THS6053IDR [TI]
DUAL LINE DRIVER, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14;
| 型号： | THS6053IDR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL LINE DRIVER, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总21页 (文件大小：958K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢉ ꢊ ꢅ ꢋꢌꢇ ꢉ ꢆ ꢍ ꢌꢎꢂ ꢏ ꢐꢑꢒ ꢏ ꢓꢔꢒ ꢎ ꢕꢓ ꢍ ꢒꢕ ꢂ
SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
D
D
Remote Terminal ADSL Line Driver
− Ideal for Both Full Rate ADSL and G.Lite
− Compatible With 1:1 Transformer Ratio
D
High Speed
− 110 MHz (−3 dB, G=8, 12 V)
− 1500 V/µs Slew Rate (G = 8, 12 V)
Low Distortion, Single-Ended, G = 8
− −83 dBc (250 kHz, 2 Vpp, 100-Ω load)
Low Power Shutdown (THS6053)
− 300-µA Total Standby Current
Thermal Shutdown and Short Circuit
Protection
Low 2.7 pA/√Hz Noninverting Current Noise
− Reduces Noise Feedback Through
Hybrid Into Downstream Channel
D
D
D
D
D
D
D
Wide Supply Voltage Range 5 V to 15 V
− Ideal for 12-V Operation
Wide Output Swing
− 42 Vpp Differential Output Voltage,
Standard SOIC, SOIC PowerPAD, and
TSSOP PowerPAD Package
Evaluation Module Available
R = 200 Ω, 12-V Supply
L
D
High Output Current
− 175 mA (typ)
THS6052
SOIC (D) AND
THS6053
SOIC (D) AND
SOIC PowerPAD (DDA) PACKAGE
TSSOP PowerPAD (PWP) PACKAGE
(TOP VIEW)
(TOP VIEW)
D1 OUT
D1 IN−
D1 IN+
V
CC+
D1 OUT
D1 IN−
D1 IN+
V
1
2
3
4
5
6
7
14
1
2
3
4
8
7
6
5
CC+
13 D2 OUT
12 D2 IN−
11 D2 IN+
D2 OUT
D2 IN−
D2 IN+
V
V
CC−
CC−
10
9
N/C
GND
N/C
N/C
SHUTDOWN
N/C
8
description
The THS6052/3 is a high-speed line driver ideal for driving signals from the remote terminal to the central office
in asymmetrical digital subscriber line (ADSL) applications. It can operate from 12-V supply voltages while
drawing only 5.2 mA of supply current per channel. It offers low –83 dBc total harmonic distortion driving a 100-Ω
load (2 Vpp). The THS6052/3 offers a high 42-Vpp differential output swing across a 200-Ω load from a 12-V
supply. The THS6053 features a low-power shutdown mode, consuming only 300 µA quiescent current per
channel. The THS6052/3 is packaged in a standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD
packages.
+12 V
THS6052
RELATED PRODUCTS
Driver 1
50 Ω
+
_
V +
I
1:1
DEVICE
DESCRIPTION
750 Ω
350-mA, 12 ADSL CPE line driver
THS6042/3
THS6092/3
OPA2677
THS6062
15.4 dBm
Delivered
to Telephone
Line
275-mA, +12 V ADSL CPE line driver
100 Ω
THS6052
Driver 2
380-mA, +12 V ADSL CPE line driver
Low noise ADSL receiver
210 Ω
50 Ω
+
_
V −
I
0.68 µF
750 Ω
−12 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
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Copyright 2001, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀ ꢁ ꢂꢃꢄ ꢅ ꢈ
ꢉꢊ ꢅ ꢋ ꢌ ꢇ ꢉ ꢆ ꢍ ꢌꢎ ꢂꢏ ꢐꢑ ꢒ ꢏꢓ ꢔ ꢒ ꢎꢕ ꢓ ꢍꢒ ꢕꢂ
SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
AVAILABLE OPTION
PACKAGED DEVICE
EVALUATION
MODULES
T
A
SOIC-8
(D)
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
TSSOP-14
(PWP)
THS6052EVM
THS6053EVM
0°C to 70°C
THS6052CD
THS6052ID
THS6052CDDA
THS6052IDDA
THS6053CD
THS6053ID
THS6053CPWP
THS6053IPWP
−40°C to 85°C
—
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
to V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
CC+
CC−
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
CC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, T : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
stg
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
DISSIPATION RATING TABLE
T
= 25°C
A
PACKAGE
θ
JA
θ
JC
T = 150°C
J
POWER RATING
1.32 W
‡
‡
‡
‡
‡
‡
D-8
DDA
D-14
PWP
95°C/W
45.8°C/W
66.6°C/W
38.3°C/W
9.2°C/W
26.9°C/W
2.73 W
1.88 W
37.5°C/W
1.4°C/W
3.3 W
‡
This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test
PCB, the Θ is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.
JA
recommended operating conditions
MIN NOM
MAX
15
UNIT
Dual supply
Single supply
C-suffix
5
10
Supply voltage, V
CC+
to V
CC−
V
30
0
70
Operating free-air temperature, T
°C
A
I-suffix
−40
85
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, T = 25°C,
A
V
= 12 V, R
= 750 Ω, R = 100 Ω (unless otherwise noted)
CC
FEEDBACK
L
dynamic performance
PARAMETER
TEST CONDITIONS
MIN
TYP
110
120
100
90
MAX
UNIT
V
=
=
5 V
CC
CC
G= 1, R = 1 kΩ
F
V
12 V
R
= 50 Ω
L
G= 2, R = 680 Ω
F
V
=
5 V, 12 V
CC
G= 8, R = 330 Ω
F
BW
Small-signal bandwidth (−3 dB)
MHz
V
V
=
=
5 V
150
170
135
110
650
850
950
1500
1700
CC
G= 1, R = 1 kΩ
F
12 V
CC
R
= 100 Ω
L
G= 2, R = 680 Ω
F
V
=
5 V, 12 V
CC
G= 8, R = 330 Ω
F
V
V
V
V
V
=
=
=
=
=
5 V
V
V
V
V
V
=
=
=
=
=
5 V
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
12 V
15 V
12 V
15 V
12 V
15 V
12 V
15 V
V
= 4 V
PP
O
SR
Slew rate (see Note 2), G=8
V/µs
V
= 16 V
PP
O
NOTE 2: Slew rate is defined from the 25% to the 75% output levels.
noise/distortion performance
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
−83
UNIT
V
= 2 V
Gain = 8,
R = 100 Ω,
L
O(pp)
V
CC
= 12 V, f = 250 kHz
V
O(pp)
V
O(pp)
V
O(pp)
= 16 V
= 2 V
= 6 V
−78
Total harmonic distortion (single-ended
configuration)
THD
dBc
−74
Gain = 8,
R
= 50 Ω,
L
V
V
=
=
5 V, f = 250 kHz
CC
−72
5 V, f = 10 kHz ,
12 V
CC
V
I
Input voltage noise
2.1
nV/√Hz
pA/√Hz
n
f = 10 kHz,
V
CC
V
CC
V
CC
=
=
=
5 V,
12 V,
15 V
+Input
2.7
Input current noise
−Input
n
10.7
f = 250 kHz,
G = 2,
V
=
12 V,
CC
L
V
V
= 2 Vp-p
−79
−71
O
R = 100 Ω
X
T
Crosstalk
dBc
f = 250 kHz,
G = 2,
V
CC
=
5 V,
= 2 Vp-p
O
R = 50 Ω
L
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, T = 25°C,
A
V
= 12 V, R
= 750 Ω, R = 100 Ω (unless otherwise noted) (continued)
CC
FEEDBACK L
dc performance
PARAMETER
Input offset voltage
TEST CONDITIONS
MIN
TYP
MAX
10
15
6
UNIT
T
A
= 25°C
5
T
= full range
= 25°C
A
mV
V
V
=
=
12 V,
6 V
CC
CC
T
A
3
V
OS
Differential offset voltage
Offset drift
T
A
= full range
= full range
= 25°C
8
T
A
30 µV/°C
T
A
5
2
5
10
12
5
− Input bias current
+ Input bias current
T
= full range
T = 25°C
A
A
V
V
=
=
12 V,
6 V
CC
CC
I
IB
µA
T
= full range
= 25°C
6
A
T
10
12
A
Differential input bias current
Open loop transimpedance
T
= full range
R = 1 kΩ,
L
A
V
CC
V
CC
=
=
12 V,
6 V
Z
OL
1
MΩ
input characteristics
PARAMETER
TEST CONDITIONS
MIN
9.7
3.8
59
TYP
10.1
4.2
MAX
UNIT
V
V
=
=
12 V
6 V
CC
V
ICR
Input common-mode voltage range
V
CC
T
= 25°C
66
V
V
=
=
12 V,
6 V
A
CC
CC
CMRR Common-mode rejection ratio
dB
T
A
= full range
57
+ Input
− Input
1.5
15
2
MΩ
Ω
R
C
Input resistance
I
I
Input capacitance
pF
output characteristics
PARAMETER
TEST CONDITIONS
MIN
4.2
TYP
4.6
MAX
UNIT
R
R
= 50 Ω,
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
=
=
=
=
=
=
6 V
12 V
6 V
L
L
10.1
4.4
10.5
4.8
V
Output voltage swing
Single ended
V
O
= 100 Ω
R
R
R
= 25 Ω,
= 10 Ω,
= 0 Ω,
12 V
6 V
150
150
175
175
250
14
L
L
L
I
I
Output current
mA
O
Short-circuit current
Output resistance
12 V
mA
SC
Open loop
Ω
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢉ ꢊ ꢅ ꢋꢌꢇ ꢉ ꢆ ꢍ ꢌꢎꢂ ꢏ ꢐꢑꢒ ꢏ ꢓꢔꢒ ꢎ ꢕꢓ ꢍ ꢒꢕ ꢂ
SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, T = 25°C,
A
V
= 12 V, R
= 750 Ω, R = 100 Ω (unless otherwise noted) (continued)
CC
FEEDBACK L
power supply
PARAMETER
Operating range
TEST CONDITIONS
MIN
4.5
9
TYP
MAX
16.5
33
UNIT
Dual supply
V
CC
V
Single supply
T
= 25°C
5.2
4.5
7
A
V
CC
V
CC
V
CC
V
CC
=
=
=
=
12 V
6 V
T
A
= full range
= 25°C
8
Quiescent current (each driver)
Power supply rejection ratio
I
mA
dB
CC
T
A
6.5
7.5
T
A
= full range
= 25°C
T
A
−64
−61
−60
−58
−62
−
12 V
6 V
T
A
= full range
= 25°C
PSRR
T
A
−70
T
A
= full range
shutdown characteristics (THS6053 only)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
=
6 V, 12 V GND = 0 V,
CC
V
V
Shutdown pin voltage for power up
Shutdown pin voltage for power down
0.8
V
IL(SHDN)
(GND Pin as Reference)
V
CC
=
6 V, 12 V, GND = 0 V,
2
V
IH(SHDN)
(GND Pin as Reference)
I
t
t
I
Total quiescent current when in shutdown state
Disable time (see Note 3)
V
V
V
V
= 0 V, V
=
CC
6 V, 12 V
0.3
0.1
0.4
40
0.7
mA
µs
CC(SHDN)
GND
=
=
=
=
12 V
DIS
CC
CC
CC
CC
Enable time (see Note 3)
12 V
µs
EN
Shutdown pin input bias current for power up
6 V, 12 V
6 V, 12 V,
= 3.3 V
100
100
µA
IL(SHDN)
V
V
I
Shutdown pin input bias current for power down
50
µA
IH(SHDN)
(SHND)
NOTE 3: Disable/enable time is defined as the time from when the shutdown signal is applied to the SHDN pin to when the supply current has
reached half of its final value.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
APPLICATION INFORMATION
+12 V
+
0.1 µF
6.8 µF
THS6052
Driver 1
50 Ω
+
_
V +
I
1:1
750 Ω
Telephone Line
100 Ω
1 µF
210 Ω
499 Ω
+12 V
0.68 µF
1 kΩ
THS6052
Driver 2
0.1 µF
50 Ω
499 Ω
+
_
V −
I
−
+
V
O
+
THS6062
Receiver 1
750 Ω
0.1 µF
499 Ω
6.8 µF
+
−12 V
1 kΩ
499 Ω
−
+
V
O
−
THS6062
Receiver 2
−12 V
0.01 µF
Figure 1. THS6052 ADSL Application With 1:1 Transformer Ratio
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
THS6052CD
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
D
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
6052C
THS6052CDDA
THS6052ID
ACTIVE SO PowerPAD
ACTIVE SOIC
ACTIVE SO PowerPAD
DDA
D
75
75
Green (RoHS
& no Sb/Br)
CU SN
0 to 70
6052C
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
-40 to 85
-40 to 85
-40 to 85
0 to 70
6052I
THS6052IDDA
THS6052IDG4
THS6053CPWPR
THS6053ID
DDA
D
8
75
Green (RoHS
& no Sb/Br)
6052I
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
HTSSOP
SOIC
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
6052I
PWP
D
14
14
14
2000
50
Green (RoHS
& no Sb/Br)
HS6053C
THS6053I
HS6053I
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
THS6053IPWP
HTSSOP
PWP
90
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
THS6053CPWPR
HTSSOP PWP
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
THS6053CPWPR
2000
Pack Materials-Page 2
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