TAS5754M [TI]
40W 立体声、61W 单声道、4.5V 至 26.4V 电源电压、数字输入 D 类音频放大器;型号: | TAS5754M |
厂家: | TEXAS INSTRUMENTS |
描述: | 40W 立体声、61W 单声道、4.5V 至 26.4V 电源电压、数字输入 D 类音频放大器 放大器 音频放大器 |
文件: | 总129页 (文件大小:4345K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TAS5754M
SLAS987 –JUNE 2014
Digital Input, Closed-Loop Class-D Amplifier with HybridFlow Processing
1 Features
3 Description
The TAS5754M device is a high-performance, stereo
closed-loop amplifier with integrated audio processor
with PurePath™ HybridFlow architecture. To convert
from digital to analog, it uses a high performance
DAC with Burr-Brown® mixed signal heritage. It
requires only two power supplies: one DVDD for low-
voltage circuitry and one PVDD for high-voltage
circuitry. It is controlled via a software control port
using standard I2C communication. In the family, the
TAS5756M uses traditional BD modulation, ensuring
low distortion characteristics. The TAS5754M uses
1SPW modulation, reducing the idle current draw at
the expense of slightly higher distortion.
1
•
Flexible Audio I/O Configuration
–
–
–
Supports I2S, TDM, LJ, RJ Digital Input
8 kHz to 192 kHz Sample Rate Support
Stereo Bridge Tied Load (BTL) or Mono
Parallel Bridge Tied Load (PBTL) Operation
–
–
BD Modulation with TAS5756M, 1SPW
Modulation with TAS5754M
Supports 3-Wire Digital Audio Interface (No
MCLK required)
•
•
High Performance Closed-Loop Architecture
(PVDD = 12V, RSPK = 8 Ω, SPK_GAIN = 20dBV)
The unique HybridFlow architecture allows the
system designer to choose from several configurable
DSP programs, specifically designed for use in
popular audio end equipment such as bluetooth (BT)
speakers, sound bars, docking stations, and
subwoofers. This combines the flexibility of a fully
programmable device with the fast download time
and ease of use of a fixed function ROM device.
–
–
–
Idle Channel Noise = 62 µVrms (A-Wtd)
THD+N = 0.007 % (at 1 W, 1 kHz)
SNR = 103 A-Wtd (Ref. to THD+N = 1%)
PurePath™ HybridFlow Processing Architecture
–
Several Configurable MiniDSP Programs
(called HybridFlows)
–
–
Download Time <100 ms (typ)
An optimal mix of thermal performance and device
cost is provided in the 90 mΩ rDS(on) of the output
MOSFETs. Additionally, a thermally enhanced 48-
Terminal TSSOP provides excellent operation in the
elevated ambient temperatures found in modern
consumer electronic devices.
Advanced Audio Processing Algorithms
•
•
Communication Features
–
–
Software Mode Control via I2C Port
Two Address Select Pins – Up to 4 Devices
Robustness and Reliability Features
Device Information(1)
–
–
Clock Error, DC, and Short-Circuit Protection
Over Temperature and Overcurrent Protection
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TAS5754M
TSSOP (48)
12.05 mm × 6.10 mm
2 Applications
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
•
•
•
LCD/LED TV and Multi-Purpose Monitors
Sound Bars, Docking Stations, PC Audio
Wireless Subwoofers, Bluetooth and Active
Speakers
Figure 1. Simplified Block Diagram
Figure 2. Power at 10% THD+N vs PVDD
DVDD
PVDD
50
Inst Power, Rspk = 8
Cont Power, Rspk = 8
Inst Power, Rspk = 6
Cont Power, Rspk = 6
Inst Power, Rspk = 4
Cont Power, Rspk = 4
45
40
35
30
25
20
15
10
5
High Voltage
Supply Domain
Low-Voltage Supply Domain
HybridFlow
Processing
High Performance
Stereo DAC
001100
1101
Closed Loop Stereo
Class D Amplifier
Serial
Audio In
Analog
Audio Out
PWM
Modulator
Power
Stage
Serial
Audio Out
miniDSP Core
Hardware
Control Port
Software Control Port
I²C Communication
0
4
6
8
10
12
14
16
18
20
22
24
GPIO/Status
PVDD (V)
C036
Note: Tested on TAS5754M-56MEVM.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS5754M
SLAS987 –JUNE 2014
www.ti.com
Table of Contents
7.13 Typical Performance Plots for the TAS5754M...... 26
Detailed Description ............................................ 34
8.1 Overview ................................................................. 34
8.2 Functional Block Diagram ....................................... 35
8.3 Feature Description................................................. 35
8.4 Register Maps......................................................... 61
Applications and Implementation ...................... 85
9.1 Application Information............................................ 85
9.2 Typical Applications ............................................... 86
1
2
3
4
5
6
Features.................................................................. 1
8
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
6.1 Internal Pin Configurations........................................ 5
Specifications......................................................... 8
7.1 Absolute Maximum Ratings ...................................... 8
7.2 Handling Ratings....................................................... 9
7.3 Recommended Operating Conditions....................... 9
7.4 Thermal Information.................................................. 9
7.5 Electrical Characteristics......................................... 10
7.6 MCLK Timing ......................................................... 15
7.7 Serial Audio Port Timing – Slave Mode.................. 16
7.8 Serial Audio Port Timing – Master Mode................ 17
7.9 I2C Bus Timing – Standard ..................................... 18
7.10 I2C Bus Timing – Fast........................................... 18
7.11 SPK_MUTE Timing .............................................. 20
7.12 Power Dissipation ................................................. 20
9
7
10 Power Supply Recommendations ................... 105
10.1 Power Supplies ................................................... 105
11 Layout................................................................. 107
11.1 Layout Guidelines ............................................... 107
11.2 Layout Examples................................................. 109
12 Device and Documentation Support ............... 119
12.1 Device Support.................................................... 119
12.2 Trademarks......................................................... 119
12.3 Electrostatic Discharge Caution.......................... 119
12.4 Glossary.............................................................. 119
13 Mechanical, Packaging, and Orderable
Information ......................................................... 120
4 Revision History
DATE
REVISION
NOTES
June 2014
*
Initial release.
2
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5 Device Comparison Table
DEVICE NAME
MODULATION STYLE
1SPW (Ternary)
TAS5754MDCA
TAS5756MDCA
BD Modulation
6 Pin Configuration and Functions
48-Terminal TSSOP
DCA Package
(Thermal Pad Down)
BSTRPA±
SPK_OUTA±
PGND
SPK_OUTA+
BSTRPA+
PVDD
1
2
3
4
5
6
7
8
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
BSTRPB±
SPK_OUTB±
PGND
SPK_OUTB+
BSTRPB+
PVDD
PVDD
PVDD
SPK_FAULT
PGND
SPK_INB±
SPK_INB+
DAC_OUTB
CPVSS
CN
GND
CP
CPVDD
DVDD
PVDD
GVDD_REG
SPK_GAIN/FREQ
AGND
9
10
11
12
13
14
15
16
17
18
19
SPK_INA±
SPK_INA+
DAC_OUTA
AVDD
AGND
SDA
SCL
GPIO0
Thermal Pad
GPIO1
ADR1
GPIO2
MCLK
SCLK
DGND
20
21
22
23
24
29
28
27
26
25
DVDD_REG
SPK_MUTE
ADR0
SDIN
LRCK/FS
Pin Functions
PIN
NAME
INTERNAL
TERMINATION
TYPE(1)
DESCRIPTION
NO.
26
20
10
15
14
Sets the LSB of the I2C Address to 0 if pulled to GND, to 1 if pulled to DVDD
Sets the 2nd LSB of the I2C Address to 0 if pulled to GND, to 1 if pulled to DVDD
ADR0
ADR1
DI
DI
Figure 13
Ground reference for analog circuitry (NOTE: This pin should be connected to the system
ground)
AGND
AVDD
G
—
P
P
Figure 4
Power supply for internal analog circuitry
Connection point for the SPK_OUTA– bootstrap capacitor which is used to create a power
supply for the high-side gate drive for SPK_OUTA–
BSTRPA–
BSTRPA+
BSTRPB–
BSTRPB+
1
5
Connection point for the SPK_OUTA+ bootstrap capacitor which is used to create a power
supply for the high-side gate drive for SPK_OUTA
P
P
P
Figure 5
Connection point for the SPK_OUTB– bootstrap capacitor which is used to create a power
supply for the high-side gate drive for SPK_OUTB–
48
44
Connection point for the SPK_OUTB+ bootstrap capacitor which is used to create a power
supply for the high-side gate drive for SPK_OUTB+
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), P =
Power, G = Ground (0 V)
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Pin Functions (continued)
PIN
INTERNAL
TERMINATION
TYPE(1)
DESCRIPTION
NAME
NO.
Negative pin for capacitor connection used in the headphone amplifier and line driver charge
pump
CN
CP
34
P
P
Figure 17
Positive pin for capacitor connection used in the headphone amplifier and line driver charge
pump
32
Figure 16
CPVDD
31
35
13
36
29
30
P
P
Figure 4
Power supply for charge pump circuitry
CPVSS
Figure 17
–3.3-V supply generated by charge pump for the DAC
Single-ended output for Channel A of the DAC
Single-ended output for Channel B of the DAC
Ground reference for digital circuitry. Connect this pin to the system ground.
Power supply for the internal digital circuitry
DAC_OUTA
DAC_OUTB
DGND
AO
AO
G
Figure 10
—
DVDD
P
Figure 4
Voltage regulator derived from DVDD supply for use for internal digital circuitry. This pin is
provided as a connection point for filtering capacitors for this supply and must not be used to
power any external circuitry.
DVDD_REG
28
P
Figure 18
GND
33
18
19
21
G
Ground pin for device. This pin should be connected to the system ground.
GPIO0
GPIO1
GPIO2
General purpose input/output pins (GPIOx) which can be incorporated in a HybridFlow for a
given purpose. Refer to documentation of target HybridFlow to determine if any of these pins
are required by the HybridFlow and, if so, how they are to be used. In most HybridFlows,
presentation of a serial audio signal, called SDOUT, is done through GPIO2.
DI/O
P
Figure 13
Figure 7
Voltage regulator derived from PVDD supply to generate the voltage required for the gate drive
of output MOSFETs. This pin is provided as a connection point for filtering capacitors for this
supply and must not be used to power any external circuitry.
GVDD_REG
8
Word select clock for the digital signal that is active on the serial port's input data line. In I2S,
LJ, and RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this
corresponds to the frame sync boundary.
LRCK/FS
MCLK
25
DI/O
DI
Figure 14
22
3
Master clock used for internal clock tree and sub-circuit and state machine clocking
PGND
39
46
6
G
—
Ground reference for power device circuitry. Connect this pin to the system ground.
7
PVDD
41
42
43
17
23
16
24
11
12
38
37
P
Figure 3
Power supply for internal power circuitry
I2C serial control port clock
SCL
DI
DI/O
DI/O
D1
AI
Figure 12
Figure 14
Figure 11
Figure 14
SCLK
Bit clock for the digital signal that is active on the input data line of the serial data port
I2C serial control port data
SDA
SDIN
Data line to the serial data port
SPK_INA–
SPK_INA+
SPK_INB–
SPK_INB+
Negative pin for differential speaker amplifier input A
Positive pin for differential speaker amplifier input A
Negative pin for differential speaker amplifier input B
Positive pin for differential speaker amplifier input B
AI
Figure 9
AI
AI
Fault pin which is pulled low when an overcurrent, overtemperature, overvoltage, undervoltage,
or DC detect event occurs
SPK_FAULT
40
DO
Figure 19
Figure 8
SPK_GAIN/FREQ
SPK_OUTA–
SPK_OUTA+
SPK_OUTB–
SPK_OUTB+
9
2
AI
Sets the gain and switching frequency of the speaker amplifier.
Negative pin for differential speaker amplifier output A
Positive pin for differential speaker amplifier output A
Negative pin for differential speaker amplifier output B
Positive pin for differential speaker amplifier output B
AO
AO
AO
AO
4
Figure 6
47
45
Speaker amplifier mute which must be pulled low (connected to DGND) to mute the device and
pulled high (connected to DVDD) to unmute the device.
SPK_MUTE
Themal pad
27
I
Figure 15
—
Provides both electrical and thermal connection from the device to the board. A matching
ground pad must be provided on the PCB and the device connected to it through solder. For
proper electrical operation, this ground pad must be connected to the system ground.
G
4
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6.1 Internal Pin Configurations
PVDD
DVDD
30 V ESD
3.3 V ESD
Figure 3. PVDD Pins
Figure 4. AVDD, DVDD and CPVDD Pins
GVDD
PVDD
BSTRPxx
PVDD
7 V ESD
SPK_OUTxx
SPK_OUTxx
Figure 5. BSTRPxx Pins
Figure 6. SPK_OUTxx Pins
GVDD
PVDD
10 ꢀ
GVDD
10 Nꢀ
SPK_GAIN/FREQ
7 V ESD
7 V ESD
Figure 8. SPK_GAIN/FREQ Pin
Figure 7. GVDD_REG Pin
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Internal Pin Configurations (continued)
AVDD
SPK_INxx
7 V ESD
Gain Switch
CPVSS
DAC_OUTA
Figure 9. SPK_INxx Pins
Figure 10. DAC_OUTx Pins
DVDD
SDA
DVDD
SCL
3.3 V
ESD
3.3 V
ESD
Figure 11. SDA Pin
Figure 12. SCL Pin
DVDD
DVDD
GPIO1
GPIO2
GPIO3
ADR0
ADR1
MCLK
SCLK
SDIN
3.3 V
ESD
3.3 V
ESD
LRCK/FS
Figure 14. SCLK, BCLK, SDIN, and LRCK/FS Pins
Figure 13. GPIO and ADR Pins
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Internal Pin Configurations (continued)
DVDD
CVPDD
CP
SPK_MUTE
3.3 V
ESD
3.3 V
ESD
Figure 15. SPK_MUTE Pin
Figure 16. CP Pin
DVDD
GND
CN
DVDD_REG
3.3 V
ESD
1.8 V
ESD
CPVSS
3.3 V
ESD
Figure 18. DVDD_REG Pin
Figure 17. CN and CPVSS Pins
100 ꢀ
SPK_FAULT
28 V
ESD
Figure 19. SPK_FAULT Pin
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7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Low-voltage digital, analog, charge pump
supply
DVDD, AVDD, CPVDD
–0.3
3.9
V
PVDD supply
PVDD
–0.3
30
V
V
Input voltage for SPK_GAIN/FREQ and
SPK_FAULT pins
VI(AmpCtrl)
–0.3 VGVDD+0.3
DVDD referenced digital inputs(2)
Analog input into speaker amplifier
Voltage at speaker output pins
Ambient operating temperature, TA
VI(DigIn)
–0.5 VDVDD+0.5
V
V
VI(SPK_INxx)
VI(SPK_OUTxx)
–0.3
–0.3
–25
6.3
32
85
V
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO1, GPIO2, LRCK/FS, MCLK, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
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7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–40
125
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
–2
2
kV
V
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins(2)
–500
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.9
4.5
3
NOM
MAX
UNIT
DVDD, AVDD, CPVDD
PVDD
3.63
26.4
V(POWER)
Power supply inputs
V
Minimum speaker load in BTL mode
Minimum speaker load in PBTL mode
Ω
Ω
RSPK
2
Input logic high for DVDD referenced
digital inputs(1)(2)
VIH(DigIn)
VIL(DigIn)
LOUT
0.9×VDVDD
VDVDD
1
VDVDD
V
V
Input logic low for DVDD referenced
digital inputs(1)(3)
0
0.1×VDVDD
Minimum inductor value in LC filter
under short-circuit condition
4.7
µH
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO1, GPIO2, LRCK/FS, MCLK, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) The best practice for driving the input pins of the TAS5754M device is to power the drive circuit or pull-up resistor from the same supply
which provides the DVDD power supply.
(3) The best practice for driving the input pins of the TAS5754M device low is to pull them down, either actively or through pull-down
resistors to the system ground.
7.4 Thermal Information
TSSOP
(48 PINS)
THERMAL METRIC(1)
UNIT
JEDEC
JEDEC
TAS5754M-
56MEVM
STANDARD 2
LAYER PCB
STANDARD 4
LAYER PCB
(AIP012A)
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
41.8
14.4
9.4
27.6
14.4
9.4
19.4
14.4
9.4
RθJC(top)
RθJB
ψJT
Junction-to-top characterization
parameter
0.6
8.1
1.0
0.6
9.3
1.0
2.0
4.8
N/A
°C/W
ψJB
Junction-to-board characterization
parameter
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
10
UNIT
DIGITAL I/O
Input logic high current
level for DVDD
referenced digital input
pins(1)
|IIH|1
VIN(DigIn) = VDVDD
µA
Input logic low current
level for DVDD
|IIL|1
VIN(DigIn) = 0 V
–10
referenced digital input
pins.(1)
Input logic high
threshold for DVDD
referenced digital
inputs(1)
VIH1
70%
80%
VDVDD
Input logic low threshold
for DVDD referenced
digital inputs(1)
VIL1
30%
VDVDD
Output logic high
voltage level(1)
VOH(DigOut)
IOH = 4 mA
VDVDD
VDVDD
V
Output logic low voltage
level(1)
VOL(DigOut)
IOH = –4mA
22%
0.8
Output logic low voltage
level for SPK_FAULT
VOL(SPK_FAULT)
With 100-kΩ pull-up resistor
I2C CONTROL PORT
Allowable load
CL(I2C)
capacitance for each
I2C Line
400
pF
fSCL(fast)
fSCL(slow)
Support SCL frequency No wait states, fast mode
Support SCL frequency No wait states, slow mode
400
100
kHz
kHz
Noise margin at High
level for each connected
device (including
hysteresis)
VNH
0.2 × VDD
V
MCLK AND PLL SPECIFICATIONS
Allowable MCLK duty
cycle
DMCLK
40%
128
6.7
1
60%
512
20
Supported MCLK
frequencies
(2)
fMCLK
Up to 50 MHz
fS
Clock divider uses fractional divide D
> 0, P = 1
MHz
MHz
fPLL
PLL input frequency
Clock divider uses integer divide D =
0, P = 1
20
(1) DVDD referenced digital pins include: ADR0, ADR1, GPIO0, GPIO1, GPIO2, LRCK/FS, MCLK, SCL, SCLK, SDA, SDIN, and
SPK_MUTE.
(2) A unit of fS indicates that the specification is the value listed in the table multiplied by the sample rate of the audio used in the
TAS5754M device .
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
SERIAL AUDIO PORT
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Required LRCK/FS to
SCLK rising edge delay
tDLY
DSCLK
fS
5
40%
8
ns
Allowable SCLK duty
cycle
60%
192
Supported input sample
rates
kHz
Supported SCLK
frequencies
(3)
fSCLK
fSCLK
32
64
fS
SCLK frequency
Either master mode or slave mode
24.576
MHz
SPEAKER AMPLIFIER (ALL OUTPUT CONFIGURATIONS)
SPK_GAIN/FREQ voltage < 3.0 V,
see Adjustable Amplifier Gain and
Switching Frequency Selection
20.3
dBV
AV(SPK_AMP)
Speaker amplifier gain
SPK_GAIN/FREQ voltage > 3.3 V,
see Adjustable Amplifier Gain and
Switching Frequency Selection
26.427
±1
dBV
dBV
Typical variation of
speaker amplifier gain
ΔAV(SPK_AMP)
Switching frequency depends on
voltage presented at
SPK_GAIN/FREQ pin and the
clocking arrangement, including the
incoming sample rate, see Adjustable
Amplifier Gain and Switching
Frequency Selection
Switching frequency of
the speaker amplifier
fSPK_AMP
176.4
768
kHz
Injected Noise = 50 Hz to 60 Hz, 200
mVP-P, Gain = 26dBV, input audio
signal = digital zero
Power supply rejection
ratio
KSVR
60
90
dB
VPVDD = 24 V, I(SPK_OUT) = 500 mA, TJ
= 25°C, includes PVDD/PGND pins,
leadframe, bondwires and
Drain-to-source on
resistance of the
individual output
MOSFETs
mΩ
rDS(on)
metallization layers.
VPVDD = 24 V, I(SPK_OUT) = 500 mA, TJ
= 25°C
90
7.5
150
27
mΩ
A
SPK_OUTxx Over-
Current Error Threshold
OCETHRES
Over-Temperature Error
Threshold
OTETHRES
°C
V
PVDD Over-Voltage
Error Threshold
OVETHRES(PVDD)
UVETHRES(PVDD)
PVDD Under-Voltage
Error Threshold
4.5
V
SPEAKER AMPLIFIER (STEREO BTL)
Measured differentially with zero input
data, SPK_GAIN/FREQ pin
2
5
10
15
configured for 20dBV gain, VPVDD
12 V
=
|VOS
|
Amplifier offset voltage
mV
Measured differentially with zero input
data, SPK_GAIN/FREQ pin
configured for 26dBV gain, VPVDD
24 V
=
(3) A unit of fS indicates that the specification is the value listed in the table multiplied by the sample rate of the audio used in the
TAS5754M device .
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, A-Weighted
62
VPVDD = 15 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, A-Weighted
65
78
81
ICN(SPK)
Idle channel noise
µVRMS
VPVDD = 19 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, A-Weighted
VPVDD = 24 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, A-Weighted
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
14
40
VPVDD = 24 V, SPK_GAIN = 26dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
VPVDD = 24 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, THD+N = 0.1%
33
30
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, THD+N = 0.1%
Maximum continuous
output power per
channel
PO(SPK)
W
VPVDD = 19 V, SPK_GAIN = 26dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
21
18
VPVDD = 19 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, THD+N = 0.1%
VPVDD = 15 V, SPK_GAIN = 26dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
23
VPVDD = 15 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, THD+N = 0.1%
13
VPVDD = 15 V, SPK_GAIN = 26dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
102
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
103
105
103
Signal-to-noise ratio
(referenced to 0dBFS
input signal)
SNR
dB
VPVDD = 24 V, SPK_GAIN[1:0] Pins =
10, RSPK = 8 Ω, A-Weighted, -
120dBFS Input
VPVDD = 19 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 4 Ω, PO = 1 W
0.009%
0.006%
0.028%
0.018%
0.017%
0.02%
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, PO = 1 W
VPVDD = 24 V, SPK_GAIN = 20dB,
RSPK = 4 Ω, PO = 1 W
VPVDD = 15 V, SPK_GAIN = 20dB,
RSPK = 4 Ω, PO = 1 W
Total harmonic
distortion and noise
THD+NSPK
VPVDD = 15 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, PO = 1 W
VPVDD = 19 V, SPK_GAIN = 20dB,
RSPK = 4 Ω, PO = 1 W
VPVDD = 19 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, PO = 1 W
0.017%
0.022%
VPVDD = 24 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, PO = 1 W
12
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 15 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, Input Signal 250 mVrms,
1-kHz Sine, across f(S)
–102
VPVDD = 12 V, SPK_GAIN = 20dBV,
RSPK = 8 Ω, Input Signal 250 mVrms,
1-kHz Sine, across f(S)
–90
–93
–93
Cross-talk (worst case
between left-to-right and
right-to-left coupling)
X-talkSPK
dB
VPVDD = 24 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, Input Signal 250 mVrms,
1-kHz Sine, across f(S)
VPVDD = 19 V, SPK_GAIN = 20dB,
RSPK = 8 Ω, Input Signal 250 mVrms,
1-kHz Sine, across f(S)
SPEAKER AMPLIFIER (MONO PBTL)
Measured differentially with zero input
data, SPK_GAIN/FREQ pin
0.7
4
8
configured for 20dBV gain, VPVDD
12 V
=
|VOS
|
Amplifier offset voltage
mV
Measured differentially with zero input
data, SPK_GAIN/FREQ pin
configured for 20dB gain, VPVDD = 24
V
14
VPVDD = 15 V, SPK_GAIN = 20 dBV,
RSPK = 8 Ω, A-Weighted
64
62
83
82
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 8 Ω, A-Weighted
ICN
Idle channel noise
µVRMS
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, A-Weighted
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, A-Weighted
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, THD+N = 0.1%, Unless
otherwise noted
40
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
61
34
50
9
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, THD+N = 0.1%
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, THD+N = 0.1%, Unless
otherwise noted
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 8 Ω, THD+N = 0.1%
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
36
20
44
Maximum continuous
output power per
channel
PO
W
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, THD+N = 0.1%
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, THD+N = 0.1%, Unless
otherwise noted
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
22
13
30
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, THD+N = 0.1%
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 2 Ω, THD+N = 0.1%, Unless
otherwise noted
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 4 Ω, THD+N = 0.1%, Unless
otherwise noted
16
104
105
107
105
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
Signal-to-noise ratio
(referenced to 0dBFS
input signal)
SNR
dB
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, A-Weighted, -120dBFS
Input
14
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SLAS987 –JUNE 2014
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 4 Ω, PO = 1 W
0.019%
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 8 Ω, PO = 1 W
0.014%
0.035%
0.04%
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, PO = 1 W
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, PO = 1 W
VPVDD = 24 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, PO = 1 W
0.027%
0.029%
0.047%
0.025%
0.047%
0.015%
0.037%
0.020%
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, PO = 1 W
Total harmonic
distortion and noise
THD+N
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, PO = 1 W
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 4 Ω, PO = 1 W
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 2 Ω, PO = 1 W
VPVDD = 15 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, PO = 1 W
VPVDD = 12 V, SPK_GAIN = 20 dBV,
RSPK = 2 Ω, PO = 1 W
VPVDD = 19 V, SPK_GAIN = 26 dBV,
RSPK = 8 Ω, PO = 1 W
7.6 MCLK Timing
MIN
20
9
NOM
MAX
UNIT
ns
tMCLK
MCLK period
1000
tMCLKH
tMCLKL
MCLK pulse width, high
MCLK pulse width, low
ns
9
ns
t
MCLKH
"H"
0.7 × V
DVDD
0.3 × V
DVDD
"L"
t
t
MCLKL
MCLK
Figure 20. Timing Requirements for MCLK Input
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7.7 Serial Audio Port Timing – Slave Mode
MIN
40
16
16
8
NOM
MAX
UNIT
ns
tSCLK
tSCLKL
tSCLKH
tSL
SCLK period
SCLK pulse width, low
ns
SCLK pulse width, high
ns
SCLK rising to LRCK/FS edge
LRCK/FS Edge to SCLK rising edge
Data set-up time, before SCLK rising edge
Data hold time, after SCLK rising edge
Data delay time from SCLK falling edge
ns
tLS
8
ns
tSU
8
ns
tDH
8
ns
tDFS
15
ns
LRCK/FS
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
SCLKL
SCLKH
t
LS
SCLK
(Input)
t
t
SL
SCLK
DATA
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
DH
SU
t
DFS
DATA
(Output)
Figure 21. MCLK Timing Diagram in Slave Mode
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7.8 Serial Audio Port Timing – Master Mode
MIN
40
16
16
–10
8
NOM
MAX
UNIT
ns
tSCLK
tSCLKL
tSCLKH
tLRD
SCLK period
SCLK pulse width, low
ns
SCLK pulse width, high
ns
LRCK/FS delay time from to SCLK falling edge
Data set-up time, before SCLK rising edge
Data hold time, after SCLK rising edge
Data delay time from SCLK falling edge
20
15
ns
tSU
ns
tDH
8
ns
tDFS
ns
t
BCL
t
SCLK.
SCLK
(Input)
0.5 × DVDD
0.5 × DVDD
t
t
LRD
SCLK
LRCK/FS
(Input)
t
DFS
DATA
(Input)
0.5 × DVDD
t
t
DH
SU
DATA
(Output)
0.5 × DVDD
Figure 22. MCLK Timing Diagram in Master Mode
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7.9 I2C Bus Timing – Standard
MIN
MAX
UNIT
kHz
µs
fSCL
SCL clock frequency
100
tBUF
Bus free time between a STOP and START condition
Low period of the SCL clock
High period of the SCL clock
Setup time for (repeated)START condition
Hold time for (repeated)START condition
Data setup time
4.7
tLOW
tHI
4.7
µs
4.0
µs
tRS-SU
tS-HD
tD-SU
tD-HD
tSCL-R
4.7
µs
4.0
250
µs
ns
Data hold time
0
900
ns
Rise time of SCL signal
20 + 0.1CB
1000
ns
Rise time of SCL signal after a repeated START condition and after an
acknowledge bit
tSCL-R1
20 + 0.1CB
1000
ns
tSCL-F
tSDA-R
tSDA-F
tP-SU
Fall time of SCL signal
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
4.0
1000
1000
1000
ns
ns
ns
µs
Rise time of SDA signal
Fall time of SDA signal
Setup time for STOP condition
7.10 I2C Bus Timing – Fast
MIN
MAX
UNIT
kHz
µs
fSCL
SCL clock frequency
400
tBUF
Bus free time between a STOP and START condition
Low period of the SCL clock
High period of the SCL clock
Setup time for (repeated)START condition
Hold time for (repeated)START condition
Data setup time
1.3
tLOW
tHI
1.3
µs
600
ns
tRS-SU
tRS-HD
tD-SU
tD-HD
tSCL-R
600
ns
600
100
ns
ns
Data hold time
0
900
300
ns
Rise time of SCL signal
20 + 0.1CB
ns
Rise time of SCL signal after a repeated START condition and after an
acknowledge bit
tSCL-R1
20 + 0.1CB
300
ns
tSCL-F
tSDA-R
tSDA-F
tP-SU
tSP
Fall time of SCL signal
20 + 0.1CB
20 + 0.1CB
20 + 0.1CB
600
300
300
300
ns
ns
ns
ns
ns
Rise time of SDA signal
Fall time of SDA signal
Setup time for STOP condition
Pulse width of spike suppressed
50
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Repeated
START
START
STOP
t
t
t
t
P-SU
t
D-SU
D-HD
SDA-F
SDA-R
t
BUF.
SDA
t
t
t
SP
SCL-R.
RS-HD
t
LOW.
SCL
t
HI.
t
RS-SU
t
t
SCL-F.
S-HD.
Figure 23. I2C Communication Port Timing Diagram
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7.11 SPK_MUTE Timing
MIN
MAX
20
UNIT
ns
tr
tf
Rise time
Fall time
20
ns
0.9 × DV
DD
DD
0.1 × DV
SPK_MUTE
t
r
t
f
< 20 ns
< 20 ns
Figure 24. SPK_MUTE Timing Diagram for Soft Mute Operation via Hardware Pin
7.12 Power Dissipation
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(4)
(5)
VPVDD
(V)
(mA)
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
21.3
0.273
0.273
0.273
0.273
0.273
0.274
0.071
0.072
0.072
0.018
0.018
0.019
0.319
0.319
0.297
0.319
0.319
0.319
0.071
0.071
0.072
0.019
0.019
0.019
Idle
Mute
21.33
21.3
21.33
21.34
21.36
2.08
384
Standby
Powerdown
Idle
2.11
2.17
2.03
2.04
1
2.06
1
7.4
20
27.48
27.49
24.46
27.5
35
35
35
35
35
35
17
17
17
1
Mute
27.51
27.52
2.04
768
Standby
Powerdown
2.08
2.11
2.06
2.07
1
2.08
1
(1) Mute: P0-R3-B0,B5 = 1
(2) Standby: P0-R2-B5 = 1
(3) P0-R2-B0 = 1
(4) IPVDD refers to all current that flows through the PVDD supply for the DUT. Any other current sinks not directly related to the DUT current
draw were removed.
(5) IDVDD refers to all current that flows through the DVDD (3.3-V) supply for the DUT. Any other current sinks not directly related to the
DUT current draw were removed.
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Power Dissipation (continued)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
24.33
24.32
24.36
24.36
24.32
24.37
3.58
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.386
0.385
0.386
0.386
0.385
0.386
0.096
0.096
0.096
0.042
0.042
0.043
0.456
0.456
0.456
0.150
0.456
0.456
0.095
0.095
0.096
0.042
0.042
0.043
Idle
Mute
384
Standby
Powerdown
Idle
3.57
3.58
3.52
3.52
1
3.54
1
11.1
20
30.7
35
35
35
35
35
35
17
17
17
1
30.65
30.67
3.072
30.69
30.69
3.54
Mute
768
Standby
Powerdown
3.54
3.58
3.53
3.53
1
3.55
1
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Power Dissipation (continued)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
25.07
25.08
25.1
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.416
0.416
0.417
0.417
0.416
0.417
0.103
0.103
0.103
0.050
0.050
0.050
0.491
0.491
0.491
0.491
0.491
0.491
0.103
0.103
0.103
0.050
0.050
0.050
Idle
Mute
25.12
25.08
25.11
3.92
384
Standby
Powerdown
Idle
3.93
3.94
3.87
3.85
1
3.87
1
12
20
31.31
31.29
31.31
31.31
31.33
31.32
3.88
35
35
35
35
35
35
17
17
17
1
Mute
768
Standby
Powerdown
3.9
3.91
3.89
3.91
1
3.88
1
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Power Dissipation (continued)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
27.94
27.91
27.75
27.98
27.94
27.88
5.09
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.535
0.534
0.532
0.535
0.535
0.534
0.132
0.133
0.134
0.079
0.079
0.080
0.611
0.611
0.612
0.611
0.611
0.611
0.132
0.132
0.133
0.079
0.079
0.080
Idle
Mute
384
Standby
Powerdown
Idle
5.12
5.19
5.02
5.06
1
5.14
1
15
26
33.05
33.03
33.08
33.03
33.04
33.05
5.07
35
35
35
35
35
35
17
17
17
1
Mute
768
Standby
Powerdown
5.09
5.14
5.02
5.04
1
5.09
1
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Power Dissipation (continued)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
32.27
32.19
32.08
32.27
32.24
32.22
6.95
6.93
7
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
0.748
0.746
0.744
0.748
0.747
0.747
0.192
0.192
0.193
0.138
0.139
0.140
0.801
0.801
0.801
0.801
0.801
0.801
0.192
0.192
0.193
0.137
0.138
0.139
Idle
Mute
384
Standby
Powerdown
Idle
6.89
6.9
1
6.96
34.99
34.95
34.97
34.96
34.98
34.96
6.93
6.93
6.98
6.84
6.89
6.9
1
19.6
26
35
35
35
35
35
35
17
17
17
1
Mute
768
Standby
Powerdown
1
1
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Power Dissipation (continued)
(4)
(5)
VPVDD
(V)
SPK_GAIN(1)(2)(3)
(dBV)
fSPK_AMP
(kHz)
STATE OF
OPERATION
RSPK
(Ω)
IPVDD
IDVDD
PDISS
(W)
(mA)
36.93
36.87
36.77
36.94
36.89
36.85
8.73
(mA)
35
35
35
35
35
35
17
17
17
1
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
4
6
8
1.002
1.000
0.998
1.002
1.001
1.000
0.266
0.265
0.265
0.211
0.211
0.212
1.000
1.000
0.999
1.000
1.000
0.999
0.264
0.264
0.265
0.210
0.211
0.211
Idle
Mute
384
Standby
Powerdown
Idle
8.72
8.71
8.64
8.66
1
8.69
1
24
26
36.84
36.86
36.83
36.85
36.84
36.82
8.66
35
35
35
35
35
35
17
17
17
1
Mute
768
Standby
Powerdown
8.68
8.71
8.63
8.64
1
8.65
1
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7.13 Typical Performance Plots for the TAS5754M
All performance plots were taken using the TAS5754M-56MEVM at room temperature, unless otherwise noted.
The term "Traditional LC filter" refers to the output filter that is present by default on the EVM. For "Filterless"
measurements, the on-board LC filter was removed and an Audio Precision AUX-025 measurement filter was
used to take the measurements.
Table 1. Quick Reference Table
OUTPUT
CONFIG
PLOT TITLE
PLOT NUMBER
Figure 25. Output Power vs PVDD
C036
C034
C002
C037
C003
C035
C004
C038
C005
C006
C007
C013
C015
C008
C009
C010
C011
C012
C014
C039
C017
C018
C019
C020
C021
C022
C023
C024
C025
C026
C031
C033
C027
C028
C029
C030
C032
Figure 26. THD+N vs Frequency, VPVDD = 12 V
Figure 27. THD+N vs Frequency, VPVDD = 15 V
Figure 28. THD+N vs Frequency, VPVDD = 18 V
Figure 29. THD+N vs Frequency, VPVDD = 24 V
Figure 30. THD+N vs Power, VPVDD = 12 V
Figure 31. THD+N vs Power, VPVDD = 15 V
Figure 32. THD+N vs Power, VPVDD = 18 V
Figure 33. THD+N vs Power, VPVDD = 24 V
Figure 34. Idle Channel Noise vs PVDD
Figure 35. Efficiency vs Output Power
BTL
Figure 36. Idle Current Draw (Filterless) vs PVDD
Figure 37. Idle Current Draw (Traditional LC Filter) vs PVDD
Figure 38. Crosstalk vs. Frequency
Figure 39. PVDD PSRR vs Frequency
Figure 40. DVDD PSRR vs Frequency
Figure 41. AVDD PSRR vs Frequency
Figure 42. CPVDD PSRR vs Frequency
Figure 43. Powerdown Current Draw vs PVDD
Figure 44. Output Power vs PVDD
Figure 45. THD+N vs Frequency, VPVDD = 12 V
Figure 46. THD+N vs Frequency, VPVDD = 15 V
Figure 47. THD+N vs Frequency, VPVDD = 18 V
Figure 48. THD+N vs Frequency, VPVDD = 24 V
Figure 49. THD+N vs Power, VPVDD = 12 V
Figure 50. THD+N vs Power, VPVDD = 15 V
Figure 51. THD+N vs Power, VPVDD = 18 V
Figure 52. THD+N vs Power, VPVDD = 24 V
Figure 53. Idle Channel Noise vs PVDD
Figure 54. Efficiency vs Output Power
PBTL
Figure 55. Idle Current Draw (filterless) vs PVDD
Figure 56. Idle Current Draw (traditional LC filter) vs PVDD
Figure 57. PVDD PSRR vs Frequency
Figure 58. DVDD PSRR vs Frequency
Figure 59. AVDD PSRR vs Frequency
Figure 60. CPVDD PSRR vs Frequency
Figure 61. Powerdown Current Draw vs PVDD
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7.13.1 Bridge Tied Load (BTL) Configuration Curves
Return to Quick Reference Table.
50
1
0.1
Inst Power, Rspk = 8
Rspk = 4
Rspk = 6
Rspk = 8
Cont Power, Rspk = 8
Inst Power, Rspk = 6
Cont Power, Rspk = 6
Inst Power, Rspk = 4
Cont Power, Rspk = 4
45
40
35
30
25
20
15
10
5
0.01
0.001
0
4
6
8
10
12
14
16
18
20
22
24
20
200
2k
20k
PVDD (V)
Frequency (Hz)
C036
C034
AV(SPK_AMP) = 26dBV
Figure 25. Output Power vs PVDD – BTL
AV(SPK_AMP) = 20dBV
PO = 1W
VPVDD = 12V
Figure 26. THD+N vs Frequency – BTL
1
1
0.1
Rspk = 4
Rspk = 4
Rspk = 6
Rspk = 8
Rspk = 6
Rspk = 8
0.1
0.01
0.001
0.01
0.001
20
200
2k
20k
20
200
2k
20k
Frequency (Hz)
Frequency (Hz)
C002
C037
AV(SPK_AMP) = 20dBV
PO = 1W
VPVDD = 15V
AV(SPK_AMP) = 20dBV
PO = 1W
VPVDD = 18V
Figure 27. THD+N vs Frequency – BTL
Figure 28. THD+N vs Frequency – BTL
1
0.1
10
1
Rspk = 4
Rspk = 4
Rspk = 6
Rspk = 8
Rspk = 6
Rspk = 8
0.1
0.01
0.001
0.01
0.001
20
200
2k
20k
0.01
0.1
1
10
Frequency (Hz)
Power (W)
C003
C035
AV(SPK_AMP) = 26dBV
PO = 1W
VPVDD = 24V
AV(SPK_AMP) = 20dBV
Input Signal =
1kHz Sine
VPVDD = 12V
Figure 29. THD+N vs Frequency – BTL
Figure 30. THD + N vs Power – BTL
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10
1
10
1
Rspk = 4
Rspk = 6
Rspk = 8
Rspk = 4
Rspk = 6
Rspk = 8
0.1
0.01
0.1
0.01
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
Power (W)
Power (W)
C004
C038
AV(SPK_AMP) = 20dBV
Input Signal =
1kHz Sine
VPVDD = 15V
AV(SPK_AMP) = 26dBV
Input Signal =
1kHz Sine
VPVDD = 18V
Figure 31. THD + N vs Power – BTL
Figure 32. THD + N vs Power – BTL
10
1
150
125
100
75
Gain = 20dBV, fspk_amp = 384kHz
Gain = 26dBV, fspk_amp = 384kHz
Gain = 20dBV, fspk_amp = 768kHz
Gain = 26dBV, fspk_amp = 768kHz
Rspk = 4
Rspk = 6
Rspk = 8
0.1
50
0.01
0.001
25
0
0.01
0.1
1
10
4
6
8
10
12
14
16
18
20
22
24
Power (W)
PO = 1W
PVDD (V)
C005
C006
AV(SPK_AMP) = 26dBV
VPVDD = 24V
AV(SPK_AMP) = 20dBV
fSPK_AMP
384kHz
=
RSPK = 8Ω
Figure 34. Idle Channel Noise vs PVDD – BTL
Figure 33. THD + N vs Power – BTL
100
90
80
70
60
50
60
50
40
30
20
10
0
Filterless
PVDD = 12V
PVDD = 15V
PVDD = 18V
PVDD = 24V
0
20
40
60
80
100
4
6
8
10
12
14
16
18
20
22
24
Total Output Power (W)
PVDD (V)
C007
C013
RSPK = 8 Ω
fSPK_AMP = 768kHz
RSPK = 8Ω
Figure 35. Efficiency vs Output Power – BTL
Figure 36. Idle Current Draw (Filterless) vs VPVDD– BTL
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0
±10
Ch. B vs Ch. A
Ch. A vs Ch. B
Traditional LC
80
70
60
50
40
30
20
10
0
±20
±30
±40
±50
±60
±70
±80
±90
±100
±110
±120
4
6
8
10
12
14
16
18
20
22
24
20
200
2k
20k
PVDD (V)
Frequency (Hz)
C015
C008
fSPK_AMP = 768kHz
RSPK = 8Ω
AV(SPK_AMP) = 26dBV
Sine Input
VPVDD = 24V
Figure 37. Idle Current Draw (Traditional LC Filter) vs
PVDD – BTL
Figure 38. Crosstalk vs Frequency – BTL
0
0
±10
±20
±30
±40
±50
±60
±70
±80
±90
Ch. B kSVR
Ch. A kSVR
Ch. B vs Ch. A
±10
Ch. A vs Ch. B
±20
±30
±40
±50
±60
±70
±80
±90
20
200
2k
20k
20
200
2k
20k
Frequency (Hz)
Frequency (Hz)
C009
Supply Noise =
250mV
C010
AV(SPK_AMP) = 26dBV
VPVDD = 24V
Sine Input
AV(SPK_AMP) = 26dBV
VPVDD = 24V
RSPK = 8Ω
Supply Noise =
250mV
Figure 39. PVDD PSRR vs Frequency – BTL
Figure 40. DVDD PSRR vs Frequency – BTL
0
±10
±20
±30
±40
±50
±60
±70
±80
±90
0
±10
±20
±30
±40
±50
±60
±70
±80
±90
Ch. B kSVR
Ch. A kSVR
Left kSVR
Right kSVR
20
200
2k
20k
20
200
2k
20k
Frequency (Hz)
Frequency (Hz)
C011
Supply Noise =
250mV
C012
Supply Noise =
250mV
AV(SPK_AMP) = 26dBV
VPVDD = 24V
RSPK = 8Ω
AV(SPK_AMP) = 26dBV
VPVDD = 24V
Sine Input
Figure 41. AVDD PSRR vs Frequency – BTL
Figure 42. CPVDD PSRR vs Frequency – BTL
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10
9
8
7
6
5
4
3
2
1
0
Shutdown
4
6
8
10
12
14
16
18
20
22
24
PVDD (V)
C014
AV(SPK_AMP) = 26dBV
fSPK_AMP
786kHz
=
Figure 43. Powerdown Current Draw vs PVDD – BTL
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7.13.2 Parallel Bridge Tied Load (PBTL) Configuration
Return to Quick Reference Table.
120
1
0.1
Inst Power, Rspk = 4
Cont Power, Rspk = 4
Ins Power, Rspk = 3
Cont Power, Rspk = 3
Inst Power, Rspk = 2
Cont Power, Rspk = 2
Rspk = 2
Rspk = 3
Rspk = 4
100
80
60
40
20
0
0.01
0.001
4
6
8
10
12
14
16
18
20
22
24
20
200
2k
20k
PVDD (V)
C017
Frequency (Hz)
C039
AV(SPK_AMP) = 26dBV
Measured on
TAS5754/6
EVM
AV(SPK_AMP) = 20dBV
PO = 1W
VPVDD = 12V
Figure 45. THD+N vs Frequency – PBTL
Figure 44. Output Power vs PVDD – PBTL
1
0.1
1
0.1
Rspk = 2
Rspk = 3
Rspk = 4
Rspk = 2
Rspk = 3
Rspk = 4
0.01
0.001
0.01
0.001
20
200
2k
20k
20
200
2k
20k
C018
C019
Frequency (Hz)
Frequency (Hz)
AV(SPK_AMP) = 20dBV
PO = 1W
VPVDD = 15V
AV(SPK_AMP) = 26dBV
PO = 1W
VPVDD = 18V
Figure 46. THD+N vs Frequency – PBTL
Figure 47. THD+N vs Frequency – PBTL
10
1
1
0.1
Rspk = 2
Rspk = 3
Rspk = 4
Rspk = 2
Rspk = 3
Rspk = 4
0.1
0.01
0.001
0.01
0.001
0.01
0.1
1
10
20
200
2k
20k
Power (W)
PO = 1W
C020
Frequency (Hz)
C021
AV(SPK_AMP) = 26dBV
PO = 1W
VPVDD = 24V
AV(SPK_AMP) = 20dBV
VPVDD = 12V
Figure 48. THD+N vs Frequency – PBTL
Figure 49. THD+N vs Power – PBTL
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10
1
10
1
Rspk = 2
Rspk = 3
Rspk = 4
Rspk = 2
Rspk = 3
Rspk = 4
0.1
0.01
0.1
0.01
0.001
0.001
0.01
0.1
1
10
0.01
0.1
1
10
100
Power (W)
PO = 1W
Power (W)
C022
C023
AV(SPK_AMP) = 20dBV
VPVDD = 15V
AV(SPK_AMP) = 20dBV
VPVDD = 18V
Input Signal =
1kHz Sine
PO = 1W
Figure 50. THD+N vs Power – PBTL
Figure 51. THD+N vs Power – PBTL
10
1
150
125
100
75
Gain = 20dBV, fS = 384kHz
Gain = 26dBV, fS = 384kHz
Gain = 20dBV, fS = 768kHz
Gain = 26dBV, fS = 768kHz
Rspk = 2
Rspk = 3
Rspk = 4
0.1
50
0.01
0.001
25
0
0.01
0.1
1
10
100
4
6
8
10
12
14
16
18
20
22
24
Power (W)
PVDD (V)
C024
C025
AV(SPK_AMP) = 20dBV
VPVDD = 24V
Input Signal =
1kHz Sine
PO = 1W
AV(SPK_AMP) = 26dBV
ILOAD = xA
VPVDD = 18V
Figure 53. Idle Channel Noise vs PVDD – PBTL
Figure 52. THD+N vs Power – PBTL
100
90
80
70
60
50
60
50
40
30
20
10
0
PVDD = 12V
PVDD = 15V
PVDD = 18V
PVDD = 24V
Filterless
0
20
40
60
80
100
4
6
8
10
12
14
16
18
20
22
24
Total Output Power (W)
PVDD (V)
C026
C031
AV(SPK_AMP) = 26dBV
ILOAD = xA
VPVDD = 24V
Figure 54. Efficiency vs Output Power – PBTL
Figure 55. Idle Current Draw (Filterless) vs PVDD – PBTL
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0
±10
±20
±30
±40
±50
±60
±70
±80
±90
Rspk = 4
80
70
60
50
40
30
20
10
0
Traditional LC
20 22
4
6
8
10
12
14
16
18
24
20
200
2k
20k
PVDD (V)
Frequency (Hz)
C033
C027
AV(SPK_AMP) = 26dBV
Sine Input
VPVDD = 24V
Figure 56. Idle Current Draw (Traditional LC filter) vs
PVDD – PBTL
Figure 57. PVDD PSRR vs Frequency – PBTL
0
0
±10
±20
±30
±40
±50
±60
±70
±80
±90
Rspk = 4
Rspk = 4
±10
±20
±30
±40
±50
±60
±70
±80
±90
20
200
2k
20k
20
200
2k
20k
Frequency (Hz)
Frequency (Hz)
C028
Supply Noise =
250mV
C029
Supply Noise =
250mV
AV(SPK_AMP) = 26dBV
VPVDD = 24V
RSPK = 8Ω
AV(SPK_AMP) = 26dBV
VPVDD = 24V
RSPK = 8Ω
Figure 58. DVDD PSRR vs Frequency – PBTL
Figure 59. AVDD PSRR vs Frequency – PBTL
0
±10
±20
±30
±40
±50
±60
±70
±80
±90
10
9
8
7
6
5
4
3
2
1
0
Rspk = 4
Shutdown
20
200
2k
20k
4
6
8
10
12
14
16
18
20
22
24
Frequency (Hz)
PVDD (V)
C030
Supply Noise =
250mV
C032
AV(SPK_AMP) = 26dBV
VPVDD = 24V
Sine Input
AV(SPK_AMP) = 26dBV
fSPK_AMP
786kHz
=
Figure 61. Powerdown Current Draw vs PVDD – PBTL
Figure 60. CPVDD PSRR vs Frequency – PBTL
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8 Detailed Description
8.1 Overview
The TAS5754M device integrates 4 main building blocks together into a single cohesive device that maximizes
sound quality, flexibility, and ease of use. These are shown in the list below:
1. A stereo Audio DAC, boasting a strong Burr-Brown heritage with a highly flexible serial audio port.
2. A miniDSP audio processing core with HybridFlow architecture, which provides an increase in flexibility over
a fixed-function ROM device with faster download time than a fully programmable device
3. A flexible closed-loop amplifier capable of operating in stereo or mono, at several different switching
frequencies, and with a variety of output voltages and loads.
4. An I2C control port for communication with the device
The device requires only two power supplies for proper operation. A DVDD supply is needed to power the low-
voltage digital and analog circuitry. Another supply, called PVDD, is needed to provide power to the output stage
of the audio amplifier. The operating range for these supplies is shown in the Recommended Operating
Conditions table.
Communication with the device is accomplished via the I2C control port. A speaker amplifier fault line is also
provided to notify a system controller of the occurrence of an over-temperature, over-current, over-voltage,
under-voltage, or DC error in the speaker amplifier. There are three digital GPIO pins that are available for use
by the HybridFlows. One popular use of the GPIO lines is to provide a Serial Audio Output from the device
(SDOUT). HybridFlows which provide an SDOUT customarily present that signal on GPIO2, although this
configuration can be changed via the I2C control port. The register space in the control port spans several pages
to accommodate some static controls which maintain their functionality across HybridFlows, as well as controls
that are determined by the HybridFlow used.
The MiniDSP audio processing core, featuring a HybridFlow architecture, allows the selection of a configurable
DSP program called a HybridFlow from a list of available HybridFlows. A hybrid flow combines audio processing
blocks, many of which that are built in the ROM portion of the device, together in a single payload. The PurePath
Console GUI provides a means by which to select the HybridFlow and manipulate the controls associated with
that HybridFlow.
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8.2 Functional Block Diagram
Internal
Voltage
Supplies
Charge
Pump
Internal Gate
Drive Regulator
1.8-V
Internal Voltage
Regulator
Supplies
Closed Loop Class D Amplifier
Gate
SPK_OUTA+
SPK_OUTA-
Full Bridge
Power
Stage A
Mini-DSP
Output
Current
Monitoring
and
Protection
Analog
to
Drives
Hybrid RAM/
ROM
Architecture
with
Several
Selectable
HybridFlows
MCLK
SCLK
SPK_OUTB+
SPK_OUTB-
PWM
Modulator
Full Bridge
Power
Stage B
Gate
Drives
DAC
Serial
Audio
Port
LRCK/FS
SDIN
Clock Monitoring
and Error Protection
Die Temperature
Monitoring and Protection
Error Reporting
SDOUT
Internal Control Registers and State Machines
GPIO0
GPIO1 GPIO2
SPK_GAIN/FREQ
SCL
SDA
ADR0
ADR1
SPK_MUTE
SPK_SD SPK_FAULT
8.3 Feature Description
8.3.1 Power-on-Reset (POR) Function
The TAS5754M device has a power-on reset function. This feature resets all of the registers to their default
configuration as the device is powering up. When the low-voltage power supply used to power DVDD, AVDD,
and CPVDD exceeds the POR threshold, the device holds sets all of the internal registers to their default values
and holds them there until it receives valid MCLK, SCLK, and LRCK/FS toggling for a period of approximately 4
ms. After the toggling period has passed, the internal reset of the registers is removed and the registers can be
programmed via the I2C Control Port.
8.3.2 Device Clocking
The TAS5754M devices have flexible systems for clocking. Internally, the device requires a number of clocks,
mostly at related clock rates to function correctly. All of these clocks can be derived from the Serial Audio
Interface in one form or another.
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Feature Description (continued)
fS
(24-bit)
16 fS
(24-bit)
128 fS
(~8-bit)
Serial Audio
Interface
(Input)
miniDSP
(including
interpolator)
Delta
Sigma
Modulator
I to V
Line
Driver
Current
Segments
+
Audio
In
Audio
Out
Charge Pump
CPCK
DSPCK
OSRCK
DACCK
LRCK/FS
Figure 62. Audio Flow with Respective Clocks
As shown in Figure 62 the basic data flow at basic sample rate (fS). Once the data is brought into the serial audio
interface, it is processed, interpolated and modulated to 128 × fS before arriving at the current segments for the
final digital to analog conversion.
The clock tree is shown in Figure 63.
PLLEN
(P0-R4)
MCLK
SREF
(P0-R13)
Divider
DDSP (P0-R27)
SCLK
GPIO
MCLK
SDAC
(P0-R14)
PLL
K × R/P
PLLCKIN
PLLCK
K = J.D
J = 1,2,3,«..,62,63
D= 0000,0001,«.,9998,9999
R= 1,2,3,4,«.,15,16
DACCK (DAC Clock )
MCLK
GPIO
Divider
CPCK (Charge Pump Clock )
P= 1,2,«.,127,128
DDAC
(P0-R28)
Divider
DNCP (P0-R29)
OSRCK
(Oversampling
Ratio Clock )
Divider
MUX
DOSR
(P0-R30)
Divide
by 2
I16E (P0-R34)
Figure 63. TAS5754M Clock Distribution Tree
The Serial Audio Interface typically has 4 connection pins
1. MLCK (System Master Clock),
2. SLCK (Bit Clock)
3. LRCK/FS (Left Right Word Clock and Frame Sync)
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Feature Description (continued)
4. SDIN (note that this is the input data. The output date, SDOUT, is presented on one of the GPIO pins. See
Serial Data Output)
The device has an internal PLL that is used to take either MLCK or SLCK and create the higher rate clocks
required by the and the DAC clock.
In situations where the highest audio performance is required, it’s suggested that the MLCK is brought to the
device, along with SLCK and LRCK/FS. The device should be configured so that the PLL is only providing a
clock source to the DSP. All other clocks are then be a division of the incoming MLCK. This is done by setting
DAC CLK Source Mux (SDAC in the diagram above) to use MLCK as a source, rather than the output of the
MLCK/PLL Mux.
8.3.3 Serial Audio Port
8.3.3.1 Clock Master Mode from Audio Rate Master Clock
In Master Mode, the device generates bit clock and left-right and frame sync clock and outputs them on the
appropriate pins. To configure the device in this mode, first put the device into reset, then use registers SLCKO
and LRKO (P0-R9). Then reset the LRCK/FS and SCLK divider counters using bits RSLCK and RLRK (P0-R12).
Finally, exit reset.
Figure 64 shows a simplified serial port clock tree for the device in master mode.
Audio Related System Clock (MCLK)
MCLK
SCLKO (Bit Clock Output In Master Mode)
Divider
Q1 = 1...128
SCLK
LRCK/FS (LR Clock or Frame Sync Output In
Master Mode
Divider
LRCK/FS
Q1 = 1...128
Figure 64. Simplified Clock Tree for MLCK Sourced Master Mode
In master mode, MLCK is an input and SCLK and LRCK/FS are outputs. SCLK and LRCK/FS are integer
divisions of MLCK. Master mode with a non-audio rate master clock source will require external GPIO’s to use
the PLL in standalone mode. The PLL needs to be configured to ensure that the on-chip processor can be driven
at its maximum clock rate. This mode of operation is described in the Clock Master from a Non-Audio Rate
Master Clock section.
When used with Audio Rate Master Clocks, the register changes that need to be done include switching the
device into master mode, and setting the divider ratio. An example of this mode of operations is using 24.576
MCLK as a master clock source and driving the SCLK and LRCK/FS with integer dividers to create 48 kHz. In
this mode, the DAC section of the device is also running from the PLL output. The TAS5754M device is able to
meet the specified audio performance while using the internal PLL. However, using the MCLK CMOS oscillator
source will have less jitter than the PLL.
To switch the DAC clocks (SDAC in the Figure 63) the following registers should be modified
•
•
Clock Tree Flex Mode (P253-R63 and P253-R64)
DAC and OSR Source Clock Register (P0-R14). Set to 0x30 (MLCK input, and OSR is set to whatever the
DAC source is)
•
The DAC clock divider should be 16fS.
–
–
–
16 × 48 kHz = 768 kHz
24.576 MHz (MLCK in) / 768 kHz = 32
Therefore, the divide ratio for register DDAC (P0-R28) should be set to 32. The register mapping gives
0x00 = 1, so 32 must be converter to 0x1F (31dec).
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Feature Description (continued)
8.3.3.2 Clock Master from a Non-Audio Rate Master Clock
The classic example here is running 12-MHz Master clock for a 48-kHz sampling system. Given the clock tree for
the device (shown in Figure 63), a non-audio clock rate cannot be brought into the MLCK to the PLL in master
mode. Therefore, the PLL source must be configured to be a GPIO pin, and the output brought back into another
GPIO pin.
Non-Audio MCLK
GPOIx
PLL
GPOIy
New
Audio
MCLK
MCLK
Master Mode
SLCK Integer
Divider
SCLK
Out
SCLK
Master Mode
LRCK/FS
Integer Divider
LRCK/FS
Out
LRCK/FS
Figure 65. Generating Audio Clocks Using Non-Audio Clock Sources
The clock flow through the system is shown above. The newly generated MLCK must be brought out of the
device on a GPIO pin, then brought into the MLCK pin for integer division to create SCLK and LRCK/FS outputs.
NOTE
Pull-up resistors should be used on SCLK and LRCK/FS in this mode to ensure the device
remains out of sleep mode.
8.3.3.3 Clock Slave Mode with 4-Wire Operation (SCLK, MCLK, LRCK/FS, SDIN)
The TAS5754M device requires a system clock to operate the digital interpolation filters and advanced segment
DAC modulators. The system clock is applied at the MLCK input and supports up to 50 MHz. The TAS5754M
device system-clock detection circuit automatically senses the system-clock frequency. Common audio sampling
frequencies in the bands of 8 kHz, 16 kHz, (32 kHz - 44.1 kHz - 48kHz), (88.2 kHz - 96 kHz), and (176.4 kHz -
192 kHz) are supported.
NOTE
Values in the parentheses are grouped when detected, e.g. 88.2 kHz and 96 kHz are
detected as double rate, 32 kHz, 44.1 kHz and 48 kHz are detected as single rate, etc.
In the presence of a valid bit MCLK, SCLK and LRCK/FS, the device automatically configures the clock tree and
PLL to drive the miniDSP as required.
The sampling frequency detector sets the clock for the digital filter, Delta Sigma Modulator (DSM) and the
Negative Charge Pump (NCP) automatically. Table 2 shows examples of system clock frequencies for common
audio sampling rates.
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Feature Description (continued)
MLCK rates that are not common to standard audio clocks, between 1 MHz and 50 MHz, are supported by
configuring various PLL and clock-divider registers. This programmability allows the device to become a clock
master and drive the host serial port with LRCK/FS and SLCK, from a non-audio related clock (for example,
using a setting of 12 MHz to generate 44.1 kHz (LRCK/FS) and 2.8224 MHz (SLCK) ).
shows the timing requirements for the system clock input. For optimal performance, use a clock source with low
phase jitter and noise. For MCLK timing requirements, refer to the Serial Audio Port Timing – Master Mode
section.
Table 2. System Master Clock Inputs for Audio Related Clocks
SYSTEM CLOCK FREQUENCY (fMLCK) (MHz)
SAMPLING
FREQUENCY
64 fS
128 fS
1.0240(2)
2.0480(2)
4.0960(2)
5.6488(2)
6.1440(2)
11.2896(2)
12.2880(2)
22.5792
192 fS
256 fS
2.0480
384 fS
3.0720
512 fS
4.0960
8 kHz
16 kHz
1.5360(2)
3.0720(2)
6.1440(2)
8.4672(2)
9.2160(2)
16.9344
18.4320
33.8688
36.8640
4.0960
6.1440
8.1920
32 kHz
8.1920
12.2880
16.9344
18.4320
33.8688
36.8640
16.3840
22.5792
24.5760
45.1584
49.1520
44.1 kHz
48 kHz
11.2896
12.2880
22.5792
24.5760
45.1584
49.1520
See note(1)
88.2 kHz
96 kHz
176.4 kHz
192 kHz
See note(1)
See note(1)
24.5760
(1) This system clock rate is not supported for the given sampling frequency.
(2) This system clock rate is supported by PLL mode.
8.3.3.4 Clock Slave Mode with SLCK PLL to Generate Internal Clocks (3-Wire PCM)
8.3.3.4.1 Clock Generation using the PLL
The TAS5754M device supports a wide range of options to generate the required clocks as shown in Figure 63.
The clocks for the PLL require a source reference clock. This clock is sourced as the incoming SLCK or MLCK, a
GPIO can also be used.
The source reference clock for the PLL reference clock is selected by programming the SRCREF value on P0-
R13, B[6:4]. The TAS5754M device provides several programmable clock dividers to achieve a variety of
sampling rates. See Figure 63.
If PLL functionality is not required, set the PLLEN value on P0-R4, B[0] to 0. In this situation, an external master
clock is required.
Table 3. PLL Configuration Registers
CLOCK MULTIPLEXER
FUNCTION
PLL Reference
FUNCTION
clock divider
BITS
BITS
SREF
DIVIDER
DDSP
P0-R13, B[6:4]
P0-R27, B[6:0]
P0-R32, B[6:0]
P0-R33, B[7:0]
DSLCK
DLRK
External SLCK Div
External LRCK/FS Div
8.3.3.4.2 PLL Calculation
The TAS5754M device has an on-chip PLL with fractional multiplication to generate the clock frequency needed
by the Digital Signal Processing blocks. The programmability of the PLL allows operation from a wide variety of
clocks that may be available in the system. The PLL input (PLLCKIN) supports clock frequencies from 1 MHz to
50 MHz and is register programmable to enable generation of required sampling rates with fine precision.
The PLL is enabled by default. The PLL can be enabled by writing to P0-R4, B[0]. When the PLL is enabled, the
PLL output clock PLLCK is given by Equation 1:
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PLLCKIN x R x J.D
P
PLLCKIN x R x K
P
PLLCK =
or PLLCK =
where
•
•
•
•
R = 1, 2, 3,4, ... , 15, 16
J = 4,5,6, . . . 63, and D = 0000, 0001, 0002, . . . 9999
K = [J value].[D value]
P = 1, 2, 3, ... 15
(1)
R, J, D, and P are programmable. J is the integer portion of K (the numbers to the left of the decimal point), while
D is the fractional portion of K (the numbers to the right of the decimal point, assuming four digits of precision).
8.3.3.4.2.1 Examples:
•
•
•
•
If K = 8.5, then J = 8, D = 5000
If K = 7.12, then J = 7, D = 1200
If K = 14.03, then J = 14, D = 0300
If K = 6.0004, then J = 6, D = 0004
When the PLL is enabled and D = 0000, the following conditions must be satisfied:
•
•
•
1 MHz ≤ ( PLLCKIN / P ) ≤ 20 MHz
64 MHz ≤ (PLLCKIN x K x R / P ) ≤ 100 MHz
1 ≤ J ≤ 63
When the PLL is enabled and D ≠ 0000, the following conditions must be satisfied:
•
•
•
•
6.667 MHz ≤ PLLCLKIN / P ≤ 20 MHz
64 MHz ≤ (PLLCKIN x K x R / P ) ≤ 100 MHz
4 ≤ J ≤ 11
R = 1
When the PLL is enabled,
•
•
fS = (PLLCLKIN × K × R) / (2048 × P)
The value of N is selected so that fS × N = PLLCLKIN x K x R / P is in the allowable range.
Example: MCLK = 12 MHz and fS = 44.1 kHz, (N=2048)
Select P = 1, R = 1, K = 7.5264, which results in J = 7, D = 5264
Example: MCLK = 12 MHz and fS = 48.0 kHz, (N=2048)
Select P = 1, R = 1, K = 8.192, which results in J = 8, D = 1920
Values are written to the registers in Table 4.
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Table 4. PLL Registers
DIVIDER
PLLE
FUNCTION
BITS
PLL enable
PLL P
P0-R4, B[0]
PPDV
PJDV
P0-R20, B[3:0]
P0-R21, B[5:0]
P0-R22, B[5:0]
P0-R23, B[7:0]
P0-R24, B[3:0]
PLL J
PDDV
PRDV
PLL D
PLL R
Table 5. PLL Configuration Recommendations
COLUMN
fS (kHz)
DESCRIPTION
Sampling frequency
RMLCK
Ratio between sampling frequency and MLCK frequency (MLCK frequency = RMLCK x sampling frequency)
System master clock frequency at MLCK input (pin 20)
MLCK (MHz)
PLL VCO (MHz) PLL VCO frequency as PLLCK in Figure 63
One of the PLL coefficients in Equation 1
PLL REF (MHz) Internal reference clock frequency which is produced by MLCK / P
P
M = K × R
K = J.D
R
The final PLL multiplication factor computed from K and R as described in Equation 1
One of the PLL coefficients in Equation 1
One of the PLL coefficients in Equation 1
PLL fS
DSP fS
NMAC
Ratio between fS and PLL VCO frequency (PLL VCO / fS)
Ratio between operating clock rate and fS (PLL fS / NMAC)
The clock divider value in Table 3
DSP CLK (MHz) The operating frequency as DSPCK in Figure 63
MOD fS
Ratio between DAC operating clock frequency and fS (PLL fS / NDAC)
MOD f (kHz)
NDAC
DAC operating frequency as DACCK in
DAC clock divider value in Table 3
OSR clock divider value in Table 3 for generating OSRCK in Figure 63. DOSR must be chosen so that MOD fS / DOSR =
16 for correct operation.
DOSR
NCP
CP f
NCP (negative charge pump) clock divider value in Table 3
Negative charge pump clock frequency (fS * MOD fS / NCP)
Percentage of error between PLL VCO / PLL fS and fS (mismatch error).
% Error
•
•
This value is typically zero but can be non-zero especially when K is not an integer (D is not zero).
This value may be non-zero only when the TAS5754M device acts as a master.
The equations above explain how to calculate all necessary coefficients and controls to configure the PLL.
Table 6 provides for easy reference to the recommended clock divider settings for the PLL as a Master Clock.
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Table 6. Recommended Clock Divider Settings for PLL as Master Clock
fS
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
(kHz)
RMLCK
(kHz)
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
8
8
8
8
8
8
8
8
8
8
8
128
192
1.024
1.536
2.048
3.072
4.096
6.144
8.192
9.216
12.288
16.384
24.576
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
3
3
3
3
9
9
9
9
1.024
1.536
2.048
1.024
1.365
2.048
2.731
1.024
1.365
1.82
96
64
48
96
72
48
36
96
72
54
36
48
32
48
48
36
48
36
48
36
54
36
2
2
1
2
2
1
1
2
2
1
1
12288
12288
12288
12288
12288
12288
12288
12288
12288
12288
12288
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
12
12
12
12
12
12
12
12
12
12
12
8.192
8.192
8.192
8.192
8.192
8.192
8.192
8.192
8.192
8.192
8.192
768
768
768
768
768
768
768
768
768
768
768
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
16
16
16
48
48
48
48
48
48
48
48
48
48
48
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
256
384
512
768
1024
1152
1536
2048
3072
2.731
11.025
11.025
11.025
11.025
11.025
11.025
11.025
11.025
11.025
11.025
11.025
128
192
1.4112
2.1168
2.8224
4.2336
5.6448
8.4672
11.2896
12.7008
16.9344
22.5792
33.8688
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
1
3
1
3
3
3
3
9
9
9
9
1.411
0.706
2.822
1.411
1.882
2.822
3.763
1.411
1.882
2.509
3.763
64
128
32
64
48
32
24
64
48
36
24
32
32
32
32
48
32
24
32
48
36
24
2
4
1
2
1
1
1
2
1
1
1
8192
8192
8192
8192
8192
8192
8192
8192
8192
8192
8192
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
8
8
8
8
8
8
8
8
8
8
8
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
11.2896
512
512
512
512
512
512
512
512
512
512
512
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
16
16
16
16
16
16
16
16
16
16
16
32
32
32
32
32
32
32
32
32
32
32
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
256
384
512
768
1024
1152
1536
2048
3072
16
16
16
16
16
16
16
16
16
16
16
16
64
1.024
2.048
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
1
3
3
3
3
3
9
9
9
1.024
2.048
3.072
4.096
2.048
2.731
4.096
5.461
6.144
2.731
3.641
5.461
96
48
32
24
48
36
24
18
16
36
27
18
48
48
32
24
48
36
24
18
16
36
27
18
2
1
1
1
1
1
1
1
1
1
1
1
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
6
6
6
6
6
6
6
6
6
6
6
6
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
16.384
384
384
384
384
384
384
384
384
384
384
384
384
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
16
16
16
16
24
24
24
24
24
24
24
24
24
24
24
24
0
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
128
192
3.072
256
4.096
384
6.144
512
8.192
768
12.288
16.384
18.432
24.576
32.768
49.152
1024
1152
1536
2048
3072
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Table 6. Recommended Clock Divider Settings for PLL as Master Clock (continued)
fS
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
RMLCK
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
(kHz)
22.05
22.05
22.05
22.05
22.05
22.05
22.05
22.05
22.05
22.05
22.05
(kHz)
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
64
1.4112
2.8224
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
1
1
3
1
3
3
3
3
9
9
9
1.411
2.822
1.411
5.645
2.822
3.763
5.645
7.526
2.822
3.763
5.018
64
32
64
16
32
24
16
12
32
24
18
32
32
32
16
32
24
16
12
32
24
18
2
1
2
1
1
1
1
1
1
1
1
4096
4096
4096
4096
4096
4096
4096
4096
4096
4096
4096
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
4
4
4
4
4
4
4
4
4
4
4
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
22.5792
256
256
256
256
256
256
256
256
256
256
256
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
128
192
4.2336
256
5.6448
384
8.4672
512
11.2896
16.9344
22.5792
25.4016
33.8688
45.1584
768
1024
1152
1536
2048
32
32
32
32
32
32
32
32
32
32
32
32
32
48
1.024
1.536
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
1
3
2
3
3
3
3
9
6
1.024
1.536
2.048
4.096
2.048
4.096
4.096
5.461
8.192
10.923
4.096
8.192
96
64
48
24
48
24
24
18
12
9
48
16
24
24
48
24
24
18
12
9
2
4
2
1
1
1
1
1
1
1
1
1
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
3072
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
1024
3
3
3
3
3
3
3
3
3
3
3
3
32.768
32.768
32.768
32.768
32.768
32.768
32.768
32.768
32.768
32.768
32.768
32.768
192
192
192
192
192
192
192
192
192
192
192
192
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
16
16
16
16
12
12
12
12
12
12
12
12
12
12
12
12
0
0
0
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
1536
64
2.048
128
192
256
384
512
768
1024
1152
1536
4.096
6.144
8.192
12.288
16.384
24.576
32.768
36.864
49.152
24
12
24
12
44.1
44.1
44.1
44.1
44.1
44.1
44.1
44.1
44.1
32
64
1.4112
2.8224
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
90.3168
1
1
1
3
2
3
3
3
3
1.411
2.822
5.645
2.822
5.645
5.645
7.526
11.29
15.053
64
32
16
32
16
16
12
8
32
16
16
32
16
16
12
8
2
2
1
1
1
1
1
1
1
2048
2048
2048
2048
2048
2048
2048
2048
2048
1024
1024
1024
1024
1024
1024
1024
1024
1024
2
2
2
2
2
2
2
2
2
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
45.1584
128
128
128
128
128
128
128
128
128
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
5644.8
16
16
16
16
16
16
16
16
16
8
8
8
8
8
8
8
8
8
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
1411.2
128
192
256
384
512
768
1024
5.6448
8.4672
11.2896
16.9344
22.5792
33.8688
45.1584
6
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Table 6. Recommended Clock Divider Settings for PLL as Master Clock (continued)
fS
MCLK
(MHz)
PLL VCO
(MHz)
PLL REF
(MHz)
DSP CLK
(MHz)
MOD f
(kHz)
CP f
(kHz)
RMLCK
(kHz)
P
M = K×R
K = J×D
R
PLL fS
DSP fS
NMAC
MOD fS
NDAC
DOSR
% ERROR
NCP
48
48
48
48
48
48
48
48
48
32
64
1.536
3.072
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
1
1
3
2
3
3
3
3
1.536
3.072
6.144
3.072
6.144
6.144
8.192
12.288
16.384
64
32
16
32
16
16
12
8
32
16
16
32
16
16
12
8
2
2
1
1
1
1
1
1
1
2048
2048
2048
2048
2048
2048
2048
2048
2048
1024
1024
1024
1024
1024
1024
1024
1024
1024
2
2
2
2
2
2
2
2
2
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
128
128
128
128
128
128
128
128
128
6144
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
16
8
8
8
8
8
8
8
8
8
0
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
1536
1536
1536
128
192
256
384
512
768
1024
6.144
9.216
12.288
18.432
24.576
36.864
49.152
6
6
96
96
96
96
96
96
96
96
32
48
3.072
4.608
98.304
98.304
98.304
98.304
98.304
98.304
98.304
98.304
1
3
1
2
3
4
6
8
3.072
1.536
6.144
6.144
6.144
6.144
6.144
6.144
32
64
16
16
16
16
16
16
16
32
8
2
2
2
1
1
1
1
1
1024
1024
1024
1024
1024
1024
1024
1024
512
512
512
512
512
512
512
512
2
2
2
2
2
2
2
2
49.152
49.152
49.152
49.152
49.152
49.152
49.152
49.152
64
64
64
64
64
64
64
64
6144
6144
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
16
16
4
4
4
4
4
4
4
4
0
0
0
0
0
0
0
0
4
4
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
1536
1536
64
6.144
128
192
256
384
512
12.288
18.432
24.576
36.864
49.152
16
16
16
16
16
192
192
192
192
192
192
32
48
6.144
9.216
98.304
98.304
98.304
98.304
98.304
98.304
1
3
1
2
3
4
6.144
3.072
16
32
8
8
16
4
2
2
2
1
1
1
512
512
512
512
512
512
256
256
256
256
256
256
2
2
2
2
2
2
49.152
49.152
49.152
49.152
49.152
49.152
32
32
32
32
32
32
6144
6144
6144
6144
6144
6144
16
16
16
16
16
16
2
2
2
2
2
2
0
0
0
0
0
0
4
4
4
4
4
4
1536
1536
1536
1536
1536
1536
64
12.288
24.576
36.864
49.152
12.288
12.288
12.288
12.288
128
192
256
8
8
8
8
8
8
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8.3.3.5 Serial Audio Port – Data Formats and Bit Depths
The serial audio interface port is a 3-wire serial port with the signals LRCK/FS (pin 25), SCLK (pin 23), and SDIN
(pin 24). SCLK is the serial audio bit clock, used to clock the serial data present on SDIN into the serial shift
register of the audio interface. Serial data is clocked into the TAS5754M device on the rising edge of SCLK.The
LRCK/FS pin is the serial audio left/right word clock or frame sync when the device is operated in TDM Mode.
Table 7. TAS5754M device Audio Data Formats, Bit Depths and Clock Rates
MAXIMUM LRCK/FS
FREQUENCY (kHz)
FORMAT
DATA BITS
MCLK RATE (fS)
SCLK RATE (fS)
I2S/LJ/RJ
32, 24, 20, 16
Up to 192
Up to 48
96
128 to 3072 (≤ 50 MHz)
128 to 3072
64, 48, 32
125, 256
125, 256
128
TDM/DSP
32, 24, 20, 16
128 to 512
192
128, 192, 256
The TAS5754M device requires the synchronization of LRCK/FS and system clock, but does not need a specific
phase relation between LRCK/FS and system clock.
If the relationship between LRCK/FS and system clock changes more than ±5 MCLK, internal operation is
initialized within one sample period and analog outputs are forced to the bipolar zero level until re-
synchronization between LRCK/FS and system clock is completed.
If the relationship between LRCK/FS and SCLK are invalid more than 4 LRCK/FS periods, internal operation is
initialized within one sample period and analog outputs are forced to the bipolar zero level until re-
synchronization between LRCK/FS and SCLK is completed.
8.3.3.5.1 Data Formats and Master/Slave Modes of Operation
The TAS5754M device supports industry-standard audio data formats, including standard I2S and left-justified.
Data formats are selected via Register (P0-R40). All formats require binary two's complement, MSB-first audio
data; up to 32-bit audio data is accepted. The data formats are detailed in Figure 66 through Figure 71.
The TAS5754M device also supports right-justified and TDM/DSP data. I2S, LJ, RJ, and TDM/DSP are selected
using Register (P0-R40). All formats require binary 2s complement, MSB-first audio data. Up to 32 bits are
accepted. Default setting is I2S and 24 bit word length. The I2S slave timing is shown in .
shows a detailed timing diagram for the serial audio interface.
In addition to acting as a I2S slave, the TAS5754M device can act as an I2S master, by generating SCLK and
LRCK/FS as outputs from the MCLK input. Table 8 lists the registers used to place the device into Master or
Slave mode. Please refer to the Serial Audio Port Timing – Master Mode section for serial audio Interface timing
requirements in Master Mode. For Slave Mode timing, please refer to to the Serial Audio Port Timing – Slave
Mode section.
Table 8. I2S Master Mode Registers
REGISTER
FUNCTION
P0-R9-B0, B4, and B5
P0-R32-B[6:0]
I2S Master mode select
SCLK divider and LRCK/FS divider
P0-R33-B[7:0]
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1 tS .
Right-channel
Left-channel
LRCK/FS
SLCK
«
«
«
«
«
«
«
Audio data word = 16-bit, SLCK = 32, 48, 64fS
«
1
2
15 16
1
1
2
15 16
DATA
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
«
«
2
1
2
24
2
23 24
DATA
LSB
LSB
MSB
MSB
Audio data word = 32-bit, SLCK = 64fS
«
«
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
Figure 66. Left Justified Audio Data Format
1 tS .
LRCK/FS
SLCK
Left-channel
Right-channel
«
«
«
«
«
«
Audio data word = 16-bit, SLCK = 32, 48, 64fS
«
«
1
2
15 16
1
1
2
15 16
DATA
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
«
«
2
2
23 24
1
23 24
DATA
LSB
MSB
LSB
MSB
Audio data word = 32-bit, SLCK = 64fS
«
«
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
I2S Data Format; L-channel = LOW, R-channel = HIGH
Figure 67. I2S Audio Data Format
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1 /fS .
Right-channel
Left-channel
LRCK/FS
«
«
«
«
«
«
SLCK
Audio data word = 16-bit, SLCK = 32, 48, 64fS
DATA
«
«
1
2
15 16
1
2
15 16
LSB
LSB
MSB
MSB
Audio data word = 24-bit, SLCK = 48, 64fS
«
«
2
1
2
24
1
2
23 24
DATA
MSB
LSB
MSB
LSB
Audio data word = 32-bit, SLCK = 64fS
«
«
1
2
31 32
1
2
31 32
DATA
MSB
LSB
MSB
LSB
Right Justified Data Format; L-channel = HIGH, R-channel = LOW
Figure 68. Right Justified Audio Data Format
1 /fS .
LRCK/FS
SLCK
«
«
«
«
«
«
Audio data word = 16-bit, Offset = 0
«
1
2
15 16
1
2
15 16
1
1
1
DATA
Data Slot 1
Data Slot 2
LSB
MSB
LSB
MSB
Audio data word = 24-bit, Offset = 0
-
,
«
«
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
LSB
MSB
MSB
Audio data word = 32-bit, Offset = 0
«
«
1
2
31 32
LSB
1
2
31 32
LSB
DATA
MSB
TDM/DSP Data Format with OFFSET = 0
Figure 69. TDM/DSP 1 Audio Data Format
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NOTE
In TDM Modes, Duty Cycle of LRCK/FS should be 1x SCLK at minimum. Rising edge is
considered frame start.
1 /fS .
OFFSET = 1
LRCK/FS
SLCK
«
«
«
«
«
Audio data word = 16-bit, Offset = 1
«
«
1
2
15 16
1
2
15 16
1
1
1
DATA
Data Slot 1
LSB
Data Slot 2
LSB
MSB
MSB
Audio data word = 24-bit, Offset = 1
«
«
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
Data Slot 2
LSB
MSB
MSB
Audio data word = 32-bit, Offset = 1
«
«
1
2
31 32
LSB
1
2
31 32
DATA
Data Slot 1
Data Slot 2
LSB
MSB
TDM/DSP Data Format with OFFSET = 1
Figure 70. TDM/DSP 2 Audio Data Format
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1 /fS .
OFFSET = n
LRCK/FS
SLCK
«
«
«
«
«
Audio data word = 16-bit, Offset = n
«
«
1
2
15 16
1
2
15 16
DATA
Data Slot 1
LSB
Data Slot 2
LSB
MSB
MSB
Audio data word = 24-bit, Offset = n
«
«
1
2
23 24
1
2
23 24
LSB
DATA
Data Slot 1
Data Slot 2
LSB
MSB
MSB
Audio data word = 32-bit, Offset = n
«
«
1
2
31 32
LSB
1
2
31 32
LSB
DATA
Data Slot 1
Data Slot 2
MSB
TDM/DSP Data Format with OFFSET = N
Figure 71. TDM/DSP 3 Audio Data Format
8.3.3.6 Input Signal Sensing (Power-Save Mode)
The TAS5754M device has a zero-detect function. This function can be applied to both channels of data as an
AND function or an OR function, via controls provided in the control port in P0-R65-B[2:1].Continuous Zero data
cycles are counted by LRCK/FS, and the threshold of decision for analog mute can be set by P0-R59, B[6:4] for
the data which is clocked in on the left frame of an I2S signal or Slot 1 of a TDM signal and P0-R59, B[2:0] for
the data which is clocked in on the right frame of an I2S signal or Slot 2 of a TDM signal as shown in Table 10.
Default values are 0 for both channels.
Table 9. Zero Detection Mode
ATMUTECTL
VALUE
FUNCTION
Zero data triggers for the two channels for zero detection are
OR'ed together.
0
Bit : 2
Zero data triggers for the two channels for zero detection are
AND'ed together.
1 (Default)
0
Zero detection and analog mute are disabled for the data
clocked in on the right frame of an I2S signal or Slot 2 of a
TDM signal.
Bit : 1
Bit : 0
Zero detection analog mute are enabled for the data clocked in
on the right frame of an I2S signal or Slot 2 of a TDM signal.
1 (Default)
0
Zero detection analog mute are disabled for the data clocked
in on the left frame of an I2S signal or Slot 1 of a TDM signal.
Zero detection analog mute are enabled for the data clocked in
on the left frame of an I2S signal or Slot 1 of a TDM signal.
1 (Default)
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Table 10. Zero Data Detection Time
ATMUTETIML OR
NUMBER OF
LRCK/FS CYCLES
TIME @ 48kHz
ATMA
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
1024
5120
21 ms
106 ms
10240
25600
51200
102400
256000
512000
213 ms
533 ms
1.066 sec
2.133 sec
5.333 sec
10.66 sec
8.3.3.7 Serial Data Output
If it is supported by the HybridFlow in use, the TAS5754M device can present serial data on one of the three
available hardware pins, GPIO0, GPIO1, or GPIO2. In a HybridFlow which supports serial data out, the serial
data out origin can always be configured to come before the mini-DSP, by clearing the SDSL bit in P0-R7. This
feature is used as a loop-back to check the integrity of the data transmission from the source to the TAS5754M
device . In addition to the default loop-back mode, HybridFlows allows the SDOUT signal to originate from either
a point after the processing or from some intermediary point within the HybridFlow. This option is accomplished
by setting the SDSL bit in P0-R7. Figure 72 shows how to configure the origin of the serial data output signal.
MiniDSP
Audio
Processing
Serial Audio Input
To Speaker Amplifier
Mux
To GPIO Configuration to
be presented on GPIO pins
Mux
SDSL
(P0-R7)
This mux, if present, is
unique to each HybridFlow
and has unique controls
Figure 72. Serial Data Output Signal
Choosing the origin to be after all processing has been applied to the signal (i.e. before it is sent to the amplifier)
is popular for sending a monitor signal back to a voice processing or echo-cancelling device elsewhere in the
system. Other origins may configure the signal to originate after a subwoofer generation block, which sums in the
inputs and applies a low-pass filter to create a mono, low-frequency signal. Please refer to the target
HybridFlows for details regarding the options for the serial data output.
8.3.4 miniDSP Audio Processing Engine
The TAS5754M device integrates a highly efficient processing engine called a miniDSP. The miniDSP in the
TAS5754M device uses a Hybrid architecture in which some processing blocks are built in ROM and other
processing blocks are created in RAM via the PurePath™ Control Console GUI. This approach allows the
flexibility of a fully-programmable device to be combined with the ease of use and rapid download time of a hard-
coded ROM device.
8.3.4.1 HybridFlow Architecture
The Hybrid RAM and ROM Architecture allows the device to be highly flexible, but also easy to use. Unlike a
device where all digital processing blocks are hard-coded in ROM, the hybrid RAM and ROM architecture allows
a variety of processing blocks to be used in various combinations with various connectivity. These combinations
of processing blocks are called HybridFlows.
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HybridFlows are generated by combining a collection of processing blocks together in a targeted manner so that
the device is well suited for a particular application or use case. Some HybridFlows are targeted for stereo
applications, while others are targeted for mono, 1.1 (Bi-Amped), or 2.1 configurations.
It is important to note that the amount of processing which can be combined together into a given process flow is
highly dependent on the sample rate of the audio signal which is being processed. For instance, an audio signal
at 48 kHz can have much more processing applied than the same signal presented to the TAS5754M device at
192 kHz sample rate. For this reason, a HybridFlow which supports only up to 48 kHz sample rate cannot be
used with a 192 kHz input signal.
8.3.4.2 Volume Control
8.3.4.2.1 Digital Volume Control
A basic digital volume control with range between 24 dB and 103 dB and mute is available on each channels by
P0-R61-B[7:0] for SPK_OUTB± and P0-R62-B[7:0] for SPK_OUTA±. These volume controls all have 0.5 dB step
programmability over most gain and attenuation ranges. Table 11 lists the detailed gain versus programmed
setting for this basic volume control. Volume can be changed for both SPK_OUTB± and SPK_OUTA± at the
same time or independently by P0-R61-B[1:0] . When B[1:0] set 00 (default), independent control is selected.
When B[1:0] set 01, SPK_OUTA± accords with SPK_OUTB± volume. When B[1:0] set 10, SPK_OUTA± volume
controls the volume for both channels. To set B[1:0] to 11 is prohibited.
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Table 11. Digital Volume Control Settings
GAIN
SETTING
GAIN
(dB)
BINARY DATA
COMMENTS
0
1
0000-0000
0000-0001
24.0
23.5
Positive maximum
.
.
.
.
.
.
.
.
.
46
47
48
49
50
51
0010-1110
0010-1111
0011-0000
0011-0001
0011-0010
0011-0011
1.0
0.5
0.0
No attenuation (default)
–0.5
–1.0
–1.5
.
.
.
.
.
.
.
.
.
253
254
255
1111-1101
1111-1110
1111-1111
–102.5
–103
Negative maximum
–
Negative infinite (Mute)
Ramp-up frequency and ramp-down frequency can be controlled by P0-R63, B[7:6] and B[3:2] as shown in
Table 12. Also ramp-up step and ramp-down step can be controlled by P0-R63, B[5:4] and B[1:0] as shown in
Table 13.
Table 12. Ramp Up or Down Frequency
RAMP UP
SPEED
RAMP DOWN
FREQUENCY
EVERY N fS
COMMENTS
EVERY N fS
COMMENTS
00
01
10
11
1
Default
00
01
10
11
1
Default
2
2
4
4
Direct change
Direct change
Table 13. Ramp Up or Down Step
RAMP UP
STEP
RAMP DOWN
COMMENTS
STEP dB
STEP dB
COMMENTS
STEP
00
01
10
11
4.0
2.0
1.0
0.5
00
01
–4.0
–2.0
–1.0
–0.5
Default
10
11
Default
8.3.4.2.1.1 Emergency Volume Ramp Down
Emergency ramp down of the volume by is provided for situations such as I2S clock error and power supply
failure. Ramp-down speed is controlled by P0-R64-B[7:6]. Ramp-down step can be controlled by P0-R64-B[5:4].
Default is ramp-down by every fS cycle with –4dB step.
8.3.5 Adjustable Amplifier Gain and Switching Frequency Selection
The voltage divider between the GVDD_REG pin a the SPK_GAIN/FREQ pin is used to set the gain and
switching frequency of the amplifier. The voltage presented on the SPK_GAIN/FREQ pin is digitized and then
decoded into a 3 bit word which is interpreted inside the TAS5754M device to correspond to a given gain and
switching frequency.
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Because the amplifier adds gain to both the signal and the noise present in the audio signal, the lowest gain
setting that can meet voltage-limited output power targets should be used. This ensures that the power target
can be reached while minimizing the idle channel noise of the system. The switching frequency selection affects
three important operating characteristics of the device. These are the power dissipation in the device, the power
dissipation in the inductor, and the target output filter for the application.
Higher switching frequencies typically result in slightly higher power dissipation in the TAS5754M device and
lower dissipation in the inductor in the system, due to decreased ripple current through the inductor and
increased charging and discharging current in device and parasitic capacitances. Switching at the higher of the
two available switching frequencies will result in lower overall dissipation in the system and lower operating
temperature of the inductors. However, the thermally limited power output of the device may be decreased in this
situation, because some of the TAS5754M device thermal headroom will be absorbed by the higher switching
frequency. Conversely inductor heating can be reduced by using the higher switching frequency in order to
reduce the ripple current.
Another advantage of increasing the switching frequency is that the higher frequency carrier signal can be filtered
by an L-C filter with a higher corner frequency, leading to physically smaller components. Use the highest
switching frequency that continues to meet the thermally limited power targets for the application. If thermal
constraints require heat reduction in the TAS5754M device, use a lower switching rate.
The switching frequency of the speaker amplifier is dependent on an internal synchronizing signal, (fSYNC), which
is synchronous with the sample rate. The rate of the synchronizing signal is also dependent on the sample rate.
Refer to Table 14 below for details regarding how the sample rates correlate to the synchronizing signal.
Table 14. Sample Rates vs Synchronization Signal
SAMPLE RATE
[kHz]
fSYNC
[kHz]
8
16
32
96
48
96
192
11.025
22.05
44.1
88.2
88.2
Table 15 summarizes the de-code of the voltage presented to the SPK_GAIN/FREQ pin.
Table 15. Amplifier Switching Mode vs.
SPK_GAIN/FREQ Voltage
VSPK_GAIN/FREQ (V)
AMPLIFIER
SWITCHING
FREQUENCY MODE
GAIN MODE
MIN
MAX
6.61
5.44
4.67
3.89
3.11
2.33
1.56
0.78
0
7
Reserved
Reserved
8 × fSYNC
6 × fSYNC
4 × fSYNC
2 × fSYNC
8 × fSYNC
6 × fSYNC
4 × fSYNC
2 × fSYNC
6.6
5.43
4.66
3.88
3.1
26dBV
20dBV
2.32
1.55
0.77
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8.3.6 Error Handling and Protection Suite
8.3.6.1 Device Over-Temperature Protection
The TAS5754M device continuously monitors die temperature to ensure it does to exceed the OTETHRES level
specified in the Recommended Operating Conditions table. If an OTE event occurs, the SPK_FAULT line is
pulled low and out the SPK_OUTxx outputs transition to high impedance, signifying a fault. This latched error
requires the SPK_MUTE line to toggle in order to reset the error. Alternatively, pulling the MCLK, SCLK, or
LRCK/FS pin low causes a clock error, which also resets the device. Normal operation resumes by re-starting the
stopped clock.
8.3.6.2 SPK_OUTxx Over-Current Protection
The TAS5754M device continuously monitors the output current of each amplifier output to ensure it does to
exceed the OCETHRES level specified in the Recommended Operating Conditions table. If an OCE event occurs,
the SPK_FAULT line is pulled low and the SPK_OUTxx outputs transition to high impedance, signifying a fault.
This latched error requires the SPK_MUTE line to toggle in order to reset the error. Alternatively, pulling the
MCLK, SCLK, or LRCK/FS pin low causes a clock error, which also resets the device. Normal operation resumes
by re-starting the stopped clock.
8.3.6.3 DC Offset Protection
If the TAS5754M device measures a DC offset in the output voltage, the SPK_FAULT line is pulled low and the
SPK_OUTxx outputs transition to high impedance, signifying a fault. This latched error require the SPK_MUTE
line to toggle in order to reset the error. Alternatively, pulling the MCLK, SCLK, or LRCK low causes a clock
error, which also resets the device. Normal operation resumes by re-starting the stopped clock.
8.3.6.4 Internal VAVDD Undervoltage-Error Protection
The TAS5754M device internally monitors the AVDD net to protect against the AVDD supply dropping
unexpectedly. To enable this feature, P1-R5-B0 is used.
8.3.6.5 Internal VPVDD Undervoltage-Error Protection
If the voltage presented on the PVDD supply drops below the UVETHRES(PVDD) value listed in the Recommended
Operating Conditions table, the SPK_OUTxx outputs transition to high impedance. This is a self-clearing error,
which means that once the PVDD level drops below the level listed in the Recommended Operating Conditions
table, the device resumes normal operation.
8.3.6.6 Internal VPVDD Overvoltage-Error Protection
If the voltage presented on the PVDD supply exceeds the OVETHRES(PVDD) value listed in the Recommended
Operating Conditions table, the SPK_OUTxx outputs will transition to high impedance. This is a self-clearing
error, which means that once the PVDD level drops below the level listed in the Recommended Operating
Conditions table, the device will resume normal operation. It is important to note that this voltage only protects up
to the level described in the Recommended Operating Conditions table for the PVDD voltage. Exceeding this
absolute maximum rating causes damage and possible device failure, because the levels exceed that which can
be protected against by the OVE protection circuit.
8.3.6.7 External Undervoltage-Error Protection
The SPK_MUTE pin can also be used to monitor a system voltage, such as a LCD TV backlight, a battery pack
in portable device, by using a voltage divider created with two resistors. (See Figure 73)
•
If the SPK_MUTE pin makes a transition from “1” to “0” over 6 ms or more, the device switches into external
under-voltage protection mode. This mode uses two trigger levels.
•
•
When the SPK_MUTE pin level reaches 2 V, soft mute process begins.
When the SPK_MUTE pin level reaches 1.2 V, analog output mute engages, regardless of digital audio level,
and analog output shutdown begins.
A timing diagram to show this is shown in Figure 74.
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NOTE
The SPK_MUTE input pin voltage range is provided in the Recommended Operating
Conditions table. The ratio of external resistors must produce a voltage within this input
range. Any increase in power supply (such as power supply positive noise or ripple) can
pull the SPK_MUTE pin higher than that the level specified in the Recommended
Operating Conditions table, potentially causing damage to or failure of the device.
Therefore, it is imperative that any monitored voltage (including all ripple, power supply
variation, resistor divider variation, transient spikes, etc.) is scaled by the resistor divider
network to never drive the voltage on the SPK_MUTE pin higher than the maximum level
specified in the Recommended Operating Conditions table.
When the divider is set correctly, any DC voltage can be monitored. shows a 12-V example of how the
SPK_MUTE is used for external undervoltage error protection.
VDD
12 V
7.25 Nꢀ
SPK_MUTE
2.75 Nꢀ
Figure 73. SPK_MUTE Used in External Undervoltage Error Protection
Digital attenuation followed by analog mute
Analog mute
SPK_MUTE
0.9 × DV
DD
2.0 V
1.2 V
0.1 × DV
DD
t
f
Figure 74. SPK_MUTE Timing for External Undervoltage Error Protection
8.3.6.8 Internal Clock Error Notification (CLKE)
8.3.7 GPIO Port and Hardware Control Pins
The TAS5754M device includes a versatile GPIO port, allowing signals to be passed from the system to the
device or sent out of the device to the system. There are three GPIO pins available for use. These pins can be
used for advanced clocking features, to pass internal signals to the system or accept signals from the system for
use inside the device by a HybridFlow, or simply to monitor the status of an external signal via I2C. The GPIO
port requires some configuration in the control port. This configuration is detailed in Figure 75.
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Internal Data
(P0-R82)
GPIOx Output Enable
P0-R8
GPIOx Output Inversion
P0-R87
GPIOx Output Selection
P0-R82
Off (low)
DSP GPIOx output
Register GPIOx output (P0-R86)
Auto mute flag (Both A and B)
Auto mute flag (Channel B)
Auto mute flag (Channel A)
Clock invalid flag
Mux
GPIOx
Mux
Serial Audio Data Output
Analog mute flag for B
Analog mute flag for A
PLL lock flag
Charge Pump Clock
GPIOx Input State
Under voltage flag 1
Under voltage flag 2
Monitoring
(P0-R119)
PLL output/4
To MiniDSP
To Clock Tree
Figure 75. GPIO Port
In addition to the dynamic controls which can be implemented with the GPIO port, each HybridFlow uses the
GPIO port as required. In some HybridFlows, a GPIO is used to present an internal serial audio data signal to a
system controller. In others, the status of a GPIO pin is monitored and the status of that pin is used to adjust the
audio processing applied to the signal. Refer to each HybridFlow for specifics regarding how the GPIO port is
used. GPIOs which have been allocated to a function in a HybridFlow can be reassigned using the same controls
as those listed in Figure 75. However, they no longer serve the purpose intended by the design of the
HybridFlow.
8.3.8 I2C Communication Port
The TAS5754M device supports the I2C serial bus and the data transmission protocol for standard and fast mode
as a slave device.
8.3.8.1 Slave Address
Table 16. I2C Slave Address
MSB
1
LSB
0
0
1
1
ADR2
ADR1
R/ W
The TAS5754M device has 7 bits for its own slave address. The first five bits (MSBs) of the slave address are
factory preset to 10011 (0x9x). The next two bits of the address byte are the device select bits which can be
user-defined by the ADR1 and ADR0 terminals. A maximum of four devices can be connected on the same bus
at one time. This gives a range of 0x98, 0x9A, 0x9C and 0x9E, as detailed below. Each TAS5754M device
responds when it receives its own slave address.
Table 17. I2C Address Configuration via ADR0 and ADR1 Pins
ADR1
ADR0
I2C SLAVE ADDRESS [R/W]
0
0
1
1
0
1
0
1
0x99/0x98
0x9B/0x9A
0x9D/0x9C
0x9F/0x9E
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8.3.8.2 Register Address Auto-Increment Mode
MSB
LSB
A0
INC
A6
A5
A4
A3
A2
A1
Figure 76. Auto Increment Mode
Auto-increment mode allows multiple sequential register locations to be written to or read back in a single
operation, and is especially useful for block write and read operations.
8.3.8.3 Packet Protocol
A master device must control packet protocol, which consists of start condition, slave address, read/write bit,
data if write or acknowledge if read, and stop condition. The TAS5754M device supports only slave receivers and
slave transmitters.
SDA
SCL
9
1–7
8
9
1–8
9
1–8
9
Sp
St
Slave address
R/W
ACK
DATA
ACK
DATA
ACK
ACK
Start
condition
Stop
condition
R/W: Read operation if 1; otherwise, write operation
ACK: Acknowledgement of a byte if 0
DATA: 8 bits (byte)
Figure 77. Packet Protocol
Table 18. Write Operation - Basic I2C Framework
Transmitter
Data Type
M
M
M
S
M
S
M
S
S
M
St
slave address
R/
ACK
DATA
ACK
DATA
ACK
ACK
Sp
Table 19. Read Operation - Basic I2C Framework
Transmitter
Data Type
M
M
M
S
S
M
S
M
M
M
St
slave address
R/
ACK
DATA
ACK
DATA
ACK
NACK
Sp
M = Master Device; S = Slave Device; St = Start Condition Sp = Stop Condition
8.3.8.4 Write Register
A master can write to any TAS5754M device registers using single or multiple accesses. The master sends a
TAS5754M device slave address with a write bit, a register address with auto-increment bit, and the data. If auto-
increment is enabled, the address is that of the starting register, followed by the data to be transferred. When the
data is received properly, the index register is incremented by 1 automatically. When the index register reaches
0x7F, the next value is 0x0. Table 20 shows the write operation.
Table 20. Write Operation
Transmitter
Data Type
M
M
M
S
M
S
M
S
M
S
S
M
reg
addr
write
data 1
write
data 2
St
slave addr
W
ACK
inc
ACK
ACK
ACK
ACK
Sp
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M = Master Device; S = Slave Device; St = Start Condition Sp = Stop Condition; W = Write; ACK = Acknowledge
8.3.8.5 Read Register
A master can read the TAS5754M device register. The value of the register address is stored in an indirect index
register in advance. The master sends a TAS5754M device slave address with a read bit after storing the
register address. Then the TAS5754M device transfers the data which the index register points to. When auto-
increment is enabled, the index register is incremented by 1 automatically. When the index register reaches
0x7F, the next value is 0x0. Table 21 shows the read operation.
Table 21. Read Operation
Transmitter
Data Type
M
M
M
S
M
S
M
M
M
S
S
M
M
M
slave
addr
reg
addr
slave
addr
St
W
ACK
inc
ACK
Sr
R
ACK
data
ACK
NACK
Sp
M = Master Device; S = Slave Device; St = Start Condition; Sr = Repeated start condition; Sp = Stop Condition;
W = Write; R = Read; NACK = Not acknowledge
8.3.9 Device Functional Modes
Because the TAS5754M device is a highly configurable device, numerous modes of operation can exist for the
device. For the sake of succinct documentation, these modes are divided into two modes:
•
•
Fundamental operating modes
Secondary usage modes
Fundamental operating modes are the primary modes of operation that affect the major operational
characteristics of the device. These are the most basic configurations that are chosen to ensure compatibility
with the intended application or the other components that interact with the device in the final system. Some
examples of these are the communication protocol used by the control port, the output configuration of the
amplifier, or the Master/Slave clocking configuration.
The fundamental operating modes are described starting in the Serial Audio Port Operating Modes section.
Secondary usage modes are best described as modes of operation that are used after the fundamental operating
modes are chosen to fine tune how the device operates within a given system. These secondary usage modes
may include selecting between left justified and right justified Serial Audio Port data formats, or enabling some
slight gain/attenuation within the DAC path. Secondary usage modes are accomplished through manipulation of
the registers and controls in the I2C control port. Those modes of operation are described in their respective
register/bit descriptions and, to avoid redundancy, are not included in this section.
8.3.9.1 Serial Audio Port Operating Modes
The serial audio port in the TAS5754M device supports industry-standard audio data formats, including I2S, Time
Division Multiplexing (TDM), Left-Justified (LJ), and Right-Justified (RJ) formats. To select the data format that
will be used with the device, controls are provided on P0-R40. The timing diagrams for the serial audio port are
shown in the Serial Audio Port Timing – Slave Mode section, and the data formats are shown in the Serial Audio
Port – Data Formats and Bit Depths section.
8.3.9.2 Communication Port Operating Modes
The TAS5754M device is configured via an I2C communication port. The device does not support a hardware
only mode of operation, nor Serial Peripheral Interface (SPI) communication. The I2C Communication Protocol is
detailed in the I2C Communication Port section. The I2C timing requirements are described in the I2C Bus
Timing – Standard and I2C Bus Timing – Fast sections.
8.3.9.3 Audio Processing Modes via HybridFlow Audio Processing
The TAS5754M device can be configured to include several different audio processing features through the use
of pre-defined DSP loads called HybridFlows. These HybridFlows have been created and tested to be application
focused. This approach results in a device which offers the flexibility of a programmable device with the ease-of-
use and fast download time of a fixed function device. The HybridFlows are selected and downloaded using the
PurePath™ ControlConsole software. .
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8.3.9.4 Speaker Amplifier Operating Modes
The TAS5754M device can be used in three different amplifier configurations:
•
•
•
Stereo Mode
Mono Mode
Bi-Amp Mode
8.3.9.4.1 Stereo Mode
The familiar stereo mode of operation uses the TAS5754M device to amplify two independent signals, which
represent the left and right portions of a stereo signal. These amplified left and right audio signals are presented
on differential output pairs shown as SPK_OUTA± and SPK_OUTB±. The routing of the audio data which is
presented on the SPK_OUTxx outputs can be changed according to the HybridFlow which is used and the
configuration of registers P0-R42-B[5:4] and P0-R42-B[1:0]. This mode of operation is shown in Figure 80.
By default, the TAS5754M device is configured to output the Right frame of a I2S input on the Channel A output
and the left frame on the Channel B output.
8.3.9.4.2 Mono Mode
This mode of operation is used to describe operation in which the two outputs of the device are placed in parallel
with one another to increase the power sourcing capabilities of the device.
On the output side of the TAS5754M device, the summation of the devices can be done before the filter in a
configuration called Pre-Filter Parallel Bridge Tied Load (PBTL). However, it is sometimes preferable to merge
the two outputs together after the inductor portion of the output filter. Doing so does require two additional
inductors, but allows smaller, less expensive inductors to be used because the current is divided between the
two inductors. This is called Post-Filter PBTL. Both variants of mono operation are shown in Figure 78 and
Figure 79.
LFILT
LFILT
SPK_OUTA+
SPK_OUTA+
CFILT
CFILT
SPK_OUTA-
LFILT
SPK_OUTA-
CFILT
SPK_OUTB+
CFILT
LFILT
SPK_OUTB-
CFILT
SPK_OUTB+
LFILT
LFILT
SPK_OUTB-
CFILT
Figure 78. Pre-Filter PBTL
Figure 79. Post-Filter PBTL
On the input side of the TAS5754M device, the input signal to the mono amplifier can be selected from the any
slot in a TDM stream or the left or right frame from an I2S, LJ, or RJ signal. It can also be configured to amplify
some mixture of two signals, as in the case of a subwoofer channel which mixes the left and right channel
together and sends it through a low-pass filter in order to create a mono, low-frequency signal.
This mode of operation is shown in the Mono (PBTL) Systems section.
8.3.9.4.3 Bi-Amp Mode
Bi-Amp mode, sometimes also referred to as 1.1 Mode uses a two channel device (such as the TAS5754M
device ) to amplify two different frequency regions of the same signal for a two-way speaker. This is most often
used in a single active speaker, where one channel of the amplifier is use to drive the high frequency transducer
and one channel is used to drive the low-frequency transducer. To operate in Bi-Amped Mode or 1.1 Mode, an
appropriate HybridFlow must be chosen, because the frequency separation and audio processing must occur in
the DSP. This mode of operation is shown in the 1.1 (Dual BTL, Bi-Amped) Systems section.
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8.3.9.4.4 Master and Slave Mode Clocking for Digital Serial Audio Port
The digital audio serial port in the TAS5754M device can be configured to receive its clocks from another device
as a serial audio slave device. This mode of operation is described in the Clock Slave Mode with SLCK PLL to
Generate Internal Clocks (3-Wire PCM) section. If there no system processor available to provide the audio
clocks, the TAS5754M device can be placed into Master Mode. In this mode, the TAS5754M device provides the
clocks to the other audio devices in the system. For more details regarding the Master and Slave mode operation
within the TAS5754M device, please refer to Serial Audio Port Operating Modes.
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8.4 Register Maps
8.4.1 Control Port Registers- Quick Reference
Register Quick Reference ~ Page 0
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
B6
B5
B4
RSTM
0
B3
B2
B1
B0
RSTR
0
Reserved Reserved Reserved
Reserved Reserved Reserved
1
2
3
4
1
2
3
4
P0-R1
P0-R2
P0-R3
P0-R4
0
0
0
0
0
0
0
Reserved Reserved Reserved
RQST
0
Reserved Reserved Reserved
RQPD
0
0
0
1
0
0
0
0
0
0
Reserved Reserved Reserved
RQMB
0
Reserved Reserved Reserved
RQMA
0
0
0
0
0
0
0
Reserved Reserved Reserved
PLCK
0
Reserved Reserved Reserved
PLLE
1
0
0
0
0
0
0
5
6
5
6
P0-R5
P0-R6
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved
DEMP
Reserved Reserved Reserved
SDSL
0
7
8
9
7
8
9
P0-R7
P0-R8
P0-R9
0
0
0
0
0
0
G2OE
0
0
0
G0OE
0
0
G1OE
0
0
Reserved Reserved
INTMUTE
Reserved Reserved
0
0
0
SCLKO
0
0
0
Reserved Reserved
SCLKP
0
Reserved Reserved Reserved LRCKFSO
0
0
0
0
0
0
10
11
A
B
P0-R10
P0-R11
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved
RSCLK
0
RLRCKFS
0
12
13
C
D
P0-R12
P0-R13
P0-R14
7C
0
0
1
0
0
1
SREF
0
1
0
0
1
1
Reserved
Reserved Reserved Reserved Reserved
0
Reserved
0
0
0
0
0
SDAC
0
Reserved Reserved Reserved Reserved
14
15
E
F
0
0
0
0
0
P0-R15
...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
... ...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
...
17
18
H
P0-R17
Reserved Reserved Reserved Reserved Reserved
GREF
0
12
P0-R18
P0-R19
P0-R20
P0-R21
P0-R22
P0-R23
P0-R24
0
10
0
0
0
0
0
0
0
0
RQSY
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
19
20
21
22
23
24
13
14
15
16
17
18
0
0
0
0
1
0
0
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved
PPDV
0
0
0
0
0
0
0
PJDV
0
0
0
0
0
0
Reserved Reserved Reserved
0
0
0
0
Reserved Reserved
PDDV (MSB)
0
0
0
0
0
0
0
0
0
0
PDDV (LSB)
0
0
–
0
–
0
–
0
–
PRDV
0
Reserved Reserved Reserved Reserved
25
26
19
1A
P0-R25
P0-R26
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
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Register Maps (continued)
Register Quick Reference ~ Page 0 (continued)
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
B6
0
B5
0
B4
0
B3
DDSP
0
B2
0
B1
0
B0
0
Reserved
27
28
29
1B
1C
1D
P0-R27
P0-R28
P0-R29
0
0
0
0
0
Reserved
DDAC
0
0
0
0
0
0
0
0
Reserved
DNCP
0
0
Reserved
0
0
0
0
0
0
0
DOSR
0
30
31
32
1E
1F
20
P0-R30
P0-R31
P0-R32
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DSCLK
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DLRCKFS
33
34
35
36
37
21
22
23
24
25
P0-R33
P0-R34
P0-R35
P0-R36
P0-R37
0
0
1
0
0
0
Reserved
0
0
FSSP
I16E
0
Reserved Reserved Reserved Reserved
0
0
0
0
IDAC (MSB)
0
0
0
0
0
1
IDAC (LSB)
0
IPLK
0
0
DCAS
0
0
IDCM
0
0
IDCH
0
0
IDSK
0
0
IDBK
0
0
IDFS
0
0
Reserved
–
38
39
26
27
P0-R38
P0-R39
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved
AFMT
Reserved Reserved
ALEN
40
41
42
43
44
28
29
2A
2B
2C
P0-R40
P0-R41
P0-R42
P0-R43
P0-R44
2
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
1
1
0
AOFS
AUPB
0
0
0
Reserved
0
Reserved Reserved Reserved
AUPA
11
1
0
0
0
Reserved Reserved Reserved Reserved
PSEL
0
0
0
0
0
0
CMDP
0
Reserved Reserved Reserved Reserved Reserved
0
0
0
0
0
0
0
45
...
2D
...
P0-R45
...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
... ...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
58
3A
P0-R58
Reserved
0
AMTB
0
Reserved
0
AMTA
0
59
60
61
62
3B
3C
3D
3E
P0-R59
P0-R60
P0-R61
P0-R62
0
0
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved
PCTL
0
0
0
0
0
0
0
1
1
0
1
1
0
0
0
0
0
0
0
0
0
VOLB
VOLA
30
30
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Register Maps (continued)
Register Quick Reference ~ Page 0 (continued)
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
0
B6
0
B5
1
B4
0
B3
B2
B1
B0
VNDF
VEDF
VNDS
VEDS
VNUF
VNUS
63
64
65
3F
40
41
P0-R63
P0-R64
P0-R65
22
0
0
1
0
Reserved Reserved Reserved Reserved
2
4
0
0
0
0
0
0
ACTL
1
1
AMLE
0
0
AMRE
0
Reserved Reserved Reserved Reserved Reserved
0
0
0
0
0
66
...
42
...
P0-R66
...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
... ...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
81
51
P0-R81
Reserved Reserved Reserved
G1SL
0
82
52
P0-R82
0
0
0
0
0
0
0
0
0
Reserved Reserved Reserved
G0SL
0
83
84
85
53
54
55
P0-R83
P0-R84
P0-R85
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved
G2SL
0
0
0
0
0
0
GOUT2
0
0
0
GOUT0
0
0
GOUT1
0
0
0
Reserved Reserved
Reserved
Reserved Reserved
86
87
56
57
P0-R86
P0-R87
0
0
0
Reserved
0
0
0
Reserved Reserved
GINV2
0
GINV0
0
GINV1
0
Reserved Reserved
0
0
0
0
88
89
58
59
P0-R88
P0-R89
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved
B1OV
0
A1OV
0
B2OV
0
A2OV
0
SFOV
0
90
91
92
93
94
95
5A
5B
5C
5D
5E
5F
P0-R90
P0-R91
P0-R92
P0-R93
P0-R94
P0-R95
0
38
0
0
Reserved
0
0
0
DTFS
1
DTSR
0
1
1
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved
DTBR
0
0
0
0
0
0
DTBR
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
40
0
0
Reserved
0
1
CDST6
0
0
CDST5
0
0
CDST4
0
0
0
CDST2
0
0
CDST1
0
0
CDST0
0
CDST3
0
Reserved
0
Reserved Reserved Reserved
LTSH
0
CKMF
0
CSRF
0
CERF
0
0
0
0
0
96
...
60
...
P0-R96
...
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
... ...
107
6B
PO-R107 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved
AMBM
1
AMAM
108
109
6C
6D
P0-R108
P0-R109
33
0
0
0
1
1
SDTM
0
0
0
1
SHTM
0
Reserved Reserved Reserved
Reserved Reserved Reserved
0
0
0
0
0
0
110
...
6E
...
PO-R110 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
... ... ...
PO-R113 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
113
71
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Register Maps (continued)
Register Quick Reference ~ Page 0 (continued)
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
B6
B5
B4
B3
B2
B1
1
B0
1
Reserved Reserved Reserved Reserved Reserved Reserved
MTST
FSMM
114
115
72
73
P0-R114
P0-R115
3
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved
0
0
0
0
0
0
0
0
116
117
74
75
P0-R116 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
P0-R117 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
BOTM
1
Reserved Reserved Reserved
PSTM
118
119
120
121
122
76
77
78
79
7A
P0-R118
P0-R119
P0-R120
P0-R121
P0-R122
85
2D
0
0
0
0
0
1
1
1
0
0
1
Reserved Reserved
GPIN
0
0
1
0
AMFB
0
1
AMFA
0
Reserved Reserved Reserved
Reserved Reserved Reserved
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DAMD
0
0
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
EIFM
0
0
0
0
0
0
0
0
0
Register Quick Reference ~ Page 1
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
B6
B5
B4
B3
B2
B1
B0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
OSEL
1
2
1
2
P1-R1
P1-R2
0
0
0
0
0
0
BAGN
0
0
0
0
0
AAGN
0
Reserved Reserved Reserved
Reserved Reserved Reserved
0
0
0
0
0
0
Reserv
ed
3
4
3
4
P1-R3
P1-R4
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Reserv
ed
Reserved Reserved Reserved Reserved Reserved Reserved
UEPD
0
UIPD
5
6
7
8
9
5
6
7
8
9
P1-R5
P1-R6
P1-R7
P1-R8
P1-R9
11
0
0
0
0
1
0
0
1
AMCT
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
0
0
0
0
AGBB
0
0
0
0
Reserved Reserved Reserved
Reserved Reserved Reserved
AGBA
0
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
RCMF
0
0
0
0
0
0
0
0
0
Reserved Reserved Reserved Reserved Reserved Reserved Reserved
VCPD
0
0
0
0
0
0
0
0
0
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Register Quick Reference ~ Page 44
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
B6
B5
B4
B3
ACRM
0
B2
AMDC
0
B1
ACRS
0
B0
ASCW
0
Reserved Reserved Reserved Reserved
1
1
P44-R1
0
0
0
0
0
Register Quick Reference ~ Page 253
Default (Binary)
Adr.
(Dec) (Hex)
Adr.
Register
Name
Default
(Hex)
B7
0
B6
0
B5
0
B4
B3
B2
0
B1
0
B0
0
PLLFLEX1
63
64
3F
40
P253-63
P253-64
0
0
0
0
0
PLLFLEX2
0
0
0
0
0
0
0
8.4.2 Control Port Registers- Detailed Description
8.4.2.1 P0-R1
Reset Modules [4] (R/W)
00000000
This bit resets the interpolation filter and the DAC modules. Since the DSP is also reset, the coefficient RAM content will also be cleared by
the DSP. This bit is auto cleared and can be set only in standby mode.
Normal
- - - 0 - - - -
- - - 1 - - - -
Reset modules
Reset Register [0] (R/W)
00000000
This bit resets the mode registers back to their initial values. The RAM content is not cleared, but the execution source will be back to ROM.
This bit is auto cleared and must be set only when the DAC is in standby mode (resetting registers when the DAC is running is prohibited
and not supported).
Normal
- - - - - - - 0
- - - - - - - 1
Reset mode registers
8.4.2.2 P0-R2
Standby Request [4] (R/W)
00000000
When this bit is set, the DAC will be forced into a system standby mode, which is also the mode the system enters in the case of clock
errors. In this mode, most subsystems will be powered down but the charge pump and digital power supply.
Normal operation
Standby mode
- - - 0 - - - -
- - - 1 - - - -
00000000
Powerdown Request [0] (R/W)
When this bit is set, the DAC will be forced into powerdown mode, in which the power consumption would be minimum as the charge pump
is also powered down. However, it will take longer to restart from this mode. This mode has higher precedence than the standby mode, i.e.
setting this bit along with bit 4 for standby mode will result in the DAC going into powerdown mode.
Normal operation
Powerdown mode
- - - - - - - 0
- - - - - - - 1
8.4.2.3 P0-R3
Mute Channel B [4] (R/W)
00000000
This bit issues soft mute request for the Channel B. The volume will be smoothly ramped down/up to avoid pop/click noise.
Normal volume
Mute
- - - 0 - - - -
- - - 1 - - - -
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Mute Channel A [0] (R/W)
00000000
This bit issues soft mute request for the Channel A. The volume will be smoothly ramped down/up to avoid pop/click noise.
Normal volume
Mute
- - - - - - - 0
- - - - - - - 1
8.4.2.4 P0-R4
PLL Lock Flag [4] (Read Only)
00000001
This bit indicates whether the PLL is locked or not. When the PLL is disabled this bit always shows that the PLL is not locked.
The PLL is locked
- - - 0 - - - -
- - - 1 - - - -
00000001
The PLL is not locked
PLL Enable [0] (R/W)
This bit enables or disables the internal PLL. When PLL is disabled, the master clock is switched to the MCLK.
Disable PLL
Enable PLL
- - - - - - - 0
- - - - - - - 1
8.4.2.5 P0-R7
De-Emphasis Enable [4] (R/W)
00000000
This bit enables or disables the de-emphasis filter. The default coefficients are for 44.1 kHz sampling rate, but can be changed by
reprogramming the appropriate coeffients via the coefficient spaces provided in each HybridFlow.
De-emphasis filter is disabled
De-emphasis filter is enabled
- - - 0 - - - -
- - - 1 - - - -
SDOUT Select [0] (R/W)
00000000
This bit selects what is being output as SDOUT via GPIO pins.
SDOUT is the DSP output (post-processing)(1)
SDOUT is the DSP input (pre-processing)
- - - - - - - 0
- - - - - - - 1
(1) Some HybridFlows offer several paths from which to take the SDOUT signal. In this case, this bit should be cleared, and the appropirate
mixer/mux function in the HybridFlow should be used to determine which processed signal should be presented as the SDOUT signal.
8.4.2.6 P0-R8
GPIO2 Output Enable [5] (R/W)
GPIO0 Output Enable [3] (R/W)
GPIO1 Output Enable [2] (R/W)
00000000
This bit sets the direction of the GPIO2 pin
GPIO2 is input
- - - 0 - - - - -
- - - 1 - - - - -
00000000
GPIO2 is output
This bit sets the direction of the GPIO0 pin
GPIO0 is input
- - - - - 0 - - -
- - - - - 1 - - -
00000000
GPIO0 is output
This bit sets the direction of the GPIO1 pin
GPIO1 is input
- - - - - 0 - -
- - - - - 1 - -
GPIO1 is output
8.4.2.7 P0-R9
SCLK Polarity [5] (R/W)
00000000
This bit sets the inverted SCLK mode. In inverted SCLK mode, the DAC assumes that the LRCK/FS and SDIN edges are aligned to the
rising edge of the SCLK. Normally they are assumed to be aligned to the falling edge of the SCLK.
Normal SCLK mode
Inverted SCLK mode
- - - 0 - - - - -
- - - 1 - - - - -
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SCLK Output Enable [4] (R/W)
00000000
This bit sets the SCLK pin direction to output for I2S master mode operation. In I2S master mode the TAS5754M outputs the reference
SCLK and LRCK/FS, and the external source device provides the SDIN according to these clocks. Use P0-R32 to program the division
factor of the MCLK to yield the desired SCLK rate (normally 64FS)
SCLK is input (I2S slave mode)
SCLK is output (I2S master mode)
- - - 0 - - - -
- - - 1 - - - -
00000000
LRCK/FS Output Enable [0] (R/W)
This bit sets the LRCK/FS pin direction to output for I2S master mode operation. In I2S master mode the PCM51xx outputs the reference
SCLK and LRCK/FS, and the external source device provides the SDIN according to these clocks. Use P0/R33 to program the division
factor of the SCLK to yield 1FS for LRCK/FS.
LRCK/FS is input (I2S slave mode)
LRCK/FS is output (I2S master mode)
- - - - - - - 0
- - - - - - - 1
8.4.2.8 P0-R12
Master Mode SCLK Divider Reset [1] (R/W)
01111100
This bit, when set to 0, will reset the MCLK divider to generate SCLK clock for I2S master mode. To use I2S master mode, the divider must
be enabled and programmed properly.
Master mode SCLK clock divider is reset
- - - - - - - 0 -
- - - - - - - 1 -
01111100
Master mode SCLK clock divider is functional
Master Mode LRCK/FS Divider Reset [0] (R/W)
This bit, when set to 0, will reset the SCLK divider to generate LRCK/FS clock for I2S master mode. To use I2S master mode, the divider
must be enabled and programmed properly.
Master mode LRCK/FS clock divider is reset
- - - - - - - 0
- - - - - - - 1
Master mode LRCK/FS clock divider is functional
8.4.2.9 P0-R13
PLL Reference [6:4] (R/W)
00000000
This bit select the source clock for internal PLL. This bit is ignored and overriden in clock auto set mode.
The PLL reference clock is MCLK
The PLL reference clock is MCLK
Reserved
- 0 0 0 - - - -
- 0 0 1- - - -
- 1 0 0 - - - -
- 1 1 1 - - - -
The PLL reference clock is GPIO (selected using P0-R18)
8.4.2.10 P0-R14
DAC Clock Source [6:4] (R/W)
00000000
These bits select the source clock for DAC clock divider.
Master clock (PLL/MCLK and OSC auto-select)
PLL clock
- 0 0 0 - - - -
- 0 0 1- - - -
- 0 1 0 - - - -
- 0 1 1 - - - -
- 1 0 0 - - - -
Reserved
MCLK clock
SCLK clock others:
Others: reserved (muted)
8.4.2.11 P0-R18
GPIO Source for PLL Reference clock [2:0] (R/W)
00000000
These bits select the GPIO pins as clock input source when GPIO is selected as the PLL reference clock source.
Reserved
- - - - - 0 0 0
- - - - - 0 0 1
- - - - - 0 1 0
Reserved
GPIO1 functions as clock input source
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GPIO Source for PLL Reference clock [2:0] (R/W)
00000000
GPIO0 functions as clock input source
Reserved
- - - - - 0 1 1
- - - - - 1 0 0
- - - - - 1 0 1
GPIO2 functions as clock input source
Others: reserved (muted)
8.4.2.12 P0-R19
Synchronization Request [0] (R/W)
00010000
This bit, when set to 1 will issue the clock resynchronization by synchronously resets the DAC, CP and OSR clocks. The actual clock
resynchronization takes place when this bit is set back to 0, where the DAC, CP and OSR clocks are resumed at the beginning of the audio
frame.
Resume DAC, CP and OSR clocks synchronized to the beginning of audio frame
Halt DAC, CP and OSR clocks as the beginning of re-synchronization process
- - - - - - - 0
- - - - - - - 1
8.4.2.13 P0-R20
PLL Divider P-Factor [3:0] (R/W)
These bits set the PLL divider P factor. These bits are ignored in clock auto set mode.
Sets the PLL divider P factor to P=1
00000000
- - - - 0 0 0 0
- - - - 0 0 0 1
- - - - 0 0 1 0
...
Sets the PLL divider P factor to P=2
Sets the PLL divider P factor to P=3
...
Sets the PLL divider P factor to P=13
- - - - 1 1 0 0
- - - - 1 1 0 1
- - - - 1 1 1 0
- - - - 1 1 1 1
Sets the PLL divider P factor to P=14
Sets the PLL divider P factor to P=15
Prohibited (do not set this value)
8.4.2.14 P0-R21
PLL Divider J-Factor [4:0] (R/W)
These bits set the J part of the overall PLL multiplication factor J.D * R. These bits are ignored in clock auto set mode.
Prohibited (do not set this value)
00000000
- - - 0 0 0 0 0
- - - 0 0 0 0 1
- - - 0 0 0 1 0
- - - 0 0 0 1 1
...
Sets the J part if the overall PLL multiplication factor J.D * R to J = 1
Sets the J part if the overall PLL multiplication factor J.D * R to J = 2
Sets the J part if the overall PLL multiplication factor J.D * R to J = 3
...
Sets the J part if the overall PLL multiplication factor J.D * R to J = 61
Sets the J part if the overall PLL multiplication factor J.D * R to J = 62
Sets the J part if the overall PLL multiplication factor J.D * R to J = 63
- - - 1 1 1 0 1
- - - 1 1 1 1 0
- - - 1 1 1 1 1
8.4.2.15 P0-R22
PLL Divider D-Factor (Most Significant Bit) [5:0] (Least Significant Bit) [7:0] (R/W)
These bits set the D part of the overall PLL multiplication factor J.D * R. These bits are ignored in clock auto set mode.
Sets the D part if the overall PLL multiplication factor J.D * R to D = 0000
Sets the D part if the overall PLL multiplication factor J.D * R to D = 0001
Sets the D part if the overall PLL multiplication factor J.D * R to D = 0010
...
Decimal
0
1
2
...
Sets the D part if the overall PLL multiplication factor J.D * R to D = 9997
Sets the D part if the overall PLL multiplication factor J.D * R to D = 9998
Sets the D part if the overall PLL multiplication factor J.D * R to D = 9999
9997
9998
9999
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8.4.2.16 P0-R24
PLL Divider R-Factor [3:0] (R/W)
00000000
These bits set the R part of the overall PLL multiplication factor J.D * R. These bits are ignored in clock auto set mode.
Sets the R part if the overall PLL multiplication factor J.D * R to R = 1
Sets the R part if the overall PLL multiplication factor J.D * R to R = 2
Sets the R part if the overall PLL multiplication factor J.D * R to R = 3
...
- - - - 0 0 0 0
- - - - 0 0 0 1
- - - - 0 0 1 0
...
Sets the R part if the overall PLL multiplication factor J.D * R to R = 14
Sets the R part if the overall PLL multiplication factor J.D * R to R = 15
Sets the R part if the overall PLL multiplication factor J.D * R to R = 16
- - - - 1 1 0 1
- - - - 1 1 1 0
- - - - 1 1 1 1
8.4.2.17 P0-R27
DSP Clock Divider [6:0] (R/W)
These bits set the source clock divider value for the DSP clock. These bits are ignored in clock auto set mode.
These bits set the source clock divider value for the DSP clock. Divide by 1
These bits set the source clock divider value for the DSP clock. Divide by 2
These bits set the source clock divider value for the DSP clock. Divide by 3
...
00000000
- 0 0 0 0 0 0 0
- 0 0 0 0 0 0 1
- 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the DSP clock. Divide by 126
These bits set the source clock divider value for the DSP clock. Divide by 127
These bits set the source clock divider value for the DSP clock. Divide by 128
- 1 1 1 1 1 0 1
- 1 1 1 1 1 1 0
- 1 1 1 1 1 1 1
8.4.2.18 P0-R28
DAC Clock Divider [6:0] (R/W)
These bits set the source clock divider value for the DAC clock. These bits are ignored in clock auto set mode.
These bits set the source clock divider value for the DAC clock. Divide by 1
These bits set the source clock divider value for the DAC clock. Divide by 2
These bits set the source clock divider value for the DAC clock. Divide by 3
...
00000000
- 0 0 0 0 0 0 0
- 0 0 0 0 0 0 1
- 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the DAC clock. Divide by 126
These bits set the source clock divider value for the DAC clock. Divide by 127
These bits set the source clock divider value for the DAC clock. Divide by 128
- 1 1 1 1 1 0 1
- 1 1 1 1 1 1 0
- 1 1 1 1 1 1 1
8.4.2.19 P0-R29
NCP Clock Divider [6:0] (R/W)
These bits set the source clock divider value for the CP clock. These bits are ignored in clock auto set mode.
These bits set the source clock divider value for the NCP clock. Divide by 1
These bits set the source clock divider value for the NCP clock. Divide by 2
These bits set the source clock divider value for the NCP clock. Divide by 3
...
00000000
- 0 0 0 0 0 0 0
- 0 0 0 0 0 0 1
- 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the NCP clock. Divide by 126
These bits set the source clock divider value for the NCP clock. Divide by 127
These bits set the source clock divider value for the NCP clock. Divide by 128
- 1 1 1 1 1 0 1
- 1 1 1 1 1 1 0
- 1 1 1 1 1 1 1
8.4.2.20 P0-R30
OSR Clock Divider [6:0] (R/W)
00000000
These bits set the source clock divider value for the OSR clock. These bits are ignored in clock auto set mode.
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OSR Clock Divider [6:0] (R/W)
00000000
These bits set the source clock divider value for the OSR clock. Divide by 1
These bits set the source clock divider value for the OSR clock. Divide by 2
These bits set the source clock divider value for the OSR clock. Divide by 3
...
- 0 0 0 0 0 0 0
- 0 0 0 0 0 0 1
- 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the OSR clock. Divide by 126
These bits set the source clock divider value for the OSR clock. Divide by 127
These bits set the source clock divider value for the OSR clock. Divide by 128
- 1 1 1 1 1 0 1
- 1 1 1 1 1 1 0
- 1 1 1 1 1 1 1
8.4.2.21 P0-R32
Master Mode SCLK Divider [6:0] (R/W)
These bits set the MCLK divider value to generate I2S master SCLK clock.
These bits set the source clock divider value for the SCLK clock. Divide by 1
These bits set the source clock divider value for the SCLK clock. Divide by 2
These bits set the source clock divider value for the SCLK clock. Divide by 3
...
00000000
- 0 0 0 0 0 0 0
- 0 0 0 0 0 0 1
- 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the SCLK clock. Divide by 126
These bits set the source clock divider value for the SCLK clock. Divide by 127
These bits set the source clock divider value for the SCLK clock Divide by 128
- 1 1 1 1 1 0 1
- 1 1 1 1 1 1 0
- 1 1 1 1 1 1 1
8.4.2.22 P0-R33
Master Mode LRCK/FS Divider [7:0] (R/W)
These bits set the I2S master SCLK clock divider value to generate I2S master LRCK/FS clock.
These bits set the source clock divider value for the LRCK/FS clock. Divide by 1
These bits set the source clock divider value for the LRCK/FS clock. Divide by 2
These bits set the source clock divider value for the LRCK/FS clock. Divide by 3
...
00000000
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
These bits set the source clock divider value for the LRCK/FS clock. Divide by 254
These bits set the source clock divider value for the LRCK/FS clock. Divide by 255
These bits set the source clock divider value for the LRCK/FS clock. Divide by 256
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.23 P0-R34
16x Interpolation [4] (R/W)
This bit enables or disables the 16x interpolation mode
8x interpolation
00000000
- - - 0 - - - -
- - - 1 - - - -
000000000
16x interpolation
Switching Frequency Speed Mode [1:0] (R/W)
These bits select the FS operation mode, which must be set according to the current audio sampling rate. These bits are ignored in clock
auto set mode.
Single speed (fSW ≤ 48 kHz)
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
Double speed (48 kHz ≤ fSW ≤ 96 kHz)
Quad speed (96 kHz ≤ fSW ≤ 192 kHz)
8.4.2.24 P0-R35
Available DSP Clock Cycles (MSB) [7:0] (R/W)
00000001
These bits specify the number of DSP clock cycles available in one audio frame. The value should match the DSP clock FS ratio. These bits
are ignored in clock auto set mode.
DSP clock:FS ratio = x
0 0 0 0 0 0 0 0
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Available DSP Clock Cycles (MSB) [7:0] (R/W)
00000001
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
DSP clock:FS ratio = x
DSP clock:FS ratio = x
...
DSP clock:FS ratio = x
DSP clock:FS ratio = x
DSP clock:FS ratio = x
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.25 P0-R36
Available DSP Clock Cycles (LSB) [7:0] (R/W)
00000000
These bits specify the number of DSP clock cycles available in one audio frame. The value should match the DSP clock FS ratio. These bits
are ignored in clock auto set mode.
DSP clock:FS ratio = x
DSP clock:FS ratio = x
DSP clock:FS ratio = x
...
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
DSP clock:FS ratio = x
DSP clock:FS ratio = x
DSP clock:FS ratio = x
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.26 P0-R37
Ignore FS Detection [6] (R/W)
00000000
This bit controls whether to ignore the FS detection. When ignored, FS error will not cause a clock error.
Regard FS detection
- 0 - - - - - -
- 1 - - - - - -
00000000
Ignore FS detection
Ignore SCLK Detection [5] (R/W)
This bit controls whether to ignore the SCLK detection against LRCK/FS. The SCLK must be stable between 32FS and 256FS inclusive or
an error will be reported. When ignored, a SCLK error will not cause a clock error.
Regard SCLK detection
Ignore SCLK detection
- - 1 - - - - -
- - 0 - - - - -
00000000
Ignore MCLK Detection [4] (R/W)
This bit controls whether to ignore the MCLK detection against LRCK/FS. Only some certain MCLK ratios within some error margin are
allowed. When ignored, an MCLK error will not cause a clock error.
Regard MCLK detection
Ignore MCLK detection
- - - 0 - - - -
- - - 1 - - - -
00000000
Ignore Clock Halt Detection [3] (R/W)
This bit controls whether to ignore the MCLK halt (static or frequency is lower than acceptable) detection. When ignored an MCLK halt will
not cause a clock error.
Regard MCLK halt detection
Ignore MCLK halt detection
- - - - - - 0 -
- - - - - - 1 -
00000000
Ignore LRCK/FS and SCLK Missing Detection [2] (R/W)
This bit controls whether to ignore the LRCK/FS and SCLK missing detection. The LRCK/FS and SCLK need to be in low state (not only
static) to be deemed missing. When ignored an LRCK/FS and SCLK missing will not cause the DAC go into powerdown mode.
Regard LRCK/FS and SCLK missing detection
Ignore LRCK/FS and SCLK missing detection
- - - - - 0 - -
- - - - - 1 - -
00000000
Disable Clock Divider Autoset [1] (R/W)
This bit enables or disables the clock auto set mode. When dealing with uncommon audio clock configuration, the auto set mode must be
disabled and all clock dividers must be set manually. Addtionally, some clock detectors might also need to be disabled. The clock autoset
feature will not work with PLL enabled in VCOM mode. In this case this feature has to be disabled and the clock dividers must be set
manually.
Enable clock auto set
- - - - - - 0 -
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Disable Clock Divider Autoset [1] (R/W)
Ignore PLL Lock Detection [0] (R/W)
00000000
Disable clock auto set
- - - - -- 1 -
00000000
This bit controls whether to ignore the PLL lock detection. When ignored, PLL unlocks will not cause a clock error. The PLL lock flag at P0-
R4, bit 4 is always correct regardless of this bit.
PLL unlocks raise clock error
PLL unlocks are ignored
- - - - - - - 0
- - - - - - - 1
8.4.2.27 P0-R40
I2S Data Format [5:4] (R/W)
00000010
These bits control both input and output audio interface formats for DAC operation.
Input and output audio interface formats for DAC operation is I2S
- - 0 0 - - - -
- - 0 1 - - - -
- - 1 0 - - - -
- - 1 1 - - - -
000000010
Input and output audio interface formats for DAC operation is TDM/DSP
Input and output audio interface formats for DAC operation is RTJ
Input and output audio interface formats for DAC operation is LTJ
I2S Word Length [1:0] (R/W)
These bits control both input and output audio interface sample word lengths for DAC operation.
Input and output audio interface sample word length for DAC operation is 16 bits
Input and output audio interface sample word length for DAC operation is 20 bits
Input and output audio interface sample word length for DAC operation is 24 bits
Input and output audio interface sample word length for DAC operation is 32 bits
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
- - - - - - 1 1
8.4.2.28 P0-R41
I2S Shift [7:0] (R/W)
00000000
These bits control the offset of audio data in the audio frame for both input and output. The offset is defined as the number of SCLK from
the starting (MSB) of audio frame to the starting of the desired audio sample.
Offset (number of SCLK from the starting (MSB) of audio frame to the starting of the desired audio sample) is 0 SCLK
(no offset)
0 0 0 0 0 0 0 0
Offset is 1 SCLK
Offset is 2 SCLKs
...
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
Offset is 254 SCLKs
Offset is 255 SCLKs
Offset is 256 SCLKs
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.29 P0-R42
Channel B DAC Data Path [5:4] (R/W)
00000001
These bits control the Channel B audio data path connection.
Zero data (mute)
Channel B data
- - 0 0 - - - -
- - 0 1 - - - -
- - 1 0 - - - -
- - 1 1 - - - -
000000001
Channel A data
Reserved (do not set)
Channel A DAC Data Path [1:0] (R/W)
These bits control the Channel A audio data path connection.
Zero data (mute)
Channel A data
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
- - - - - - 1 1
Channel B data
Reserved (do not set)
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8.4.2.30 P0-R43
DSP Program Selection [4:0] (R/W)
00000001
These bits select the DSP program to use for audio processing.
Reserved (do not set)
- - - 0 0 0 0 0
- - - 0 0 0 0 1
- - - 0 0 0 1 0
- - - 0 0 0 1 1
- - - 0 0 1 0 0
- - - 0 0 1 0 1
- - - 0 0 1 1 0
- - - 0 0 1 1 1
...
8x, 4x, or 2x FIR interpolation filter with de-emphasis
8x, 4x, or 2x Low latency IIR interpolation filter with de-emphasis
16x FIR interpolation filter with de-emphasis
16x Low latency IIR interpolation filter with de-emphasis
Fixed process flow with configurable parameters
Reserved (do not set)
8× Ringing-less low latency FIR interpolation filter without de-emphasis
Others: Reserved (do not set)
User program in RAM
- - - 1 1 1 1 1
8.4.2.31 P0-R44
Clock Missing Detection Period [2:0] (R/W)
00000000
These bits set how long both SCLK and LRCK/FS keep low before the audio clocks deemed missing and the DAC transitions to powerdown
mode.
Period that SCLK and LRCK/FS are keep low before the audio clock is deemed missing and the DAC transitions to
powerdown mode is approximately 1 second
- - - - - 0 0 0
Period that SCLK and LRCK/FS are keep low before the audio clock is deemed missing and the DAC transitions to
powerdown mode is approximately 2 seconds
- - - - - 0 0 1
...
...
Period that SCLK and LRCK/FS are keep low before the audio clock is deemed missing and the DAC transitions to
powerdown mode is approximately 7 seconds
- - - - - 1 1 0
Period that SCLK and LRCK/FS are keep low before the audio clock is deemed missing and the DAC transitions to
powerdown mode is approximately 8 seconds
- - - - - 1 1 1
8.4.2.32 P0-R59
Auto Mute Time for Channel B [6:4] (R/W)
00000000
These bits specify the length of consecutive zero samples at Channel B before the channel can be auto muted. The times shown are for 48
kHz sampling rate and will scale with other rates.
Length of consecutive zero samples before the channel can be auto muted is 21 ms
Length of consecutive zero samples before the channel can be auto muted is 106 ms
Length of consecutive zero samples before the channel can be auto muted is 213 ms
Length of consecutive zero samples before the channel can be auto muted is 533 ms
Length of consecutive zero samples before the channel can be auto muted is 1.07 seconds
Length of consecutive zero samples before the channel can be auto muted is 2.13 seconds
Length of consecutive zero samples before the channel can be auto muted is 5.33 seconds
Length of consecutive zero samples before the channel can be auto muted is 10.66 seconds
Auto Mute Time for Channel A [2:0] (R/W)
- 0 0 0 - - - -
- 0 0 1- - - -
- 0 1 0 - - - -
- 0 1 1 - - - -
- 1 0 0 - - - -
- 1 0 1 - - - -
- 1 1 0 - - - -
- 1 1 1 - - - -
00000000
These bits specify the length of consecutive zero samples at Channel A before the channel can be auto muted. The times shown are for 48
kHz sampling rate and will scale with other rates.
Length of consecutive zero samples before the channel can be auto muted is 21 ms
Length of consecutive zero samples before the channel can be auto muted is 106 ms
Length of consecutive zero samples before the channel can be auto muted is 213 ms
Length of consecutive zero samples before the channel can be auto muted is 533 ms
Length of consecutive zero samples before the channel can be auto muted is 1.07 seconds
Length of consecutive zero samples before the channel can be auto muted is 2.13 seconds
Length of consecutive zero samples before the channel can be auto muted is 5.33 seconds
- - - - - 0 0 0
- - - - - 0 0 1
- - - - - 0 1 0
- - - - - 0 1 1
- - - - - 1 0 0
- - - - - 1 0 1
- - - - - 1 1 0
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Auto Mute Time for Channel A [2:0] (R/W)
00000000
Length of consecutive zero samples before the channel can be auto muted is 10.66 seconds
- - - - - 1 1 1
8.4.2.33 P0-R60
Digital Volume Control [1:0] (R/W)
These bits control the behavior of the digital volume.
The volume for Channels A and B are independent
Channel A volume follows Channel B setting
000000000
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
- - - - - - 1 1
Channel B volume follows Channel A setting
Reserved (The volume for Channels A and B are independent)
8.4.2.34 P0-R61
Channel B Digital Volume [7:0] (R/W)
00110000
These bits control the Channel B digital volume. The digital volume is 24 dB to -103 dB in -0.5 dB step.
Channel B digital volume is 24 dB
Channel B digital volume is 23.5 dB
Channel B digital volume is 23 dB.
...
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
Channel B digital volume is 0.5 dB
Channel B digital volume is 0 dB
Channel B digital volume is –0.5 dB
...
0 0 1 0 0 0 0 0
0 0 1 1 0 0 0 0
0 0 1 1 0 0 0 1
...
Channel B digital volume is –102.5 dB
Channel B digital volume is –103 dB
Reserved
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.35 P0-R62
Channel A Digital Volume [7:0] (R/W)
00110000
These bits control the Channel A digital volume. The digital volume is 24 dB to -103 dB in -0.5 dB step.
Channel A digital volume is 24 dB
Channel A digital volume is 23.5 dB
Channel A digital volume is 23 dB.
...
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
Channel A digital volume is 0.5 dB
Channel A digital volume is 0 dB
Channel A digital volume is –0.5 dB
...
0 0 1 0 0 0 0 0
0 0 1 1 0 0 0 0
0 0 1 1 0 0 0 1
...
Channel A digital volume is –102.5 dB
Channel A digital volume is –103 dB
Reserved
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.36 P0-R63
Digital Volume Normal Ramp-Down Frequency [7:6] (R/W)
00100010
These bits control the frequency of the digital volume updates when the volume is ramping down. The setting here is applied to soft mute
request, asserted by SPK_MUTE pin or P0-R3.
The frequency of the digital volume updates is every 1 FS period
The frequency of the digital volume updates is every 2 FS period
The frequency of the digital volume updates is every 4 FS period
0 0 - - - - - -
0 1 - - - - - -
1 0 - - - - - -
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Digital Volume Normal Ramp-Down Frequency [7:6] (R/W)
Directly sets the volume to zero (Instant mute)
Digital Volume Normal Ramp Down Step [5:4] (R/W)
00100010
1 1 - - - - - -
00100010
These bits control the step of the digital volume updates when the volume is ramping down. The setting here is applied to soft mute
request, asserted by SPK_MUTE pin or P0-R3.
Decrement by 4 dB for each update
Decrement by 2 dB for each update
Decrement by 1 dB for each update
Decrement by 0.5 dB for each update
- - 0 0 - - - -
- - 0 1 - - - -
- - 1 0 - - - -
- - 1 1 - - - -
00100010
Digital Volume Normal Ramp-Up Frequency [3:2] (R/W)
These bits control the frequency of the digital volume updates when the volume is ramping up. The setting here is applied to soft unmute
request, asserted by SPK_MUTE pin or P0-R3.
The frequency of the digital volume updates is every 1 FS period
The frequency of the digital volume updates is every 2 FS period
The frequency of the digital volume updates is every 4 FS period
Directly sets the volume to zero (Instant unmute)
- - - - 0 0 - -
- - - - 0 1 - -
- - - - 1 0 - -
- - - - 1 1 - -
001000010
Digital Volume Normal Ramp Up Step [1:0] (R/W)
These bits control the step of the digital volume updates when the volume is ramping up. The setting here is applied to soft unmute request,
asserted by SPK_MUTE pin or P0-R3.
Increment by 4 dB for each update
Increment by 2 dB for each update
Increment by 1 dB for each update
Increment by 0.5 dB for each update
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
- - - - - - 1 1
8.4.2.37 P0-R64
Digital Volume Emergency Ramp Down Frequency [7:6] (R/W)
00000010
These bits control the frequency of the digital volume updates when the volume is ramping down due to clock error or power outage, which
usually needs faster ramp down compared to normal soft mute.
The frequency of the digital volume updates is every 1 FS period
The frequency of the digital volume updates is every 2 FS period
The frequency of the digital volume updates is every 4 FS period
Directly sets the volume to zero (Instant mute)
0 0 - - - - - -
0 1 - - - - - -
1 0 - - - - - -
1 1 - - - - - -
00000010
Digital Volume Emergency Ramp Down Step [5:4] (R/W)
These bits control the step of the digital volume updates when the volume is ramping down due to clock error or power outage, which
usually needs faster ramp down compared to normal soft mute.
Decrement by 4 dB for each update
Decrement by 2 dB for each update
Decrement by 1 dB for each update
Decrement by 0.5 dB for each update
- - 0 0 - - - -
- - 0 1 - - - -
- - 1 0 - - - -
- - 1 1 - - - -
8.4.2.38 P0-R65
Auto Mute Control [2] (R/W)
00000100
This bit controls the behavior of the auto mute upon zero sample detection. The time length for zero detection is set with P0-R59.
Auto mute Channel B and Channel A independently
- - - - - 0 - -
Auto mute Channels A and Channel B only when both channels are about to be auto muted
Auto Mute Channel B [1] (R/W)
- - - - - 1 - -
00000100
This bit enables or disables auto mute on Channel A. Note that when Channel A auto mute is disabled and the P0-R65, bit 2 is set to 1, the
Channel B will also never be auto muted.
Disable Channel A auto mute
Enable Channel A auto mute
- - - - - - - 0 -
- - - - - - - 1 -
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Auto Mute Channel A [0] (R/W)
00000100
This bit enables or disables auto mute on Channel B. Note that when Channel B auto mute is disabled and the P0-R65, bit 2 is set to 1, the
Channel A will also never be auto muted.
Disable Channel B auto mute
Enable Channel B auto mute
- - - - - - - 0
- - - - - - - 1
8.4.2.39 P0-R82
GPIO1 Output Selection [4:0] (R/W)
00000000
These bits select the signal to output to GPIO1. To actually output the selected signal, the GPIO1 must be set to output mode at P0-R8.
Off (low)
- - - 0 0 0 0 0
- - - 0 0 0 0 1
- - - 0 0 0 1 0
- - - 0 0 0 1 1
- - - 0 0 1 0 0
- - - 0 0 1 0 1
- - - 0 0 1 1 0
- - - 0 0 1 1 1
- - - 0 1 0 0 0
- - - 0 1 0 0 1
- - - 0 1 0 1 0
- - - 0 1 0 1 1
- - - 0 1 1 0 0
- - - 0 1 1 0 1
- - - 0 1 1 1 0
- - - 0 1 1 1 1
- - - 1 0 0 0 0
DSP GPIO1 output
Register GPIO1 output (P0-R86, bit 2)
Auto mute flag (asserted when both Channel A and Channel B are auto muted)
Auto mute flag for Channel B
Auto mute flag for Channel A
Clock invalid flag (clock error or clock changing or clock missing)
Serial audio interface data output (SDOUT)
Analog mute flag for Channel B (low active)
Analog mute flag for Channel A (low active)
PLL lock flag
Charge pump clock
Reserved
Reserved
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.7 DVDD
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.3 DVDD
PLL Output/4 (Requires Clock Flex Register)
Others: reserved
8.4.2.40 P0-R83
GPIO0 Output Selection [4:0] (R/W)
00000000
These bits select the signal to output to GPIO0. To actually output the selected signal, the GPIO0 must be set to output mode at P0-R8.
Off (low)
- - - 0 0 0 0 0
- - - 0 0 0 0 1
- - - 0 0 0 1 0
- - - 0 0 0 1 1
- - - 0 0 1 0 0
- - - 0 0 1 0 1
- - - 0 0 1 1 0
- - - 0 0 1 1 1
- - - 0 1 0 0 0
- - - 0 1 0 0 1
- - - 0 1 0 1 0
- - - 0 1 0 1 1
- - - 0 1 1 0 0
- - - 0 1 1 0 1
- - - 0 1 1 1 0
- - - 0 1 1 1 1
- - - 1 0 0 0 0
DSP GPIO0 output
Register GPIO0 output (P0-R86, bit 2)
Auto mute flag (asserted when both Channel A and Channel B are auto muted)
Auto mute flag for Channel B
Auto mute flag for Channel A
Clock invalid flag (clock error or clock changing or clock missing)
Serial audio interface data output (SDOUT)
Analog mute flag for Channel B (low active)
Analog mute flag for Channel A (low active)
PLL lock flag
Charge pump clock
Reserved
Reserved
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.7 DVDD
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.3 DVDD
PLL Output/4 (Requires Clock Flex Register)
Others: reserved
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8.4.2.41 P0-R85
GPIO2 Output Selection [4:0] (R/W)
00000000
These bits select the signal to output to GPIO2. To actually output the selected signal, the GPIO2 must be set to output mode at P0-R8.
Off (low)
- - - 0 0 0 0 0
- - - 0 0 0 0 1
- - - 0 0 0 1 0
- - - 0 0 0 1 1
- - - 0 0 1 0 0
- - - 0 0 1 0 1
- - - 0 0 1 1 0
- - - 0 0 1 1 1
- - - 0 1 0 0 0
- - - 0 1 0 0 1
- - - 0 1 0 1 0
- - - 0 1 0 1 1
- - - 0 1 1 0 0
- - - 0 1 1 0 1
- - - 0 1 1 1 0
- - - 0 1 1 1 1
- - - 1 0 0 0 0
DSP GPIO2 output
Register GPIO2 output (P0-R86, bit 5)
Auto mute flag (asserted when both Channels A and B are auto muted)
Auto mute flag for Channel B
Auto mute flag for Channel A
Clock invalid flag (clock error or clock changing or clock missing)
Serial audio interface data output (SDOUT)
Analog mute flag for Channel B (low active)
Analog mute flag for Channel A (low active)
PLL lock flag
Charge pump clock
Reserved
Reserved
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.7 DVDD
Under voltage flag, asserted when SPK_MUTE voltage is higher than 0.3 DVDD
PLL Output/4 (Requires Clock Flex Register)
Others: reserved
8.4.2.42 P0-R86
GPIO2 Output Control [5] (R/W)
00000000
This bit controls the GPIO2 output when the selection at P0-R85 is set to 0010 (register output).
Output low
- - - 0 - - - - -
- - - 1 - - - - -
00000000
Output high
GPIO0 Output Control [3] (R/W)
This bit controls the GPIO0 output when the selection at P0-R83 is set to 0010 (register output).
Output low
- - - - - 0 - - -
- - - - - 1 - - -
00000000
Output high
GPIO1 Output Control [2] (R/W)
This bit controls the GPIO1 output when the selection at P0-R82 is set to 0010 (register output).
Output low
Output high
- - - - - 0 - -
- - - - - 1 - -
8.4.2.43 P0-R87
GPIO2 Output Inversion [5] (R/W)
00000000
This bit controls the polarity of GPIO2 output. When set to 1, the output is inverted for any signal being selected.
Non-inverted
- - - 0 - - - - -
- - - 1 - - - - -
00000000
Inverted
GPIO0 Output Inversion [3] (R/W)
This bit controls the polarity of GPIO0 output. When set to 1, the output is inverted for any signal being selected.
Non-inverted
Inverted
- - - - - 0 - - -
- - - - - 1 - - -
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GPIO1 Output Inversion [2] (R/W)
00000000
This bit controls the polarity of GPIO1 output. When set to 1, the output is inverted for any signal being selected.
Non-inverted
Inverted
- - - - - 0 - -
- - - - - 1 - -
8.4.2.44 P0-R90
Channel B-1 Overflow [4] (Read Only)
00000000
This bit indicates whether the Channel B of DSP first output port has overflow. This bit is sticky and is cleared when read.
No overflow
- - - 0 - - - -
- - - 1 - - - -
00000000
Overflow occurred
Channel A-1 Overflow [3] (Read Only)
This bit indicates whether the Channel A of DSP first output port has overflow. This bit is sticky and is cleared when read.
No overflow
- - - - - 0 - - -
- - - - - 1 - - -
00000000
Overflow occurred
Channel B-2 Overflow [2] (Read Only)
This bit indicates whether the Channel B of DSP second output port has overflow. This bit is sticky and is cleared when read.
No overflow
- - - - - 0 - -
- - - - - 1 - -
00000000
Overflow occurred
Channel A-2 Overflow [1] (Read Only)
This bit indicates whether the Channel A of DSP second output port has overflow. This bit is sticky and is cleared when read.
No overflow
- - - - - - - 0 -
- - - - - - - 1 -
00000000
Overflow occurred
Shifter Overflow [0] (Read Only)
This bit indicates whether overflow occurred in the DSP shifter (possible sample corruption). This bit is sticky and is cleared when read.
No overflow
- - - - - - - 0
- - - - - - - 1
Overflow occurred
8.4.2.45 P0-R91
Detected FS [6:4] (Read Only)
00111000
These bits indicate the currently detected audio sampling rate.
Error (out-of-valid range)
8 kHz
- 0 0 0 - - - -
- 0 0 1 - - - -
- 0 1 0 - - - -
- 0 1 1 - - - -
- 1 0 0 - - - -
- 1 0 1 - - - -
- 1 1 1 - - - -
00111000
16 kHz
32 kHz to 48 kHz
88.2 kHz to 96 kHz
176.4 kHz to 192 kHz
Reserved
Detected MCLK Ratio [3:0] (Read Only)
These bits indicate the currently detected MCLK ratio. Note that even if the MCLK ratio is not indicated as error, clock error might still be
flagged due to incompatible combination with the sampling rate. Specifically the MCLK ratio must be high enough to allow enough DSP
cycles for minimal audio processing when PLL is disabled. The absolute MCLK frequency must also be lower than 50 MHz.
Ratio error (The MCLK ratio is not allowed)
MCLK = 32 FS
- - - - 0 0 0 0
- - - - 0 0 0 1
- - - - 0 0 1 0
- - - - 0 0 1 1
- - - - 0 1 0 0
- - - - 0 1 0 1
- - - - 0 1 1 0
- - - - 0 1 1 1
MCLK = 48 FS
MCLK = 64 FS
MCLK = 128 FS
MCLK = 192 FS
MCLK = 256 FS
MCLK = 384 FS
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Detected MCLK Ratio [3:0] (Read Only)
00111000
MCLK = 512 FS
MCLK = 768 FS
MCLK = 1024 FS
MCLK = 1152 FS
MCLK = 1536 FS
MCLK = 2048 FS
MCLK = 3072 FS
- - - - 1 0 0 0
- - - - 1 0 0 1
- - - - 1 0 1 0
- - - - 1 0 1 1
- - - - 1 1 0 0
- - - - 1 1 0 1
- - - - 1 1 1 0
8.4.2.46 P0-R92
Detected SCLK Ratio [0] (Read Only)
00000000
This bit is the MSB of the 9 bit word that describes the currently detected SCLK to LRCK/FS Ratio. Binary to decimal conversion gives ratio.
Decode with P0-93 to determine value.
- - - - - - - 0
- - - - - - - 1
8.4.2.47 P0-R93
Detected SCLK Ratio [7:0] (Read Only)
00000000
These bits are bit 1 through bit 8 of the 9 bit word that describes the currently detected SCLK to LRCK/FS Ratio. Binary to decimal
conversion gives ratio.
LSB of 9 bit word
- - - - - - - 0
2nd LSB of 9 bit word
- - - - - - 0 -
...
...
2nd MSB of 9 bit word (MSB is found in P0-R92-B0)
0 - - - - - - -
00111000
Detected MCLK Ratio [3:0] (Read Only)
These bits indicate the currently detected MCLK ratio. Note that even if the MCLK ratio is not indicated as error, clock error might still be
flagged due to incompatible combination with the sampling rate. Specifically the MCLK ratio must be high enough to allow enough DSP
cycles for minimal audio processing when PLL is disabled. The absolute MCLK frequency must also be lower than 50 MHz.
These bits indicate the currently detected MCLK ratio. Note that even if the MCLK ratio is not indicated as error, clock
error might still be flagged due to incompatible combination with the sampling rate. Specifically the MCLK ratio must be
high enough to allow enough DSP cycles for minimal audio processing when PLL is disabled. The absolute MCLK
- - - - 0 0 0 0
frequency must also be lower than 50 MHz. Ratio error (The MCLK ratio is not allowed)
MCLK = 32 FS
MCLK = 48 FS
MCLK = 64 FS
MCLK = 128 FS
MCLK = 192 FS
MCLK = 256 FS
MCLK = 384 FS
MCLK = 512 FS
MCLK = 768 FS
MCLK = 1024 FS
MCLK = 1152 FS
MCLK = 1536 FS
MCLK = 2048 FS
MCLK = 3072 FS
- - - - 0 0 0 1
- - - - 0 0 1 0
- - - - 0 0 1 1
- - - - 0 1 0 0
- - - - 0 1 0 1
- - - - 0 1 1 0
- - - - 0 1 1 1
- - - - 1 0 0 0
- - - - 1 0 0 1
- - - - 1 0 1 0
- - - - 1 0 1 1
- - - - 1 1 0 0
- - - - 1 1 0 1
- - - - 1 1 1 0
8.4.2.48 P0-R94
Clock Detector Status [6] (Ready Only)
00000000
This bit indicates whether the MCLK clock is present or not.
MCLK is present
- 0 - - - - - -
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Clock Detector Status [6] (Ready Only)
Clock Detector Status 5 [5] (Ready Only)
00000000
MCLK is missing (halted)
- 1 - - - - - -
00000000
This bit indicates whether the PLL is locked or not. The PLL will be reported as unlocked when it is disabled.
PLL is locked
- - 1 - - - - -
- - 0 - - - - -
00000000
PLL is unlocked
Clock Detector Status 4 [4] (Ready Only)
This bit indicates whether the both LRCK/FS and SCLK are missing (tied low) or not.
LRCK/FS and/or SCLK is present
- - - 0 - - - -
- - - 1 - - - -
00000000
LRCK/FS and SCLK are missing
Clock Detector Status 3 [3] (Read Only)
This bit indicates whether the combination of current sampling rate and MCLK ratio is valid for clock auto set.
The combination of FS:MCLK ratio is valid
- - - - - 0 - - -
- - - - - 1 - - -
00000000
Error (clock auto set is not possible)
Clock Detector Status 2 [2] (Read Only)
This bit indicates whether the MCLK is valid or not. The MCLK ratio must be detectable to be valid. There is a limitation with this flag, that
is, when the low period of LRCK/FS is less than or equal to 5 SCLKs, this flag will be asserted (MCLK invalid reported).
MCLK is valid
- - - - - 0 - -
- - - - - 1 - -
00000000
MCLK is invalid
Clock Detector Status 1 [1] (Read Only)
This bit indicates whether the SCLK is valid or not. The SCLK ratio must be stable and in the range of 32-256FS to be valid.
SCLK is valid
- - - - - - - 0 -
- - - - - - - 1 -
00000000
SCLK is invalid
Clock Detector Status 0 [0] (Read Only)
This bit indicated whether the audio sampling rate is valid or not. The sampling rate must be detectable to be valid. There is a limitation with
this flag, that is when this flag is asserted and P0-R37 is set to ignore all asserted error flags such that the DAC recovers, this flag will be
de-asserted (sampling rate invalid not reported anymore).
Sampling rate is valid
Sampling rate is invalid
- - - - - - - 0
- - - - - - - 1
8.4.2.49 P0-R95
Latched Clock Halt [4] (Ready Only)
00000000
This bit indicates whether MCLK halt has occurred. The bit is cleared when read.
MCLK halt has not occurred
- - - 0 - - - -
- - - 1 - - - -
00000000
MCLK halt has occurred since last read
Clock Missing [2] (Read Only)
This bit indicates whether the LRCK/FS and SCLK are missing (tied low).
One or both of LRCK/FS SCLK is present
Both LRCK/FS and SCLK are missing
Clock Resync Request [1] (Read Only)
This bit indicates whether the clock resynchronization is in progress.
Not resynchronizing
- - - - - 0 - -
- - - - - 1 - -
00000000
- - - - - - - 0 -
- - - - - - - 1 -
00000000
Clock resynchronization is in progress
Clock Error [0] (Read Only)
This bit indicates whether a clock error is being reported.
Clock is valid
- - - - - - - 0
- - - - - - - 1
Clock is invalid (Error)
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8.4.2.50 P0-R108
Channel B Analog Mute Monitor [1] (Read Only)
00110011
This bit is a monitor for Channel B analog mute status.
Mute
- - - - - - - 0 -
- - - - - - - 1 -
00110011
Unmute
Channel A Analog Mute Monitor [0] (Read Only)
This bit is a monitor for Channel A analog mute status.
Mute
- - - - - - - 0
- - - - - - - 1
Unmute
8.4.2.51 P0-R109
Short Detect Monitor [4] (Ready Only)
00000000
This bit indicates whether line output short is occurring on the DAC_OUTx line.
Normal (No short)
- - - 0 - - - -
- - - 1 - - - -
00000000
Line output is being shorted
Short Detected Monitor [0] (Read Only)
This bit indicates whether line output short on DAC_OUTx has occurred since last read. This bit is sticky and is cleared when read.
No short
- - - - - - - 0
Line output short occurred
- - - - - - - 1
8.4.2.52 P0-R114
SPK_MUTE Decoder Status[1:0] (Read Only)
00000000
These bits indicate the output of the SPK_MUTE level decoder for monitoring purpose.
VDD > SPK_MUTE
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
- - - - - - 1 1
VDD ≤ SPK_MUTE < 0.7 × VDD
Reserved (do not set)
0.7 × VDD ≤ SPK_MUTE
8.4.2.53 P0-R115
FS Speed Mode Monitor [1:0] (Read Only)
00000000
These bits indicate the actual FS operation mode being used. The actual value is the auto set one when clock auto set is active and register
set one when clock auto set is disabled.
Single speed (fS ≤ 48 kHz)
- - - - - - 0 0
- - - - - - 0 1
- - - - - - 1 0
Double speed (48 kHz ≤ fS ≤ 96 kHz)
Quad speed (96 kHz ≤ fS ≤ 192 kHz)
8.4.2.54 P0-R117
DSP Boot Done Flag [7] (R/W)
00000000
This bit indicates whether the DSP boot is completed.
DSP is booting
0 - - - - - - -
1 - - - - - - -
00000000
DSP boot completed
Power State [3:0] (Read Only)
These bits indicate the current power state of the DAC
Powerdown
- - - - 0 0 0 0
- - - - 0 0 0 1
- - - - 0 0 1 0
- - - - 0 0 1 1
Wait for CP voltage valid
Calibration
Calibration
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Power State [3:0] (Read Only)
00000000
Volume ramp up
- - - - 0 1 0 0
- - - - 0 1 0 1
- - - - 0 1 1 0
- - - - 0 1 1 1
- - - - 1 0 0 0
Run (Playing)
Line output short or low impedance
Volume ramp down
Standby
8.4.2.55 P0-R119
GPIO2 Input State [5] (Read Only)
00101101
This bit indicates the logic level at GPIO2 pin.
GPIO2 logic level low
- - - 0 - - - - -
- - - 1 - - - - -
00101101
GPIO2 logic level high
GPIO0 Input State [3] (Read Only)
This bit indicates the logic level at GPIO0 pin.
GPIO0 logic level low
- - - - - 0 - - -
- - - - - 1 - - -
00101101
GPIO0 logic level high
GPIO1 Input State [2] (Read Only)
This bit indicates the logic level at GPIO1 pin.
GPIO1 logic level low
- - - - - 0 - -
- - - - - 1 - -
GPIO1 logic level high
8.4.2.56 P0-R120
Auto Mute Flag for Channel B [4] (Read Only)
00000000
This bit indicates the auto mute status for Channel B.
Not auto muted
Auto muted
- - - 0 - - - -
- - - 1 - - - -
00000000
Auto Mute Flag for Channel A [0] (Read Only)
This bit indicates the auto mute status for Channel A.
Not auto muted
Auto muted
- - - - - - - 0
- - - - - - - 1
8.4.2.57 P0-R121
DAC Mode [0] (R/W)
00000000
This bit controls the DAC mode.
Mode1
Mode2
- - - - - - - 0
- - - - - - - 1
8.4.2.58 P1-R2
Analog Gain Control for Channel B [4] (R/W)
00000000
This bit controls the Channel B analog gain.
0 dB
- - - 0 - - - -
- - - 1 - - - -
00000000
–6 dB
Analog Gain Control for Channel A [0] (R/W)
This bit controls the Channel A analog gain.
0 dB
- - - - - - - 0
- - - - - - - 1
–6 dB
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8.4.2.59 P1-R5
External UVP Control [1] (R/W)
00010001
This bit enables or disables detection of power supply drop via SPK_MUTE pin (external UVLO protection).
Enabled
- - - - - - - 0 -
- - - - - - - 1 -
00010001
Disabled
Internal UVP Control [0] (R/W)
This bit enables or disables internal detection of AVDD voltage drop (internal UVLO protection).
Enabled
Disabled
- - - - - - - 0
- - - - - - - 1
8.4.2.60 P1-R6
Analog Mute Control [0] (R/W)
00000000
This bit enables or disables analog mute following digital mute.
Enabled
Disabled
- - - - - - - 0
- - - - - - - 1
8.4.2.61 P1-R7
Analog +10% Gain for Channel B [4] (R/W)
This bit enables or disables amplitude boost mode for Channel B.
Normal amplitude
00000000
- - - 0 - - - -
- - - 1 - - - -
00000000
+10% (+0.8 dB) boosted amplitude
Analog +10% Gain for Channel A [0] (R/W)
This bit enables or disables amplitude boost mode for Channel A.
Normal amplitude
- - - - - - - 0
- - - - - - - 1
+10% (+0.8 dB) boosted amplitude
8.4.2.62 P1-R8
VCOM Reference Ramp-Up [0] (R/W)
This bit controls the VCOM voltage ramp up speed.
00000000
Normal ramp-up time is approximately 600 ms with external capacitance = 1 µF
Fast ramp-up time is approximately 3 ms with external capacitance = 1 µF
- - - - - - - 0
- - - - - - - 1
8.4.2.63 P1-R9
VCOM Power-Down Control [0] (R/W)
This bit controls VCOM powerdown switch.
VCOM is powered on
00000000
- - - - - - - 0
- - - - - - - 1
VCOM is powered down
8.4.2.64 P44-R1
Active CRAM Monitor [3] (Read Only)
00000000
This bit indicates which CRAM is being accessed by the DSP when adaptive mode is disabled. When adaptive mode is enabled, this bit
has no meaning.
CRAM A is being used by the DSP
CRAM B is being used by the DSP
- - - - - 0 - - -
- - - - - 1 - - -
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Adaptive Mode Control [2] (R/W)
00000000
This bit controls the DSP adaptive mode. When in adaptive mode, only CRAM A is accessible via serial interface when the DSP is disabled
(DAC in standby state), while when the DSP is enabled (DAC is run state) the CRAM A can only be accessed by the DSP and the CRAM B
can only be accessed by the serial interface, or vice versa depending on the value of CRAMSTAT. When not in adaptive mode, both CRAM
A and B can be accessed by the serial interface when the DSP is disabled, but when the DSP is enabled, no CRAM can be accessed by
serial interface. The DSP can access either CRAM, which can be monitored at SWPMON.
Adaptive mode disabled
Adaptive mode enabled
- - - - - 0 - -
- - - - - 1 - -
00000000
Active CRAM Selection [1] (Read Only)
This bit indicates which CRAM currently serves as the active one. The other CRAM serves as an update buffer, and can accessed by serial
interface (SPI/I2C)
CRAM A is active and being used by the DSP
CRAM B is active and being used by the DSP
- - - - - - - 0 -
- - - - - - - 1 -
00000000
Switch Active CRAM [0] (R/W)
This bit is used to request switching roles of the two buffers, (switching the active buffer role between CRAM A and CRAM B). This bit is
cleared automatically when the switching process completed.
No switching requested or switching completed
Switching is being requested
- - - - - - - 0
- - - - - - - 1
8.4.2.65 P253-R63
Clock Flex Register No. 1 [7:0] (R/W)
00000000
Using this register allows the PLL I/O to be set to GPIOs.
Set to 0x11
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
...
0 0 1 0 0 0 0 0
0 0 1 1 0 0 0 0
0 0 1 1 0 0 0 1
...
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
8.4.2.66 P253-R64
Clock Flex Register No. 2 [7:0] (R/W)
00000000
Using this register allows the PLL I/O to be set to GPIOs.
Set to 0x11
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 1
0 0 0 0 0 0 1 0
...
...
0 0 1 0 0 0 0 0
0 0 1 1 0 0 0 0
0 0 1 1 0 0 0 1
...
1 1 1 1 1 1 0 1
1 1 1 1 1 1 1 0
1 1 1 1 1 1 1 1
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9 Applications and Implementation
9.1 Application Information
One of the most significant benefits of the TAS5754M device is the ability to be used in a variety of applications
and with an assortment of signal processing options. This section details the information needed to configure the
device for several popular configurations and provides guidance on integrating the TAS5754M device into the
larger system.
9.1.1 External Component Selection Criteria
The Supporting Component Requirements table in each application description section lists the details of the
supporting required components in each of the System Application Schematics.
Where possible, the supporting component requirements have been consolidated to minimize the number of
unique components which are used in the design. Component list consolidation is a method to reduce the
number of unique part numbers in a design, to ease inventory management, and reduce the manufacturing steps
during board assembly. For this reason, some capacitors are specified at a higher voltage than what would
normally be required. An example of this is a 50-V capacitor may be used for decoupling of a 3.3-V power supply
net.
In this example, a higher voltage capacitor can be used even on the lower voltage net to consolidate all caps of
that value into a single component type. Similarly, a several unique resistors, having all the same size and value
but with different power ratings can be consolidated by using the highest rated power resistor for each instance
of that resistor value.
While this consolidation may seem excessive, the benefits of having fewer components in the design may far
outweigh the trivial cost of a higher voltage capacitor. If lower voltage capacitors are already available elsewhere
in the design, they can be used instead of the higher voltage capacitors. In all situations, the voltage rating of the
capacitors must be at least 1.45 times the voltage of the voltage which appears across them. The power rating of
the capacitors should be 1.5 times to 1.75 times the power dissipated in it during normal use case.
9.1.2 Component Selection Impact on Board Layout, Component Placement, and Trace Routing
Because the layout is important to the overall performance of the circuit, the package size of the components
shown in the component list were intentionally chosen to allow for proper board layout, component placement,
and trace routing. In some cases, traces are passed in between two surface mount pads or ground plane
extends from the TAS5754M device between two pads of a surface mount component and into to the
surrounding copper for increased heat-sinking of the device. While components may be offered in smaller or
larger package sizes, it is highly recommended that the package size remain identical to that used in the
application circuit as shown. This consistency ensures that the layout and routing can be matched very closely,
optimizing thermal, electromagnetic, and audio performance of the TAS5754M device in circuit in the final
system.
9.1.3 Amplifier Output Filtering
The TAS5754M device is often used with a low-pass filter, which is used to filter out the carrier frequency of the
PWM modulated output. This filter is frequently referred to as the L-C Filter, due to the presence of an inductive
element L and a capacitive element C to make up the 2-pole filter.
The L-C filter removes the carrier frequency, reducing electromagnetic emissions and smoothing the current
waveform which is drawn from the power supply. The presence and size of the L-C filter is determined by several
system level constraints. In some low-power use cases that do not have other circuits which are sensitive to EMI,
a simple ferrite bead or ferrite bead and capacitor can replace the traditional large inductor and capacitor that are
commonly used. In other high-power applications, large toroid inductors are required for maximum power and
film capacitors may be preferred due to audio characteristics. Refer to the application report SLOA119 for a
detailed description on proper component selection and design of an L-C filter based upon the desired load and
response.
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9.2 Typical Applications
9.2.1 2.0 (Stereo BTL) System
For the stereo (BTL) PCB layout, see Figure 87.
A 2.0 system generally refers to a system in which there are two full range speakers without a separate amplifier
path for the speakers which reproduce the low-frequency content. In this system, two channels are presented to
the amplifier via the digital input signal. These two channels are amplified and then sent to two separate
speakers. In some cases, the amplified signal is further separated based upon frequency by a passive crossover
network after the L-C filter. Even so, the application is considered 2.0.
Most commonly, the two channels are a pair of signals called a stereo pair, with one channel containing the
audio for the left channel and the other channel containing the audio for the right channel. While certainly the two
channels can contain any two audio channels, such as two surround channels of a multi-channel speaker
system, the most popular occurrence in two channels systems is a stereo pair.
It is important to note that the HybridFlows which have been developed for specifically for stereo applications will
frequently apply the same equalizer curves to the left channel and the right channel. This maximizes the
processing capabilities of each HybridFlow by minimizing the cycles required by the BiQuad filters.
When two signals that are not two separate signals, but instead are derived from a single signal which is
separated into low frequency and high frequency by the signal processor, the application is commonly referred to
as 1.1 or Bi-Amped systems. The 2.0 (Stereo BTL) System application is shown in Figure 80.
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PVDD
R100
750k
R101
150k
C103
1µF
C100
0.1µF
C101
22µF
C102
22µF
GND
GND
GND
GND
GND
C104
To System Processor
0.22µF
3.3V
L100
L101
2.0-SDA
2.0-SCL
2.0-SPK_OUTA+
2.0-GPIO0
2.0-GPIO1
2.0-SDOUT
2.0-MCLK
2.0-SCLK
2.0-SDIN
2.0-OUTA+
C105
1µF
C106
2.2µF
C107
2.2µF
2.0-SPK_OUTA-
C108
3.3V
2.0-OUTA-
C109
0.68µF
C110
0.68µF
0.22µF
GND
U100
TAS5754MDCA
TAS5756MDCA
GND
GND
PAD
GND
C111
2.0-LRCK/FS
0.22µF
L102
L103
GND
GND
GND
GND
GND
2.0-SPK_OUTB-
2.0-OUTB-
2.0-OUTB+
C112
1µF
C113
2.2µF
C114
2.2µF
3.3V
2.0-SPK_OUTB+
C115
C116
0.68µF
C117
0.68µF
C118
1µF
C119
1µF
C120
1µF
GND
0.22µF
PVDD
GND
GND
2.0-SPK_MUTE
2.0-SPK_FAULT
GND
GND
GND
C121
0.1µF
C122
22µF
C123
22µF
GND
GND
GND
Figure 80. 2.0 (Stereo BTL) System Application Schematic
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9.2.1.1 Design Requirements
•
Power Supplies:
–
–
3.3-V Supply
5-V to 24-V Supply
Communication: Host Processor serving as I2C Compliant Master
•
•
External Memory (such as EEPROM and Flash) used for coefficients and RAM portions of HybridFlow < 5 kB
The requirements for the supporting components for the TAS5754M device in a Mono (PBTL) System is provided
in Table 22.
Table 22. Supporting Component Requirements for Stereo 2.0 (BTL) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
Digital-input, closed-loop class-D amplifier with HybridFlow
processing
U100
TAS5754M
48 Pin TSSOP
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
R100
R101
0402
0402
1%, 0.063 W
1%, 0.063 W
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
L100, L101, L102,
L103
See Amplifier Output Filtering
C196, C197, C198,
C199
0.01 µF
0.1 µF
0.22 µF
0.68 µF
1 µF
0603
0402
0603
0805
0603
0402
Ceramic, 0.01 µF, 50V, ±10%, X7R
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C100, C121
C104, C108, C111,
C115
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C109, C110, C116,
C117
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C103
C105, C118, C119,
C120
1 µF
Ceramic, 1 µF, 6.3V, ±10%, X5R
C106, C107, C113,
C114
Ceramic, 2.2 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
2.2 µF
22 µF
0402
0805
C101, C102, C122,
C123
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout and routing give in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical section of the circuit is the the power supply inputs, the amplifier output signals, and the
high-frequency signals which go to the serial audio port. It is recommended that these be constructed to
ensure they are given precedent as design trade-offs are made.
–
For questions and support go to the E2E forums (e2e.ti.com). If it is necessary to deviate from the
recommended layout, please visit the E2E forum to request a layout review.
9.2.1.2.2 Step Two: HybridFlow Selection and System Level Tuning
•
Use the TAS5754/6M HybridFlow Processsor User Guide and HybridFlow Documentation (SLAU577) to
select the HybridFlow that meets the needs of the target application.
•
Use the TAS5754_56MEVM evaluation module and the PurePath ControlConsole (PPC) software, to load the
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appropriate HybridFlow. Tune the end equipment by following the instructions in the SLAU577 .
9.2.1.2.3 Step Three: Software Integration
•
•
Use the Register Dump feature of the PPC software to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
9.2.1.3 Application Specific Performance Plots for Stereo 2.0 (BTL) Systems
Table 23. Relevant Performance Plots
PLOT TITLE
Figure 25. Output Power vs PVDD
PLOT NUMBER
C036
Figure 26. THD+N vs Frequency, VPVDD = 12 V
Figure 27. THD+N vs Frequency, VPVDD = 15 V
Figure 28. THD+N vs Frequency, VPVDD = 18 V
Figure 29. THD+N vs Frequency, VPVDD = 24 V
Figure 30. THD+N vs Power, VPVDD = 12 V
Figure 31. THD+N vs Power, VPVDD = 15 V
Figure 32. THD+N vs Power, VPVDD = 18 V
Figure 33. THD+N vs Power, VPVDD = 24 V
Figure 34. Idle Channel Noise vs PVDD
C034
C002
C037
C003
C035
C004
C038
C005
C006
Figure 35. Efficiency vs Output Power
C007
Figure 36. Idle Current Draw (Filterless) vs PVDD
Figure 37. Idle Current Draw (Traditional LC Filter) vs PVDD
Figure 40. DVDD PSRR vs. Frequency
C013
C015
C028
Figure 41. AVDD PSRR vs. Frequency
C029
Figure 42. CPVDD PSRR vs. Frequency
C030
Figure 43. Powerdown Current Draw vs. PVDD
C032
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9.2.2 Mono (PBTL) Systems
For the mono (PBTL) PCB layout, see Figure 89.
A mono system refers to a system in which the amplifier is used to drive a single loudspeaker. Parallel Bridge
Tied Load (PBTL) indicates that the two full-bridge channels of the device are placed in parallel and drive the
loudspeaker simultaneously using an identical audio signal. The primary benefit of operating the TAS5754M
device in PBTL operation is to reduce the power dissipation and increase the current sourcing capabilities of the
amplifier output. In this mode of operation, the current limit of the audio amplifier is approximately doubled while
the on-resistance is approximately halved.
The loudspeaker can be a full-range transducer or one that only reproduces the low-frequency content of an
audio signal, as in the case of a powered subwoofer. Often in this use case, two stereo signals are mixed
together and sent through a low-pass filter in order to create a single audio signal which contains the low
frequency information of the two channels. Conversely, advanced digital signal processing can create a low-
frequency signal for a multichannel system, with audio processing which is specifically targeted on low-frequency
effects.
Although any of the HybridFlows can be made to work with a mono speaker, it is strongly recommended that
HybridFlows which have been created specifically for mono applications be used. These HybridFlows contain the
mixing and filtering required to generate the mono signal. They also include processing which is targeted at
improving the low-frequency performance of an audio system- a feature that, while targeted at subwoofers, can
also be used to enhance the low-frequency performance of a full-range speaker.
Because low-frequency signals are not perceived as having a direction (at least to the extent of high-frequency
signals) it is common to reproduce the low-frequency content of a stereo signal that is sent to two separate
channels. This configuration pairs one device in Mono PBTL configuration and another device in Stereo BTL
configuration in a single system called a 2.1 system. The Mono PBTL configuration is detailed in the 2.1 (Stereo
BTL + External Mono Amplifier) Systems section.
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PVDD
R200
750k
R201
150k
C204
390µF
C200
1µF
C201
0.1µF
C202
1µF
C203
22µF
GND
GND
GND
GND
GND
GND
To System Processor
3.3V
MONO-SDA
MONO-SCL
C208
MONO-GPIO0
MONO-GPIO1
MONO-SDOUT
MONO-MCLK
MONO-SCLK
MONO-SDIN
0.22µF
L200
C205
1µF
C206
2.2µF
C207
2.2µF
MONO-SPK_OUTA
C209
MONO_OUT+
C220
0.68µF
0.22µF
GND
U200
TAS5754MDCA
TAS5756MDCA
GND
PAD
GND
C214
MONO-LRCK/FS
0.22µF
L201
GND
GND
GND
GND
GND
MONO-SPK_OUTB
C215
MONO_OUT-
C210
1µF
R202
49.9k
C221
0.68µF
3.3V
0.22µF PVDD
C211
1µF
C212
1µF
C213
1µF
GND
C219
390µF
C216
0.1µF
C217
1µF
C218
22µF
MONO-SPK_MUTE
MONO-SPK_FAULT
GND
GND
GND
GND
GND
GND
GND
Figure 81. Mono (PBTL) System Application Schematic
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9.2.2.1 Design Requirements
•
Power Supplies:
–
–
3.3-V Supply
5-V to 24-V Supply
Communication: Host Processor serving as I2C Compliant Master
•
•
External Memory (EEPROM, Flash, Etc.) used for Coefficients and RAM portions of HybridFlow < 5 kB
The requirements for the supporting components for the TAS5754M device in a Mono (PBTL) System is provided
in Table 24.
Table 24. Supporting Component Requirements for Mono (PBTL) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
Digital-input, closed-loop class-D amplifier with HybridFlow
processing
U200
TAS5754M
48 Pin TSSOP
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
R200
R201
R202
0402
0402
0402
1%, 0.063 W
1%, 0.063 W
1%, 0.063 W
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
L200, L201
C298, C299
See Amplifier Output Filtering
0.01 µF
0.1 µF
0603
0402
Ceramic, 0.01 µF, 50 V, ±10%, X7R
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C216
C208, C209, C214,
C215
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
0.22 µF
0.68 µF
1 µF
0603
0805
0603
0402
0805
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
C220, C221
C200
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C205, C211, C213,
C212
1 µF
Ceramic, 1 µF, 6.3 V, ±10%, X5R
C202, C217, C352,
C367
Ceramic, 1 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
1 µF
Ceramic, 2.2 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
C206, C207
C203, C218
C204, C219
2.2 µF
22 µF
0402
0805
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
390 µF
10 × 10
Aluminum, 390 µF, ±20%, 0.08-Ω
Voltage rating must be > 1.45 × VPVDD
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout and routing give in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical section of the circuit is the the power supply inputs, the amplifier output signals, and the
high-frequency signals which go to the serial audio port. It is recommended that these be constructed to
ensure they are given precedent as design trade-offs are made.
–
For questions and support go to the E2E forums (e2e.ti.com). If it is necessary to deviate from the
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recommended layout, please visit the E2E forum to request a layout review.
9.2.2.2.2 Step Two: HybridFlow Selection and System Level Tuning
•
Use the TAS5754/6M HybridFlow Processsor User Guide and HybridFlow Documentation (SLAU577) to
select the HybridFlow that meets the needs of the target application.
•
Use the TAS5754_56MEVM evaluation module and the PurePath ControlConsole (PPC) software, to load the
appropriate HybridFlow. Tune the end equipment by following the instructions in the SLAU577 .
9.2.2.2.3 Step Three: Software Integration
•
•
Use the Register Dump feature of the PPC software to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
9.2.2.3 Application Specific Performance Plots for Mono (PBTL) Systems
Table 25. Relevant Performance Plots
PLOT TITLE
Figure 44. Output Power vs PVDD
PLOT NUMBER
C039
. THD+N vs Frequency, VPVDD = 12 V
C017
. THD+N vs Frequency, VPVDD = 15 V
C018
Figure 47. THD+N vs Frequency, VPVDD = 18 V
Figure 48. THD+N vs Frequency, VPVDD = 24 V
Figure 49. THD+N vs Power, VPVDD = 12 V
Figure 50. THD+N vs Power, VPVDD = 15 V
Figure 51. THD+N vs Power, VPVDD = 18 V
Figure 52. THD+N vs Power, VPVDD = 24 V
Figure 53. Idle Channel Noise vs PVDD
Figure 54. Efficiency vs Output Power
C019
C020
C021
C022
C023
C024
C025
C026
Figure 55. Idle Current Draw (filterless) vs PVDD
Figure 56. Idle Current Draw (traditional LC filter) vs PVDD
Figure 57. PVDD PSRR vs Frequency
C031
C032
C027
Figure 40. DVDD PSRR vs. Frequency
Figure 41. AVDD PSRR vs. Frequency
Figure 42. CPVDD PSRR vs. Frequency
Figure 43. Powerdown Current Draw vs. PVDD
C028
C029
C030
C032
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9.2.3 2.1 (Stereo BTL + External Mono Amplifier) Systems
Figure 91 shows the PCB Layout for the 2.1 System.
To increase the low-frequency output capabilities of an audio system, a single subwoofer can be added to the
system. Because the spatial clues for audio are predominately higher frequency than that reproduced by the
subwoofer, often a single subwoofer can be used to reproduce the low frequency content of several other
channels in the system. This is frequently referred to as a dot one system. A stereo system with a subwoofer is
referred to as a 2.1 (two-dot-one), a 3 channel system with subwoofer is referred to as a 3.1 (three-dot-one), a
popular surround system with five speakers and one subwoofer is referred to as a 5.1, and so on.
9.2.3.1 Basic 2.1 System (TAS5754M Device + Simple Digital Input Amplifier)
In the most basic 2.1 system, a subwoofer is added to a stereo left and right pair of speakers as discussed
above. The audio amplifiers include one TAS5754M device for the high frequency channels and one simple
digital input device without integrated audio processing for the subwoofer channel. A member of the popular
TAS5760xx family of devices is a popular choice for the subwoofer amplifier. In this system, the subwoofer
content is generated by summing the two channels of audio and sending them through a high-pass filter to filter
out the high frequency content. This is then sent to the SDIN pin of the subwoofer amplifier, which is operating in
PBTL, via the SDOUT line of the TAS5754M device . In the basic 2.1 system, only HybridFlows which included
subwoofer signal generation can be used, because the subwoofer amplifier depends on the TAS5754M device to
create its stereo low-frequency input signal.
9.2.3.2 Advanced 2.1 System ( Two TAS5754M devices)
In higher performance systems, the subwoofer output can be enhanced using digital audio processing as was
done in the high-frequency channels. To accomplish this, two TAS5754M devices are used- one for the high
frequency left and right speakers and one for the mono subwoofer speaker. In this system, the audio signal can
be sent from the TAS5754M device through the SDOUT pin. Alternatively, the subwoofer amplifier can accept
the same digital input as the stereo, which might come from a central systems processor. In advanced 2.1
systems, any HybridFlow can be used for the subwoofer, provided the sample rates for the two are the same.
While any of the HybridFlows can be used, it is highly recommended that only mono HybridFlows are used for
the subwoofer. Doing so streamlines development time and effort by minimizing confusion and complexity.
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PVDD
R300
750k
R301
150k
C303
1µF
C300
0.1µF
C301
22µF
C302
22µF
GND
GND
GND
GND
GND
C304
To System Processor
3.3V
0.22µF
L300
L301
2.1-SDA
2.1-SCL
2.1-SPK_OUT1A+
2.1-GPIO0_HF
2.1-GPIO1_HF
2.1-HF_OUTA+
2.1-HF_OUTA-
C305
1µF
C306
2.2µF
C307
2.2µF
2.1-MCLK
2.1-SCLK
2.1-SDIN
3.3V
2.1-SPK_OUT1A-
C308
C309
0.68µF
C310
0.68µF
0.22µF
GND
U300
TAS5754MDCA
TAS5756MDCA
GND
GND
PAD
GND
C311
2.1-LRCK/FS
0.22µF
L302
GND
GND
GND
GND
GND
2.1-SPK_OUT1B-
2.1-HF_OUTB-
L303
C312
1µF
C313
2.2µF
C314
2.2µF
3.3V
2.1-SPK_OUT1B+
C315
2.1-HF_OUTB+
C316
0.68µF
C317
0.68µF
C318
1µF
C319
1µF
C320
1µF
GND
PVDD
0.22µF
GND
GND
2.1-SPK_MUTE
2.1-SPK_FAULT
GND
GND
GND
C321
0.1µF
C322
22µF
C323
22µF
GND
GND
GND
PVDD
R350
750k
R351
150k
C354
390µF
C350
1µF
C351
0.1µF
C352
1µF
C353
22µF
GND
GND
GND
GND
GND
GND
3.3V
C358
2.1-GPIO0_LF
2.1-GPIO1
2.1-SDOUT_LF
0.22µF
L350
C355
1µF
C356
2.2µF
C357
2.2µF
2.1-SPK_OUT2A
C359
2.1_LF+
C370
0.68µF
0.22µF
GND
U301
TAS5754MDCA
TAS5756MDCA
GND
PAD
GND
C364
0.22µF
2.1-SPK_OUT2B
C365
L351
GND
GND
GND
GND
GND
2.1_LF-
C360
1µF
R352
49.9k
C371
0.68µF
3.3V
0.22µF PVDD
C361
1µF
C362
1µF
C363
1µF
GND
C369
390µF
C366
0.1µF
C367
1µF
C368
22µF
GND
GND
GND
GND
GND
GND
GND
Figure 82. 2.1 (Stereo BTL + External Mono Amplifier) Application Schematic
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9.2.3.3 Design Requirements
•
Power Supplies:
–
–
3.3-V Supply
5-V to 24-V Supply
Communication: Host Processor serving as I2C Compliant Master
•
•
External Memory (EEPROM, Flash, Etc.) used for Coefficients and RAM portions of HybridFlow < 5 kB
The requirements for the supporting components for the TAS5754M device in a 2.1 (Stereo BTL + External Mono
Amplifier) System is provided in Table 26.
Table 26. Supporting Component Requirements for 2.1 (Stereo BTL + External Mono Amplifier) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
Digital-input, closed-loop class-D amplifier with HybridFlow
processing
U300
TAS5754M
48 Pin TSSOP
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
R300, R350
R301, R351
R352
0402
0402
0402
1%, 0.063 W
1%, 0.063 W
1%, 0.063 W
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
L300, L301, L302,
L303
See Amplifier Output Filtering
See Amplifier Output Filtering
Ceramic, 0.01µF, 50V, +/-10%, X7R
L350, L351
C394, C395, C396,
C397, C398, C399
0.01 µF
0.1 µF
0603
0402
C300, C321, C351,
C366
Ceramic, 0.1µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C304, C308, C311,
C315, C358, C359,
C364, C365
Ceramic, 0.22µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
0.22 µF
0603
C309, C310, C316,
C317, C370, C371
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
0.68 µF
1 µF
0805
0603
C303, C350, C312,
C360
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C305, C318, C319,
C320, C355, C361,
C363, C312, C362
1 µF
0402
Ceramic, 1 µF, 6.3V, ±10%, X5R
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C352, C367
1 µF
0805
0402
C306, C307, C313,
C314, C356, C357,
2.2 µF
Ceramic, 2.2 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
C301, C302, C322,
C323, C353, C368
22 µF
0805
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
C354, C369
390 µF
10 × 10
Aluminum, 390 µF, ±20%, 0.08 Ω
Voltage rating must be > 1.45 × VPVDD
9.2.3.4 Detailed Design Procedure
9.2.3.4.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout and routing give in the example layout
above, integrate the device and its supporting components into the system PCB file.
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–
–
The most critical section of the circuit is the the power supply inputs, the amplifier output signals, and the
high-frequency signals which go to the serial audio port. It is recommended that these be constructed to
ensure they are given precedent as design trade-offs are made.
For questions and support go to the E2E forums (e2e.ti.com). If it is necessary to deviate from the
recommended layout, please visit the E2E forum to request a layout review.
9.2.3.4.2 Step Two: HybridFlow Selection and System Level Tuning
•
Use the TAS5754/6M HybridFlow Processsor User Guide and HybridFlow Documentation (SLAU577) to
select the HybridFlow that meets the needs of the target application.
•
Use the TAS5754_56MEVM evaluation module and the PurePath ControlConsole (PPC) software, to load the
appropriate HybridFlow. Tune the end equipment by following the instructions in the SLAU577 .
9.2.3.4.3 Step Three: Software Integration
•
•
Use the Register Dump feature of the PPC software to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
9.2.3.5 Application Specific Performance Plots for 2.1 (Stereo BTL + External Mono Amplifier) Systems
Table 27. Relevant Performance Plots
DEVICE
PLOT TITLE
Figure 25. Output Power vs PVDD
PLOT NUMBER
C036
C034
C002
C037
C003
C035
C004
C038
C005
C006
C007
C013
C015
C039
C017
C018
C019
C020
C021
C022
C023
C024
C025
C026
C031
C032
C027
Figure 26. THD+N vs Frequency, VPVDD = 12 V
Figure 27. THD+N vs Frequency, VPVDD = 15 V
Figure 28. THD+N vs Frequency, VPVDD = 18 V
Figure 29. THD+N vs Frequency, VPVDD = 24 V
Figure 30. THD+N vs Power, VPVDD = 12 V
Figure 31. THD+N vs Power, VPVDD = 15 V
Figure 32. THD+N vs Power, VPVDD = 18 V
Figure 33. THD+N vs Power, VPVDD = 24 V
Figure 34. Idle Channel Noise vs PVDD
U300
Figure 35. Efficiency vs Output Power
Figure 36. Idle Current Draw (Filterless) vs PVDD
Figure 37. Idle Current Draw (Traditional LC Filter) vs PVDD
Figure 44. Output Power vs PVDD
. THD+N vs Frequency, VPVDD = 12 V
. THD+N vs Frequency, VPVDD = 15 V
Figure 47. THD+N vs Frequency, VPVDD = 18 V
Figure 48. THD+N vs Frequency, VPVDD = 24 V
Figure 49. THD+N vs Power, VPVDD = 12 V
Figure 50. THD+N vs Power, VPVDD = 15 V
Figure 51. THD+N vs Power, VPVDD = 18 V
Figure 52. THD+N vs Power, VPVDD = 24 V
Figure 53. Idle Channel Noise vs PVDD
U301
Figure 54. Efficiency vs Output Power
Figure 55. Idle Current Draw (filterless) vs PVDD
Figure 56. Idle Current Draw (traditional LC filter) vs PVDD
Figure 57. PVDD PSRR vs Frequency
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Table 27. Relevant Performance Plots (continued)
DEVICE
PLOT TITLE
Figure 40. DVDD PSRR vs. Frequency
Figure 41. AVDD PSRR vs. Frequency
Figure 42. CPVDD PSRR vs. Frequency
Figure 43. Powerdown Current Draw vs. PVDD
PLOT NUMBER
C028
U300
and
U301
C029
C030
C032
9.2.4 2.2 (Dual Stereo BTL) Systems
For the 2.2 (Dual Stereo BTL) PCB layout, see Figure 93.
A 2.2 system consists of a stereo pair of loudspeakers with a pair of low frequency loudspeakers. In some cases,
this is implemented as two stereo full-range speakers and two subwoofers. In others, it is implemented as two
high frequency speakers and two mid-range speakers.
As in the case of the 2.1 system, the 2.2 system can be created by using the audio processing inside of the
TAS5754M device and creating a subwoofer signal which is sent to a simple digital input amplifier like one of the
TAS5760xx devices (or similar). This requires that a HybridFlow that contains a subwoofer generation processing
block be used in the TAS5754M device. This signal is created by summing the left and right channel, filtering
with a high-pass filter and sending it to the subwoofer amplifier. For this type of system, the TAS5754M device
used for the high-frequency drivers must have a subwoofer generation processing block in order to provide the
appropriate signal to the subwoofer amplifiers.
Alternatively, the low-frequency drivers can be implemented by using two TAS5754M devices; each receiving
their input from a central systems processor. This type of implementation allows for any stereo HybridFlow to be
used for both the low-frequency and high-frequency drivers, increasing the processing options available for the
system. This expands the processing capabilities of the system, introducing digital signal processing to the low-
frequency drivers as well as the high-frequency drivers. This type of 2.2 system is described in Figure 83.
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PVDD
R400
750k
R401
150k
C403
1µF
C400
0.1µF
C401
22µF
C402
22µF
GND
GND
GND
GND
GND
To System Processor
C404
3.3V
0.22µF
L400
L401
2.2-SDA
2.2-SCL
2.2-SPK_OUT1A+
2.2-GPIO0_HF
2.2-GPIO1_HF
2.2-HF_OUTA+
C405
1µF
C406
2.2µF
C407
2.2µF
2.2-MCLK
2.2-SCLK
2.2-SDIN
3.3V
2.2-SPK_OUT1A-
C408
2.2-HF_OUTA-
C410
0.68µF
C409
0.68µF
0.22µF
GND
U400
TAS5754MDCA
TAS5756MDCA
GND
GND
PAD
GND
C411
2.2-LRCK/FS
0.22µF
L402
L403
GND
GND
GND
GND
GND
2.2-SPK_OUT1B-
2.2-HF_OUTB-
C412
1µF
C413
2.2µF
C414
2.2µF
3.3V
2.2-SPK_OUT1B+
C415
2.2-HF_OUTB+
C416
0.68µF
C417
0.68µF
C418
1µF
C419
1µF
C420
1µF
GND
PVDD
0.22µF
GND
GND
2.2-SPK_MUTE
2.2-SPK_FAULT
GND
GND
GND
C421
0.1µF
C422
22µF
C423
22µF
GND
GND
GND
PVDD
R450
750k
R451
150k
C453
1µF
C450
0.1µF
C451
22µF
C452
22µF
GND
GND
GND
GND
GND
C454
3.3V
0.22µF
L450
L451
2.2-SPK_OUT2A+
2.2-GPIO0_LF
2.2-GPIO1_LF
2.2-SDOUT_LF
2.2-LF_OUTA+
C455
1µF
C456
2.2µF
C457
2.2µF
3.3V
2.2-SPK_OUT2A-
C458
2.2-LF_OUTA-
C459
0.68µF
C460
0.68µF
0.22µF
GND
U401
TAS5754MDCA
TAS5756MDCA
GND
GND
PAD
GND
C461
0.22µF
L452
L453
GND
GND
GND
GND
GND
2.2-SPK_OUT2B-
2.2-LF_OUTB-
C462
1µF
C463
2.2µF
C464
2.2µF
3.3V
2.2-SPK_OUT2B+
C465
2.2-LF_OUTB+
C466
0.68µF
C467
0.68µF
C468
1µF
C469
1µF
C470
1µF
GND
PVDD
0.22µF
GND
GND
GND
GND
GND
C471
0.1µF
C472
22µF
C473
22µF
GND
GND
GND
Figure 83. 2.2 (Dual Stereo BTL) Application Schematic
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9.2.4.1 Design Requirements
•
Power Supplies:
–
–
3.3-V Supply
5-V to 24-V Supply
Communication: Host Processor serving as I2C Compliant Master
•
•
External Memory (EEPROM, Flash, Etc.) used for Coefficients and RAM portions of HybridFlow < 5 kB
The requirements for the supporting components for the TAS5754M device in a 2.1 (Stereo BTL + External Mono
Amplifier) System is provided in Figure 89.
Table 28. Supporting Component Requirements for 2.2 (Dual Stereo BTL) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
U400, U401
Digital Input, Closed-Loop Class-
D Amplifier with HybridFlow
Processing
TAS5754M device
48-pin TSSOP
R400, R450
R401, R451
See Figure 84
See Figure 84
0402
0402
1%, 0.063 W
1%, 0.063 W
L400, L401, L402, L403, L450,
L451, L452, L453
See Amplifier Output Filtering
0603
C492, C493, C494, C495, C496,
C497, C498, C499
Ceramic, 0.01 µF, 50 V, ±10%,
X7R
0.01 µF
0.1 µF
C400, C421, C450, C471
Ceramic, 0.1 µF, ±10%, X7R,
Voltage rating must be > 1.45 ×
VPVDD
0402
0603
0805
C404, C408, C411, C415, C454,
C458, C461, C465
Ceramic, 0.22 µF, ±10%, X7R,
Voltage rating must be > 1.45 ×
VPVDD
0.22 µF
0.68 µF
C409, C410, C416, C417, C459,
C460, C466, C467
Ceramic, 0.68 µF, ±10%, X7R,
Voltage rating must be > 1.8 ×
VPVDD
C403, C453, C462
Ceramic, 1 µF, ±10%, X7R,
Voltage rating must be > 1.45 ×
VPVDD
1 µF
1 µF
0603
0402
0402
C405, C418, C419, C420, C455,
C468, C469, C470, C412, C462
Ceramic, 1 µF, 6.3V, ±10%, X5R
C406, C407, C413, C414, C456,
C457, C463, C464
Ceramic, 2.2 µF, ±10%, X5R,
Voltage rating must be > 1.45 ×
VPVDD
2.2 µF
C401, C402, C422, C423, C451,
C452, C472, C473
Ceramic, 22 µF, ±20%, X5R,
Voltage rating must be > 1.45 ×
VPVDD
22 µF
0805
9.2.4.2 Detailed Design Procedure
9.2.4.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout and routing give in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical section of the circuit is the the power supply inputs, the amplifier output signals, and the
high-frequency signals which go to the serial audio port. It is recommended that these be constructed to
ensure they are given precedent as design trade-offs are made.
–
For questions and support go to the E2E forums (e2e.ti.com). If it is necessary to deviate from the
recommended layout, please visit the E2E forum to request a layout review.
9.2.4.2.2 Step Two: HybridFlow Selection and System Level Tuning
•
Use the TAS5754/6M HybridFlow Processsor User Guide and HybridFlow Documentation (SLAU577) to
select the HybridFlow that meets the needs of the target application.
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•
Use the TAS5754_56MEVM evaluation module and the PurePath ControlConsole (PPC) software, to load the
appropriate HybridFlow. Tune the end equipment by following the instructions in the SLAU577 .
9.2.4.2.3 Step Three: Software Integration
•
•
Use the Register Dump feature of the PPC software to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
9.2.4.3 Application Specific Performance Plots for 2.2 (Dual Stereo BTL) Systems
Table 29. Relevant Performance Plots
PLOT TITLE
Figure 25. Output Power vs PVDD
PLOT NUMBER
C036
C034
C002
C037
C003
C035
C004
C038
C005
C006
C007
C013
C015
C028
C029
C030
C032
Figure 26. THD+N vs Frequency, VPVDD = 12 V
Figure 27. THD+N vs Frequency, VPVDD = 15 V
Figure 28. THD+N vs Frequency, VPVDD = 18 V
Figure 29. THD+N vs Frequency, VPVDD = 24 V
Figure 30. THD+N vs Power, VPVDD = 12 V
Figure 31. THD+N vs Power, VPVDD = 15 V
Figure 32. THD+N vs Power, VPVDD = 18 V
Figure 33. THD+N vs Power, VPVDD = 24 V
Figure 34. Idle Channel Noise vs PVDD
Figure 35. Efficiency vs Output Power
Figure 36. Idle Current Draw (Filterless) vs PVDD
Figure 37. Idle Current Draw (Traditional LC Filter) vs PVDD
Figure 40. DVDD PSRR vs. Frequency
Figure 41. AVDD PSRR vs. Frequency
Figure 42. CPVDD PSRR vs. Frequency
Figure 43. Powerdown Current Draw vs. PVDD
9.2.5 1.1 (Dual BTL, Bi-Amped) Systems
The 1.1 use case is a special application of the 2.0 stereo BTL system. In this system, two channels of an
amplifier are used to reproduce a single channel of an audio signal that has been separated based on frequency.
This configuration removes the need for passive cross-over elements inside of a loudspeaker, because the signal
is separated into a low-frequency and a high-frequency component before it is amplified. Systems which operate
in this configuration, in which separate amplifier channels drive the low and high-frequency loudspeakers directly,
are often called “bi-amped” systems.
Popular applications for this configuration include:
•
•
•
•
Powered near-field monitors
Blue-tooth Speakers
Co-axial Loudspeakers
Surround/Fill Speakers for multi-channel audio
From a hardware perspective, the TAS5754M device is configured in the same way as the Stereo BTL system.
However, special HybridFlows which support 1.1 operation must be used, because HybridFlows that are
designed for stereo applications frequently apply the same equalizer curves to the left and the right hand
channel. Additionally, many 1.1 HybridFlows include a delay element which can improve time alignment between
two loudspeakers that are mounted on the same baffle some distance apart.
For the 1.1 (Dual BTL, Bi-Amped) PCB layout, see Figure 95.
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PVDD
R500
750k
R501
150k
C503
1µF
C500
0.1µF
C501
22µF
C502
22µF
GND
GND
GND
GND
GND
C504
To System Processor
0.22µF
3.3V
L500
L501
1.1-SDA
1.1-SCL
1.1-SPK_OUTA+
1.1-GPIO0
1.1-GPIO1
1.1-SDOUT
1.1-MCLK
1.1-SCLK
1.1-SDIN
1.1_LF+
1.1_LF-
C505
1µF
C506
2.2µF
C507
2.2µF
1.1-SPK_OUTA-
C508
3.3V
C509
0.68µF
C510
0.22µF
GND
U500
TAS5754MDCA
TAS5756MDCA
GND
GND
PAD
GND
C511
1.1-LRCK/FS
0.22µF
L502
L503
GND
GND
GND
GND
GND
1.1-SPK_OUTB-
1.1_HF-
1.1_HF+
C512
1µF
C513
2.2µF
C514
2.2µF
3.3V
1.1-SPK_OUTB+
C515
C516
0.68µF
C517
0.68µF
C518
1µF
C519
1µF
C520
1µF
GND
0.22µF
PVDD
GND
GND
1.1-SPK_MUTE
1.1-SPK_FAULT
GND
GND
GND
C521
0.1µF
C522
22µF
C523
22µF
GND
GND
GND
Figure 84. 1.1 (Dual BTL, Bi-Amped) Application Schematic
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9.2.5.1 Design Requirements
•
Power Supplies:
–
DVDD Supply, in compliance with the voltage ranges shown in the Recommended Operating Conditions
table.
–
PVDD Supply, in compliance with the voltage ranges shown in the Recommended Operating Conditions
table.
•
•
Communication: Host Processor serving as I2C Compliant Master
External Memory (EEPROM, Flash, Etc.) used for Coefficients and RAM portions of HybridFlow < 5 kB
The requirements for the supporting components for the TAS5754M device in a Dual BTL, Bi-Amped System is
provided in Figure 95.
Table 30. Supporting Component Requirements for 1.1 (Dual BTL, Bi-Amped) Systems
REFERENCE
DESIGNATOR
VALUE
SIZE
DETAILED DESCRIPTION
Digital-input, closed-loop class-D amplifier with HybridFlow
processing
U500
TAS5754M
48 Pin TSSOP
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
R500
R501
0402
0402
1%, 0.063 W
1%, 0.063 W
See Adjustable
Amplifier Gain and
Switching Frequency
Selection
L500, L501, L502,
L503
See Amplifier Output Filtering
C596, C597, C598,
C599
0.01 µF
0.1 µF
0.22 µF
0.68 µF
1 µF
0603
0402
0603
0805
0603
0402
Ceramic, 0.01 µF, 50 V, ±10%, X7R
Ceramic, 0.1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C500, C521
C504, C508, C511,
C515
Ceramic, 0.22 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C509, C510, C516,
C517
Ceramic, 0.68 µF, ±10%, X7R
Voltage rating must be > 1.8 × VPVDD
Ceramic, 1 µF, ±10%, X7R
Voltage rating must be > 1.45 × VPVDD
C503
C505, C518, C519,
C520, C512
1 µF
Ceramic, 1 µF, 6.3V, ±10%, X5R
C506, C507, C513,
C514
Ceramic, 2.2 µF, ±10%, X5R
Voltage rating must be > 1.45 × VPVDD
2.2 µF
22 µF
0402
805
C501, C502, C522,
C523
Ceramic, 22 µF, ±20%, X5R
Voltage rating must be > 1.45 × VPVDD
9.2.5.2 Detailed Design Procedure
9.2.5.2.1 Step One: Hardware Integration
•
•
Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
Following the recommended component placement, board layout and routing give in the example layout
above, integrate the device and its supporting components into the system PCB file.
–
The most critical section of the circuit is the the power supply inputs, the amplifier output signals, and the
high-frequency signals which go to the serial audio port. It is recommended that these be constructed to
ensure they are given precedent as design trade-offs are made.
–
For questions and support go to the E2E forums (e2e.ti.com). If it is necessary to deviate from the
recommended layout, please visit the E2E forum to request a layout review.
9.2.5.2.2 Step Two: HybridFlow Selection and System Level Tuning
•
Use the TAS5754/6M HybridFlow Processsor User Guide and HybridFlow Documentation (SLAU577) to
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select the HybridFlow that meets the needs of the target application.
•
Use the TAS5754_56MEVM evaluation module and the PurePath ControlConsole (PPC) software, to load the
appropriate HybridFlow. Tune the end equipment by following the instructions in the SLAU577 .
9.2.5.2.3 Step Three: Software Integration
•
•
Use the Register Dump feature of the PPC software to generate a baseline configuration file.
Generate additional configuration files based upon operating modes of the end-equipment and integrate static
configuration information into initialization files.
•
Integrate dynamic controls (such as volume controls, mute commands, and mode-based EQ curves) into the
main system program.
9.2.5.3 Application Specific Performance Plots for 1.1 (Dual BTL, Bi-Amped) Systems
Table 31. Relevant Performance Plots
PLOT TITLE
Figure 25. Output Power vs PVDD
PLOT NUMBER
C036
Figure 26. THD+N vs Frequency, VPVDD = 12 V
Figure 27. THD+N vs Frequency, VPVDD = 15 V
Figure 28. THD+N vs Frequency, VPVDD = 18 V
Figure 29. THD+N vs Frequency, VPVDD = 24 V
Figure 30. THD+N vs Power, VPVDD = 12 V
Figure 31. THD+N vs Power, VPVDD = 15 V
Figure 32. THD+N vs Power, VPVDD = 18 V
Figure 33. THD+N vs Power, VPVDD = 24 V
Figure 34. Idle Channel Noise vs PVDD
C034
C002
C037
C003
C035
C004
C038
C005
C006
Figure 35. Efficiency vs Output Power
C007
Figure 36. Idle Current Draw (Filterless) vs PVDD
Figure 37. Idle Current Draw (Traditional LC Filter) vs PVDD
Figure 40. DVDD PSRR vs. Frequency
C013
C015
C028
Figure 41. AVDD PSRR vs. Frequency
C029
Figure 42. CPVDD PSRR vs. Frequency
C030
Figure 43. Powerdown Current Draw vs. PVDD
C032
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10 Power Supply Recommendations
10.1 Power Supplies
The TAS5754M device requires two power supplies for proper operation. A high-voltage supply called PVDD is
required to power the output stage of the speaker amplifier and its associated circuitry. Additionally, one low-
voltage power supply called DVDD is required to power the various low-power portions of the device. The
allowable voltage range for both the PVDD and the DVDD supply are listed in the Recommended Operating
Conditions table.
AVDD
Internal Analog Circuitry
Internal Mixed
Signal Circuitry
Internal Digital
Circuitry
+
DVDD
DVDD
DVDD_REG
External Filtering/Decoupling
±
LDO
CPVDD
CPVSS
External Filtering/Decoupling
Charge
Pump
DAC Output Stage
(Positive)
DAC Output Stage
(Negative)
Output Stage
Power Supply
Gate Drive
Voltage
PVDD
GVDD_REG
External Filtering/Decoupling
Linear
Regulator
+
PVDD
±
Figure 85. Power Supply Functional Block Diagram
10.1.1 DVDD Supply
The DVDD supply required from the system is used to power several portions of the device. As shown in the
Figure 85, it provides power to the DVDD pin, the CPVDD pin, and the AVDD pin. Proper connection, routing,
and decoupling techniques are highlighted in the TAS5754M device EVM User's Guide SLAU583 (as well as the
Applications and Implementation section and Layout Examples section) and must be followed as closely as
possible for proper operation and performance. Deviation from the guidance offered in the TAS5754M device
EVM User's Guide, which followed the same techniques as those shown in the Applications and Implementation
section, may result in reduced performance, errant functionality, or even damage to the TAS5754M device.
Some portions of the device also require a separate power supply which is a lower voltage than the DVDD
supply. To simplify the power supply requirements for the system, the TAS5754M device includes an integrated
low-dropout (LDO) linear regulator to create this supply. This linear regulator is internally connected to the DVDD
supply and its output is presented on the DVDD_REG pin, providing a connection point for an external bypass
capacitor. It is important to note that the linear regulator integrated in the device has only been designed to
support the current requirements of the internal circuitry, and should not be used to power any additional external
circuitry. Additional loading on this pin could cause the voltage to sag, negatively affecting the performance and
operation of the device.
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Power Supplies (continued)
The outputs of the high-performance DACs used in the TAS5754M device are ground centered, requiring both a
positive low-voltage supply and a negative low-voltage supply. The positive power supply for the DAC output
stage is taken from the AVDD pin, which is connected to the DVDD supply provided by the system. A charge
pump is integrated in the TAS5754M device to generate the negative low-voltage supply. The power supply input
for the charge pump is the CPVDD pin. The CPVSS pin is provided to allow the connection of a filter capacitor
on the negative low-voltage supply. As is the case with the other supplies, the component selection, placement,
and routing of the external components for these low voltage supplies are shown in the evmName and should be
followed as closely as possible to ensure proper operation of the device.
10.1.2 PVDD Supply
The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which
provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques are
highlighted in the evmName and must be followed as closely as possible for proper operation and performance.
Due the high-voltage switching of the output stage, it is particularly important to properly decouple the output
power stages in the manner described in the TAS5754M device EVM User's Guide. Lack of proper decoupling,
like that shown in the EVM User's Guide, results in voltage spikes which can damage the device.
A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the speaker
amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A GVDD_REG
pin is provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is important to
note that the linear regulator integrated in the device has only been designed to support the current requirements
of the internal circuitry, and should not be used to power any additional external circuitry. Additional loading on
this pin could cause the voltage to sag, negatively affecting the performance and operation of the device.
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11 Layout
11.1 Layout Guidelines
11.1.1 General Guidelines for Audio Amplifiers
Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout.
Ideally, the guidance provided in the applications section with regard to device and component selection can be
followed by precise adherence to the layout guidance shown in . These examples represent exemplary baseline
balance of the engineering trade-offs involved with laying out the device. These designs can be modified slightly
as needed to meet the needs of a given application. In some applications, for instance, solution size can be
compromised in order to improve thermal performance through the use of additional contiguous copper near the
device. Conversely, EMI performance can be prioritized over thermal performance by routing on internal traces
and incorporating a via picket-fence and additional filtering components. In all cases, it is recommended to start
from the guidance shown in the Layout Examples section and the TAS5754M-56MEVM, and work with TI field
application engineers or through the E2E community in order to modify it based upon the application specific
goals.
11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
Placing the bypassing and decoupling capacitors close to supply has been long understood in the industry. This
applies to DVDD, AVDD, CPVDD, and PVDD. However, the capacitors on the PVDD net for the TAS5754M
device deserve special attention.
It is imperative that the small bypass capacitors on the PVDD lines of the DUT be placed as close the PVDD pins
as possible. Not only does placing these devices far away from the pins increase the electromagnetic
interference in the system, but doing so can also negatively affect the reliability of the device. Placement of these
components too far from the TAS5754M device may cause ringing on the output pins that can cause the voltage
on the output pin to exceed the maximum allowable ratings shown in the Absolute Maximum Ratings table,
damaging the device. For that reason, the capacitors on the PVDD net must be no further away from their
associated PVDD pins than what is shown in the example layouts in the Layout Examples section
11.1.3 Optimizing Thermal Performance
Follow the layout examples shown in the Layout Examples section of this document to achieve the best balance
of solution size, thermal, audio, and electromagnetic performance. In some cases, deviation from this guidance
may be required due to design constraints which cannot be avoided. In these instances, the system designer
should ensure that the heat can get out of the device and into the ambient air surrounding the device.
Fortunately, the heat created in the device would prefer to travel away from the device and into the lower
temperature structures around the device.
11.1.3.1 Device, Copper, and Component Layout
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures.
These tips should be followed to achieve that goal:
•
Avoid placing other heat producing components or structures near the amplifier (including above or below in
the end equipment).
•
If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5754M device
and to prevent traces and copper signal and power planes from breaking up the contiguous copper on the top
and bottom layer.
•
•
Place the TAS5754M device away from the edge of the PCB when possible to ensure that heat can travel
away from the device on all four sides.
Avoid cutting off the flow of heat from the TAS5754M device to the surrounding areas with traces or via
strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular
to the device.
•
Unless the area between two pads of a passive component is large enough to allow copper to flow in
between the two pads, orient it so that the narrow end of the passive component is facing the TAS5754M
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Layout Guidelines (continued)
device .
•
Because the ground pins are the best conductors of heat in the package, maintain a contiguous ground plane
from the ground pins to the PCB area surrounding the device for as many of the ground pins as possible.
11.1.3.2 Stencil Pattern
The recommended drawings for the TAS5754M device PCB foot print and associated stencil pattern are shown
at the end of this document in the package addendum. Additionally, baseline recommendations for the via
arrangement under and around the device are given as a starting point for the PCB design. This guidance is
provided to suit the majority of manufacturing capabilities in the industry and prioritizes manufacturability over all
other performance criteria. In elevated ambient temperatures or under high-power dissipation use-cases, this
guidance may be too conservative and advanced PCB design techniques may be used to improve thermal
performance of the system. It is important to note that the customer must verify that deviation from the guidance
shown in the package addendum, including the deviation explained in this section, meets the customer’s quality,
reliability, and manufacturability goals.
11.1.3.2.1 PCB footprint and Via Arrangement
The PCB footprint (also known as a symbol or land pattern) communicates to the PCB fabrication vendor the
shape and position of the copper patterns to which the TAS5754M device will be soldered to. This footprint can
be followed directly from the guidance in the package addendum at the end of this data sheet. It is important to
make sure that the thermal pad, which connects electrically and thermally to the PowerPAD of the TAS5754M
device , be made no smaller than what is specified in the package addendum. This ensures that the TAS5754M
device has the largest interface possible to move heat from the device to the board.
The via pattern shown in the package addendum provides an improved interface to carry the heat from the
device through to the layers of the PCB, because small diameter plated vias (with minimally-sized annular rings)
present a low thermal-impedance path from the device into the PCB. Once into the PCB, the heat travels away
from the device and into the surrounding structures and air. By increasing the number of vias, as shown in the
Layout Examples section, this interface can benefit from improved thermal performance.
NOTE
Vias can obstruct heat flow if they are not constructed properly.
•
•
Remove thermal reliefs on thermal vias, because they impede the flow of heat through the via.
Vias filled with thermally conductive material are best, but a simple plated via can be used to avoid the
additional cost of filled vias.
•
The drill diameter should be no more than 8mils in diameter. Also, the distance between the via barrel and
the surrounding planes should be minimized to help heat flow from the via into the surrounding copper
material. In all cases, minimum spacing should be determined by the voltages present on the planes
surrounding the via and minimized wherever possible.
•
Vias should be arranged in columns, which extend in a line radially from the heat source to the surrounding
area. This arrangement is shown in the Layout Examples section.
•
•
Ensure that vias do not cut-off power current flow from the power supply through the planes on internal
layers. If needed, remove some vias which are farthest from the TAS5754M device to open up the current
path to and from the device.
11.1.3.2.1.1 Solder Stencil
During the PCB assembly process, a piece of metal called a stencil on top of the PCB and deposits solder paste
on the PCB wherever there is an opening (called an aperture) in the stencil. The stencil determines the quantity
and the location of solder paste that is applied to the PCB in the electronic manufacturing process. In most
cases, the aperture for each of the component pads is almost the same size as the pad itself.
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Layout Guidelines (continued)
However, the thermal pad on the PCB is quite large and depositing a large, single deposition of solder paste
would lead to manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the
solder paste to outgas during the assembly process and reduce the risk of solder bridging under the device. This
structure is called an aperture array, and is shown in the Layout Examples section. It is important that the total
area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the
area of the thermal pad itself.
11.2 Layout Examples
11.2.1 2.0 (Stereo BTL) System
Figure 86. 2.0 (Stereo BTL) 3-D View
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Layout Examples (continued)
Figure 87. 2.0 (Stereo BTL) Top Copper View
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Layout Examples (continued)
11.2.2 Mono (PBTL) System
Figure 88. Mono (PBTL) 3-D View
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Layout Examples (continued)
Figure 89. Mono (PBTL) Top Copper View
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Layout Examples (continued)
11.2.3 2.1 (Stereo BTL + Mono PBTL) Systems
Figure 90. 2.1 (Stereo BTL + Mono PBTL) 3-D View
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Layout Examples (continued)
Figure 91. 2.1 (Stereo BTL + Mono PBTL) Top Copper View
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Layout Examples (continued)
11.2.4 2.2 (Dual Stereo BTL) Systems
Figure 92. 2.2 (Dual Stereo BTL) 3-D View
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Layout Examples (continued)
Figure 93. 2.2.2 (Dual Stereo BTL) Top Copper View
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Layout Examples (continued)
11.2.5 1.1 (Bi-Amped BTL) Systems
Figure 94. 1.1 (Bi-Amped BTL) 3-D View
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Layout Examples (continued)
Figure 95. 2. 1.1 (Bi-Amped BTL) Top Copper View
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Specification Definitions
The glossary listed in the Glossary section is a general glossary with commonly used acronyms and words which
are defined in accordance with a broad TI initiative to comply with industry standards such as JEDEC, IPC, IEEE,
and others. The glossary provided in this section defines words, phrases, and acronyms that are unique to this
product and documentation, collateral, or support tools and software used with this product. For any additional
questions regarding definitions and terminology, please see the e2e Audio Amplfier Forum.
Bridge tied load (BTL) is an output configuration in which one terminal of the speaker is connected to one half-
bridge and the other terminal is connected to another half-bridge.
DUT refers to a device under test to differentiate one device from another.
Closed-loop architecture describes a topology in which the amplifier monitors the output terminals, comparing
the output signal to the input signal and attempts to correct for non-linearities in the output.
Dynamic controls are those which are changed during normal use by either the system or the end-user.
GPIO is a general purpose input/output pin. It is a highly configurable, bi-directional digital pin which can perform
many functions as required by the system.
Host processor refers to device which serves as a central system controller, providing control information to
devices connected to it as well as gathering audio source data from devices upstream from it and distributing it to
other devices. Configuring the controls of a device to optimize the audio output of a loudspeaker based on
frequency response, time alignment, target sound pressure level, safe operating area of the system, and user
preference.
HybridFlow uses components which are built in RAM and components which are built in ROM to make a
configurable device that is easier to use than a fully-programmable device while remaining flexible enough to be
used in several applications
Maximum continuous output power refers to the maximum output power that the amplifier can continuously
deliver without shutting down when operated in a 25°C ambient temperature. Testing is performed for the period
of time required that their temperatures reach thermal equilibrium and are no longer increasing
Parallel bridge tied load (PBTL) is an output configuration in which one terminal of the speaker is connected to
two half-bridges which have been placed in parallel and the other terminal is connected to another pair of half
bridges placed in parallel
rDS(on) is a measure of the on-resistance of the MOSFETs used in the output stage of the amplifier.
Static configuration information are controls which do not change while the system is in normal use.
Vias are copper-plated through-hole in a PCB.
12.2 Trademarks
PurePath is a trademark of Texas Instruments.
Burr-Brown is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TAS5754MDCA
ACTIVE
ACTIVE
HTSSOP
HTSSOP
DCA
DCA
48
48
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-25 to 85
-25 to 85
TAS5754M
TAS5754M
TAS5754MDCAR
2000 RoHS & Green
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TAS5754MDCAR
HTSSOP DCA
48
2000
330.0
24.4
8.6
13.0
1.8
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP DCA 48
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TAS5754MDCAR
2000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
DCA HTSSOP
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
TAS5754MDCA
48
40
530
11.89
3600
4.9
Pack Materials-Page 3
GENERIC PACKAGE VIEW
DCA 48
12.5 x 6.1, 0.5 mm pitch
HTSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
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