THS4520-DIE [TI]
宽带、低噪声、低失真、全差分放大器;
| 型号： | THS4520-DIE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 宽带、低噪声、低失真、全差分放大器 放大器 |
| 文件： | 总6页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
THS4520-DIE
www.ti.com.cn
ZHCSBM5 –SEPTEMBER 2013
具有轨至轨输出的宽带、低噪声、低失真全差动放大器
查询样品: THS4520-DIE
1
特性
•
•
•
完全差分架构具有轨至轨输出
应用范围
中央输入共模范围
断电能力
•
•
•
•
•
数据采集系统
高线性模式转换器 (ADC) 放大器
无线通信
测试和测量
声音处理系统
说明
THS4520-DIE 是一款设计用于数据采集系统的宽带、完全差动运算放大器。 它具有极低噪声和低谐波失真。 转换
率非常适合于数据采集系统。 针对单位增益稳定而设计。
为了使直流耦合进入 ADC，它的独特输出共模控制电路将输出共模电压保持为置位电压。 共模置位点由内部电路
缺省设置为中电源，可由一个外部源过驱动。
此输入和输出在共模电压被设定为中电源时针对最佳性能进行了优化。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
THS4520TDA1
THS4520TDA2
100
10
THS4520
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
English Data Sheet: SLOS865
THS4520-DIE
ZHCSBM5 –SEPTEMBER 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AL5TiN
675 nm
2
Copyright © 2013, Texas Instruments Incorporated
THS4520-DIE
www.ti.com.cn
ZHCSBM5 –SEPTEMBER 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
526.6
Y MIN
1161.95
1161.95
1161.95
1161.95
1161.95
1161.95
1071.35
868.45
411.55
324.55
161.05
4.45
X MAX
Y MAX
1236.95
1236.95
1236.95
1236.95
1236.95
1236.95
1146.35
943.45
486.55
399.55
236.05
79.45
VS-
VS-
1
601.6
516.6
2
441.6
VS-
3
356.6
431.6
VS-
4
271.6
346.6
VS-
5
186.6
261.6
VS-
6
101.6
176.6
N/C
7
55.75
130.75
130.75
128.25
128.25
128.25
153.65
238.65
323.65
408.65
493.65
578.65
790.85
875.85
960.85
1045.85
1130.85
1215.85
1246.75
1246.75
1246.75
1246.75
1246.75
1192.85
1107.85
1022.85
937.85
852.85
767.85
VIN-
VOUT+
VOUT+
CM
8
55.75
9
53.25
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
53.25
53.25
VS+
VS+
VS+
VS+
VS+
VS+
VS+
VS+
VS+
VS+
VS+
VS+
CM
78.65
163.65
248.65
333.65
418.65
503.65
715.85
800.85
885.85
970.85
1055.85
1140.85
1171.75
1171.75
1171.75
1171.75
1171.75
1117.85
1032.85
947.85
862.85
777.85
692.85
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
4.45
79.45
161.05
324.55
411.55
868.45
1071.35
1161.95
1161.95
1161.95
1161.95
1161.95
1161.95
236.05
399.55
486.55
943.45
1146.35
1236.95
1236.95
1236.95
1236.95
1236.95
1236.95
VOUT-
VOUT-
VIN+
PD
VS-
VS-
VS-
VS-
VS-
VS-
Copyright © 2013, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
THS4520TDA1
THS4520TDA2
ACTIVE
ACTIVE
0
0
100
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
25 to 25
25 to 25
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2021
Addendum-Page 2
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