THS7364_14 [TI]
6-Channel Video Amplifier with 3 SD and 3 Full-HD Filters with 6-dB Gain;
| 型号： | THS7364_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 6-Channel Video Amplifier with 3 SD and 3 Full-HD Filters with 6-dB Gain |
| 文件： | 总47页 (文件大小：1116K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
THS7364
www.ti.com
SBOS530 –AUGUST 2010
6-Channel Video Amplifier with 3 SD and 3 Full-HD Filters with 6-dB Gain
Check for Samples: THS7364
1
FEATURES
DESCRIPTION
2345
•
Three SDTV Video Amplifiers for CVBS,
Fabricated using the revolutionary, complementary
Silicon-Germanium (SiGe) BiCom3X process, the
THS7364 is a low-power, single-supply, 2.7-V to 5-V,
six-channel integrated video buffer. It incorporates
three SDTV filters and three Full-HD (also known as
True-HD) HDTV filters. All filters feature bypassable
sixth-order Butterworth characteristics that are useful
as digital-to-analog converter (DAC) reconstruction
filters or as analog-to-digital converter (ADC)
anti-aliasing filters.
S-Video, Y’/P’B/P’R, 480i/576i, Y’U’V’, or G'B'R'
•
Three Full-HD Selectable Filters for Y’/P’B/P’R,
G’B’R’, or Computer RGB
•
Bypassable Sixth-Order Low-Pass Filters:
–
–
Fixed SD Channels: 9.5-MHz
Fixed Full-HD Channels: 72-MHz
•
Versatile Input Biasing:
–
–
DC-Coupled with 300-mV Output Shift
AC-Coupled with Sync-Tip Clamp or Bias
The THS7364 has flexible input coupling capabilities,
and can be configured for either ac- or dc-coupled
inputs. The 300-mV output level shift allows for a full
sync dynamic range at the output with 0-V input.
AC-coupled modes include a transparent sync-tip
clamp for CVBS, Y', and G'B'R' signals. AC-coupled
biasing for C'/P'B/P'R channels can easily be achieved
by adding an external resistor to VS+.
•
•
•
Built-in 6-dB Gain (2 V/V)
+2.7-V to +5-V Single-Supply Operation
Rail-to-Rail Output:
–
Output Swings within 100 mV from the
Rails: Allows AC or DC Output Coupling
–
Supports Driving Two Video Lines/Channel
The THS7364 is an ideal choice for a wide range of
video buffer applications. Its rail-to-rail output stage
with 6-dB gain allows for both ac and dc line driving.
The ability to drive two lines, or 75-Ω loads, allows for
maximum flexibility as a video line driver. The
23.4-mA total quiescent current at 3.3 V and 0.1 mA
(disabled mode) makes it well-suited for systems that
must meet power-sensitive Energy Star® standards.
•
•
•
Low Total Quiescent Current: 23.4 mA at 3.3 V
Disabled Supply Current Function: 0.1 mA
Low Differential Gain/Phase: 0.25%/0.4°
APPLICATIONS
•
•
•
Set Top Box Output Video Buffering
PVR/DVDR Output Buffering
BluRay™ Output Video Buffer
The THS7364 is available in a TSSOP-20 package
that is lead-free and green (RoHS-compliant).
THS7364
CVBS
75 W
CVBS
SD1 OUT
1
2
3
4
5
6
7
8
9
SD1 IN
SD2 IN
SD3 IN
NC
20
19
18
17
16
15
14
13
12
11
S-Video Y' Out
75 W
R
R
R
SD2 OUT
SD3 OUT
75 W
S-Video
Y’
S-Video C' Out
75 W
Disable SD
GND
Disable SD
75 W
+2.7 V to
+5 V
VS+
S-Video
C’
75 W
Disable FHD
FHD1 OUT
FHD2 OUT
FHD3 OUT
Bypass FHD
Disable FHD
NC
Y'/G' Out
75 W
FHD1 IN
FHD2 IN
FHD3 IN
Y'/G'
P'B/B' Out
75 W
R
R
75 W
10 Bypass SD
P'B/B'
P'R/R' Out
75 W
75 W
75 W
Bypass
SD LPF
Bypass
FHD LPF
P'R/R'
R
Figure 1. Single-Supply, DC-Input/DC-Output Coupled Video Line Driver
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
4
5
BluRay is a trademark of Blu-ray Disc Association (BDA).
Energy Star is a registered trademark of Energy Star.
Macrovision is a registered trademark of Macrovision Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
THS7364
SBOS530 –AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)(2)
PRODUCT
THS7364IPW
THS7364IPWR
PACKAGE-LEAD
TRANSPORT MEDIA, QUANTITY
ECO STATUS(2)
Rails, 70
TSSOP-20
Pb-Free, Green
Tape and Reel, 2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at ti.com.
(2) These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that
does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering
processes.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
THS7364
UNIT
MIN
MAX
5.5
Supply voltage, VS+ to GND
V
V
Input voltage, VI
–0.4
VS+
Output current, IO
±90
mA
°C
°C
°C
V
Maximum junction temperature, any condition(2), TJ
Maximum junction temperature, continuous operation, long-term reliability(3), TJ
Storage temperature range, TSTG
Human body model (HBM)
+150
+125
+150
4000
1000
200
–60
ESD rating:
Charge device model (CDM)
Machine model (MM)
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
THERMAL INFORMATION
THS7364
THERMAL METRIC(1)
PW
20 PINS
108.0
41.6
UNITS
qJA
Junction-to-ambient thermal resistance
qJC(top)
qJB
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
61.3
°C/W
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
2.9
yJB
58.4
qJC(bottom)
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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THS7364
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SBOS530 –AUGUST 2010
RECOMMENDED OPERATING CONDITIONS
MIN
2.7
NOM
MAX
5
UNIT
V
Supply voltage, VS+
Ambient temperature, TA
–40
+85
°C
ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
AC PERFORMANCE (SD CHANNELS)
Passband bandwidth
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
–1 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP
6.6
8
8.2
9.5
10
11
MHz
MHz
MHz
V/ms
dB
B
B
B
B
B
B
C
C
C
C
C
C
C
C
A
B
C
C
C
C
C
Small- and large-signal bandwidth
Bypass mode bandwidth
Slew rate
85
150
100
0.2
Bypass mode; VO = 2 VPP
70
With respect to 500 kHz(2), f = 6.75 MHz
With respect to 500 kHz(2), f = 27 MHz
f = 100 kHz
–0.9
42
1.2
Attenuation
54
dB
Group delay
78
ns
Group delay variation
Channel-to-channel delay
Differential gain
f = 5.1 MHz with respect to 100 kHz
11
ns
0.3
ns
NTSC/PAL
NTSC/PAL
0.25/0.35
0.4/0.5
–69
70
%
Differential phase
Degrees
dB
Total harmonic distortion
f = 1 MHz, VO = 1.4 VPP
100 kHz to 6 MHz, non-weighted
100 kHz to 6 MHz, unified weighting
All channels, TA = +25°C
All channels, TA = –40°C to +85°C
f = 6.75 MHz, Filter mode
f = 6.75 MHz, Bypass mode
Disabled
dB
Signal-to-noise ratio
Gain
78
dB
5.7
6
6.3
dB
5.65
6.35
dB
0.9
0.9
Ω
Output impedance
Ω
20 || 3
44
kΩ || pF
dB
Return loss
Crosstalk
f = 6.75 MHz, Filter mode
f = 1 MHz, SD to SD channels
–72
dB
(1) Test levels: (A) 100% tested at +25°C. Over temperature limits set by characterization and simulation. (B) Limits set by characterization
and simulation only. (C) Typical value only for information.
(2) 3.3-V supply filter specifications are ensured by 100% testing at 5-V supply together with design and characterization.
Copyright © 2010, Texas Instruments Incorporated
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SBOS530 –AUGUST 2010
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ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
AC PERFORMANCE (FULL-HD CHANNELS)
Passband bandwidth
Small- and large-signal bandwidth
Bypass mode bandwidth
Slew rate
–1 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP
53
60
60
72
66
83
MHz
MHz
MHz
V/µs
dB
B
B
B
B
B
B
C
C
C
C
C
C
A
B
C
C
C
C
C
C
C
250
400
–0.5
33
350
500
0.6
40
Bypass mode; VO = 2 VPP
With respect to 500 kHz(3), f = 54 MHz
With respect to 500 kHz(3), f = 148 MHz
f = 100 kHz
2
Attenuation
dB
Group delay
12
ns
Group delay variation
Channel-to-channel delay
Total harmonic distortion
f = 54 MHz with respect to 100 kHz
4.5
0.3
–54
60
ns
ns
f = 20 MHz, VO = 1.4 VPP
100 kHz to 60 MHz, non-weighted
Unified weighting
dB
dB
Signal-to-noise ratio
Gain
70
dB
All channels, TA = +25°C
All channels, TA = –40°C to +85°C
f = 60 MHz, Filter mode
5.7
6
6.3
dB
5.65
6.35
dB
9
9
Ω
Output impedance
Return loss
f = 60 MHz, Bypass mode
Disabled
Ω
2 || 3
25
kΩ || pF
dB
f = 60 MHz, Filter mode
f = 25 MHz, FHD to SD channels
f = 25 MHz, SD to FHD channels
f = 25 MHz, FHD to FHD channels
–55
–70
–45
dB
Crosstalk
dB
dB
DC PERFORMANCE
Biased output voltage
Input voltage range
VIN = 0 V, SD channels
VIN = 0 V, FHD channels
DC input, limited by output
VIN = –0.1 V, SD channels
VIN = –0.1 V, FHD channels
200
200
305
300
400
400
mV
mV
A
A
C
A
A
C
–0.1/1.46
200
V
140
280
mA
Sync-tip clamp charge current
400
mA
Input impedance
800 || 2
kΩ || pF
OUTPUT CHARACTERISTICS
RL = 150 Ω to +1.65 V
RL = 150 Ω to GND
3.15
3.1
3.1
3
V
V
C
A
C
C
C
A
C
C
C
C
2.85
High output voltage swing
Low output voltage swing
RL = 75 Ω to +1.65 V
V
RL = 75 Ω to GND
V
RL = 150 Ω to +1.65 V (VIN = –0.2 V)
RL = 150 Ω to GND (VIN = –0.2 V)
RL = 75 Ω to +1.65 V (VIN = –0.2 V)
RL = 75 Ω to GND (VIN = –0.2 V)
RL = 10 Ω to +1.65 V
0.06
0.05
0.1
0.05
80
V
0.12
V
V
V
Output current (sourcing)
Output current (sinking)
mA
mA
RL = 10 Ω to +1.65 V
70
(3) 3.3-V supply filter specifications are ensured by 100% testing at 5-V supply together with design and characterization.
4
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THS7364
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SBOS530 –AUGUST 2010
ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
POWER SUPPLY
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
Operating voltage
2.6
18.8
5.6
3.3
23.4
6.9
5.5
28.5
9
V
B
A
A
A
A
VIN = 0 V, all channels on
mA
mA
mA
mA
VIN = 0 V, SD channels on, FHD channels off
VIN = 0 V, SD channels off, FHD channels on
VIN = 0 V, all channels off, VDISABLE = 3 V
Total quiescent current, no load
13.2
16.5
0.1
19.5
10
Power-supply rejection ratio
(PSRR)
At dc
52
dB
C
LOGIC CHARACTERISTICS(4)
VIH
Disabled or Bypass engaged
Enabled or Bypass disengaged
Applied voltage = 3.3 V
1.6
1.4
0.75
1
V
V
A
A
C
C
C
C
C
VIL
0.6
IIH
mA
mA
ns
ns
ns
IIL
Applied voltage = 0 V
1
Disable time
Enable time
Bypass/filter switch time
200
250
15
(4) The logic input pins default to a logic '0' condition when left floating.
Copyright © 2010, Texas Instruments Incorporated
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ELECTRICAL CHARACTERISTICS: VS+ = +5 V
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
AC PERFORMANCE (SD CHANNELS)
Passband bandwidth
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
–1 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP
6.6
8
8.2
9.5
10.2
11.3
MHz
MHz
MHz
V/ms
dB
B
B
B
B
A
A
C
C
C
C
C
C
C
C
A
B
C
C
C
C
C
Small- and large-signal bandwidth
Bypass mode bandwidth
Slew rate
85
150
100
0.25
54
Bypass mode; VO = 2 VPP
70
With respect to 500 kHz, f = 6.75 MHz
With respect to 500 kHz, f = 27 MHz
f = 100 kHz
–0.9
42
1.2
Attenuation
dB
Group delay
78
ns
Group delay variation
Channel-to-channel delay
Differential gain
f = 5.1 MHz with respect to 100 kHz
11
ns
0.3
ns
NTSC/PAL
NTSC/PAL
0.25/0.35
0.4/0.5
–71
70
%
Differential phase
Degrees
dB
Total harmonic distortion
f = 1 MHz, VO = 1.4 VPP
100 kHz to 6 MHz, non-weighted
100 kHz to 6 MHz, unified weighting
All channels, TA = +25°C
All channels, TA = –40°C to +85°C
f = 6.75 MHz, Filter mode
f = 6.75 MHz, Bypass mode
Disabled
dB
Signal-to-noise ratio
Gain
78
dB
5.7
6
6.3
dB
5.65
6.35
dB
0.9
0.9
Ω
Output impedance
Ω
20 || 3
44
kΩ || pF
dB
Return loss
Crosstalk
f = 6.75 MHz, Filter mode
f = 1 MHz, SD to SD channels
–72
dB
(1) Test levels: (A) 100% tested at +25°C. Over temperature limits set by characterization and simulation. (B) Limits set by characterization
and simulation only. (C) Typical value only for information.
6
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SBOS530 –AUGUST 2010
ELECTRICAL CHARACTERISTICS: VS+ = +5 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
AC PERFORMANCE (FULL-HD CHANNELS)
Passband bandwidth
Small- and large-signal bandwidth
Bypass mode bandwidth
Slew rate
–1 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP and 2 VPP
–3 dB; VO = 0.2 VPP
53
60
60
72
66
83
MHz
MHz
MHz
V/ms
dB
B
B
B
B
A
A
C
C
C
C
C
C
A
B
C
C
C
C
C
C
C
250
400
–0.5
33
350
500
0.4
40
Bypass mode; VO = 2 VPP
With respect to 500 kHz, f = 54 MHz
With respect to 500 kHz, f = 148 MHz
f = 100 kHz
2
Attenuation
dB
Group delay
12
ns
Group delay variation
Channel-to-channel delay
Total harmonic distortion
f = 54 MHz with respect to 100 kHz
4.5
0.3
–50
60
ns
ns
f = 20 MHz, VO = 1.4 VPP
100 kHz to 60 MHz, non-weighted
Unified weighting
dB
dB
Signal-to-noise ratio
Gain
70
dB
All channels, TA = +25°C
All channels, TA = –40°C to +85°C
f = 60 MHz, Filter mode
5.7
6
6.3
dB
5.65
6.35
dB
9
9
Ω
Output impedance
Return loss
f = 60 MHz, Bypass mode
Disabled
Ω
2 || 3
25
kΩ || pF
dB
f = 60 MHz, Filter mode
f = 25 MHz, FHD to SD channels
f = 25 MHz, SD to FHD channels
f = 25 MHz, FHD to FHD channels
–55
–70
–45
dB
Crosstalk
dB
dB
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SBOS530 –AUGUST 2010
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ELECTRICAL CHARACTERISTICS: VS+ = +5 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7364
TEST
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
LEVEL(1)
DC PERFORMANCE
VIN = 0 V, SD channels
VIN = 0 V, FHD channels
DC input, limited by output
VIN = –0.1 V, SD channels
VIN = –0.1 V, FHD channels
200
200
305
300
400
400
mV
mV
A
A
C
A
A
C
Biased output voltage
Input voltage range
–0.1/2.3
200
V
140
280
mA
Sync-tip clamp charge current
400
mA
Input impedance
800 || 2
kΩ || pF
OUTPUT CHARACTERISTICS
RL = 150 Ω to +2.5 V
RL = 150 Ω to GND
4.85
4.75
4.7
V
V
C
A
C
C
C
A
C
C
C
C
4.4
High output voltage swing
Low output voltage swing
RL = 75 Ω to +2.5V
V
RL = 75 Ω to GND
4.5
V
RL = 150 Ω to +2.5 V (VIN = –0.2 V)
RL = 150 Ω to GND (VIN = –0.2 V)
RL = 75 Ω to +2.5 V (VIN = –0.2 V)
RL = 75 Ω to GND (VIN = –0.2 V)
RL = 10 Ω to +2.5 V
0.06
0.05
0.1
V
0.12
V
V
0.05
90
V
Output current (sourcing)
Output current (sinking)
POWER SUPPLY
mA
mA
RL = 10 Ω to +2.5 V
85
Operating voltage
2.6
19.7
6
5
5.5
30.2
9.5
V
B
A
A
A
A
VIN = 0 V, all channels on
24.5
7.2
17.3
1
mA
mA
mA
mA
VIN = 0 V, SD channels on, FHD channels off
VIN = 0 V, SD channels off, FHD channels on
VIN = 0 V, all channels off, VDISABLE = 3 V
Total quiescent current, no load
13.7
20.7
10
Power-supply rejection ratio
(PSRR)
At dc
52
dB
C
LOGIC CHARACTERISTICS(2)
VIH
Disabled or Bypass engaged
Enabled or Bypass disengaged
Applied voltage = 3.3 V
2.1
1.9
1.2
1
V
V
A
A
C
C
C
C
C
VIL
1
IIH
mA
mA
ns
ns
ns
IIL
Applied voltage = 0 V
1
Disable time
Enable time
Bypass/filter switch time
150
200
10
(2) The logic input pins default to a logic '0' condition when left floating.
8
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SBOS530 –AUGUST 2010
PIN CONFIGURATION
PW PACKAGE
TSSOP-20
(TOP VIEW)
SD1 OUT
SD2 OUT
SD3 OUT
Disable SD
GND
SD1 IN
SD2 IN
SD3 IN
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
NC(1)
VS+
Disable FHD
FHD1 OUT
FHD2 OUT
FHD3 OUT
Bypass FHD
NC
FHD1 IN
FHD2 IN
FHD3 IN
Bypass SD 10
(1) NC = No connection.
TERMINAL FUNCTIONS
TERMINAL
NAME
SD1 IN
SD2 IN
SD3 IN
NC
NO.
1
I/O
DESCRIPTION
Standard-definition video input, channel 1; LPF = 9.5 MHz
Standard-definition video input, channel 2; LPF = 9.5 MHz
Standard-definition video input, channel 3; LPF = 9.5 MHz
No internal connection
I
I
2
3
I
4
—
I
VS+
5
Positive power-supply pin; connect to +2.7 V up to +5 V
No internal connection
NC
6
—
I
FHD1 IN
FHD2 IN
FHD3 IN
7
Full high-definition video input, channel 1; LPF = 72 MHz
Full high-definition video input, channel 2; LPF = 72 MHz
Full high-definition video input, channel 3; LPF = 72 MHz
8
I
9
I
Bypass all SD channel filters. Logic high bypasses the internal filters and logic low engages the
internal filters.
Bypass SD
10
11
I
I
Bypass all FHD channel filters. Logic high bypasses the internal filters and logic low engages the
internal filters.
Bypass FHD
FHD3 OUT
FHD2 OUT
FHD1 OUT
12
13
14
O
O
O
Full high-definition video output, channel 3; LPF = 72 MHz
Full high-definition video output, channel 2; LPF = 72 MHz
Full high-definition video output, channel 1; LPF = 72 MHz
Disable full high-definition channels. Logic high disables the FHD channels and logic low enables
the FHD channels.
Disable FHD
GND
15
16
17
I
I
I
Ground pin for all internal circuitry
Disable standard definition channels. Logic high disables the SD channels and logic low enables the
SD channels.
Disable SD
SD3 OUT
SD2 OUT
SD1 OUT
18
19
20
O
O
O
Standard-definition video output, channel 3; LPF = 9.5 MHz
Standard-definition video output, channel 2; LPF = 9.5 MHz
Standard-definition video output, channel 1; LPF = 9.5 MHz
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FUNCTIONAL BLOCK DIAGRAM
+VS
+VS
+VS
gm
Bypass SD
Level
Shift
SD Channel 1
Input
(CVBS)
SD Channel 1
Output
(CVBS)
6 dB
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
800 kW
800 kW
6-Pole
9.5 MHz
gm
Bypass SD
LPF
Level
Shift
SD Channel 2
Input
(S-Video Y)
SD Channel 2
Output
(S-Video Y)
6 dB
Sync-Tip Clamp
(DC Restore)
6-Pole
9.5 MHz
gm
Bypass SD
LPF
Level
Shift
SD Channel 3
Input
(S-Video C)
SD Channel 3
Output
(S-Video C)
6 dB
Sync-Tip Clamp
(DC Restore)
6-Pole
9.5 MHz
Bypass SD
Disable SD
+VS
+VS
+VS
Bypass FHD
Disable FHD
gm
Bypass FHD
LPF
Level
Shift
Full-HD
Channel 1 Input
(Y’)
Full-HD
Channel 1 Output
(Y’)
6 dB
6 dB
6 dB
Sync-Tip Clamp
(DC Restore)
800 kW
800 kW
800 kW
6-Pole
72 MHz
gm
Bypass FHD
LPF
Level
Shift
Full-HD
Channel 2 Input
(P’B)
Full-HD
Channel 2 Output
(P’B)
Sync-Tip Clamp
(DC Restore)
6-Pole
72 MHz
gm
Bypass FHD
LPF
Level
Shift
Full-HD
Channel 3 Input
(P’R)
Full-HD
Channel 3 Output
(P’R)
Sync-Tip Clamp
(DC Restore)
6-Pole
72 MHz
+3 V to +5 V
(1)
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TYPICAL CHARACTERISTICS
Table 1. Table of Graphs: 3.3 V, Standard-Definition (SD) Channels
TITLE
FIGURE
Figure 2, Figure 3, Figure 4, Figure 9,
Figure 10, Figure 19, Figure 20
SD Channels Small-Signal Gain vs Frequency Response
SD Channels Phase vs Frequency Response
SD Channels Group Delay vs Frequency Response
SD Channels Large-Signal Gain vs Frequency Response
SD Channels Bypass Mode Response vs Time
SD Channels Disable Mode Response vs Time
SD Channels Slew Rate vs Output Voltage
Figure 5
Figure 6
Figure 7, Figure 8
Figure 11
Figure 12, Figure 13
Figure 14
SD Channels Large-Signal Pulse Response vs Time
SD Channels Small-Signal Pulse Response vs Time
SD Channels THD vs Frequency
Figure 15, Figure 16
Figure 17, Figure 18
Figure 21, Figure 22
Table 2. Table of Graphs: 3.3 V, Full High-Definition (FHD) Channels
TITLE
FIGURE
Figure 23, Figure 24, Figure 29, Figure 30,
Figure 35, Figure 36
FHD Channels Small-Signal Gain vs Frequency Response
FHD Channels Phase vs Frequency Response
FHD Channels Group Delay vs Frequency Response
FHD Channels Large-Signal Gain vs Frequency Response
FHD Channels Slew Rate vs Output Voltage
FHD Channels Bypass Mode Response vs Time
FHD Channels Disable Mode Response vs Time
FHD Channels THD vs Frequency
Figure 25
Figure 26
Figure 27, Figure 28
Figure 31
Figure 32
Figure 33, Figure 34
Figure 37, Figure 38
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Table 3. Table of Graphs: 5 V, Standard-Definition (SD) Channels
TITLE
FIGURE
Figure 39, Figure 40, Figure 41, Figure 46,
Figure 47, Figure 56, Figure 57
SD Channels Small-Signal Gain vs Frequency Response
SD Channels Phase vs Frequency Response
SD Channels Group Delay vs Frequency Response
SD Channels Large-Signal Gain vs Frequency Response
SD Channels Bypass Mode Response vs Time
SD Channels Disable Mode Response vs Time
SD Channels Slew Rate vs Output Voltage
Figure 42
Figure 43
Figure 44, Figure 45
Figure 48
Figure 49, Figure 50
Figure 51
SD Channels Large-Signal Pulse Response vs Time
SD Channels Small-Signal Pulse Response vs Time
SD Channels THD vs Frequency
Figure 52, Figure 53
Figure 54, Figure 55
Figure 58, Figure 59
Table 4. Table of Graphs: 5 V, Full High-Definition (FHD) Channels
TITLE
FHD Channels Small-Signal Gain vs Frequency Response
FHD Channels Phase vs Frequency Response
FHD Channels Group Delay vs Frequency Response
FHD Channels Large-Signal Gain vs Frequency Response
FHD Channels Small-Signal Gain vs Frequency Response
FHD Channels Slew Rate vs Output Voltage
FIGURE
Figure 60, Figure 61
Figure 62
Figure 63
Figure 64, Figure 65
Figure 66, Figure 67, Figure 72, Figure 73
Figure 68
FHD Channels Bypass Mode Response vs Time
FHD Channels Disable Mode Response vs Time
FHD Channels THD vs Frequency
Figure 69
Figure 70, Figure 71
Figure 74, Figure 75
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
RESPONSE
10
0
6.5
6
5.5
5
Filter Mode
RL = 150 W
RL = 75 W
-10
-20
-30
-40
-50
-60
Filter Mode
RL = 150 W
RL = 75 W
Bypass Mode
RL = 75 W
4.5
4
RL = 150 W
VS+ = 3.3 V
VS+ = 3.3 V
3.5
3
Load = RL || 10 pF
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
2.5
100 k
1 M
10 M
100 M
1 G
100 k
1 M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 2.
Figure 3.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS PHASE vs FREQUENCY RESPONSE
6.5
45
VS+ = 3.3 V
0
-45
6
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
5.5
Bypass Mode
-90
5
RL = 150 W
-135
-180
-225
-270
-315
-360
RL = 75 W
4.5
Filter Mode
RL = 150 W
RL = 75 W
4
VS+ = 3.3 V
3.5
Bypass Mode
RL = 75 W
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
3
RL = 150 W
2.5
1 M
10 M
100 M
1 G
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 4.
Figure 5.
SD CHANNELS GROUP DELAY vs FREQUENCY
RESPONSE
SD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
130
120
10
VS+ = 3.3 V
Filter Mode
0
Load = RL || 10 pF
DC-Coupled Output
110 VO = 200 mVPP
VO = 0.2 VPP
-10
VO = 2 VPP
Bypass Mode
VO = 2 VPP
100
-20
-30
-40
-50
-60
VO = 1 VPP
90
VO = 0.2 VPP
Filter Mode
80
VS+ = 3.3 V
RL = 150 W
RL = 75 W
70
Load = 150 W || 10 pF
DC-Coupled Output
60
100 k
1 M
10 M
100 M
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 6.
Figure 7.
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
6.5
10
VS+ = 3.3 V
6
5.5
5
Load = 150 W || 10 pF
0
Filter Mode
DC-Coupled Output
DC-Coupled Output
AC-Coupled Output
Bypass Mode
-10
-20
-30
-40
-50
-60
AC-Coupled Output
DC-Coupled Output
Filter Mode
4.5
4
VO = 0.2 VPP
VO = 2 VPP
VS+ = 3.3 V
Bypass Mode
VO = 2 VPP
3.5
3
Load = 150 W || 10 pF
AC- vs DC-Coupled Output
VO = 0.2 VPP
VO = 1 VPP
VO = 0.2 VPP
2.5
1 M
10 M
100 M
1 G
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 8.
Figure 9.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS BYPASS MODE RESPONSE vs TIME
1.3
1.1
0.9
0.7
0.5
0.3
0.1
-0.1
4
7
VS+ = 3.3 V, Load = 150 W || 10 pF, VO = 0.2 VPP
6.5
2
AC- vs DC-Coupled Output
VBYPASS
6
VS+ = 3.3 V
0
fIN = 10 MHz
5.5
-2
5
Filter Mode
-4
-6
4.5
DC-Coupled Output
4
3.5
3
AC-Coupled Output
Bypass Mode
-8
AC-Coupled Output
DC-Coupled Output
VOUT
-10
1200
2.5
100 k
0
200
400
600
800
1000
1 M
10 M
100 M
1 G
Time (ns)
Frequency (Hz)
Figure 10.
Figure 11.
SD CHANNELS DISABLE MODE RESPONSE vs TIME
SD CHANNELS DISABLE MODE RESPONSE vs TIME
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
6
4
2
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2
VDISABLE
0
VDISABLE
VS+ = 3.3 V
0
Bypass Mode
-2
VS+ = 3.3 V
-2
-4
Filter Mode
-4
-6
-6
VOUT
-8
-8
VOUT
-10
-12
-14
-10
-12
-14
-0.3
-0.6
-0.3
0
100 200 300 400 500 600 700 800 900
Time (ns)
0
100
200
300
400
Time (ns)
500
600
700
800
Figure 12.
Figure 13.
14
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS LARGE-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SLEW RATE vs OUTPUT VOLTAGE
4.6
3.6
1.65
120
Bypass Mode
Negative Slew Rate
Positive Slew Rate
Input Voltage
0.65
100
80
60
40
20
0
Waveform
Input tR/tF = 1 ns
2.6
-0.35
-1.35
-2.35
-3.35
Output Voltage
Waveform
VS+ = 3.3 V
Bypass Mode
1.6
VS+ = 3.3 V
DC-Coupled Output
0.6
Filter Mode
Positive and Negative Slew Rate
-0.4
0
100 200 300 400 500 600 700 800 900 1000
0.5
1
1.5
2
2.5
Time (ns)
Output Voltage (VPP
)
Figure 14.
Figure 15.
SD CHANNELS LARGE-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SMALL-SIGNAL PULSE RESPONSE vs
TIME
4.6
3.6
1.65
2
1.9
1.8
1.7
1.6
1.5
1.4
0.75
Input tR/tF = 1 ns
Input tR/tF = 120 ns
0.65
0.55
0.45
0.35
0.25
0.15
Input Voltage
Waveform
0.65
Input Waveforms
Input tR/tF = 1 ns
2.6
-0.35
-1.35
-2.35
-3.35
Input tR/tF = 120 ns
Input tR/tF = 1 ns
1.6
VS+ = 3.3 V
Bypass Mode
Output Voltage
Waveform
0.6
VS+ = 3.3 V
Filter Mode
Output Waveforms
-0.4
0
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Time (ns)
Time (ns)
Figure 16.
Figure 17.
SD CHANNELS SMALL-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
2
1.9
1.8
1.7
1.6
1.5
1.4
0.75
10
Input tR/tF = 1 ns
Input tR/tF = 120 ns
0
0.65
Input Waveforms
-10
-20
0.55
CL = 5 pF
VS+ = 3.3 V
0.45
Filter Mode
-30
-40
-50
-60
Input tR/tF = 120 ns
Input tR/tF = 1 ns
VS+ = 3.3 V
CL = 18 pF
CL = 10 pF
0.35
Bypass Mode
Load = 150 W || CL
0.25
DC-Coupled Output
VO = 200 mVPP
Output Waveforms
0.15
100 200 300 400 500 600 700 800 900 1000
0
10 M
100 M
1 G
Time (ns)
Frequency (Hz)
Figure 18.
Figure 19.
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS THD vs FREQUENCY
10
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
0
VO = 1.4 VPP
VO = 2 VPP
-10
-20
-30
-40
-50
-60
VO = 2.5 VPP
CL = 10 pF
CL = 18 pF
VS+ = 3.3 V
Filter Mode
Load = 150 W || CL
VS+ = 3.3 V
Bypass Mode
DC-Coupled Output
DC-Coupled Output
VO = 200 mVPP
CL = 5 pF
100 M
1 M
10 M
Frequency (Hz)
1 G
1
10
60
Frequency (MHz)
Figure 20.
Figure 21.
SD CHANNELS THD vs FREQUENCY
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 2.5 VPP
VS+ = 3.3 V
Filter Mode
DC-Coupled Output
1
7
Frequency (MHz)
Figure 22.
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TYPICAL CHARACTERISTICS: 3.3 V, Full HD (FHD) Channels
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
6
Filter Mode
RL = 150 W
RL = 75 W
0
Filter Mode
5.5
5
RL = 150 W
RL = 75 W
-10
-20
-30
-40
-50
-60
Bypass Mode
RL = 75 W
Bypass Mode
RL = 75 W
4.5
4
RL = 150 W
RL = 150 W
VS+ = 3.3 V
VS+ = 3.3 V
3.5
3
Load = RL || 5 pF
Load = RL || 5 pF
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
2.5
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 23.
Figure 24.
FHD CHANNELS GROUP DELAY vs FREQUENCY
RESPONSE
FHD CHANNELS PHASE vs FREQUENCY RESPONSE
20
18
16
14
12
10
8
45
VS+ = 3.3 V
0
Load = RL || 5 pF
Filter Mode
DC-Coupled Output
VO = 200 mVPP
-45
-90
RL = 150 W
RL = 75 W
-135
-180
-225
-270
-315
-360
Filter Mode
RL = 150 W
RL = 75 W
VS+ = 3.3 V
Bypass Mode
RL = 75 W
Load = RL || 5 pF
DC-Coupled Output
VO = 200 mVPP
RL = 150 W
6
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 25.
Figure 26.
FHD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
VS+ = 3.3 V
Filter Mode
0
6
5.5
5
Load = 150 W || 5 pF
DC-Coupled Output
VO = 0.2 VPP
-10
-20
-30
-40
-50
-60
VO = 2 VPP
Bypass Mode
VO = 2 VPP
Filter Mode
VO = 0.2 VPP
VO = 2 VPP
4.5
4
VO = 1 VPP
VO = 0.2 VPP
Bypass Mode
VO = 2 VPP
3.5
3
VS+ = 3.3 V
VO = 1 VPP
Load = 150 W || 5 pF
VO = 0.2 VPP
DC-Coupled Output
2.5
10 M
100 M
1 G
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 27.
Figure 28.
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TYPICAL CHARACTERISTICS: 3.3 V, Full HD (FHD) Channels (continued)
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
VS+ = 3.3 V, Load = RL || 5 pF, VO = 200 mVPP
6
0
-10
-20
-30
-40
-50
-60
Filter Mode
AC- vs DC-Coupled Output
DC-Coupled Output
AC-Coupled Output
Bypass Mode
5.5
5
AC-Coupled Output
DC-Coupled Output
4.5
4
Filter Mode
DC-Coupled Output
AC-Coupled Output
Bypass Mode
VS+ = 3.3 V
3.5
3
Load = 150 W || 5 pF
AC- vs DC-Coupled Output
VO = 0.2 VPP
AC-Coupled Output
DC-Coupled Output
2.5
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 29.
FHD CHANNELS SLEW RATE vs OUTPUT VOLTAGE
Figure 30.
FHD CHANNELS BYPASS MODE RESPONSE vs TIME
1.3
1.1
0.9
0.7
0.5
0.3
0.1
-0.1
4
600
Positive Slew Rate
Negative Slew Rate
2
500
400
300
200
100
0
VBYPASS
Bypass Mode
VS+ = 3.3 V
0
fIN = 80 MHz
-2
VS+ = 3.3 V
DC-Coupled Output
-4
-6
VOUT
-8
Filter Mode
Positive and Negative Slew Rate
-10
0
40
80
120
Time (ns)
160
200
0.5
1
1.5
2
2.5
Output Voltage (VPP
)
Figure 31.
Figure 32.
FHD CHANNELS DISABLE MODE RESPONSE vs TIME
FHD CHANNELS DISABLE MODE RESPONSE vs TIME
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2
2
VDISABLE
VDISABLE
0
0
-2
-2
VS+ = 3.3 V
VS+ = 3.3 V
-4
-4
Bypass Mode
Filter Mode
-6
-8
-6
-8
-10
-10
VOUT
VOUT
-12
-14
-12
-14
-0.3
-0.3
0
100 200 300 400 500 600 700 800 900
Time (ns)
0
100 200 300 400 500 600 700 800 900
Time (ns)
Figure 33.
Figure 34.
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TYPICAL CHARACTERISTICS: 3.3 V, Full HD (FHD) Channels (continued)
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
20
10
CL = 18 pF
CL = 10 pF
10
0
0
-10
CL = 5 pF
CL = 10 pF
-10
-20
-30
-40
-50
-60
-20
CL = 18 pF
-30
VS+ = 3.3 V
VS+ = 3.3 V
-40
Bypass Mode
Load = 150 W || CL
Filter Mode
Load = 150 W || CL
-50
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
CL = 5 pF
100 M
-60
10 M
10 M
100 M
1 G
1 G
Frequency (Hz)
Frequency (Hz)
Figure 35.
Figure 36.
FHD CHANNELS THD vs FREQUENCY
FHD CHANNELS THD vs FREQUENCY
-30
-40
-50
-60
-70
-80
-90
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
VO = 2 VPP
VO = 0.5 VPP
VO = 1 VPP
VO = 2.5 VPP
VO = 1.4 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 2.5 VPP
VS+ = 3.3 V
VS+ = 3.3 V
Bypass Mode
DC-Coupled Output
Filter Mode
DC-Coupled Output
1
10
60
1
10
60
Frequency (MHz)
Frequency (MHz)
Figure 37.
Figure 38.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
6
5.5
5
Filter Mode
RL = 150 W
RL = 75 W
0
-10
-20
-30
-40
-50
-60
Filter Mode
RL = 150 W
RL = 75 W
Bypass Mode
RL = 75 W
4.5
4
RL = 150 W
VS+ = 5 V
VS+ = 5 V
3.5
3
Load = RL || 10 pF
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
2.5
100 k
1 M
10 M
100 M
1 G
100 k
1 M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 39.
Figure 40.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS PHASE vs FREQUENCY RESPONSE
6.5
45
VS+ = 5 V
0
-45
6
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
5.5
Bypass Mode
-90
5
RL = 150 W
-135
-180
-225
-270
-315
-360
RL = 75 W
4.5
4
Filter Mode
RL = 150 W
RL = 75 W
VS+ = 5 V
3.5
3
Bypass Mode
RL = 75 W
Load = RL || 10 pF
DC-Coupled Output
VO = 200 mVPP
RL = 150 W
2.5
1 M
10 M
100 M
1 G
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 41.
Figure 42.
SD CHANNELS GROUP DELAY vs FREQUENCY
RESPONSE
SD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
20
10
VS+ = 5 V
18 Load = RL || 10 pF
0
-10
-20
-30
-40
-50
-60
Filter Mode
VO = 0.2 VPP
VO = 2 VPP
DC-Coupled Output
VO = 200 mVPP
16
14
12
10
8
Bypass Mode
VO = 2 VPP
VO = 1 VPP
Filter Mode
VO = 0.2 VPP
VS+ = 5 V
RL = 150 W
RL = 75 W
Load = 150 W || 10 pF
DC-Coupled Output
6
100 k
1 M
10 M
100 M
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 43.
Figure 44.
20
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
6.5
10
VS+ = 5 V
6
5.5
5
Load = 150 W || 10 pF
0
-10
-20
-30
-40
-50
-60
Filter Mode
DC-Coupled Output
DC-Coupled Output
AC-Coupled Output
Bypass Mode
AC-Coupled Output
DC-Coupled Output
Filter Mode
4.5
4
VO = 0.2 VPP
VO = 2 VPP
VS+ = 5 V
Bypass Mode
VO = 2 VPP
3.5
3
Load = 150 W || 10 pF
AC- vs DC-Coupled Output
VO = 0.2 VPP
VO = 1 VPP
VO = 0.2 VPP
2.5
1 M
10 M
100 M
1 G
100 k
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 45.
Figure 46.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS BYPASS MODE RESPONSE vs TIME
1.3
1.1
0.9
0.7
0.5
0.3
0.1
-0.1
4
7
VS+ = 5 V, Load = 150 W || 10 pF, VO = 0.2 VPP
6.5
AC- vs DC-Coupled Output
2
VBYPASS
6
5.5
5
VS+ = 5 V
0
fIN = 10 MHz
-2
Filter Mode
-4
-6
4.5
4
DC-Coupled Output
AC-Coupled Output
Bypass Mode
3.5
3
-8
AC-Coupled Output
DC-Coupled Output
VOUT
-10
1200
2.5
100 k
0
200
400
600
800
1000
1 M
10 M
100 M
1 G
Time (ns)
Frequency (Hz)
Figure 47.
Figure 48.
SD CHANNELS DISABLE MODE RESPONSE vs TIME
SD CHANNELS DISABLE MODE RESPONSE vs TIME
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2
2
VDISABLE
VDISABLE
0
0
-2
-2
VS+ = 5 V
VS+ = 5 V
-4
-4
Bypass Mode
Filter Mode
-6
-6
-8
-8
VOUT
VOUT
-10
-12
-14
-10
-12
-14
-0.3
-0.3
0
100 200 300 400 500 600 700 800 900
Time (ns)
0
100
200
300
400
500
600
700
800
Time (ns)
Figure 49.
Figure 50.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS LARGE-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SLEW RATE vs OUTPUT VOLTAGE
4.6
3.6
1.65
120
Bypass Mode
Negative Slew Rate
Positive Slew Rate
Input Voltage
Waveform
100
80
60
40
20
0
0.65
Input tR/tF = 1 ns
2.6
-0.35
Output Voltage
Waveform
VS+ = 5 V
VS+ = 5 V
DC-Coupled Output
1.6
-1.35
-2.35
-3.35
BypassMode
0.6
Filter Mode
Positive and Negative Slew Rate
-0.4
0
100 200 300 400 500 600 700 800 900 1000
0.5
1
1.5
2
2.5
Time (ns)
Output Voltage (VPP
)
Figure 51.
Figure 52.
SD CHANNELS LARGE-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SMALL-SIGNAL PULSE RESPONSE vs
TIME
4.6
3.6
1.65
2
1.9
1.8
1.7
1.6
1.5
1.4
0.75
Input tR/tF = 1 ns
Input tR/tF = 120 ns
0.65
0.55
0.45
0.35
0.25
0.15
Input Voltage
Waveform
0.65
Input Waveforms
Input tR/tF = 1 ns
2.6
-0.35
-1.35
-2.35
-3.35
Input tR/tF = 120 ns
Input tR/tF = 1 ns
1.6
VS+ = 5 V
Bypass Mode
Output Voltage
Waveform
0.6
VS+ = 5 V
Output Waveforms
Filter Mode
-0.4
0
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Time (ns)
Time (ns)
Figure 53.
Figure 54.
SD CHANNELS SMALL-SIGNAL PULSE RESPONSE vs
TIME
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
2
1.9
1.8
1.7
1.6
1.5
1.4
0.75
10
Input tR/tF = 1 ns
Input tR/tF = 120 ns
0
0.65
Input Waveforms
-10
-20
0.55
CL = 5 pF
VS+ = 5 V
0.45
Filter Mode
-30
-40
-50
-60
Input tR/tF = 120 ns
Input tR/tF = 1 ns
VS+ = 5 V
CL = 18 pF
CL = 10 pF
0.35
Bypass Mode
Load = 150 W || CL
0.25
DC-Coupled Output
VO = 200 mVPP
Output Waveforms
0.15
100 200 300 400 500 600 700 800 900 1000
0
10 M
100 M
1 G
Time (ns)
Frequency (Hz)
Figure 55.
Figure 56.
22
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
SD CHANNELS THD vs FREQUENCY
10
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 3 VPP
0
-10
-20
-30
-40
-50
-60
CL = 10 pF
CL = 18 pF
VS+ = 5 V
Filter Mode
Load = 150 W || CL
VS+ = 5 V
Bypass Mode
DC-Coupled Output
DC-Coupled Output
VO = 200 mVPP
CL = 5 pF
100 M
1 M
10 M
Frequency (Hz)
1 G
1
10
60
Frequency (MHz)
Figure 57.
Figure 58.
SD CHANNELS THD vs FREQUENCY
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 3 VPP
VS+ = 5 V
Filter Mode
DC-Coupled Output
1
7
Frequency (MHz)
Figure 59.
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TYPICAL CHARACTERISTICS: 5 V, Full HD (FHD) Channels
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
6
Filter Mode
RL = 150 W
RL = 75 W
0
Filter Mode
5.5
5
RL = 150 W
RL = 75 W
-10
-20
-30
-40
-50
-60
Bypass Mode
RL = 75 W
Bypass Mode
RL = 75 W
4.5
4
RL = 150 W
RL = 150 W
VS+ = 5 V
VS+ = 5 V
3.5
3
Load = RL || 5 pF
Load = RL || 5 pF
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
2.5
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 60.
Figure 61.
FHD CHANNELS GROUP DELAY vs FREQUENCY
RESPONSE
FHD CHANNELS PHASE vs FREQUENCY RESPONSE
20
18
16
14
12
10
8
45
VS+ = 5 V
0
Load = RL || 5 pF
Filter Mode
DC-Coupled Output
VO = 200 mVPP
-45
-90
RL = 150 W
RL = 75 W
-135
-180
-225
-270
-315
-360
Filter Mode
RL = 150 W
RL = 75 W
VS+ = 5 V
Bypass Mode
RL = 75 W
Load = RL || 5 pF
DC-Coupled Output
VO = 200 mVPP
RL = 150 W
6
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 62.
Figure 63.
FHD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS LARGE-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
6.5
VS+ = 5 V
6
5.5
5
Load = 150 W || 5 pF
0
-10
-20
-30
-40
-50
-60
Filter Mode
VO = 0.2 VPP
VO = 2 VPP
DC-Coupled Output
Bypass Mode
VO = 2 VPP
Filter Mode
VO = 0.2 VPP
VO = 2 VPP
4.5
4
VO = 1 VPP
VO = 0.2 VPP
Bypass Mode
VO = 2 VPP
3.5
3
VS+ = 5 V
VO = 1 VPP
Load = 150 W || 5 pF
VO = 0.2 VPP
DC-Coupled Output
2.5
10 M
100 M
1 G
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 64.
Figure 65.
24
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TYPICAL CHARACTERISTICS: 5 V, Full HD (FHD) Channels (continued)
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
10
7
VS+ = 5 V, Load = 150 W || 5 pF, VO = 0.2 VPP
6.5
AC- vs DC-Coupled Output
0
-10
-20
-30
-40
-50
-60
Filter Mode
DC-Coupled Output
AC-Coupled Output
Bypass Mode
6
5.5
5
AC-Coupled Output
DC-Coupled Output
Filter Mode
4.5
DC-Coupled Output
4
3.5
3
AC-Coupled Output
Bypass Mode
VS+ = 5 V
Load = 150 W || 5 pF
AC- vs DC-Coupled Output
VO = 0.2 VPP
AC-Coupled Output
DC-Coupled Output
2.5
1 M
10 M
100 M
1 G
1 M
10 M
100 M
1 G
Frequency (Hz)
Frequency (Hz)
Figure 66.
FHD CHANNELS SLEW RATE vs OUTPUT VOLTAGE
Figure 67.
FHD CHANNELS BYPASS MODE RESPONSE vs TIME
1.3
1.1
0.9
0.7
0.5
0.3
0.1
-0.1
4
600
Positive Slew Rate
Negative Slew Rate
2
500
400
300
200
100
0
VBYPASS
Bypass Mode
VS+ = 5 V
0
fIN = 80 MHz
-2
VS+ = 5 V
DC-Coupled Output
-4
-6
VOUT
-8
Filter Mode
Positive and Negative Slew Rate
-10
0
40
80
120
Time (ns)
160
200
0.5
1
1.5
2
2.5
Output Voltage (VPP
)
Figure 68.
Figure 69.
FHD CHANNELS DISABLE MODE RESPONSE vs TIME
FHD CHANNELS DISABLE MODE RESPONSE vs TIME
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
4
2
2
VDISABLE
VDISABLE
0
0
-2
-2
VS+ = 5 V
VS+ = 5 V
-4
-4
Bypass Mode
Filter Mode
-6
-8
-6
-8
-10
-10
VOUT
VOUT
-12
-14
-12
-14
-0.3
-0.3
0
100 200 300 400 500 600 700 800 900
Time (ns)
0
100 200 300 400 500 600 700 800 900
Time (ns)
Figure 70.
Figure 71.
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TYPICAL CHARACTERISTICS: 5 V, Full HD (FHD) Channels (continued)
With load = 150 Ω || 5 pF, dc-coupled input and output, unless otherwise noted.
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
FHD CHANNELS SMALL-SIGNAL GAIN vs FREQUENCY
RESPONSE
20
10
CL = 18 pF
CL = 10 pF
10
0
0
-10
CL = 5 pF
CL = 10 pF
-10
-20
-30
-40
-50
-60
-20
CL = 18 pF
-30
VS+ = 5 V
VS+ = 5 V
-40
Bypass Mode
Load = 150 W || CL
Filter Mode
Load = 150 W || CL
-50
DC-Coupled Output
VO = 200 mVPP
DC-Coupled Output
VO = 200 mVPP
CL = 5 pF
100 M
-60
10 M
10 M
100 M
1 G
1 G
Frequency (Hz)
Frequency (Hz)
Figure 72.
Figure 73.
FHD CHANNELS THD vs FREQUENCY
FHD CHANNELS THD vs FREQUENCY
-30
-40
-50
-60
-70
-80
-90
-30
-40
-50
-60
-70
-80
-90
VO = 0.5 VPP
VO = 1 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 3 VPP
VO = 0.5 VPP
VO = 1 VPP
VO = 1.4 VPP
VO = 2 VPP
VO = 3 VPP
VS+ = 5 V
Bypass Mode
DC-Coupled Output
VS+ = 5 V
Filter Mode
DC-Coupled Output
1
10
60
1
10
60
Frequency (MHz)
Frequency (MHz)
Figure 74.
Figure 75.
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APPLICATION INFORMATION
coefficient capacitors. The design of the THS7364
allows operation down to 2.6 V, but it is
recommended to use at least a 3-V supply to ensure
that no issues arise with headroom or clipping with
100% color-saturated CVBS signals. If only 75% color
saturated CVBS is supported, then the output voltage
requirements are reduced to 2 VPP on the output,
allowing a 2.7-V supply to be utilized without issues.
The THS7364 is targeted for six-channel video output
applications that require three standard-definition
(SD) video output buffers and three full-high definition
(FHD) video output buffers. Although it can be used
for numerous other applications, the needs and
requirements of the video signal are the most
important design parameters of the THS7364. Built
on the revolutionary, complementary Silicon
Germanium (SiGe) BiCom3X process, the THS7364
incorporates many features not typically found in
integrated video parts while consuming very low
power. The THS7364 includes the following features:
A 0.1-mF to 0.01-mF capacitor should be placed as
close as possible to the power-supply pins. Failure to
do so may result in the THS7364 outputs ringing or
oscillating. Additionally, a large capacitor (such as
22 mF to 100 mF) should be placed on the
power-supply line to minimize interference with
50-/60-Hz line frequencies.
•
•
•
Single-supply 2.7-V to 5-V operation with low total
quiescent current of 23.4 mA at 3.3 V and
24.5 mA at 5 V
Disable mode allows for shutting down individual
SD/FHD blocks of amplifiers to save system
power in power-sensitive applications
INPUT VOLTAGE
The THS7364 input range allows for an input signal
range from –0.2 V to approximately (VS+ – 1.5 V).
However, because of the internal fixed gain of 2 V/V
(+6 dB) and the internal input level shift of 150 mV
(typical), the output is generally the limiting factor for
the allowable linear input range. For example, with a
5-V supply, the linear input range is from –0.2 V to
3.5 V. However, because of the gain and level shift,
the linear output range limits the allowable linear
input range to approximately –0.1 V to 2.3 V.
Input configuration accepting dc + level shift, ac
sync-tip clamp, or ac-bias
–
AC-biasing is allowed with the use of external
pull-up resistors to the positive power supply
•
Sixth-order, low-pass filter for DAC reconstruction
or ADC image rejection:
–
9.5 MHz for NTSC, PAL, SECAM, composite
video (CVBS), S-Video Y’/C’, 480i/576i,
Y’/P’B/P’R, and G’B’R’ (R’G’B’) signals
–
72-MHz for 1080p60 Y’/P’ B/P’R or G’B’R’
signals; also allows up to QXGA (1600 × 1200
at 60 Hz) R'G'B' video in filter bypass mode
INPUT OVERVOLTAGE PROTECTION
The THS7364 is built using a very high-speed,
complementary, bipolar, and CMOS process. The
internal junction breakdown voltages are relatively
low for these very small geometry devices. These
breakdowns are reflected in the Absolute Maximum
Ratings table. All input and output device pins are
protected with internal ESD protection diodes to the
power supplies, as shown in Figure 76.
•
Individually-controlled Bypass mode bypasses the
low-pass filters for each SD/FHD block of
amplifiers
–
SD bypass mode features 150-MHz and
100-V/ms performance
FHD bypass mode features 350-MHz and
500-V/ms performance
–
•
•
•
Individually-controlled Disable mode shuts down
all amplifiers in each SD/FHD block to reduce
quiescent current to 0.1 mA
Internally-fixed gain of 2-V/V (+6-dB) buffer that
can drive two video lines with dc-coupling or
traditional ac-coupling
Flow-through configuration using a TSSOP-20
package that complies with the latest lead-free
(RoHS-compatible) and green manufacturing
requirements
+VS
External
Internal
Input/Output
Circuitry
Pin
Figure 76. Internal ESD Protection
OPERATING VOLTAGE
These diodes provide moderate protection to input
overdrive voltages above and below the supplies as
well. The protection diodes can typically support
30 mA of continuous current when overdriven.
The THS7364 is designed to operate from 2.7 V to
5 V over the –40°C to +85°C temperature range. The
impact on performance over the entire temperature
range is negligible as a result of the implementation
of thin film resistors and high-quality, low-temperature
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TYPICAL CONFIGURATION AND VIDEO
TERMINOLOGY
the definition of luminance as stipulated by the
International Commission on Illumination (CIE). Video
departs from true luminance because a nonlinear
term, gamma, is added to the true RGB signals to
form R’G’B’ signals. These R’G’B’ signals are then
used to mathematically create luma (Y’). Thus,
A typical application circuit using the THS7364 as a
video buffer is shown in Figure 77. It shows a DAC or
encoder driving the input channels of the THS7364.
One channel is a CVBS connection while two other
channels are for the S-Video Y’/C’ signals of an SD
video system. These signals can be NTSC, PAL, or
SECAM signals. The other three channels are the
component video Y’/P’B/P’R (sometimes labeled
Y’U’V’ or incorrectly labeled Y’/C’B/C’R) signals. These
signals are typically 480i, 576i, 480p, 576p, 720p,
1080i, or up to 1080p60 signals. Because the filters
can be bypassed, other formats such as R'G'B' video
up to QXGA or UWXGA can also be supported with
the THS7364.
luminance (Y) is not maintained, providing
difference in terminology.
a
This rationale is also used for the chroma (C’) term.
Chroma is derived from the nonlinear R’G’B’ terms
and, thus, it is nonlinear. Chominance (C) is derived
from linear RGB, giving the difference between
chroma (C’) and chrominance (C). The color
difference signals (P’B/P’R/U’/V’) are also referenced
in this manner to denote the nonlinear (gamma
corrected) signals.
Note that the Y’ term is used for the luma channels
throughout this document rather than the more
common luminance (Y) term. This usage accounts for
THS7364
CVBS
75 W
SD1 OUT
CVBS
S-Video Y’
S-Video C’
Y'/G'
1
2
3
4
5
6
7
8
9
SD1 IN
SD2 IN
SD3 IN
NC
20
19
18
17
16
15
14
13
12
11
75 W
75 W
75 W
R
R
R
R
R
R
SD2 OUT
SD3 OUT
S-Video Y' Out
75 W
Disable SD
GND
Disable SD
+2.7 V to
+5 V
VS+
S-Video C' Out
Disable FHD
FHD1 OUT
FHD2 OUT
FHD3 OUT
Bypass FHD
Disable FHD
NC
75 W
FHD1 IN
FHD2 IN
FHD3 IN
Y'/G' Out
75 W
10 Bypass SD
75 W
75 W
75 W
P'B/B' Out
Bypass
SD LPF
Bypass
FHD LPF
P'B/B'
75 W
P'R/R' Out
P'R/R'
75 W
(1) Figure 77. Typical Six-Channel System Inputs from DC-Coupled Encoder/DAC with DC-Coupled Line
Driving
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R’G’B’ (commonly mislabeled RGB) is also called
G’B’R’ (again commonly mislabeled as GBR) in
professional video systems. The Society of Motion
Other AGC circuits use the chroma burst amplitude
for amplitude control; reduction in the sync signals
does not alter the proper gain setting. However, it is
good engineering design practice to ensure that
saturation/clipping does not take place. Transistors
always take a finite amount of time to come out of
saturation. This saturation could possibly result in
timing delays or other aberrations on the signals.
Picture
and
Television
Engineers
(SMPTE)
component standard stipulates that the luma
information is placed on the first channel, the blue
color difference is placed on the second channel, and
the red color difference signal is placed on the third
channel. This practice is consistent with the Y'/P'B/P'R
nomenclature. Because the luma channel (Y') carries
the sync information and the green channel (G') also
carries the sync information, it makes logical sense
that G' be placed first in the system. Because the
blue color difference channel (P'B) is next and the red
color difference channel (P'R) is last, then it also
makes logical sense to place the B' signal on the
second channel and the R' signal on the third
channel, respectfully. Thus, hardware compatibility is
better achieved when using G'B'R' rather than R'G'B'.
Note that for many G'B'R' systems, sync is embedded
on all three channels, but this configuration may not
always be the case in all systems.
To eliminate saturation or clipping problems, the
THS7364 has a 150-mV input level shift feature. This
feature takes the input voltage and adds an internal
+150-mV shift to the signal. Because the THS7364
also has a gain of 6 dB (2 V/V), the resulting output
with a 0-V applied input signal is approximately 300
mV. The THS7364 rail-to-rail output stage can create
this output level while connected to a typical video
load. This configuration ensures that no saturation or
clipping of the sync signals occur. This shift is
constant, regardless of the input signal. For example,
if a 1-V input is applied, the output is 2.3 V.
Because the internal gain is fixed at +6 dB, the gain
dictates what the allowable linear input voltage range
can be without clipping concerns. For example, if the
power supply is set to 3 V, the maximum output is
approximately 2.9 V while driving a significant amount
of current. Thus, to avoid clipping, the allowable input
is ([2.9 V/2] – 0.15 V) = 1.3 V. This range is valid for
up to the maximum recommended 5-V power supply
that allows approximately a ([4.9 V/2] – 0.15 V) = 2.3
V input range while avoiding clipping on the output.
INPUT MODE OF OPERATION: DC
The inputs to the THS7364 allow for both ac- and
dc-coupled inputs. Many DACs or video encoders can
be dc-connected to the THS7364. One of the
drawbacks to dc-coupling arises when 0 V is applied
to the input. Although the input of the THS7364
allows for a 0-V input signal without issue, the output
swing of a traditional amplifier cannot yield a 0-V
signal, resulting in possible clipping. This limitation is
true for any single-supply amplifier because of the
characteristics of the output transistors. Neither
CMOS nor bipolar transistors can achieve 0 V while
sinking current. This transistor characteristic is also
the same reason why the highest output voltage is
always less than the power-supply voltage when
sourcing current.
The input impedance of the THS7364 in this mode of
operation is dictated by the internal, 800-kΩ
pull-down resistor, as shown in Figure 78. Note that
the internal voltage shift does not appear at the input
pin; it only shows at the output pin.
+VS
Internal
Circuitry
This output clipping can reduce the sync amplitudes
(both horizontal and vertical sync) on the video
signal. A problem occurs if the video signal receiver
uses an automatic gain control (AGC) loop to account
for losses in the transmission line. Some video AGC
circuits derive gain from the horizontal sync
amplitude. If clipping occurs on the sync amplitude,
then the AGC circuit can increase the gain too
much—resulting in too much luma and/or chroma
amplitude gain correction. This correction may result
in a picture with an overly bright display with too
much color saturation.
Input
Pin
800 kW
Level
Shift
Figure 78. Equivalent DC Input Mode Circuit
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INPUT MODE OF OPERATION: AC SYNC TIP
CLAMP
+VS
Internal
Circuitry
STC LPF
+VS
Some video DACs or encoders are not referenced to
ground but rather to the positive power supply. The
resulting video signals are generally at too great a
voltage for a dc-coupled video buffer to function
properly. To account for this scenario, the THS7364
incorporates a sync-tip clamp circuit. This function
requires a capacitor (nominally 0.1 mF) to be in series
with the input. Although the term sync-tip-clamp is
used throughout this document, it should be noted
that the THS7364 would probably be better termed as
a dc restoration circuit based on how this function is
performed. This circuit is an active clamp circuit and
not a passive diode clamp function.
gm
Input
Pin
0.1 mF
Input
800 kW
Level
Shift
Figure 79. Equivalent AC Sync-Tip-Clamp Input
Circuit
While this feature may not fully eliminate overshoot
issues on the input signal, in cases of extreme
overshoot and/or ringing, the STC system should help
minimize improper clamping levels. As an additional
method to help minimize this issue, an external
capacitor (for example, 10 pF to 47 pF) to ground in
parallel with the external termination resistors can
help filter overshoot problems.
The input to the THS7364 has an internal control loop
that sets the lowest input applied voltage to clamp at
ground (0 V). By setting the reference at 0 V, the
THS7364 allows a dc-coupled input to also function.
Therefore, the sync-tip-clamp (STC) is considered
transparent because it does not operate unless the
input signal goes below ground. The signal then goes
through the same 150-mV level shifter, resulting in an
output voltage low level of 300 mV. If the input signal
tries to go below 0 V, the THS7364 internal control
loop sources up to 6 mA of current to increase the
input voltage level on the THS7364 input side of the
coupling capacitor. As soon as the voltage goes
above the 0-V level, the loop stops sourcing current
and becomes very high impedance.
It should be noted that this STC system is dynamic
and does not rely upon timing in any way. It only
depends on the voltage that appears at the input pin
at any given point in time. The STC filtering helps
minimize level shift problems associated with
switching noises or very short spikes on the signal
line. This architecture helps ensure a very robust
STC system.
One of the concerns about the sync-tip-clamp level is
how the clamp reacts to a sync edge that has
overshoot—common in VCR signals, noise, DAC
overshoot, or reflections found in poor printed circuit
board (PCB) layouts. Ideally, the STC should not
react to the overshoot voltage of the input signal.
Otherwise, this response could result in clipping on
the rest of the video signal because it may raise the
bias voltage too much.
When the ac STC operation is used, there must also
be some finite amount of discharge bias current. As
previously described, if the input signal goes below
the 0-V clamp level, the internal loop of the THS7364
sources current to increase the voltage appearing at
the input pin. As the difference between the signal
level and the 0-V reference level increases, the
amount
of
source
current
increases
proportionally—supplying up to 6 mA of current.
Thus, the time to re-establish the proper STC voltage
can be very fast. If the difference is very small, then
the source current is also very small to account for
minor voltage droop.
To help minimize this input signal overshoot problem,
the control loop in the THS7364 has an internal
low-pass filter, as shown in Figure 79. This filter
reduces the response time of the STC circuit. This
delay is a function of how far the voltage is below
ground, but in general it is approximately a 400-ns
delay for the SD channel filters and approximately a
150-ns delay for the FHD filters. The effect of this
filter is to slow down the response of the control loop
so as not to clamp on the input overshoot voltage but
rather the flat portion of the sync signal.
However, what happens if the input signal goes
above the 0-V input level? The problem is the video
signal is always above this level and must not be
altered in any way. Thus, if the sync level of the input
signal is above this 0-V level, then the internal
discharge (sink) current reduces the ac-coupled bias
signal to the proper 0-V level.
As a result of this delay, sync may have an apparent
voltage shift. The amount of shift depends on the
amount of droop in the signal as dictated by the input
capacitor and the STC current flow. Because sync is
used primarily for timing purposes with syncing
occurring on the edge of the sync signal, this shift is
transparent in most systems.
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This discharge current must not be large enough to
alter the video signal appreciably or picture quality
issues may arise. This effect is often seen by looking
at the tilt (droop) of a constant luma signal being
applied and the resulting output level. The associated
change in luma level from the beginning and end of
the video line is the amount of line tilt (droop).
properly set the dc operating point within the
THS7364. This function is easily accomplished with
the THS7364 by simply adding an external pull-up
resistor to the positive power supply, as shown in
Figure 80.
+3.3 V
+3.3 V
Internal
Circuitry
If the discharge current is very small, the amount of
tilt is very low, which is a generally a good thing.
However, the amount of time for the system to
capture the sync signal could be too long. This effect
is also termed hum rejection. Hum arises from the ac
line voltage frequency of 50 Hz or 60 Hz. The value
of the discharge current and the ac-coupling capacitor
combine to dictate the hum rejection and the amount
of line tilt.
CIN
RPU
0.1 mF
Input
Input
Pin
800 kW
Level
Shift
To allow for both dc- and ac-coupling in the same
part, the THS7364 incorporates an 800-kΩ resistor to
ground. Although a true constant current sink is
preferred over a resistor, there can be issues when
the voltage is near ground. This configuration can
cause the current sink transistor to saturate and
cause potential problems with the signal. The 800-kΩ
resistor is large enough to not impact a dc-coupled
DAC termination. For discharging an ac-coupled
source, Ohm’s Law is used. If the video signal is 1 V,
then there is 1 V/800 kΩ = 1.25-mA of discharge
current. If more hum rejection is desired or there is a
loss of sync occurring, then simply decrease the
0.1-mF input coupling capacitor. A decrease from
0.1 mF to 0.047 mF increases the hum rejection by a
factor of 2.1. Alternatively, an external pull-down
resistor to ground may be added that decreases the
overall resistance and ultimately increases the
discharge current.
Figure 80. AC-Bias Input Mode Circuit
Configuration
The dc voltage appearing at the input pin is equal to
Equation 1:
800 kW
VDC = VS
800 kW + RPU
(1)
The THS7364 allowable input range is approximately
0 V to (VS+ – 1.5 V), allowing for a very wide input
voltage range. As such, the input dc bias point is very
flexible, with the output dc bias point being the
primary factor. For example, if the output dc bias
point is desired to be 1.6 V on a 3.3-V supply, then
the input dc bias point should be (1.6 V – 300 mV)/2
= 0.65 V. Thus, the pull-up resistor calculates to
approximately 3.3 MΩ, resulting in 0.644 V. If the
output dc-bias point is desired to be 1.6 V with a 5-V
power supply, then the pull-up resistor calculates to
approximately 5.36 MΩ.
To ensure proper stability of the ac STC control loop,
the source impedance must be less than 1-kΩ with
the input capacitor in place. Otherwise, there is a
possibility of the control loop ringing, which may
appear on the output of the THS7364. Because most
DACs or encoders use resistors to establish the
voltage, which are typically less than 300-Ω, meeting
the less than 1-kΩ requirement is easily done.
However, if the source impedance looking from the
THS7364 input perspective is very high, then simply
adding a 1-kΩ resistor to GND ensures proper
operation of the THS7364.
Keep in mind that the internal 800-kΩ resistor has
approximately
a ±20% variance. As such, the
calculations should take this variance into account.
For the 0.644-V example above, using an ideal
3.3-MΩ resistor, the input dc bias voltage is
approximately 0.644 V ± 0.1 V.
The value of the output bias voltage is very flexible
and is left to each individual design. It is important to
ensure that the signal does not clip or saturate the
video signal. Thus, it is recommended to ensure the
output bias voltage is between 0.9 V and (VS+ – 1 V).
For 100% color saturated CVBS or signals with
Macrovision®, the CVBS signal can reach up to
1.23 VPP at the input, or 2.46 VPP at the output of the
THS7364. In contrast, other signals are typically
1 VPP or 0.7 VPP at the input which translate to an
output voltage of 2 VPP or 1.4 VPP. The output bias
voltage must account for a worst-case situation,
depending on the signals involved.
INPUT MODE OF OPERATION: AC BIAS
Sync-tip clamps work very well for signals that have
horizontal and/or vertical syncs associated with them;
however, some video signals do not have a sync
embedded within the signal. If ac-coupling of these
signals is desired, then a dc bias is required to
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One other issue that must be taken into account is
the dc-bias point is a function of the power supply. As
such, there is an impact on system PSRR. To help
reduce this impact, the input capacitor combines with
the pull-up resistance to function as a low-pass filter.
Additionally, the time to charge the capacitor to the
final dc bias point is a function of the pull-up resistor
and the input capacitor size. Lastly, the input
capacitor forms a high-pass filter with the parallel
impedance of the pull-up resistor and the 800-kΩ
resistor. In general, it is good to have this high-pass
filter at approximately 3 Hz to minimize any potential
droop on a P’B or P’R signal. A 0.1-mF input capacitor
to 100% yellow for P’B signal or 100% cyan for P’R
signal . Because the P’B and P’R signal voltage can
be lower than the sync voltage, there exists a
potential for clipping of the signal for a short period of
time if the signals drop below the sync voltage.
The THS7364 does include a 150-mV input level
shift, or 300 mV at the output, that should mitigate
any clipping issues. For example, if a STC is used,
then the bottom of the sync is 300 mV at the output.
If the signal does go the lowest level, or 50 mV lower
than the sync at the input, then the instantaneous
output is (–50 mV + 150 mV) × 2 = 200 mV at the
output.
with
a
3.3-MΩ pull-up resistor equates to
approximately a 2.5-Hz high-pass corner frequency.
Another potential risk is that if this signal (100%
yellow for P’B or 100% cyan for P’R) exists for several
pixels, then the STC circuit engages to raise the
voltage back to 0 V at the input. This function can
cause a 50-mV level shift at the input midway through
the active video signal. This effect is undesirable and
can cause errors in the decoding of the signal.
This mode of operation is recommended for use with
chroma (C’), P’B, P’R, U’, and V’ signals. This method
can also be used with sync signals if desired. The
benefit of using the STC function over the ac-bias
configuration on embedded sync signals is that the
STC maintains a constant back-porch voltage as
opposed to a back-porch voltage that fluctuates
depending on the video content. Because the
high-pass corner frequency is a very low 2.5 Hz, the
impact on the video signal is negligible relative to the
STC configuration.
It is therefore recommended to use ac bias mode for
component P’B and P’R signals when ac-coupling is
desired.
OUTPUT MODE OF OPERATION:
DC-COUPLED
One question may arise over the P’B and P’R
channels. For 480i, 576i, 480p, and 576p signals, a
sync may or may not be present. If no sync exists
within the signal, then it is obvious that ac-bias is the
preferred method of ac-coupling the signal.
The THS7364 incorporates a rail-to-rail output stage
that can be used to drive the line directly without the
need for large ac-coupling capacitors. This design
offers the best line tilt and field tilt (droop)
performance because no ac-coupling occurs. Keep in
mind that if the input is ac-coupled, then the resulting
tilt as a result of the input ac-coupling continues to be
seen on the output, regardless of the output coupling.
The 80-mA output current drive capability of the
THS7364 is designed to drive two video lines
For 720p, 1080i, and 1080p signals, or for the the
480i, 576i, 480p, and 576p signals with sync present
on the P’B and P’R channels, the lowest voltage of the
sync is –300 mV below the midpoint reference
voltage of 0 V. The P’B and P’R signals allow a signal
to be as low as –350 mV below the midpoint
reference voltage of 0 V. This allowance corresponds
simultaneously—essentially,
a
75-Ω load—while
keeping the output dynamic range as wide as
possible. Figure 81 shows the THS7364 driving two
video lines while keeping the output dc-coupled.
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CVBS 1 Out
75 W
THS7364
CVBS 1 Out
75 W
75 W
SD1 OUT
1
2
3
4
5
6
7
8
9
SD1 IN
SD2 IN
SD3 IN
NC
20
19
18
17
16
15
14
13
12
11
CVBS
75 W
R
R
R
R
R
R
SD2 OUT
SD3 OUT
S-Video Y' 1 Out
75 W
S-Video Y’
S-Video C’
Y'/G'
S-Video Y' 1 Out
Disable SD
GND
Disable SD
75 W
75 W
+2.7 V to
+5 V
VS+
Disable FHD
FHD1 OUT
FHD2 OUT
FHD3 OUT
Bypass FHD
Disable FHD
NC
S-Video C' 1 Out
75 W
FHD1 IN
FHD2 IN
FHD3 IN
75 W
S-Video C' 1 Out
75 W
75 W
10 Bypass SD
75 W
Y'/G' 1 Out
75 W
Y'/G' 1 Out
Bypass
SD LPF
Bypass
FHD LPF
75 W
P'B/B'
75 W
75 W
P'B/B' 1 Out
75 W
P'R/R'
P’B/B' 1 Out
75 W
75 W
75 W
P’R/R' 1 Out
75 W
P'R/R' 1 Out
75 W
75 W
75 W
(1) Figure 81. Typical Six-Channel System with DC-Coupled Line Driving and Two Outputs Per Channel
One concern of dc-coupling, however, arises if the
line is terminated to ground. If the ac-bias input
configuration is used, the output of the THS7364 has
a dc bias on the output, such as 1.6 V. With two lines
terminated to ground, this configuration allows a dc
current path to flow, such as 1.6 V/75-Ω = 21.3 mA.
The result of this configuration is a slightly decreased
high output voltage swing and an increase in power
dissipation of the THS7364. While the THS7364 was
designed to operate with a junction temperature of up
to +125°C, care must be taken to ensure that the
junction temperature does not exceed this level or
else long-term reliability could suffer. Using a 5-V
supply, this configuration can result in an additional
dc power dissipation of (5 V – 1.6 V) × 21.3 mA =
72.5 mW per channel. With a 3.3-V supply, this
dissipation reduces to 36.2 mW per channel. The
overall low quiescent current of the THS7364 design
minimizes potential thermal issues even when using
the TSSOP package at high ambient temperatures,
but power and thermal analysis should always be
examined in any system to ensure that no issues
arise. Be sure to use RMS power and not
instantaneous power when evaluating the thermal
performance.
Note that the THS7364 can drive the line with
dc-coupling regardless of the input mode of
operation. The only requirement is to make sure the
video line has proper termination in series with the
output (typically 75 Ω). This requirement helps isolate
capacitive loading effects from the THS7364 output.
Failure to isolate capacitive loads may result in
instabilities with the output buffer, potentially causing
ringing or oscillations to appear. The stray
capacitance appearing directly at the THS7364 output
pins should be kept below 20 pF for the fixed SD filter
channels and below 15 pF for the FHD filter
channels. One way to help ensure this condition is
satisfied is to make sure the 75-Ω source resistor is
placed within 0.5 inches, or 12.7 mm, of the THS7364
output pin. If a large ac-coupling capacitor is used,
the capacitor should be placed after this resistor.
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There are many reasons dc-coupling is desirable,
including reduced costs, PCB area, and no line tilt. A
common question is whether or not there are any
drawbacks to using dc-coupling. There are some
potential issues that must be examined, such as the
dc current bias as discussed above. Another potential
risk is whether this configuration meets industry
In the same way as the dc output mode of operation
discussed previously, each line should have a 75-Ω
source termination resistor in series with the
ac-coupling capacitor. This 75-Ω resistor should be
placed next to the THS7364 output to minimize
capacitive loading effects. If two lines are to be
driven, it is best to have each line use its own
capacitor and resistor rather than sharing these
components. This configuration helps ensure
line-to-line dc isolation and eliminates the potential
problems as described previously. Using a single,
1000-mF capacitor for two lines is permissible, but
there is a chance for interference between the two
receivers.
standards.
EIA/CEA-770
stipulates
that
the
back-porch shall be 0 V ± 1 V as measured at the
receiver. With a double-terminated load system, this
requirement implies a 0 V ± 2 V level at the video
amplifier output. The THS7364 can easily meet this
requirement without issue. However, in Japan, the
EIAJ CP-1203 specification stipulates a 0 V ± 0.1 V
level with no signal. This requirement can be met with
the THS7364 in shutdown mode, but while active it
cannot meet this specification without output
ac-coupling. AC-coupling the output essentially
ensures that the video signal works with any system
and any specification. For many modern systems,
however, dc-coupling can satisfy most needs.
Lastly, because of the edge rates and frequencies of
operation, it is recommended (but not required) to
place a 0.1-mF to 0.01-mF capacitor in parallel with
the large 220-mF to 1000-mF capacitor. These large
value capacitors are most commonly aluminum
electrolytic. It is well-known that these capacitors
have significantly large equivalent series resistance
(ESR), and the impedance at high frequencies is
rather large as a result of the associated inductances
involved with the leads and construction. The small
0.1-mF to 0.01-mF capacitors help pass these
high-frequency signals (greater than 1 MHz) with
much lower impedance than the large capacitors.
OUTPUT MODE OF OPERATION:
AC-COUPLED
A very common method of coupling the video signal
to the line is with a large capacitor. This capacitor is
typically between 220 mF and 1000 mF, although
470 mF is very typical. The value of this capacitor
must be large enough to minimize the line tilt (droop)
and/or field tilt associated with ac-coupling as
described previously in this document. AC-coupling is
performed for several reasons, but the most common
is to ensure full interoperability with the receiving
video system. This approach ensures that regardless
of the reference dc voltage used on the transmitting
side, the receiving side re-establishes the dc
reference voltage to its own requirements.
Although it is common to use the same capacitor
values for all the video lines, the frequency bandwidth
of the chroma signal in a S-Video system is not
required to go as low (or as high of a frequency) as
the luma channels. Thus, the capacitor values of the
chroma line(s) can be smaller, such as 0.1 mF.
Figure 82 shows a typical configuration where the
input is ac-coupled and the output is also ac-coupled.
AC-coupled inputs are generally required when
current-sink DACs are used or the input is connected
to an unknown source, such as when the THS7364 is
used as an input device.
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THS7364
0.1 mF(1)
0.1 mF(1)
0.1 mF(1)
0.1 mF(1)
0.1 mF(1)
0.1 mF(1)
330 mF(2)
75 W
SD1 OUT
CVBS
S-Video Y’
S-Video C’
Y'/G'
1
2
3
4
5
6
7
8
9
SD1 IN
SD2 IN
SD3 IN
NC
20
19
18
17
16
15
14
13
12
11
75 W
R
R
R
R
R
R
SD2 OUT
SD3 OUT
Y' Out
330 mF(2)
+V
+V
+V
+V
+V
+V
75 W
RPU
Disable SD
GND
Disable SD
To GPIO or
+2.7 V to
+5 V
75 W
75 W
75 W
VS+
GND/VS+
P’B Out
330 mF(2)
Disable FHD
FHD1 OUT
FHD2 OUT
FHD3 OUT
Bypass FHD
Disable FHD
NC
75 W
FHD1 IN
FHD2 IN
FHD3 IN
Y' Out
330 mF(2)
330 mF(2)
330 mF(2)
75 W
75 W
75 W
10 Bypass SD
P'B Out
Bypass
SD LPF
Bypass
FHD LPF
P'B/B'
75 W
To GPIO or
GND/VS+
P'R Out
P'R/R'
75 W
RPU
RPU
+2.7 V to +5 V
(1) AC-coupled input is shown in this example. DC-coupling is also allowed as long as the DAC output voltage is within the allowable linear
input and output voltage range of the THS7364. To apply dc-coupling, remove the 0.1-mF input capacitors and the RPU pull-up resistors along
with connecting the DAC termination resistors (R) to ground.
(2) This example shows an ac-coupled output. DC-coupling is also allowed by simply removing these capacitors.
Figure 82. Typical AC Input System Driving AC-Coupled Video Lines
The use of other type of filters, such as elliptic or
LOW-PASS FILTER
chebyshev, are not recommended for video
applications because of the very large group delay
variations near the corner frequency resulting in
significant overshoot and ringing. While these filters
may help meet the video standard specifications with
respect to amplitude attenuation, the group delay is
well beyond the standard specifications. Considering
this delay with the fact that video can go from a white
pixel to a black pixel over and over again, it is easy to
see that ringing can occur. Ringing typically causes a
display to have ghosting or fuzziness appear on the
edges of a sharp transition. On the other hand, a
Bessel filter has ideal group delay response, but the
rate of attenuation is typically too low for acceptable
image rejection. Thus, the Butterworth filter is an
acceptable compromise for both attenuation and
group delay.
Each channel of the THS7364 incorporates
sixth-order, low-pass filter. These video
a
reconstruction filters minimize DAC images from
being passed onto the video receiver. Depending on
the receiver design, failure to eliminate these DAC
images can cause picture quality problems because
of aliasing of the ADC in the receiver. Another benefit
of the filter is to smooth out aberrations in the signal
that some DACs can have if the internal filtering is
not very good. This benefit helps with picture quality
and ensures that the signal meets video bandwidth
requirements.
Each filter has an associated Butterworth
characteristic. The benefit of the Butterworth
response is that the frequency response is flat with a
relatively steep initial attenuation at the corner
frequency. The problem with this characteristic is that
the group delay rises near the corner frequency.
Group delay is defined as the change in phase
(radians/second) divided by a change in frequency.
An increase in group delay corresponds to a time
domain pulse response that has overshoot and some
possible ringing associated with the overshoot.
The THS7364 SD filters have a nominal corner
(–3 dB) frequency at 9.5 MHz and a –1-dB passband
typically at 8.2 MHz. This 9.5-MHz filter is ideal for
SD NTSC, PAL, and SECAM composite video
(CVBS) signals. It is also useful for S-Video signals
(Y’C’), 480i/576i Y’/P’B/P’R, Y’U’V’, broadcast G’B’R’
signals, and computer R'G'B' video signals. The
9.5-MHz, –3-dB corner frequency was designed to
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achieve
BENEFITS OVER PASSIVE FILTERING
54 dB of attenuation at 27 MHz—a common sampling
frequency between the DAC/ADC second and third
Nyquist zones found in many video systems. This
consideration is important because any signal that
appears around this frequency can also appear in the
baseband as a result of aliasing effects of an ADC
found in a receiver.
Two key benefits of using an integrated filter system,
such as the THS7364, over a passive system are
PCB area and filter variations. The small TSSOP-20
package for six video channels is much smaller over
a passive RLC network, especially a six-pole passive
network. Additionally, consider that inductors have at
best ±10% tolerances (normally, ±15% to ±20% is
common) and capacitors typically have ±10%
tolerances. Using a Monte Carlo analysis shows that
the filter corner frequency (–3 dB), flatness (–1 dB), Q
factor (or peaking), and channel-to-channel delay
have wide variations. These variances can lead to
potential performance and quality issues in
mass-production environments. The THS7364 solves
most of these problems with the corner frequency
being essentially the only variable.
The THS7364 FHD filters have a nominal corner
(–3 dB) frequency at 72 MHz and a –1-dB passband
typically at 60 MHz. This 72-MHz filter is ideal for
1080p50 or 1080p60 component video. It is also ideal
for oversampling systems where the video DAC
upsamples the video signal such as 720p or 1080i
upsampled to 148.5 MHz. The benefit is an extremely
flat passband response along with almost no group
delay within the HD video passband. In bypass mode,
these filters can also be used for some computer
R’G’B’ video signals including VGA, SVGA, XGA,
SXGA, and QXGA.
Another concern about passive filters is the use of
inductors. Inductors are magnetic components, and
are therefore susceptible to electromagnetic
coupling/interference (EMC/EMI). Some common
coupling can occur because of other video channels
nearby using inductors for filtering, or it can come
from nearby switched-mode power supplies. Some
other forms of coupling could be from outside sources
with strong EMI radiation and can cause failure in
EMC testing such as required for CE compliance.
Keep in mind that images do not stop at the DAC
sampling frequency, fS (for example, 27 MHz for
traditional SD DACs); they continue around the
sampling frequencies of 2x fS, 3x fS, 4x fS, and so on
(that is, 54 MHz, 81 MHz, 108 MHz, etc.). Because of
these multiple images, an ADC can fold down into the
baseband signal, meaning that the low-pass filter
must also eliminate these higher-order images. The
THS7364 filters are Butterworth filters and, as such,
do not bounce at higher frequencies, thus maintaining
good attenuation performance.
One concern about an active filter in an integrated
circuit is the variation of the filter characteristics when
the ambient temperature and the subsequent die
temperature changes. To minimize temperature
effects, the THS7364 uses low-temperature
coefficient resistors and high-quality, low-temperature
coefficient capacitors found in the BiCom3X process.
These filters have been specified by design to
account for process variations and temperature
variations to maintain proper filter characteristics.
This approach maintains a low channel-to-channel
time delay that is required for proper video signal
performance.
The filter frequencies were chosen to account for
process variations in the THS7364. To ensure the
required video frequencies are effectively passed, the
filter corner frequency must be high enough to allow
component variations. The other consideration is that
the attenuation must be large enough to ensure the
anti-aliasing/reconstruction filtering is sufficient to
meet the system demands. Thus, the selection of the
filter frequencies was not arbitrarily selected and is a
good compromise that should meet the demands of
most systems.
Another benefit of the THS7364 over a passive RLC
filter is the input and output impedance. The input
impedance presented to the DAC varies significantly,
from 35 Ω to over 1.5 kΩ with a passive network, and
may cause voltage variations over frequency. The
THS7364 input impedance is 800 kΩ, and only the
2-pF input capacitance plus the PCB trace
capacitance impact the input impedance. As such,
the voltage variation appearing at the DAC output is
better controlled with a fixed termination resistor and
the high input impedance buffer of the THS7364.
One of the features of the THS7364 is that these
filters can be bypassed. Bypassing the SD filters
results in an amplifier with 150-MHz bandwidth and
100-V/ms slew rate. This configuration can be helpful
when diagnosing potential system issues or when
simply wishing to pass higher frequency signals
through the system.
Bypassing the FHD filters results in a amplifier
supporting 350-MHz bandwidth and 500-V/ms slew
rate. This configuration supports computer R'G'B'
signals up to UWXGA resolution.
On the output side of the filter, a passive filter again
has a large impedance variation over frequency. The
EIA/CEA-770 specifications require the return loss to
be at least 25 dB over the video frequency range of
usage. For a video system, this requirement implies
the source impedance (which includes the source,
36
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series resistor, and the filter) must be better than 75
Ω, +/-9 Ω. The THS7364 is an operational amplifier
that approximates an ideal voltage source, which is
desirable because the output impedance is very low
and can source and sink current. To properly match
the transmission line characteristic impedance of a
video line, a 75-Ω series resistor is placed on the
output. To minimize reflections and to maintain a
good return loss meeting EIA/CEA specifications, this
output impedance must maintain a 75-Ω impedance.
A wide impedance variation of a passive filter cannot
ensure this level of performance. On the other hand,
the THS7364 has approximately 0.9 Ω of output
impedance, or a return loss of 44 dB, at 6.75 MHz for
the SD filters and approximately 9 Ω of output
impedance, or a return loss of 25 dB, at 60 MHz for
the FHD filters. Thus, the system is matched
significantly better with a THS7364 compared to a
passive filter.
drive at least 1.25 VP (100% saturation CVBS)/37.5 Ω
= 33.3 mA. A DAC is a current-steering element, and
this amount of current flows internally to the DAC
even if the output is 0 V. Thus, power dissipation in
the DAC may be very high, especially when six
channels are being driven. Using the THS7364 with a
high input impedance and the capability to drive up to
two video lines per channel can reduce DAC power
dissipation significantly. This outcome is possible
because the resistance that the DAC drives can be
substantially increased. It is common to set this
resistance in a DAC by a current-setting resistor on
the DAC itself. Thus, the resistance can be 300 Ω or
more, substantially reducing the current drive
demands from the DAC and saving significant
amounts of power. For example, a 3.3-V, six-channel
DAC dissipates 660 mW alone for the steering
current capability (six channels × 33.3 mA × 3.3 V) if
it must drive a 37.5-Ω load. With a 300-Ω load, the
DAC power dissipation as a result of current steering
current would only be 82 mW (six channels ×
4.16 mA × 3.3 V).
One final benefit of the THS7364 over a passive filter
is power dissipation. A DAC driving a video line must
be able to drive a 37.5-Ω load: the receiver 75-Ω
resistor and the 75-Ω impedance matching resistor
next to the DAC to maintain the source impedance
requirement. This requirement forces the DAC to
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EVALUATION MODULE
To evaluate the THS7364, an evaluation module
(EVM) is available. The THS7364EVM allows for
testing the THS7364 in many different configurations.
Inputs and outputs include BNC connectors and RCA
connectors commonly found in video systems, along
with 75-Ω input termination resistors, 75-Ω series
source termination resistors, and 75-Ω characteristic
impedance traces. Several unpopulated component
pads are found on the EVM to allow for different input
and output configurations as dictated by the user.
This EVM is designed to be used with a single supply
from 2.6 V up to 5 V.
The EVM default output configuration sets all
channels for ac output coupling. The 470-mF and
0.1-mF capacitors work well for most ac-coupled
systems. However, if dc-coupled output is desired,
then replacing the 0.1-mF capacitors (C20, C22, C24,
C26, C28, and/or C30) with 0-Ω resistors works well.
Removing the 470-mF capacitors is optional, but
removing them from the EVM eliminates a few
picofarads of stray capacitance on each signal path
which may be desirable.
The THS7364 incorporates an easy method to
configure the bypass modes and the disable modes.
The use of JP4 controls the SD channels disable
feature; JP6 controls the FHD channels disable
feature; JP3 controls the SD channels filter/bypass
mode; and JP5 controls the FHD channels
filter/bypass mode.
The EVM default input configuration sets all channels
for dc input coupling. The input signal must be within
0 V to approximately 1.4 V for proper operation.
Failure to be within this range saturates and/or clips
the output signal. If the input range is beyond this, if
the signal voltage is unknown, or if coming from a
current sink DAC, then ac input configuration is
desired. This option is easily accomplished with the
EVM by simply replacing the Z1 through Z6 0-Ω
resistors with 0.1-mF capacitors.
Connection of JP4 and JP6 to GND applies 0 V to the
disable pins and the THS7364 operates normally.
Moving JP4 to +VS causes the THS7364 SD
channels to be in disable mode, while moving JP6 to
+VS causes the THS7364 FHD channels to be in
disable mode.
For an ac-coupled input and sync-tip clamp (STC)
functionality commonly used for CVBS, s-video Y',
component Y' signals, and R'G'B' signals, no other
changes are needed. However, if a bias voltage is
needed after the input capacitor which is commonly
needed for s-video C', component P'B, and P'R, then a
pull-up resistor should be added to the signal on the
EVM. This configuration is easily achieved by simply
adding a resistor to any of the following resistor pads;
RX7 to RX12. A common value to use is 3.3 MΩ.
Note that even signals with embedded sync can also
use bias mode if desired.
Connection of JP3 to GND places the THS7364 SD
channels in filter mode while moving JP3 to +VS
places the THS7364 SD channels in bypass mode.
Connection of JP5 to GND places the THS7364 FHD
channels in filter mode while moving JP5 to +VS
places the THS7364 FHD channels in bypass mode.
Figure 83 shows the THS7364EVM schematic.
Figure 84 and Figure 85 illustrate the two layers of
the EVM PCB, incorporating standard high-speed
layout practices. Table 5 lists the bill of materials as
the board comes supplied from Texas Instruments.
38
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Figure 83. THS7364EVM Schematic
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Figure 84. THS7364EVM PCB Top Layer
40
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Figure 85. THS7364EVM PCB Bottom Layer
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THS7364EVM Bill of Materials
Table 5. THS7364EVM Parts List
MANUFACTURER
PART NUMBER
DISTRIBUTOR
PART NUMBER
ITEM
REF DES
QTY
DESCRIPTION
Bead, ferrite, 2.5 A, 330 Ω
SMD SIZE
(DIGI-KEY)
445-1569-1-ND
1
FB1, FB2
2
805
(TDK) MPZ2012S331A
Capacitor, 100 µF, tantalum, 10 V, 10%, low
ESR
(DIGI-KEY)
478-1765-1-ND
2
3
C12
C40
1
1
C
C
(AVX) TPSC107K010R0100
(AVX) TPSC226K016R0375
Capacitor, 22 µF, tantalum, 16 V, 10%, low
ESR
(DIGI-KEY)
478-1767-1-ND
C1-C6,
C13-C18,
C3-C36
4
5
18
1
OPEN
0805
0805
—
—
(DIGI-KEY)
478-1358-1-ND
C37
Capacitor, 0.01 µF, ceramic, 100 V, X7R
(AVX) 08051C103KAT2A
C8, C10, C11,
C20, C22, C24,
C26, C28, C30,
C38, C39,
(DIGI-KEY)
478-1395-1-ND
6
23
Capacitor, 0.1 µF, ceramic, 50 V, X7R
0805
(AVX) 08055C104KAT2A
C41-C52
(DIGI-KEY)
478-1556-1-ND
7
8
9
C9
C7
1
1
6
Capacitor, 0.1 µF, ceramic, 50 V, X7R
Capacitor, 3.3 µF, ceramic, 25 V, X7R
Capacitor, aluminum, 470 µF, 10 V, 20%
1206
1206
F
(AVX) 12065C104KAT2A
(TDK) C3216X7R1E335K
(DIGI-KEY)
445-4029-1-ND
C19, C21, C23,
C25, C27, C29
(PANASONIC)
EEE-FP1A471AP
(DIGI-KEY)
PCE4526CT-ND
10
11
RX1-RX12
R10-R13
12
4
Open
Open
0603
0805
—
—
—
—
Z1-R9,
R19-R21,
R26-R28,
R35-R37
(DIGI-KEY)
RHM0.0ACT-ND
12
18
Resistor, 0 Ω
0805
(ROHM) MCR10EZHJ000
R1-R6,
R29-R34
(DIGI-KEY)
RHM75.0CCT-ND
13
14
15
16
17
18
19
20
12
1
Resistor, 75 Ω, 1/8 W, 1%
Resistor, 100 Ω, 1/8 W, 1%
Resistor, 1 kΩ, 1/8 W, 1%
Resistor, 100 kΩ, 1/8 W, 1%
Resistor, 1 kΩ, 1/4 W, 1%
Diode, ultrafast
0805
0805
0805
0805
1206
(ROHM) MCR10EZHF75.0
(ROHM) MCR10EZHF1000
(ROHM) MCR10EZHF1001
(ROHM) MCR10EZHF1003
(ROHM) MCR18EZHF1001
(FAIRCHILD) BAV99
(DIGI-KEY)
RHM100CCT-ND
R14
R15, R17, R24,
R25
(DIGI-KEY)
RHM1.00KCCT-ND
4
R16, R18, R22,
R23
(DIGI-KEY)
RHM100KCCT-ND
4
(DIGI-KEY)
RHM1.00KFCT-ND
R38
1
(DIGI-KEY)
BAV99FSCT-ND
D1-D12
J10, J11
12
2
Jack, banana receptance, 0.25" diameter
hole
(SPC) 15459
(NEWARK) 79K5034
(NEWARK) 93F7554
J1-J6, J13-J17,
J18
(AMPHENOL)
31-5329-72RFX
12
Connector, BNC, jack, 75 Ω
21
22
23
24
25
26
27
28
29
30
31
J8, J20
J7, J19
J9, J12
TP1, TP2
JP1, JP2
JP3-JP6
JP3-JP6
U1
2
2
2
2
2
4
4
1
4
4
1
Connector, mini circular DIN
Connector, RCA jack, yellow
Connector, RCA, jack, R/A
Test point, black
(CUI) MD-40SM
(DIGI-KEY) CP-2240-ND
(DIGI-KEY) CP-1421-ND
(DIGI-KEY) CP-1446-ND
(DIGI-KEY) 5001K-ND
—
(CUI) RCJ-044
(CUI) RCJ-32265
(KEYSTONE) 5001
—
Open
Header, 0.1" CTRS, 0.025" square pins
Shunts
3 pos.
PW
(SULLINS) PBC36SAAN
(SULLINS) SSC02SYAN
(TI) THS7364IPW
(KEYSTONE) 1808
PMSSS 440 0025 PH
EDGE # 6518231 REV.A
(DIGI-KEY) S1011E-36-ND
(DIGI-KEY) S9002-ND
—
IC, THS7364
Standoff, 4-40 hex, 0.625" length
Screw, Phillips, 4-40, .250"
Board, printed circuit
(DIGI-KEY) 1808K-ND
(DIGI-KEY) H703-ND
—
42
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
THS7364IPW
ACTIVE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
THS7364IPWR
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
THS7364IPWR
TSSOP
PW
20
2500
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 20
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 33.0
THS7364IPWR
2500
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
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