TB5D1MDWRE4 [TI]
QUAD LINE DRIVER, PDSO16, ROHS COMPLIANT, PLASTIC, SOIC-16;
| 型号： | TB5D1MDWRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUAD LINE DRIVER, PDSO16, ROHS COMPLIANT, PLASTIC, SOIC-16 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总21页 (文件大小：711K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
QUAD DIFFERENTIAL PECL DRIVERS
The TB5D1M device is
a pin and functional
1
FEATURES
replacement for the Agere systems BDG1A and
BPNGA quad differential drivers. The TB5D1M has a
built-in lightning protection circuit to absorb large
transitions on the transmission lines without
destroying the device. When the circuit is powered
down it loads the transmission line, because of the
protection circuit.
•
Functional Replacements for the Agere
BDG1A, BPNGA and BDGLA
•
Pin-Equivalent to the General-Trade 26LS31
Device
•
•
•
•
•
2.0 ns Maximum Propagation Delays
0.15 ns Output Skew Typical Between Pairs
Capable of Driving 50-Ω Loads
The TB5D2H device is
a pin and functional
replacement for the Agere systems BDG1A and
BDGLA quad differential drivers. Upon power down
the TB5D2H output circuit appears as an open circuit
and does not load the transmission line.
5.0-V or 3.3-V Supply Operation
TB5D1M Includes Surge Protection on
Differential Outputs
•
•
•
•
•
TB5D2H No Line Loading When VCC = 0
Third State Output Capability
Both drivers feature a 3-state output with a third-state
level of less than 0.1 V.
-40C to 85C Operating Temp Range
ESD Protection HBM > 3 kV and CDM > 2 kV
The packaging options available for these quad
differential line drivers include
a 16-pin SOIC
gull-wing (DW) and a 16-pin SOIC (D) package.
Available in Gull-Wing SOIC (JEDEC MS-013,
DW) and SOIC (D) Packages
Both drivers are characterized for operation from
-40C to 85C
APPLICATIONS
The logic inputs of this device include internal pull-up
resistors of approximately 40 kΩ that are connected
to VCC to ensure a logical high level input if the inputs
are open circuited.
•
Digital Data or Clock Transmission Over
Balanced Transmission Lines
DESCRIPTION
These quad differential drivers are TTL input to
pseudo-ECL differential output used for digital data
transmission over balanced transmission lines.
DW AND D PACKAGE
(TOP VIEW)
FUNCTIONAL DIAGRAM
AO
AI
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
AI
AO
AO
E1
CC
DI
AO
BO
DO
DO
E2
CO
CO
CI
BI
BO
ENABLE TRUTH TABLE
BO
BO
BI
CO
CO
DO
DO
E1
E2 Condition
CI
DI
0
0
Active
1
0
1
0
1
1
Active
Disabled
Active
GND
E1
E2
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER
TB5D1MDW
TB5D1MD
PART MARKING
TB5D1M
PACKAGE
Gull-wing SOIC
SOIC
LEAD FINISH
NiPdAu
STATUS
Production
Production
Production
Production
TB5D1M
NiPdAu
TB5D2HDW
TB5D2HD
TB5D2H
Gull-wing SOIC
SOIC
NiPdAu
TB5D2H
NiPdAu
PACKAGE DISSIPATION RATINGS
CIRCUIT
BOARD
MODEL
T
A ≤ 25°C
THERMAL RESISTANCE,
JUNCTION-TO-AMBIENT
WITH NO AIR FLOW
DERATING FACTOR(1)
ABOVE TA = 25C
TA = 85C POWER
RATING
PACKAGE
POWER
RATING
Low-K(2)
High-K(3)
Low-K(2)
High-K(3)
754 mW
1166 mW
816 mW
1206 mW
132.6 C/W
85.8 C/W
122.5 C/W
82.9 C/W
7.54 mW/C
11.7 mW/C
8.17 mW/C
12.1 mW/C
301 mW
466 mW
326 mW
482 mW
D
DW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted with no air flow.
(2) In accordance with the low-K thermal metric definitions of EIA/JESD51-3.
(3) In accordance with the high-K thermal metric definitions of EIA/JESD51-7.
THERMAL CHARACTERISTICS
PARAMETER
PACKAGE
VALUE
UNITS
C/W
D
51.4
56.6
45.7
49.2
θJB
Junction-to-board thermal resistance
DW
D
C/W
C/W
θJC
Junction-to-case thermal resistance
DW
C/W
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TB5D1M, TB5D2H
Supply voltage, VCC
Input voltage
0 V to 6 V
- 0.3 V to (VCC + 0.3 V)
3 kV
Human Body Model(2)
All Pins
All Pins
ESD
Charged-Device Model(3)
2 kV
Continuous power dissipation
Storage temperature, Tstg
Junction temperature, TJ
See Dissipation Rating Table
-65C to 130C
130C
D Package
-80 V to 100 V
-100 V to 100 V
Lightning surge, TB5D1M only, see Figure 6
DW Package
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance with JEDEC Standard 22, Test Method A114-A.
(3) Tested in accordance with JEDEC Standard 22, Test Method C101.
2
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
RECOMMENDED OPERATING CONDITIONS(1)
MIN
4.5
3.0
-40
NOM
5
MAX
5.5
3.6
85
UNIT
Supply voltage, VCC
5.0-V nominal supply
3.3-V nominal supply
V
V
C
3.3
Operating free-air temperature, TA
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet, unless
otherwise stated.
ELECTRICAL CHARACTERISTICS
over recommended operating conditions unless otherwise noted
parameter
test conditions
min
typ(1)
max
unit
VCC = 4.5 V to 5.5 V,
no loads
40
ICC
Supply current
mA
VCC = 3.0 V to 3.6 V,
no loads
40
VCC = 4.5 V to 5.5 V,
Figure 3 loads all outputs
290
280
360
360
PD
Power dissipation
mW
VCC = 3.0 V to 3.6 V,
Figure 4 loads all outputs
VOH
VOL
VOD
VOH
VOL
VOD
Output high voltage
VCC - 1.8
VOH - 1.4
0.7
VCC - 1.3
VOH - 1.2
1.2
VCC - 0.8
VOH - 0.7
1.4
V
V
V
V
V
V
VCC = 4.5 V to 5.5 V,
Figure 3
Output low voltage
Differential output voltage |VOH - VOL
|
Output high voltage
VCC - 1.8
VOH - 1.4
0.5
VCC - 1.3
VOH - 1.1
1.1
VCC - 0.8
VOH - 0.5
1.4
VCC = 3.0 V to 3.6 V,
Figure 4
Output low voltage
Differential output voltage |VOH - VOL
|
Peak-to-peak common-mode output
voltage
VOC(PP)
CL= 5 pF, Figure 5
230
600
mV
VOZ
VIL
Third-state output voltage
Low level input voltage(2)
High level input voltage
Enable input clamp voltage
Figure 3 or Figure 4 load
0.1
0.8
V
V
V
V
VIH
VIK
2
VCC = 4.5 V, II = -5 mA
VCC = 5.5 V, VO = 0 V
VCC = 5.5 V, VOD = 0 V
VCC = 5.5 V, VI = 0.4 V
VCC = 5.5 V, VI =2.7 V
VCC = 5.5 V, VI =5.5 V
-1(3)
-250(3)
10(3)
-400(3)
20
IOS
IIL
Output short-circuit current(4)
mA
Input low current, enable or data
Input high current, enable or data
Input reverse current, enable or data
Input capacitance
A
A
IIH
100
A
CIN
5
pF
(1) All typical values are at 25C and with a 3.3-V or 5-V supply.
(2) The input level provides no noise immunity and should be tested only in a static, noise-free environment.
(3) This parameter is listed using a magnitude and polarity/direction convention, rather than an algebraic convention, to match the original
Agere data sheet.
(4) Test must be performed one output at a time to prevent damage to the device. No test circuit attached.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
THIRD STATE—A TB5D1M (or TB5D2H) driver produces pseudo-ECL levels, and has a third-state mode, which
is different than a conventional TTL device. When a TB5D1M (or TB5D2H) driver is placed in the third state, the
base of the output transistors is pulled low, bringing the outputs below the active-low level of standard PECL
devices. [For example: The TB5D1M low output level is typically 2.7 V, while the third state output level is less
than 0.1 V.] In a bidirectional, multipoint, bus application, the driver of one device, which is in its third state, may
be back driven by another driver on the bus whose voltage in the low state is lower than the third-stated device.
This could come about due to differences in the driver's independent power supplies. In this case, the device in
the third state controls the line, thus clamping the line and reducing the signal swing. If the difference voltage
between the independent driver power supplies is small, this consideration can be ignored. Again using the
TB5D1M driver as an example, a typical supply voltage difference between separate drivers of > 2 V can exist
without significantly affecting the amplitude of the signal.
SWITCHING CHARACTERISTICS, 5-V NOMINAL SUPPLY
over recommended operating conditions unless otherwise noted
parameter
test conditions
min
typ(1)
max
unit
ns
tP1
tP2
ΔtP
Propagation delay time, input high to output(2)
Propagation delay time, input low to output(2)
Capacitive delay
1.2
1.2
2
2
CL = 5 pF, See Figure 1 and
Figure 3
0.01
0.03
ns/pF
Propagation delay time,
high-level-to-high-impedance output
tPHZ
tPLZ
tPZH
tPZL
7
12
12
12
12
Propagation delay time,
low-level-to-high-impedance output
7
5
4
CL = 5 pF, See Figure 2 and
Figure 3
ns
Propagation delay time,
high-impedance-to-high-level output
Propagation delay time,
high-impedance-to-low-level output
tskew1
tshew2
tskew(pp)
Δtskew
tTLH
Output skew, |tP1 - tP2
|
0.15
0.15
0.1
0.3
1.1
1
Output skew, |tPHH - tPHL|, |tPLH - tPLL
Part-to-part skew(3)
Output skew, difference between drivers(4)
Rise time (20% - 80%)
|
CL = 5 pF, See Figure 1 and
Figure 3
ns
ns
0.3
2
0.7
0.7
CL = 5 pF, See Figure 1 and
Figure 3
tTHL
Fall time (80% - 20%)
2
(1) All typical values are at 25C and with a 5-V supply.
(2) Parameters tP1 and tP2 are measured from the 1.5 V point of the input to the crossover point of the outputs (see Figure 1).
(3) tskew(pp) is the magnitude of the difference in differential propagation delay times, tP1 or tP2, between any specified outputs of two devices
when both devices operate with the same supply voltage, at the same temperature, and have identical packages and test circuits.
(4) Δtskew is the magnitude of the difference in differential skew tskew1 between any specified outputs of a single device.
4
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
SWITCHING CHARACTERISTICS, 3.3-V NOMINAL SUPPLY
over recommended operating conditions unless otherwise noted
typ(1
parameter
test conditions
min
max
unit
)
tP1
Propagation delay time, input high to output(2)
Propagation delay time, input low to output(2)
1.2
1.2
0.01
8
3.5
3.5
CL = 5 pF, See Figure 1 and
Figure 4
ns
tP2
ΔtP
Capacitive delay
0.03 ns/pF
12
tPHZ
tPLZ
tPZH
tPZL
Propagation delay time, high-level-to-high-impedance output
Propagation delay time, low-level-to-high-impedance output
Propagation delay time, high-impedance-to-high-level output
Propagation delay time, high-impedance-to-low-level output
5
12
ns
12
CL = 5 pF, See Figure 2 and
Figure 4
5
8
12
tskew1
tshew2
tskew(pp)
Δtskew
tTLH
Output skew, |tP1 - tP2
|
0.15
0.15
0.1
0.3
Output skew, |tPHH - tPHL|, |tPLH - tPLL
Part-to-part skew(3)
Output skew, difference between drivers(4)
Rise time (20% - 80%)
|
1.2
ns
1
CL = 5 pF, See Figure 1 and
Figure 4
0.3
0.7
0.7
2
CL = 5 pF, See Figure 1 and
Figure 4
ns
2
tTHL
Fall time (80% - 20%)
(1) All typical values are at 25C and with a 3.3-V supply.
(2) Parameters tP1 and tP2 are measured from the 1.5 V point of the input to the crossover point of the outputs (see Figure 1).
(3) tskew(pp) is the magnitude of the difference in differential propagation delay times, tP1 or tP2, between any specified outputs of two devices
when both devices operate with the same supply voltage, at the same temperature, and have identical packages and test circuits.
(4) Δtskew is the magnitude of the difference in differential skew tskew1 between any specified outputs of a single device.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
2.4 V
1.5 V
0.4 V
INPUT
OUTPUTS
OUTPUT
OUTPUT
t
t
t
t
P1
P2
V
OH
V
OL
V
OH
PHH
PLL
(V + V )/2
OH
OL
V
OL
t
t
PHL
PLH
V
OH
(V + V )/2
OH
OL
V
V
V
OL
OH
OL
80%
20%
80%
OUTPUT
20%
t
t
tHL
tLH
Figure 1. Propagation Delay Time Waveforms
2.4 V
(1)
E1
1.5 V
0.4 V
2.4 V
1.5 V
0.4 V
(2)
E2
t
t
PZH
PHZ
V
V
V
OH
+ 0.2 V
− 0.1 V
OL
OL
OUTPUT
V
OL
t
t
PZL
PLZ
V
V
OL
OUTPUT
− 0.1 V
OL
(1)
E2 = 1 while E1 changes state
E1 = 0 while E2 changes state
(2)
NOTE: In the third state, both outputs (OUTPUT and OUTPUT) are 0.1 V (max).
Figure 2. Enable and Disable Delay Time Waveforms
6
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
TEST CONDITIONS
Parametric values specified under the Electrical Characteristics and Switching Characteristics sections are
measured with the following output load circuit.
OUTPUT
100 Ω
200 Ω
OUTPUT
200 Ω
C
L
C
L
Figure 3. Driver Test Circuits, 5-V Nominal Supplies
OUTPUT
100 Ω
75 Ω
OUTPUT
75 Ω
C
L
C
L
Figure 4. Driver Test Circuits, 3.3-V Nominal Supplies
V
OC
V
OC
OUTPUT
OUTPUT
OUTPUT
OUTPUT
50 Ω
50 Ω
50 Ω
50 Ω
200 Ω
200 Ω
75 Ω
75 Ω
C
L
C
P
= 2 pF
C
L
C
L
C
P
= 2 pF
C
L
Note: V
load circuit for 5-V nominal supplies.
Note: V
load circuit for 3.3-V nominal supplies.
OC(PP)
OC(PP)
V
V
OH
OUTPUT
OL
V
OC
V
OC(PP)
Note: All input pulses are supplied by a generator having the following characteristics: t or t = 1 ns, pulse repetition rate
r
f
(PRR) = 0.25 Mbps, pulse width = 500 ± 10 ns. C includes the instrumentation and fixture capacitance within 0,06 m of the D.U.T.
P
The measurement of V
is made on test equipment with a –3 dB bandwidth of at least 1 GHz.
OC(PP)
Figure 5. Test Circuits and Definitions for the Driver Common-Mode Output Voltage
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
V
CC
110 Ω
DUT
110 Ω
+
_
Lightning Surge
Test Generators
+
_
Note: Surges may be applied simultaneously, but never in opposite polarities.
Surge test pulses have t = t = 2 µs, pulse width = 7 µs (50% points), and
r
f
period = 250 ms.
Figure 6. Lightning-Surge Testing Configuration for TB5D1M
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE RELATIVE TO VCC
vs
OUTPUT CURRENT
OUTPUT VOLTAGE RELATIVE TO VCC
vs
FREE-AIR TEMPERATURE
0
0
V
= 4.5 V to 5.5 V,
CC
T = 255C
A
Figure 3 Load
-0.5
-0.5
V
OH
-1
V
Max
OH
-1
-1.5
-2
-1.5
-2
V
Min
OH
V
OL
Max
Min
-2.5
-3
V
OL
V
OL
-2.5
-3
-3.5
-50
0
50
100
150
-50
-40
-30
-20
-10
0
T
A
- Free-Air Temperature - °C
I
O
- Output Current - mA
Figure 7.
Figure 8.
8
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE RELATIVE TO VCC
DIFFERENTIAL OUTPUT VOLTAGE
vs
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
0
1.6
1.4
1.2
V
CC
= 4.5 V to 5.5 V,
V
= 3 V to 3.6 V,
CC
Figure 3 Load
Figure 4 Load
V
OD
Max
-0.5
-1
V
Max
Min
OH
V
Nom
Min
OD
V
-1.5
-2
OH
V
OD
V
OL
Max
Min
1
V
OL
-2.5
-3
0.8
-50
-50
0
50
100
150
0
50
100
150
T
A
- Free-Air Temperature - °C
T
A
- Free-Air Temperature - °C
Figure 9.
Figure 10.
DIFFERENTIAL OUTPUT VOLTAGE
PROPAGATION DELAY TIME tP1 or tP2
vs
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
1.6
1.4
1.4
V
= 4.5 V to 5.5 V,
CC
Figure 3 Load
V
OD
Max
1.2
1
V
OD
Nom
1.2
Max Delay
1
V
OD
Min
Min Delay
0.8
0.6
0.8
V
= 3 V to 3.6 V,
CC
Figure 4 Load
0
−50
50
100
150
0
-50
0
50
100
150
T
A
- Free-Air Temperature - 5C
T
A
- Free-Air Temperature - °C
Figure 11.
Figure 12.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
PROPAGATION DELAY TIME tP1 or tP2
vs
FREE-AIR TEMPERATURE
3.5
V
CC
= 3 V to 3.6 V,
Figure 4 Load
3
2.5
Max Delay
2
1.5
Min Delay
1
0.5
0
−50
50
100
150
0
T
A
- Free-Air Temperature - 5C
Figure 13.
10
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
APPLICATION INFORMATION
the device and PCB. JEDEC/EIA has defined
standardized test conditions for measuring θJA. Two
commonly used conditions are the low-K and the
high-K boards, covered by EIA/JESD51-3 and
EIA/JESD51-7 respectively. Figure 14 shows the
low-K and high-K values of θJA versus air flow for this
device and its package options.
Power Dissipation
The power dissipation rating, often listed as the
package dissipation rating, is a function of the
ambient temperature, TA, and the airflow around the
device. This rating correlates with the device's
maximum junction temperature, sometimes listed in
the absolute maximum ratings tables. The maximum
junction temperature accounts for the processes and
materials used to fabricate and package the device,
in addition to the desired life expectancy.
The standardized θJA values may not accurately
represent the conditions under which the device is
used. This can be due to adjacent devices acting as
heat sources or heat sinks, to nonuniform airflow, or
to the system PCB having significantly different
thermal characteristics than the standardized test
PCBs. The second method of system thermal
analysis is more accurate. This calculation uses the
power dissipation and ambient temperature, along
with two device and two system-level parameters:
There are two common approaches to estimating the
internal die junction temperature, TJ. In both of these
methods, the device’s internal power dissipation, PD,
needs to be calculated. This is done by totaling the
supply power(s) to arrive at the system power
dissipation:
•
•
•
•
θJC, the junction-to-case thermal resistance, in
degrees Celsius per watt
θJB, the junction-to-board thermal resistance, in
degrees Celsius per watt
θCA, the case-to-ambient thermal resistance, in
degrees Celsius per watt
θBA, the board-to-ambient thermal resistance, in
degrees Celsius per watt.
S(V I
)
Sn
Sn
(1)
and then subtracting the total power dissipation of the
external load(s):
S(V I
)
Ln
Ln
(2)
The first TJ calculation uses the power dissipation
and ambient temperature, along with one parameter:
θJA, the junction-to-ambient thermal resistance, in
degrees Celsius per watt.
In this analysis, there are two parallel paths, one
through the case (package) to the ambient, and
another through the device to the PCB to the
ambient. The system-level junction-to-ambient
thermal impedance,θJA(S), is the equivalent parallel
impedance of the two parallel paths:
The product of PD and θJA is the junction temperature
rise above the ambient temperature. Therefore:
T
+ T ) (P q
)
J
A
D
JA
(3)
T
+ T ) (P q
)
140
120
100
J
A
D
JA(S)
(4)
where
D, Low−K
DW, Low−K
(q ) q ) (q ) q
)
JC
CA
JB
) q ) q
BA
q
+
JA(S)
(q
) q
)
JC
CA
JB
BA
The device parameters θJC and θJB account for the
internal structure of the device. The system-level
parameters θCA and θBA take into account details of
the PCB construction, adjacent electrical and
mechanical components, and the environmental
conditions including airflow. Finite element (FE), finite
difference (FD), or computational fluid dynamics
(CFD) programs can determine θCA and θBA. Details
on using these programs are beyond the scope of
this data sheet, but are available from the software
manufacturers.
80
DW, High−K
D, High−K
60
40
0
100
200
300
400
500
Air Flow − LFM
Figure 14. Thermal Impedance vs Air Flow
Note that θJA is highly dependent on the PCB on
which the device is mounted, and on the airflow over
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TB5D1M TB5D2H
TB5D1M, TB5D2H
www.ti.com
SLLS579C–SEPTEMBER 2003–REVISED JANUARY 2008
Load Circuits
Transmission Line
The test load circuits shown in Figure 3 and Figure 4
are based on a recommended pi type of load circuit
shown in Figure 15. The 100-Ω differential load
resistor RT at the receiver provide proper termination
for the interconnecting transmission line, assuming it
has a 100-Ω characteristic impedance. The two
resistors RS to ground at the driver end of the
transmission line link provide dc current paths for the
emitter follower output transistors. The two resistors
to ground normally should not be placed at the
receiver end, as they shunt the termination resistor,
potentially creating an impedance mismatch with
undesirable reflections.
INPUT
OUTPUT
R /2
T
R /2
T
Recommended Resistor Values:
For 5 V Nom Supplies, R = 200 Ω, R = 90 Ω
T
S
For 3.3 V Nom Supplies, R = 100 Ω, R = 30 Ω
T
S
R
S
Figure 16. A Recommended Y Load Circuit
An additional load circuit, similar to one commonly
used with ECL and PECL, is shown in Figure 17.
Transmission Line
INPUT
OUTPUT
Transmission Line
R /2
T
R /2
T
Recommended Resistor Values:
For 5 V and 3.3 V Nom Supplies, R = 100 Ω,
T
V
T
= V - 2.55 V
CC
INPUT
OUTPUT
R
= 100
W
+
V
T
T
_
R
R
S
Recommended Resistor Values:
For 5-V Nominal Supplies, R = 200 W
S
S
Figure 17. A Recommended PECL-Style Load
Circuit
For 3.3-V Nominal Supplies, R = 75 W
S
Figure 15. A Recommended pi Load Circuit
An important feature of all of these recommended
load circuits is that they ensure that both of the
emitter follower output transistors remain active
(conducting current) at all times. When deviating from
these recommended values, it is important to make
sure that the low-side output transistor does not turn
off. Failure to do so increases the tskew2 and VOC(PP)
values, increasing the potential for electromagnetic
radiation.
Another common load circuit, a Y load, is shown in
Figure 16. The receiver-end line termination of RT is
provided by the series combination of the two RT/2
resistors, while the dc current path to ground is
provided by the single resistor RS. Recommended
values, as a function of the nominal supply voltage
range, are indicated in the figure.
12
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): TB5D1M TB5D2H
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TB5D1MD
TB5D1MDE4
TB5D1MDW
TB5D1MDWE4
TB5D1MDWR
TB5D1MDWRE4
TB5D2HD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40
40
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
Pb-Free (RoHS)
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Request Free Samples
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Request Free Samples
Request Free Samples
Request Free Samples
Purchase Samples
DW
DW
DW
DW
D
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
2000
2000
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Purchase Samples
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Request Free Samples
Request Free Samples
Purchase Samples
TB5D2HDE4
TB5D2HDR
D
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
D
2500
2500
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
TB5D2HDRE4
TB5D2HDW
D
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Purchase Samples
DW
DW
DW
DW
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Request Free Samples
Request Free Samples
Purchase Samples
TB5D2HDWE4
TB5D2HDWR
TB5D2HDWRE4
40
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
2000
2000
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
Purchase Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TB5D1MDWR
TB5D2HDR
SOIC
SOIC
SOIC
DW
D
16
16
16
2000
2500
2000
330.0
330.0
330.0
16.4
16.4
16.4
10.75 10.7
6.5 10.3
10.75 10.7
2.7
2.1
2.7
12.0
8.0
16.0
16.0
16.0
Q1
Q1
Q1
TB5D2HDWR
DW
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TB5D1MDWR
TB5D2HDR
SOIC
SOIC
SOIC
DW
D
16
16
16
2000
2500
2000
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
TB5D2HDWR
DW
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明