TCAN1144-Q1 [TI]
TCAN114x-Q1 Enhanced CAN FD and High Speed CAN Transceiver with Selective Wake;
| 型号： | TCAN1144-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TCAN114x-Q1 Enhanced CAN FD and High Speed CAN Transceiver with Selective Wake |
| 文件： | 总10页 (文件大小：398K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TCAN1144-Q1, TCAN1145-Q1, TCAN1146-Q1
SLLSF81 –OCTOBER 2019
TCAN114x-Q1 Enhanced CAN FD and High Speed CAN Transceiver with Selective Wake
1 Features
3 Description
The TCAN114x-Q1 is a family of enhanced high-
speed CAN FD transceivers supporting data rates up
to 8 Mbps. These devices are configured using serial
peripheral interface (SPI) in order to use all the
features available. The TCAN114x-Q1 supports 1.8 V
to 5 V processors by applying the appropriate voltage
to the VIO pin, allowing lower power processors to be
utilized. The family of devices are register compatible
enabling the system designer the flexibility to
implement the features needed with minimal if any
hardware and software changes.
1
•
AEC-Q100 (Grade 1) Qualified for automotive
applications
•
•
Meets the requirements of ISO 11898-2:2016
TCAN1145-Q1 and TCAN1146-Q1 support
selective wake, partial networking
•
CAN FD transceiver supporting communication
rates up to 8 Mbps
•
•
Classical CAN backwards compatible
Operating modes programmable through SPI
command
The TCAN1144-Q1 and TCAN1146-Q1 are full
featured devices supporting watchdog and advanced
bus diagnostics. For ease of debug, the advanced
bus fault diagnostics and communication feature can
be used to pinpoint bus faults when used with other
devices supporting this feature. The inhibit (INH) pin
can be used to enable node power but if this is not
required, the pin can be configured as a limp home
pin when a watchdog error takes place.
–
–
–
–
Normal mode
Low power standby mode
Low power selective wake mode
Low power sleep mode
•
•
1.8 V, 3.3 V to 5 V MCU support
Wide operating range:
–
–
±58 V Bus fault protection
±12 V Common mode
The TCAN1145-Q1 and TCAN1146-Q1 support
selective wake, also known as partial networking,
used in systems containing nodes that can be placed
into sleep mode and reducing overall power of the
system. The transceiver and selective wake function
meets the specifications of the ISO11898-2:2016
•
TCAN1144-Q1 and TCAN1146-Q1 support
timeout, window and question and answer
watchdog
•
•
Programmable INH/LIMP pin
standard. If
a
watchdog and advanced bus
TCAN1144-Q1 and TCAN1146-Q1 support
advanced bus fault diagnostics and reporting
diagnostics are not needed then the TCAN1145-Q1 is
the device to select.
•
14-Pin SOIC, VSON and SOT23 package
Device Information(1)
2 Applications
PART NUMBER
PACKAGE
BODY SIZE (NOM)
9.90 mm x 3.91 mm
4.5 mm x 3.0 mm
4.2 mm x 2.0 mm
TCAN114xD-Q1
SOIC
•
•
•
•
Body electronics and lighting
Automotive infotainment and cluster
Hybrid, electric & powertrain systems
Industrial transportation
TCAN114xDMT-Q1
TCAN114xDYY-Q1
VSON
SOT
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematics
Simplified Schematics
3 kꢀ
3 kꢀ
VBAT
VBAT
100 nF
100 nF
22 nF
22 nF
EN
EN
33 kꢀ
33 kꢀ
VIN
VIN
7
10
9
7
10
9
Voltage Regulator
Voltage Regulator
INH VSUP
INH VSUP
5 VOUT
VIOOUT
5 VOUT
VIOOUT
WAKE
WAKE
3
3
VCC
VCC
10 µF
10 µF
TCAN1145
TCAN1146
TCAN1144
5
5
13
13
VIO
VIO
CANH
CANH
10 µF
10 µF
VDD
VDD
8
8
SCLK
SCLK
SCLK
SCLK
2-wire
CAN
bus
2-wire
CAN
bus
11
6
11
6
MOSI
MISO
MOSI
MISO
SDI
SDO
SDI
SDO
Selective
Wake
14
14
MCU
MCU
nCS
nCS
nCS
nCS
12
12
1
4
1
4
CANL
CANL
TXD
RXD
TXD
RXD
CAN
CNTL
CAN
CNTL
Optional:
Terminating
Node
Optional:
Terminating
Node
Optional:
Filtering,
Transient and
ESD
Optional:
Filtering,
Transient and
ESD
2
2
GND
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
TCAN1144-Q1, TCAN1145-Q1, TCAN1146-Q1
SLLSF81 –OCTOBER 2019
www.ti.com
4 Device and Documentation Support
This device will conform to the following CAN standards. The core of what is needed is covered within this
system spec, however reference should be made to these standards and any discrepancies pointed out and
discussed. This document should provide all the basics of what is needed. However for a full understanding of
CAN including the protocol these additional sources will be very helpful as the scope of CAN protocol in detail is
outside the scope of this physical layer (transceiver) specification.
4.1 Documentation Support
4.1.1 CAN Transceiver Physical Layer Standards:
•
ISO 11898-2:2016: High speed medium access unit with low power mode (super sets -2 standard electrically
in several specs and adds the original wake up capability via the bus in low power mode)
•
•
•
ISO 8802-3: CSMA/CD – referenced for collision detection from ISO11898-2
CAN FD 1.0 Spec and Papers
Bosch “Configuration of CAN Bit Timing”, Paper from 6th International CAN Conference (ICC), 1999. This is
repeated a lot in the DCAN IP CAN Controller spec copied into this system spec.
•
•
•
•
GMW3122: GM requirements for HS CAN
SAE J2284-2: High Speed CAN (HSC) for Vehicle Applications at 250 kbps
SAE J2284-3: High Speed CAN (HSC) for Vehicle Applications at 500 kbps
Bosch M_CAN Controller Area Network Revision 3.2.1.1 (3/24/2016)
4.1.2 EMC Requirements:
•
SAEJ2962-2: US3 requirements for CAN Transceivers (-2, -5, GM will propose updates to address -6 + FD,
but this is the best place for a working start)
•
HW Requirements for CAN, LIN,FR V1.3: German OEM requirements for HS CAN
4.1.3 Conformance Test Requirements:
HS_TRX_Test_Spec_V_1_0: GIFT / ICT CAN test requirements for High Speed Physical Layer
•
4.1.4 Related Documentation
•
•
“A Comprehensible Guide to Controller Area Network”, Wilfried Voss, Copperhill Media Corporation
“CAN System Engineering: From Theory to Practical Applications”, 2nd Edition, 2013; Dr. Wolfhard Lawrenz,
Springer.
4.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
ORDER NOW
TCAN1144-Q1
TCAN1145-Q1
TCAN1146-Q1
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
4.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
2
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: TCAN1144-Q1 TCAN1145-Q1 TCAN1146-Q1
TCAN1144-Q1, TCAN1145-Q1, TCAN1146-Q1
www.ti.com
SLLSF81 –OCTOBER 2019
4.4 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
4.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2019, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: TCAN1144-Q1 TCAN1145-Q1 TCAN1146-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Nov-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTCAN1144DMTQ1
PTCAN1144DQ1
PTCAN1145DMTQ1
PTCAN1145DQ1
PTCAN1146DMTQ1
PTCAN1146DQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSON
SOIC
VSON
SOIC
VSON
SOIC
DMT
D
14
14
14
14
14
14
250
50
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
Call TI
Call TI
Call TI
Call TI
Call TI
DMT
D
250
50
DMT
D
250
50
TCAN1144DMTRQ1
TCAN1144DRQ1
PREVIEW
PREVIEW
VSON
SOIC
DMT
D
14
14
14
14
14
14
14
14
14
3000
2500
3000
3000
2500
3000
3000
2500
3000
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
TCAN1144DYYRQ1
TCAN1145DMTRQ1
TCAN1145DRQ1
PREVIEW SOT-23-THN
DYY
DMT
D
PREVIEW
PREVIEW
VSON
SOIC
TCAN1145DYYRQ1
TCAN1146DMTRQ1
TCAN1146DRQ1
PREVIEW SOT-23-THN
DYY
DMT
D
PREVIEW
PREVIEW
VSON
SOIC
TCAN1146DYYRQ1
PREVIEW SOT-23-THN
DYY
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Nov-2020
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
DMT0014A
VSON - 0.9 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.05)
SECTION A-A
SCALE 30.000
SECTION A-A
TYPICAL
C
0.9 MAX
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
A
A
2X
3.9
15
SYMM
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
14X
PIN 1 ID
0.1
C A B
C
(OPTIONAL)
0.05
4223033/B 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMT0014A
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4223033/B 10/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMT0014A
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4223033/B 10/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明