THN5602F [TI]
NPN SiGe RF POWER TRANSISTOR; NPN硅锗RF功率晶体管型号: | THN5602F |
厂家: | TEXAS INSTRUMENTS |
描述: | NPN SiGe RF POWER TRANSISTOR |
文件: | 总6页 (文件大小:281K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
THN5602F
SOT-89
NPN SiGe RF POWER
TRANSISTOR
The THN5602F is a low cost, NPN medium power
SiGe HBT(Hetero-Junction Bipolar Transistor)
encapsulated in a plastic SOT-89 SMD package.
The THN5602F can be used as a driver device or
4
an output device, depending on the specific app-
lication.
□ FEATURES
o 4.8 Volt operation
o P1dB 28 dBm @f=465MHz
o Power gain 10 dB @f=465MHz
Unit : m m
PIN CONFIGURATION
PIN NO
SYMBOL
DESCRIPTION
□ APPLICATIONS
1
2
3
4
b
c
e
c
base
collector
emitter
o Hand-held radio equipment in common
emitter class-AB operation in 450 MHz
communication band.
collector
□ MAXIMUM RATINGS
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
20
8
4
V
V
V
mA
W
℃
℃
VCBO
VCEO
VEBO
Ic
PT
TSTG
TJ
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Total Power Dissipation
Storage Temperature
Open Emitter
Open Base
Open Collector
350
1
-65 ~ 150
150
Ts = 60℃ ; note 1
Operating Juction Temperature
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-1/6-
THN5602F
□ THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
thermal resistance from junction
to soldering point
55
K/W
Rth j-s
PT=1W; Ts=60℃;note1
* Note 1. Ts is temperature at the soldering point of the collector pin.
□ QUICK REFERENCE DATA
RF performance at Ts ≤ 60 ℃ in common emitter test circuit (see Fig 6.)
Mode of Operation
f [MHz]
VCE [V]
PL [mW]
GP [dB]
≥ 10
ηC [%]
CW, class-AB
465
4.8
630
≥ 60
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-2/6-
THN5602F
□ DC CHARACTERISTICS
Tj=25 ℃ unless otherwise specified
SYMBOL
PARAMETER
CONDITION
open emitte
MIN.
MAX. UNIT
20
8
V
BVCBO
BVCEO
BVEBO
IS
collector-base breakdown voltage
collector-emitter breakdown voltage
emitter-base breakdown voltage
collector leakage current
V
open base
3
V
mA
open collector
0.1
60
200
hFE
DC current gain
4.5
pF
Cc
collector capacitance
160
6
140
120
100
80
Hfe
Cc
[pF]
5
4
3
60
40
20
2
0
0
2
4
6
8
10
VCB [V]
0.00
0.10
0.20
0.30
0.40
0.50
Ic(A)
f=900M Hz; VCE=4.8V; ICQ=5m A; Ts < 60℃
VCE = 4.8V ; Tj =25℃
Fig 1. DC Current gain v.s collector current
Fig 2. Collector-base capacitance v.s collector-
base voltage(DC)
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-3/6-
THN5602F
□ APPLICATION INFORMATION
RF performance at Ts ≤ 60 ℃ in common emitter configuration.
Mode of Operation
f [MHz]
VCE [V]
PL [mW]
GP [dB]
ηC [%]
CW, class-AB
465
4.8
630
≥ 10
≥ 60
THN5602F Source/Load Impedance as a frequency
VCE = 4.8V, ICQ = 5mA, Pout = 28dBm
THN5602F Transistor Impedance
ZS [Ω]
Freq.
[MHz]
440
450
460
ZL [Ω]
Rs
Xs
RL
XL
17.34
17.21
17.12
17.09
6.91
7.89
8.90
9.95
22.21
19.31
17.20
-0.59
2.58
7.07
L
Z
Zs
470
15.66 19.00
20
18
30
25
20
15
10
5
Rs
ZS
[Ω]
ZL
RL
[Ω]
16
14
12
10
8
XL
Xs
0
6
-5
-10
4
430
440
450
460
470
480
430
440
450
460
470
480
Freq[M Hz]
Freq [M Hz]
Fig 3. Source Impedance (series components) as
a freq, typical values.
Fig 4. Load Impedance (series components) as
a freq, typical values.
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-4/6-
THN5602F
Part List
Vcc
C1, C7,C10,C11
C3,C4
470pF
6pF
C2
8pF
50
C5
C6
C9,C12
7pF
12pF
1nF
RF_OUT
RF IN
C8,C13
100nF
8.2nH
3turn
8turn
2 mm
L1(Chip L : 1608)
L2,L3,L4 (Air Coil)
L5,L6 (Air Coil)
Air Coil Diameter
: Air Coil
79.5
Unit : m m
Fig 5. THN5602F Test Circuit Board Layout @ f = 465MHz
Test board : FR4 glass epoxy board, dielectric constant = 4.5, thickness = 0.8 mm
Test condition : CW test, VCC = 4.8 V, ICQ = 5 mA, frequency = 465 MHz.
THN5602F
THN5602F Test Circuit Schem atic Diagram
Fig 6. Test Circuit Schematic Diagram @f = 465MHz
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-5/6-
THN5602F
□ PACKAGE DIMENSION
Fig 7. SOT-89 Package dimension
Sep-2003
Rev 1.1
www.tachyonics.co.kr
-6/6-
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