC Resistance
MIN
TYP
1
MAX
UNIT
µH
A
0.47
L1
Boost Converter Inductor(1)
5.5
120
Ω
EMI Filter Inductors (optional). These are
not recommended as it degrades THD+N
performance. TAS2564 is a filter-less
Class-D and does not require these bead
inductors.
0.095
2
Ω
L2, L3
C1
DC Current
A
Size
0402
EIA
µF
Boost Converter Input Capacitor(1)
Capacitance, 20% Tolerance
Type
10
X5R
10
Capacitance, 20% Tolerance
Rated Voltage
47
µF
V
C2
Boost Converter Output Capacitor
16
Capacitance at 11.5 V derating
3.3
µF
EMI Filter Capacitors (optional, must use
L2, L3 if C3, C4 used)
C3, C4
Capacitance
1
nF
C5
C6
C6
VDD Decoupling Capacitor
DREG Decoupling Capacitor
GREG Fly Capacitor
Capacitance
Capacitance
Capacitance
4.7
1
µF
µF
nF
100
(1) See section Boost Converter Passive Devices for additional requirements on derating, stability, and inductor value trade-offs.
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9.2.1 Design Requirements
For Figure 49 example, use the parameters shown in Table 321.
Table 321. Design Parameters
DESIGN PARAMETER
Audio Input
EXAMPLE VALUE
Digital Audio, I2S
Digital Audio, I2S
Mono
Current and Voltage Data Stream
Mono or Stereo Configuration
Max Output Power at 1% THD+N
7.0 W
9.2.2 Detailed Design Procedure
9.2.2.1 Mono/Stereo Configuration
In this application, the device is assumed to be operating in mono mode. See Device Mode and Address
Selection for information on changing the I2C address of the TAS2564 to support stereo operation. Mono or
stereo configuration does not impact the device performance.
9.2.2.2 Boost Converter Passive Devices
The boost converter requires three passive devices that are labeled L1, C1 and C2 in and whose specifications
are provided in Table 320. These specifications are based on the design of the TAS2564 and are necessary to
meet the performance targets of the device. In particular, L1 should not be allowed to enter in the current
saturation region. The saturation current for L1 should be > ILIM to deliver Class-D peak power.
Additionally, the ratio of L1/C2 (the derated value of C2 at 11.5 V should be used in this ratio) has to be lesser
than 1/3 for boost stability. This 1/3 ratio should be maintained including the worst case variation of L1 and C2.
To satisfy sufficient energy transfer, L1 needs to be ≥ 0.47 μH at the boost switching frequency (100 kHz to 4
MHz). Using a 0.47μH will have more boost ripple than a 1.0 μH or 2.2 μH but the high PSRR should minimize
the effect from the additional ripple. Finally, the minimum C2 (derated value at programmed boost voltage)
should be > 3.3 μF for Class-D power delivery specification.
9.2.2.3 EMI Passive Devices
The system designer may want to include passive devices on the Class-D output . These passive devices that
are labeled L2, L3, C3 and C4 in and their recommended specifications are provided in Table 320. If C3 and C4
are used, L2 and L3 must also be installed, and C3 and C4 must be placed after L2 and L3 respectively to
maintain the stability of the output stage.
9.2.2.4 Miscellaneous Passive Devices
The GREG Capacitor requires 100 nF to meet boost and Class-D power delivery and efficiency specs. For best
device performance, the GREG capacitor should be placed very close to the device, star connected to PVDD
and be routed with wide traces to minimize the impact of PCB parasitic effects.
DREG Capacitor should be placed and Ground Loop closed next to device. DREG is internal supply(1.5V typical,
functional min of 1.35V) generated from external VDD supply. For best performance, noise on VDD should be
reduced by wide traces or higher caps on VDD next to device based on board routings.
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10 Power Supply Recommendations
10.1 Power Supplies
The TAS2564 requires four power supplies:
•
•
•
Boost Input (terminal: VBAT)
–
–
Voltage: 2.9 V to 5.5 V
Max Current: 5 A for ILIM = 4.0 A (default)
Analog Supply (terminal: VDD)
–
–
Voltage: 1.65 V to 1.95 V
Max Current: 30 mA
Internal Supplies
–
–
–
Digital Supply (terminal: DREG): 1.35 V to 1.65 V
Boost Output (terminal: VBST) : VBAT to 13V
Class-D Power Supply (terminal: PVDD): Short to VBST
The decoupling capacitors for the power supplies should be placed close to the device terminals.
10.2 Power Supply Sequencing
The power rail may be brought up and down in any order. There is no requirement on sequencing. However if
VDD is present without VBAT an additional rise in VDD current will be observed until VBAT is present.
When the supplies have settled, the SDZ terminal can be set HIGH to operate the device. Additionally the SDZ
pin can be tied to VDD and the internal POR will perform a reset of the device. After a hardware or software
reset additional commands to the device should be delayed for 100 uS to allow the OTP to load. The above
sequence should be completed before any I2C operation.
10.2.1 Boost Supply Details
The boost supply (VBAT) and associated passives need to be able to support the current requirements of the
device. By default, the peak current limit of the boost is set to 5 A. Refer to Table 90 for information on changing
the current limit. A minimum of a 10 µF capacitor is recommended on the boost supply to quickly support
changes in required current. Refer to Figure 48 for the schematic.
The current requirements can also be reduced by lowering the gain of the amplifier, or in response to decreasing
battery through the use of the battery-tracking feature of the TAS2564 described in Supply Tracking Limiters with
Brown Out Prevention.
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11 Layout
11.1 Layout Guidelines
•
•
•
•
Place the boost inductor between VBAT and SW close to device terminals with no VIAS between the device
terminals and the inductor.
Place the capacitor between VBSTand Ground close to device terminals with no VIAS between the device
terminals and capacitor.
Place the capacitor between VBAT and GND close to device terminals with no VIAS between the device
terminals and capacitor.
Minimize trace inductance between the GREG capacitor and TAS2564. This can be done by using multiple
vias in parallel and by using wide routes where possible. This capacitor should have a star connection to
PVDD.
•
•
Do not use VIAS for traces that carry high current. These include the traces for VBST, SW, VBAT, PGND and
the speaker OUT_P, OUT_M.
SW, OUT_P and OUT_M are high switching nets and keep out should be kept from these signals to prevent
corruption of digital signals.
•
•
Use epoxy filled vias for the interior pads.
Connect VSNS_P, VSNS_N as close as possible to the speaker.
–
VSNS_P, VSNS_N should be connected between the EMI ferrite and the speaker if EMI ferrites are used
on OUT_P, OUT_M.
–
EMI ferrites must be used if EMI capacitors are used on OUT_P, OUT_M.
•
Use a ground plane with multiple vias for each terminal to create a low-impedance connection to GND for
minimum ground noise.
•
•
Use supply decoupling capacitors as shown in and described in Power Supplies.
Place EMI ferrites, if used, close to the device.
Table 322. Pin Layout Guidelines
PIN
MAX PARASITIC INDUCTANCE
LAYOUT RECOMMENDATIONS
BGND, GND, PGND, GNDD
150 pH
Short BGND, GND, GNDD, PGDN below the package and
connect them to PCB ground plane strongly through
multiple vias. Minimize inductance as much as possible
DREG
500 pH
Bypass to GND with capacitor recommended in
Table 320. Do not connect to external load. Both ends of
decoupling cap should see as low inductance as possible
between this pin and gnd pins.
GREG
PVDD
SW
200 pH
100 pH
Connect it to PVDD with a star connection and not to
boost plane with recommended in Table 320. Do not
connect to external load.
Short it to VBST(boost) plane through strong conneciton.
Connect it to GREG with a star connection and not to
boost plane.
Connect to VBAT with boost inductor recommended in
Table 320. Reduce parasitic capacitor and resistance for
efficiency. Boost inductor should be as close as possible
to the SW pin. Inductor should be connected to SW
through thick plane. Traces should support currents up to
device over-current limit.
VBAT
VBST
500 pH
100 pH
Bypass to GND with capacitor recommended in
Table 320. Should be connected to inductor through thick
plane. Both ends of decoupling capacitor should see as
low inductance as possible between VBAT pin and PGND
pin.
Do not connect to external load. Bypass to GND with
capacitor recommended in Table 320. Connect to PVDD
through thick plane. Both ends of decoupling capacitor
should see as low inductance as possible between VBST
pin and BGND pin. Traces should support currents up to
device over-current limit.
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Layout Guidelines (continued)
Table 322. Pin Layout Guidelines (continued)
PIN
MAX PARASITIC INDUCTANCE
LAYOUT RECOMMENDATIONS
VDD
200 pH
Bypass to GND with capacitor recommended in
Table 320. Both the end of decoupling cap should see as
low inductance as possible between this pin and GND pin
11.2 Layout Example
Figure 51. Board Layout
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Layout Example (continued)
Figure 52. Top Copper
Figure 53. Second Copper Layer
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Layout Example (continued)
Figure 54. Third Copper Layer
Figure 55. Fourth Copper Layer
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Layout Example (continued)
Figure 56. Fifth Copper Layer
Figure 57. Bottom Layer
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following: TAS2563YBGEVM-DC Evaluation module user's guide
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
YBG0036
DSBGA - 0.5 mm max height
SCALE 6.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
2 TYP
SYMM
F
E
2
D
TYP
SYMM
D: Max = 2.484 mm, Min = 2.444 mm
E: Max = 2.654 mm, Min = 2.614 mm
C
B
0.4 TYP
A
2
1
4
5
6
3
0.27
36X
0.23
0.015
C A B
0.4 TYP
4224846/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.23)
2
1
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
( 0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224846/A 03/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
36X ( 0.25)
(R0.05) TYP
6
2
3
1
4
5
A
(0.4) TYP
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4224846/A 03/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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13.1 Package Option Addendum
13.1.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Finish(3)
(1)
(2)
(4)
Orderable Device
Status
Pins
Eco Plan
MSL Peak Temp
Op Temp (°C)
Device Marking(5)(6)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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13.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
P1 Pitch between successive cavity centers
W
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
112
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Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: TAS2564
TAS2564
www.ti.com
SLASEI6A –OCTOBER 2019–REVISED DECEMBER 2019
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
Length (mm) Width (mm)
Height (mm)
Copyright © 2019, Texas Instruments Incorporated
Submit Documentation Feedback
113
Product Folder Links: TAS2564
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TAS2564YBGR
TAS2564YBGT
ACTIVE
ACTIVE
DSBGA
DSBGA
YBG
YBG
36
36
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
TAS2564
TAS2564
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TAS2564YBGR
TAS2564YBGT
DSBGA
DSBGA
YBG
YBG
36
36
3000
250
180.0
180.0
8.4
8.4
2.64
2.64
2.81
2.81
0.7
0.7
4.0
4.0
8.0
8.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TAS2564YBGR
TAS2564YBGT
DSBGA
DSBGA
YBG
YBG
36
36
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YBG0036
DSBGA - 0.5 mm max height
SCALE 6.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
2 TYP
SYMM
F
E
D
C
2
TYP
SYMM
D: Max = 2.624 mm, Min =2.564 mm
E: Max = 2.454 mm, Min =2.394 mm
B
A
0.4 TYP
0.27
2
1
4
5
6
3
36X
0.23
0.015
C A B
0.4 TYP
4224846/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.23)
2
1
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224846/A 03/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.25)
(0.4) TYP
(R0.05) TYP
6
2
1
4
5
A
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4224846/A 03/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
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Copyright © 2023, Texas Instruments Incorporated
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