TI380C25PGE [TI]

Token Ring Commprocessor 144-LQFP;
TI380C25PGE
型号: TI380C25PGE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Token Ring Commprocessor 144-LQFP

时钟 局域网 数据传输 外围集成电路
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TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
IEEE 802.5 and IBM Token-Ring Network  
Dual-Port DMA and Direct I/O Transfers to  
Compatible  
Host Bus  
Compatible With TI380FPA FNL  
Supports 8- or 16-Bit Pseudo-DMA  
PacketBlaster  
Operation  
Token-Ring Features  
Enhanced-Address-Copy-Option (EACO)  
Interface Supports External  
– 16- or 4-Megabit-per-Second Data Rates  
– Supports up to 18K-Byte Frame Size  
(16-Mbps Operation Only)  
Address-Checking Logic for Bridging or  
External Custom Applications  
– Supports Universal-and Local-Network  
Addressing  
– Early Token-Release Option  
(16-Mbps Operation Only)  
Support for Module High-Impedance  
In-Circuit Testing  
Built-In Real-Time Error Detection  
Bring-Up and Self-Test Diagnostics With  
– Compatible With the TMS38054  
Loopback  
Expandable Local LAN-Subsystem Memory  
Automatic Frame-Buffer Management  
2- to 33-MHz System-Bus Clock  
Slow-Clock Low-Power Mode  
Single 5-V Supply  
0.8-µm CMOS Technology  
250-mA Typical Latch-Up Immunity at 25°C  
ESD Protection Exceeds 2000 V  
Space up to 2 Megabytes  
Glueless Interface to DRAMs  
High-Performance 16-Bit CPU for  
Communications-Protocol Processing  
1- to 16.5-Megabyte-per-Second  
High-Speed Bus Master DMA Interface  
Low-Cost Host-Slave I/O Interface Option  
Up to 32-Bit Host Address Bus  
Selectable Host System-Bus Options  
144-Pin Plastic Thin Quad Flat Package  
(PGE Suffix)  
Adapter Local-Bus Speed Is Switchable  
Operating Temperature Range  
0°C to 70°C  
Between 4 MHz and 6 MHz  
80x8x or 68xxx-Type Bus and Memory  
Organization  
8- or 16-Bit Data Bus on 80x8x Buses  
– Optional Parity Checking  
LAN Subsystem  
Attached  
System  
Bus  
(2 MHz  
to  
Transmit  
Token-Ring  
To  
Physical-Layer  
Network  
TI380C25  
Circuitry  
Receive  
33 MHz)  
16  
Memory  
Figure 1. Network-Commprocessor Applications Diagram  
IBM and Token-Ring Network are trademarks of International Business Machines Corp.  
PacketBlaster is a trademark of Texas Instruments Incorporated.  
Copyright 1994, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
pin assignments  
PGE PACKAGE  
(TOP VIEW)  
NC  
1
V
108  
107  
106  
105  
104  
103  
102  
101  
100  
99  
SSL  
NC  
V
2
SSL  
MOE  
MBEN  
MADH7  
MADH6  
MADH5  
MADH4  
3
V
DD  
4
XMATCH  
XFAIL  
5
6
TEST0  
TEST1 (NC)  
TEST2  
TEST3  
TEST4  
TEST5  
SADH0  
SADH1  
SADH2  
SADH3  
SADH4  
SADH5  
7
8
9
V
DD  
NC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
98  
V
SS  
97  
MADH3  
MADH2  
MADH1  
MADH0  
MAXPH  
MBRQ  
96  
95  
94  
93  
92  
91  
MBGR  
V
SS  
NC  
90  
V
SS  
89  
MAXPL  
MADL7  
MADL6  
MADL5  
MADL4  
MADL3  
MADL2  
MADL1  
MADL0  
EXTINT3  
EXTINT2  
EXTINT1  
EXTINT0  
NMI  
V
DD  
NC  
88  
87  
V
SSC  
86  
SADH6  
85  
SADH7  
SPH  
SRD/SUDS  
SRDY/SDTACK  
SOWN  
84  
83  
82  
81  
80  
SDBEN  
79  
SBHE/SRNW  
SHRQ/SBRQ  
SPL  
SADL0  
SADL1  
SADL2  
V
SSL  
78  
77  
76  
75  
V
DD  
NC  
74  
73  
V
SSL  
NC – No internal connection  
2
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
description  
The TI380C25 is a single-chip network-communications processor (commprocessor) that supports token-ring  
local area networks (LANs) at data rates of 16 Mbps or 4 Mbps. The TI380C25 conforms to ISO 8802–5/IEEE  
802.51992 standards and has been verified to be completely IBM Token-Ring Network compatible. By  
integrating the essential control building blocks needed on a LAN-subsystem card into one device, the  
TI380C25 ensures that this IBM compatibility is maintained in silicon.  
The high degree of integration of the TI380C25 makes it a virtual LAN subsystem on a single chip. Protocol  
handling, host-system interfacing, memory interfacing, and communications processing are all provided  
through the TI380C25. To complete LAN-subsystem design, only the network-interface hardware, local  
memory, and minimal additional components such as PAL devices and crystal oscillators need to be added.  
The TI380C25 provides a 32-bit system-memory address reach with a high-speed bus-master DMA interface  
that supports rapid communications with the host system. In addition, the TI380C25 supports direct I/O and a  
low-cost 8- or 16-bit pseudo-DMA interface that requires only a chip select to work directly on an 80x8x 8-bit  
slave I/O interface. Finally, selectable 80x8x or 68xxx-type host-system bus and memory organization add to  
design flexibility.  
The TI380C25 supports addressing for up to 2M bytes of local memory. This expanded memory capacity can  
improve LAN-subsystem performance by allowing larger blocks of information to be transferred at one time and  
minimizing the frequency of host LAN-subsystem communications. The support of large local memory is  
importantinapplicationsthatrequirelargedatatransfers(suchasgraphicsordatabasetransfers)andinheavily  
loaded networks where the extra memory can provide data buffers to store data until it can be processed by  
the host.  
The proprietary CPU used in the TI380C25 allows protocol software to be downloaded into RAM or stored in  
ROM in the local-memory space. By moving protocols (such as LLC) to the LAN-subsystem, overall system  
performance is increased. This is accomplished by offloading the processing from the host system to the  
TI380C25, which can also reduce LAN-subsystem-to-host communications. As other protocol software is  
developed, greater differentiation of end products with enhanced system performance is possible.  
In addition, the TI380C25 includes hardware counters that provide real-time error detection and automatic  
frame-buffer management. These counters control system-bus retries and burst size, and track host and  
LAN-subsystembuffer status. Previously, these counters needed to be maintained in software. Integrating them  
into hardware removes software overhead and improves LAN-subsystem performance.  
The TI380C25 implements a TI-patented enhanced-address-copy-option (EACO) interface. This interface  
supports external address-checking devices, such as the TMS380SRA source-routing accelerator. The  
TI380C25 has a 128-word external I/O space in its memory to support external address-checker devices and  
other hardware extensions to the TMS380 architecture.  
The major blocks of the TI380C25 include the communications processor (CP), the system interface (SIF), the  
memory interface (MIF), the protocol handler (PH), the clock generator (CG), and the adapter-support function  
(ASF), as shown in the functional block diagram.  
The TI380C25 is available in a 144-pin plastic thin quad flat package (PGE suffix) and is characterized for  
operation from 0°C to 70°C.  
The TI380C25 has a bus interface to the host system, a bus interface to local memory, and an interface to the  
physical-layercircuitry. PinnamesstartingwiththeletterSattachtothehost-systembus, andpinnamesstarting  
with the letter M attach to the local-memory bus.  
PAL is a registered trademark of Advanced Micro Devices, Inc. Other companies also manufacture programmable array logic devices.  
3
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
functional block diagram  
System  
Interface  
(SIF)  
Memory  
Interface  
(MIF)  
SADH0  
MADH0  
SADH7  
SADL0  
MADH7  
MADL0  
DIO Control  
Bus Control  
DMA Control  
DRAM Refresh  
Local-Bus  
Arbitrator  
Local-Bus  
Control  
Local  
Parity-Check/  
Generator  
SADL7  
MADL7  
SPH  
SPL  
SBRLS  
MRAS  
MCAS  
MAXPH  
MAXPL  
MW  
SINTR/SIRQ  
SDDIR  
SDBEN  
MOE  
SALE  
SXAL  
MDDIR  
MAL  
SOWN  
MAX0  
SIACK  
MAX2  
SBCLK  
MRESET  
MROMEN  
MBEN  
MBRQ  
MBGR  
MACS  
MBIAEN  
MREF  
SRD/SUDS  
SWR/SLDS  
SRDY/SDTACK  
SI/M  
SHLDA/SBGR  
SBHE/SRNW  
SRAS/SAS  
S8/SHALT  
SRESET  
SRS0  
OSCIN  
OSCOUT  
MBCLK1  
MBCLK2  
SYNCIN  
CLKDIV  
Clock  
Generator  
(CG)  
SRS1  
SRS2/SBERR  
SCS  
SRSX  
SHRQ/SBRQ  
SBBSY  
BTSTRP  
PRTYEN  
NSELOUT0  
NSELOUT1  
NMI  
EXTINT0  
Adapter-  
Support  
Function  
(ASF)  
EXTINT3  
TEST0  
Interrupts  
Communications  
Processor  
Test Function  
TEST5  
XMATCH  
XFAIL  
RCLK  
REDY  
WFLT  
FRAQ  
NSRT  
WRAP  
DRVR  
DRVR  
Token-Ring  
Protocol Handler (PH)  
RCVR  
PXTALIN  
4
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
Bootstrap. The value on BTSTRP is loaded into the BOOT bit of the SIFACL register at reset (i.e., when  
SRESET is asserted or the ARESET bit in the SIFACL register is set) to form a default value. BTSTRP  
indicates whether chapters 0 and 31 of the memory map are RAM or ROM. If these chapters are RAM,  
the TI380C25 is denied access to the local-memory bus until the CPHALT bit in the SIFACL register  
is cleared.  
BTSTRP  
42  
I
H = Chapters 0 and 31 of local memory are RAM based (see Note 1).  
L
= Chapters 0 and 31 of local memory are ROM based.  
Clock divider select (see Note 2)  
CLKDIV  
38  
I
H = 64-MHz OSCIN for 4-MHz local bus  
L
= 32-MHz OSCIN for 4-MHz local bus or 48-MHz OSCIN for 6-MHz local bus  
EXTINT0  
EXTINT1  
EXTINT2  
EXTINT3  
32  
31  
30  
29  
I/O  
I
Reserved; must be pulled high (see Note 3)  
MACS  
132  
Reserved; must be tied low (see Note 4)  
MADH0  
MADH1  
MADH2  
MADH3  
MADH4  
MADH5  
MADH6  
MADH7  
15  
14  
13  
12  
8
7
6
5
Local-memory address, data, and status bus — high byte. For the first quarter of the local-memory  
cycle, these bus lines carry address bits AX4 and A0 to A6; for the second quarter, they carry status  
bits; and for the third and fourth quarters, they carry data bits 0 to 7. The most significant bit is MADH0  
and the least significant bit is MADH7.  
I/O  
Memory Cycle  
1Q  
2Q  
3Q  
4Q  
Signal  
AX4, A0A6  
Status  
D0D7  
D0D7  
MADL0  
MADL1  
MADL2  
MADL3  
MADL4  
MADL5  
MADL6  
MADL7  
28  
27  
26  
25  
24  
23  
22  
21  
Local-memory address, data, and status bus — low byte. For the first quarter of the local-memory  
cycle, these bus lines carry address bits A7 to A14; for the second quarter, they carry address bits AX4  
and A0 to A6; and for the third and fourth quarters, they carry data bits 8 to 15. The most significant  
bit is MADL0 and the least significant bit is MADL7.  
I/O  
Memory Cycle  
1Q  
2Q  
3Q  
4Q  
Signal  
A7A14  
AX4, A0A6 D8D15  
D8D15  
Memory-address latch. MAL is a strobe signal for sampling the address at the start of the memory  
cycle; it is used by SRAMs and EPROMs. The full 20-bit word address is valid on MAX0, MAXPH,  
MAX2, MAXPL, MADH0MADH7, and MADL0MADL7. Three 8-bit transparent latches can be used  
to retain a 20-bit static address throughout the cycle.  
MAL  
131  
139  
O
Rising edge  
Falling edge  
=
=
No signal latching  
Allows the above address signals to be latched  
Local-memory-extended address bit. MAX0 drives AX0 at row-address time and drives A12 at  
column-address and data-valid times for all cycles. This signal can be latched by MRAS. Driving A12  
eases interfacing to a BIA ROM.  
MAX0  
I/O  
Memory Cycle  
1Q  
2Q  
3Q  
4Q  
Signal  
AX0  
A12  
A12  
A12  
I = input, O = output  
NOTES: 1. Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
2. TheTI380FPA and TMS380SRA are currently supported only with the 4-MHz local bus in either CLKDIV state. Expansion to support  
the 6-MHz local bus is under development.  
3. Each pin must be individually tied to V  
4. Pin should be connected to ground.  
with a 1-kpullup resistor.  
CC  
5
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
DESCRIPTION  
I/O  
NAME  
NO.  
Local-memory-extended address bit. MAX2 drives AX2 at row-address time, which can be latched by  
MRAS and A14 at column-address and data-valid times for all cycles. Driving A14 eases interfacing  
to a BIA ROM.  
Memory Cycle  
MAX2  
140  
I/O  
1Q  
2Q  
3Q  
4Q  
Signal  
AX2  
A14  
A14  
A14  
Local-memory-extended address and parity — high byte. For the first quarter of a memory cycle,  
MAXPH carries the extended-address bit AX1; for the second quarter of a memory cycle, it carries the  
extended-address bit AX0; and for the last half of the memory cycle, it carries the parity bit for the high  
data byte.  
MAXPH  
MAXPL  
16  
20  
I/O  
Memory Cycle  
1Q  
AX1  
2Q  
3Q  
4Q  
Parity  
Signal  
AX0  
Parity  
Local-memory-extended address and parity — low byte. For the first quarter of a memory cycle,  
MAXPL carries the extended-address bit AX3; for the second quarter of a memory cycle, it carries  
extended-address bit AX2; and for the last half of the memory cycle, it carries the parity bit for the low  
data byte.  
I/O  
Memory Cycle  
1Q  
2Q  
3Q  
4Q  
Signal  
AX3  
AX2  
Parity  
Parity  
Local-bus clock 1 and local-bus clock 2. MBCLK1 and MBCLK2 are referenced for all local-bus  
transfers. MBCLK2 lags MBCLK1 by a quarter of a cycle. These clocks operate according to:  
MBCLK1  
MBCLK2  
123  
124  
MBCLK[1:2]  
8 MHz  
8 MHz  
12 MHz  
OSCIN  
64 MHz  
32 MHz  
48 MHz  
CLKDIV  
O
H
L
L
Buffer enable. MBEN enables the bidirectional buffer outputs on the MADH, MAXPH, MAXPL, and  
MADLbuses during the data phase. MBEN is used in conjunction with MDDIR, which selects the buffer  
output direction.  
MBEN  
4
O
I/O  
O
H = Buffer output disabled  
L
= Buffer output enabled  
MBGR  
MBIAEN  
MBRQ  
18  
Reserved; must be left unconnected.  
Burned-in address enable. MBIAEN is an output signal used to provide an output enable for the ROM  
containing the adapter’s burned-in address (BIA).  
127  
H = MBIAEN is driven high for any write accesses to the addresses between >00.0000 and  
>00.000F, or any accesses (read/write) to any other address.  
L
=
MBIAEN is driven low for any read from addresses between >00.0000 and >00.000F.  
17  
I/O  
Reserved; must be pulled high (see Note 3).  
I = input, O = output  
NOTE 3: Each pin must be individually tied to V  
with a 1-kpullup resistor.  
CC  
6
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
Column-address strobe for DRAMs. The column address is valid for the 3/16 of the memory cycle  
following the row-address portion of the cycle. MCAS is driven low every memory cycle while the  
column address is valid on MADL0MADL7, MAXPH, and MAXPL, except when one of the following  
conditions occurs:  
1) When the address accessed is in the BIA ROM (>00.0000 – >00.000F)  
2) When the address accessed is in the EPROM memory map (i.e., when the BOOT bit in  
the SIFACL register is zero and an access is made between >00.0010 – >00.FFFF  
or >1F.0000 – >1F.FFFF)  
MCAS  
141  
O
3) When the cycle is a refresh cycle, in which case MCAS is driven at the start of the cycle before  
MRAS (for DRAMs that have CAS-before-RAS refresh). For DRAMs that do not support CAS-  
before-RAS refresh, it may be necessary to disable MCAS with MREF during the refresh  
cycle.  
Datadirection. MDDIRisusedasadirectioncontrolforbidirectionalbusdrivers. MDDIRbecomesvalid  
before MBEN becomes active.  
MDDIR  
138  
I/O  
H = TI380C25 memory-bus write  
L
= TI380C25 memory-bus read  
Memory output enable. MOE is used to enable the outputs of the DRAM memory during a read cycle.  
MOE is high for EPROM or BIA ROM read cycles.  
MOE  
3
O
O
O
H = Disable DRAM outputs  
L
= Enable DRAM outputs  
Row-address strobe for DRAMs. The row address lasts for the first 5/16 of the memory cycle. MRAS  
is driven low every memory cycle while the row address is valid on MADL0MADL7, MAXPH, and  
MAXPL for both RAM and ROM cycles. It is also driven low during refresh cycles when the refresh  
address is valid on MADL0MADL7.  
MRAS  
MREF  
143  
130  
DRAM refresh cycle in progress. MREF is used to indicate that a DRAM refresh cycle is occurring. It  
is also used for disabling MCAS to all DRAMs that do not use a CAS-before-RAS refresh.  
H = DRAM refresh cycle in process  
L
= Not a DRAM refresh cycle  
Memory-bus reset. MRESET is a reset signal generated when either the ARESET bit in the SIFACL  
register is set or SRESET is asserted. This signal is used for resetting external local-bus glue logic.  
MRESET  
125  
O
H = External logic not reset  
L
= External logic reset  
ROM enable. During the first 5/16 of the memory cycle, MROMEN is used to provide a chip select for  
ROMs when the BOOT bit of the SIFACL register is zero (i.e., when code is resident in ROM, not RAM).  
It can be latched by MAL. MROMEN goes low for any read from addresses >00.0010 – >00.FFFF or  
>1F.0000 – >1F.FFFF when the BOOT bit in the SIFACL register is zero. MROMEN stays high for  
writes to these addresses, accesses of other addresses, or accesses of any address when the BOOT  
bit is 1. During the final three quarters of the memory cycle, MROMEN outputs the A13 address signal  
for interfacing to a BIA ROM. This means MBIAEN, MAX0, ROMEN, and MAX2 together form a  
glueless interface for the BIA ROM.  
MROMEN  
133  
O
H = ROM disabled  
L
=
ROM enabled  
I = input, O = output  
7
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
DESCRIPTION  
I/O  
NAME  
NO.  
142  
33  
Local-memory write. MW is used to specify a write cycle on the local-memory bus. The data on the  
MADH0MADH7 and MADL0MADL7 buses is valid while MW is low. DRAMs latch data on the  
falling edge of MW, while SRAMs latch data on the rising edge of MW.  
MW  
NMI  
O
I
H = Not a local-memory write cycle  
L
= Local-memory write cycle  
Nonmaskable interrupt request. NMI must be left unconnected.  
External oscillator input. OSCIN provides the clock frequency to the TI380C25 for a 4-MHz or 6-MHz  
internal bus (see Notes 5 and 6).  
OSCIN  
135  
I
CLKDIV  
OSCIN  
H
L
64 MHz for a 4-MHz local bus  
32 MHz for a 4-MHz local bus or 48 MHz for a 6-MHz local bus  
Oscillator output  
CLKDIV  
L
OSCOUT  
OSCOUT  
PRTYEN  
122  
41  
O
OSCIN / 4 (if OSCIN = 32 MHz, OSCOUT = 8 MHz;  
if OSCIN = 48 MHz, OSCOUT = 12 MHz)  
OSCIN/8 (if OSCIN = 64 MHz, OSCOUT = 8 MHz)  
H
Parity enable. The value on PRTYEN is loaded into the PEN bit of the SIFACL register at reset (i.e.,  
when SRESET is asserted or the ARESET bit in the SIFACL register is set) to form a default value.  
PRTYEN enables parity checking for the local memory.  
I
H = Local-memory data bus checked for parity (see Note 1).  
L
= Local-memory data bus not checked for parity.  
Network selection outputs. NSELOUT0 and NSELOUT1 are controlled by the host through the  
correspondingbits of the SIFACL register. The value of these bits/signals can be changed only while  
the TI380C25 is reset.  
NSELOUT0  
NSELOUT1  
40  
119  
O
O
NSELOUT0  
NSELOUT1  
DESCRIPTION  
16-Mbps token ring  
4-Mbps token ring  
L
H
H
H
SADH0  
SADH1  
SADH2  
SADH3  
SADH4  
SADH5  
SADH6  
SADH7  
97  
96  
95  
94  
93  
92  
86  
85  
System address/data bushigh byte (see Note 1).These lines make up the most significant byte  
of each address word (32-bit address bus) and data word (16-bit data bus). The most significant bit  
is SADH0, and the least significant bit is SADH7.  
I/O  
Address multiplexing: Bits 31 – 24 and bits 15 – 8  
Data multiplexing: Bits 15 – 8  
SADL0  
SADL1  
SADL2  
SADL3  
SADL4  
SADL5  
SADL6  
SADL7  
76  
75  
74  
70  
69  
68  
67  
66  
System address/data buslow byte (see Note 1). These lines make up the least significant byte  
of each address word (32-bit address bus) and data word (16-bit data bus). The most significant bit  
is SADL0 and the least significant bit is SADL7.  
I/O  
Address multiplexing: Bits 23 – 16 and bits 7 – 0  
Data multiplexing: Bits 7 – 0  
I = input, O = output  
NOTES: 1. Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
5. Pin has an expanded input voltage specification.  
6. A maximum of two TI380C25 devices can be connected to any one oscillator.  
8
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
System address-latch enable. SALE is the enable pulse used to externally latch the 16 LSBs of the  
addressfromtheSADH0 – SADH7andSADL0 – SADL7busesatthestartoftheDMAcycle. Systems  
that implement address parity can also externally latch the parity bits (SPH and SPL) for the latched  
address.  
SALE  
64  
O
System bus busy. The TI380C25 samples the value on SBBSY during arbitration (see Note 1). The  
sample has one of two values:  
SBBSY  
SBCLK  
50  
65  
I
I
H = Not busy. The TI380C25 can become bus master if the grant condition is met.  
L
= Busy. The TI380C25 cannot become bus master.  
System bus clock. The TI380C25 requires SBCLK to synchronize its bus timings for all DMA transfers.  
Valid frequencies are 2 MHz33 MHz.  
SBHE is used for system byte high enable. SBHE is a 3-state output driven during DMA;  
it is an input at all other times.  
Intel Mode  
H = System byte high not enabled (see Note 1)  
L
= System byte high enabled  
SBHE/SRNW  
79  
I/O  
SRNW is used for system read not write. SRNW serves as a control signal to indicate  
a read or write cycle.  
Motorola  
Mode  
H = Read cycle (see Note 1)  
L
= Write cycle  
System bus release. SBRLS indicates to the TI380C25 that a higher-priority device requires the  
system bus. The value on SBRLS is ignored when the TI380C25 is not perfoming DMA. SBRLS is  
internally synchronized to SBCLK.  
SBRLS  
49  
I
H = The TI380C25 can hold onto the system bus (see Note 1).  
L
=
The TI380C25 should release the system bus upon completion of current DMA cycle. If the  
DMA transfer is not yet complete, the SIF rearbitrates for the system bus.  
System chip select. SCS activates the system interface of the TI380C25 for a DIO read or write.  
SCS  
48  
80  
I
H = Not selected (see Note 1)  
L
= Selected  
System data-bus enable. SDBEN signals to the external data buffers to begin driving data. SDBEN  
is activated during both DIO and DMA.  
SDBEN  
O
H = Keep external data buffers in the high-impedance state  
L
= Cause external data buffers to begin driving data  
System data direction. SDDIR provides the external data buffers with a signal indicating the direction  
the data is moving. During DIO writes and DMA reads, SDDIR is low (data direction is into the  
TI380C25).DuringDIOreadsandDMAwrites,SDDIRishigh(datadirectionisoutfromtheTI380C25).  
When the system interface is not involved in a DIO or DMA operation, SDDIR is high by default.  
SDDIR  
59  
O
DATA  
SDDIR  
H
L
DIRECTION  
output  
DIO  
read  
write  
DMA  
write  
read  
input  
I = input, O = output  
NOTE 1: Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
9
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
DESCRIPTION  
I/O  
NAME  
NO.  
SHLDA is used for system-hold acknowledge. SHLDA indicates that the system DMA  
hold request has been acknowledged. It is internally synchronized to SBCLK  
(see Note 1).  
Intel Mode  
H = Hold request acknowledged  
L
= Hold request not acknowledged  
58  
I
SHLDA/SBGR  
SBGR is used for system bus grant. SBGR is an active-low bus grant, as defined in the  
standard 68xxx interface, and is internally synchronized to SBCLK (see Note 1).  
Motorola  
Mode  
H = System bus not granted  
L
= System bus granted  
SHRQ is used for system-hold request. SHRQ is used to request control of the system  
bus in preparation for a DMA transfer. SHRQ is internally synchronized to SBCLK.  
Intel Mode  
H = System bus requested  
L
= System bus not requested  
78  
O
SHRQ/SBRQ  
SBRQ is used for system-bus request. SBRQ is used to request control of the system  
bus in preparation for a DMA transfer. SBRQ is internally synchronized to SBCLK.  
Motorola  
Mode  
H = System bus not requested  
L
= System bus requested  
System-interruptacknowledge.SIACKisfromthehostprocessortoacknowledgetheinterruptrequest  
from the TI380C25.  
SIACK  
SI/M  
43  
56  
I
I
H = System interrupt not acknowledged (see Note 1)  
L
=
System interrupt acknowledged: The TI380C25 places its interrupt vector onto the system  
bus.  
System Intel/Motorola mode select. The value on SI/M specifies the system-interface mode.  
H = Intel-compatible interface mode selected. Intel interface can be 8-bit or 16-bit mode  
(see S8/SHALT description and Note 1).  
L
=
Motorola-compatible interface mode selected. Motorola interface mode is always 16 bits.  
SINTR is used for system-interrupt request. TI380C25 activates SINTR to signal an  
interrupt request to the host processor.  
Intel Mode  
H = Interrupt request by TI380C25  
No interrupt request  
L
=
57  
O
SINTR/SIRQ  
SIRQ is used for system-interrupt request. TI380C25 activates SIRQ to signal an  
interrupt request to the host processor.  
Motorola  
Mode  
H = No interrupt request  
L
= Interrupt request by TI380C25  
System bus owned. SOWN indicates to external devices that TI380C25 has control of the system bus.  
SOWN drives the enable signal of the bus-transceiver chips that drive the address and bus-control  
signals.  
SOWN  
81  
O
H = TI380C25 does not have control of the system bus.  
L
= TI380C25 has control of the system bus.  
I = input, O = output  
NOTE 1: Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
10  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
System parity high. The optional odd-parity bit for each address or data byte transmitted over  
SADH0SADH7 (see Note 1).  
SPH  
SPL  
84  
I/O  
I/O  
System parity low. The optional odd-parity bit for each address or data byte transmitted over  
SADL0SADL7 (see Note 1).  
77  
SRAS is used for system memory-address strobe (see Note 7). SRAS is used to latch  
the SCS and SRSX – SRS2 register input signals. In a minimum-chip system, SRAS is  
tied to the SALE output of the system bus. The latching capability can be defeated  
because the internal latch for these inputs remains transparent as long as SRAS  
remains high. This permits SRAS to be pulled high and the signals at SCS,  
Intel Mode SRSX – SRS2, and SBHE to be applied independently of the SALE strobe from the  
system bus. During DMA, SRAS remains an input.  
H
L
= Transparent mode  
= Holds latched values of SCS, SRSXSRS2, and SBHE  
60  
I/O  
SRAS/SAS  
Falling edge = Latches SCS, SRSX – SRS2, and SBHE  
SAS is used for sytem-memory address strobe (see Note 7). SAS is an active-low  
address strobe that is an input during DIO (although ignored as an address strobe) and  
an output during DMA.  
Motorola  
Mode  
H = Address is not valid.  
L
= Address is valid and a transfer operation is in progress.  
SRDisusedforsystem-readstrobe(seeNote7). SRDistheactive-lowstrobeindicating  
that a read cycle is performed on the system bus. SRD is an input during DIO and an  
output during DMA.  
Intel Mode  
H = Read cycle is not occurring.  
L
=
If DMA, host provides data to system bus.  
If DIO, SIF provides data to system bus.  
83  
I/O  
SRD/SUDS  
SUDS is used for upper-data strobe (see Note 7). SUDS is the active-low upper-data  
strobe. SUDS is an input during DIO and an output during DMA.  
Motorola  
Mode  
H = Not valid data on SADH0SADH7 lines  
L
= Valid data on SADH0SADH7 lines  
SRDY is used for system bus ready (see Note 7). SRDY indicates to the bus master that  
a data transfer is complete. SRDY is asynchronous but during DMA and pseudo-DMA  
cycles, it is internally synchronized to SBCLK. During DMA cycles, SRDY must be  
asserted before the falling edge of SBCLK in state T2 to prevent a wait state. SRDY is  
an output when the TI380C25 is selected for DIO; otherwise; it is an input.  
Intel Mode  
H = System bus is not ready.  
L
= Data transfer is complete; system bus is ready.  
82  
I/O  
SRDY/SDTACK  
SDTACK is used for system data-transfer acknowledge (see Note 7). The purpose of  
SDTACK is to indicate to the bus master that a data transfer is complete. SDTACK is  
internally synchronized to SBCLK. During DMA cycles, SDTACK must be asserted  
before the falling edge of SBCLK in state T2 in order to prevent a wait state. SDTACK  
is an output when the TI380C25 is selected for DIO; otherwise, it is an input.  
Motorola  
Mode  
H = System bus is not ready.  
L
= Data transfer is complete; system bus is ready.  
I = input, O = output  
NOTES: 1. Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
7. Pin should be tied to V  
CC  
with a 4.7-kpullup resistor.  
11  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
DESCRIPTION  
I/O  
NAME  
NO.  
System reset. SRESET is activated to place the TI380C25 into a known initial state. Hardware reset  
puts most of the TI380C25 outputs into the high-impedance state and places all blocks into the reset  
state. The Intel mode DMA bus-width selection (S8) is latched on the rising edge of SRESET.  
SRESET  
44  
I
H
L
=
=
No system reset  
System reset  
Rising edge = Latch bus width for DMA operations (for Intel-mode applications)  
SRSX and SRS0SRS2 are used for system-register select. These inputs select the  
word or byte to be transferred during a system DIO access. The most significant bit is  
SRSX and the least significant bit is SRS2 (see Note 1).  
Intel Mode  
MSb  
LSb  
Register selected = SRSX  
SRS0  
SRS1  
SRS2/SBERR  
SRSX, SRS0 and SRS1 are used for system-register select. These inputs select the  
word or byte to be transferred during a system DIO access. The most significant bit is  
SRSX and the least significant bit is SRS1 (see Note 1).  
47  
46  
45  
54  
SRSX  
SRS0  
SRS1  
SRS2/SBERR  
I
MSb  
LSb  
Motorola  
Mode  
Register selected  
=
SRSX  
SRS0  
SRS1  
SBERRisusedforbuserror. Thissignalcorrespondstothebus-errorsignalofthe68xxx  
microprocessor. SBERR is internally synchronized to SBCLK. This input is driven low  
during a DMA cycle to indicate to the TI380C25 that the cycle must be terminated (see  
Section 3.4.5.3 of the TMS380 Second-Generation Token Ring User’s Guide  
(SPWU005) for more information).  
SWR is used for system-write strobe (see Note 7). SWR is an active-low write strobe  
that is an input during DIO and an output during DMA.  
Intel Mode  
H = Write cycle is not occurring.  
L
=
If DMA, data to be driven from SIF to host bus.  
If DIO, on the rising edge, the data is latched and written to the selected register.  
61  
I/O  
SWR/SLDS  
SLDS is used for lower-data strobe (see Note 7). SLDS is an input during DIO and an  
output during DMA.  
Motorola  
Mode  
H = Not valid data on SADL0SADL7 lines  
L
= Valid data on SADL0SADL7 lines  
System-extended-address latch. SXAL provides the enable pulse used to externally latch the most  
significant 16 bits of the 32-bit system address during DMA. SXAL is activated prior to the first cycle  
of each block DMA transfer, and thereafter as necessary (whenever an increment of the DMA address  
counter causes a carry out of the lower 16 bits). Systems that implement parity on addresses can use  
SXAL to externally latch the parity bits (available on SPL and SPH) for the DMA address extension.  
SXAL  
63  
O
I
SYNCIN  
136  
Reserved. SYNCIN must be left unconnected (see Note 1).  
I = input, O = output  
NOTES: 1: Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
7. Pin should be tied to V  
with a 4.7-kpullup resistor.  
CC  
12  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
S8 is used for system 8/16-bit bus select. S8 selects the bus width used for  
communications through the system interface. On the rising edge of SRESET, the  
TI380C25 latches the DMA bus width; otherwise, the value on S8 dynamically selects  
the DIO bus width.  
Intel Mode  
H = Selects 8-bit mode (see Note 1)  
51  
I
S8/SHALT  
L
= Selects 16-bit mode  
SHALT is used for system halt/bus error retry. If SHALT is asserted along with SBERR,  
the adapter retries the last DMA cycle. This is the rerun operation as defined in the 68xxx  
specification. The BERETRY counter is not decremented by SBERR when SHALT is  
asserted (see Section 3.4.5.3 of the TMS380 Second-Generation Token Ring User’s  
Guide (SPWU005) for more information).  
Motorola  
Mode  
37  
55  
126  
Positive-supply voltage for digital logic. All V  
power-supply plane.  
pins must be attached to the common-system  
DDL  
V
V
I
I
DDL  
9
34  
72  
Positive-supply voltage for output buffers. All V  
power-supply plane.  
pins must be attached to the common-system  
DD  
DD  
89  
106  
137  
39  
87  
117  
144  
Ground reference for output buffers (clean ground). All V  
common-system ground plane.  
pins must be attached to the  
SSC  
V
I
I
SSC  
SSL  
2
52  
53  
73  
36  
V
Groundreferencefordigitallogic.AllV  
SSL  
pinsmustbeattachedtothecommon-systemgroundplane.  
108  
128  
129  
11  
19  
62  
91  
V
SS  
I
Ground connections for output buffers. All V pins must be attached to system ground plane.  
SS  
134  
1
10  
35  
71  
88  
NC  
These pins should be left unconnected.  
90  
107  
109  
I = input, O = output  
NOTE 1: Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
13  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
Token-Ring Media Interface  
PIN  
DESCRIPTION  
I/O  
NAME  
NO.  
DRVR  
115  
114  
Differential-driver data output. DRVR and DRVR are the differential outputs that send the TI380C25  
transmit data to the TMS38054 for driving onto the ring-transmit-signal pair.  
O
O
DRVR  
FRAQ  
Frequency-acquisition control. FRAQ determines the use of frequency- or phase-acquisition mode in  
the TMS38054.  
111  
H = Wide range. Frequency centering to PXTALIN by TMS38054.  
L
= Narrow range. Phase lock onto the incoming data (RCVINA and RCVINB) by the TMS38054.  
Insert-control signal to the TMS38054. NSRT enables the phantom-driver outputs (PHOUTA and  
PHOUTB) of the TMS38054, through the watchdog timer, for insertion onto the token ring.  
NSRT  
112  
118  
O
I
Static high  
Static low  
NSRT low and pulsed high  
=
=
=
Inactive, phantom current removed (due to watchdog timer)  
Inactive, phantom current removed (due to watchdog timer)  
Active, current output on PHOUTA and PHOUTB  
Ring-interface clock-frequency control (see Note 5). At 16-Mbps ring speed, PXTALIN must be  
supplied a 32-MHz signal. At 4-Mbps ring speed, PXTALIN must be 8 MHz and can be the output from  
OSCOUT.  
PXTALIN  
Ring-interface recovered clock (see Note 5). RCLK is the clock recovered by the TMS38054 from the  
token-ring received data. For 16-Mbps operation, RCLK is a 32-MHz clock; for 4-Mbps operation,  
RCLK is an 8-MHz clock.  
RCLK  
RCVR  
120  
121  
I
I
Ring-interface received data (see Note 5). RCVR contains the data received by the TMS38054 from  
the token ring.  
Ring-interface ready. REDY indicates the presence of received data as monitored by the TMS38054  
energy-detect capacitor.  
REDY  
WFLT  
110  
113  
I
I
H = Not ready. Ignore received data.  
L
= Ready. Received data.  
Wire-faultdetect. WFLTis an input to the TI380C25 driven by the TMS38054. WFLTindicates a current  
imbalance of the TMS38054 PHOUTA and PHOUTB pins.  
H = No wire fault detected  
L
= Wire fault detected  
Internal wrap select. WRAP is an output from the TI380C25 to the ring interface to activate an internal  
attenuated feedback path from the transmitted data (DRVR) to receive data (RCVR) signals for  
bring-up diagnostic testing. When active, the TMS38054 also cuts off the current drive to the  
transmission pair.  
WRAP  
116  
O
H = Normal ring operation  
L
= Transmit data drives receive data (loopback).  
I = input, O = output  
NOTE 5: Pin has an expanded input-voltage specification.  
14  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Pin Functions (Continued)  
Token-Ring Media Interface  
PIN  
NAME  
DESCRIPTION  
I/O  
NO.  
Network select inputs. TEST0TEST2 are used to select the network speed and type to be used by  
the TI380C25. These inputs should be changed only during adapter reset. Connect TEST2 to V  
TEST0 TEST1 TEST2 DESCRIPTION  
.
DDL  
TEST0  
TEST1  
TEST2  
103  
102  
101  
I
L
H
X
NC  
NC  
X
H
H
L
16-Mbps token ring  
4-Mbps token ring  
Reserved  
TEST3  
TEST4  
TEST5  
100  
99  
98  
Test inputs. TEST3TEST5 should be left unconnected (see Note 1). Module-in-place test mode is  
achieved by tying TEST3 and TEST4 to ground. In this mode, all TI380C25 outputs are in the  
high-impedance state. Internal pullups on all TI380C25 inputs are disabled (except TEST3TEST5).  
I
I
External fail-to-match signal. An enhanced-address-copy-option (EACO) device uses XFAIL to  
indicateto the TI380C25 that it should not copy the frame nor set the ARI/FCI bits in a token-ringframe  
due to an external address match.The ARI/FCI bits in a token-ring frame can be set due to an internal  
address-matched frame. If an EACO device is not used, XFAIL must be left unconnected. XFAIL is  
ignored when CAF mode is enabled [see table in XMATCH description (see Note 1)].  
XFAIL  
104  
H = No address match by external address checker  
L
= External address-checker-armed state  
External match signal. An enhanced-address-copy-option (EACO) device uses XMATCH to indicate  
to the TI380C25 to copy the frame and set the ARI/FCI bits in a token-ring frame. If an EACO device  
is not used, XMATCH must be left unconnected. XMATCH is ignored when CAF mode is enabled  
(see Note 1).  
H = Address match recognized by external address checker  
L
= External address-checker-armed state  
XMATCH  
105  
I
XMATCH  
XFAIL  
FUNCTION  
0
0
1
0
1
0
Armed (processing frame data)  
Do not externally match the frame (XFAIL takes precedence).  
Copy the frame  
1
Hi-Z  
1
Hi-Z  
Do not externally match the frame (XFAIL takes precedence).  
Reset state (adapter not initialized)  
I = input, O = output  
NOTE 1: Pin has an internal pullup device to maintain a high-voltage level when left unconnected (no etch).  
15  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
architecture  
The major blocks of the TI380C25 include the communications processor (CP), system interface (SIF), memory  
interface (MIF), protocol handler (PH), clock generator (CG), and adapter-support function (ASF). The  
functionality of each block is described in the following sections.  
communications processor (CP)  
The CP performs the control and monitoring of the other functional blocks in the TI380C25. The control and  
monitoring protocols are specified by the software (downloaded or ROM based) in local memory. Available  
protocols include:  
Media access control (MAC) software  
Logical link control (LLC) software  
Copy all frames (CAF) software  
The CP is a proprietary 16-bit central processing unit (CPU) with data cache and a single prefetch pipe for  
pipelining of instructions. These features enhance the TI380C25 maximum performance capability to about 8  
million instructions per second (MIPS) with an average of about 5 MIPS.  
system interface (SIF)  
The SIF performs the interfacing of the LAN subsystem to the host system. This interface may require additional  
logic depending on the application. The system interface can transfer information/data using any of these three  
methods:  
Direct memory access (DMA)  
Direct input/output (DIO)  
Pseudo-direct memory access (PDMA)  
DMA (or PDMA) is used to transfer all data to/from host memory from / to local memory. The main uses of DIO  
are for loading the software to local memory and for initializing the TI380C25. DIO also allows command/status  
interrupts to occur to and from the TI380C25.  
The system interface can be hardware selected for either of two modes by use of SI / M. The mode selected  
determines the memory organizations and control signals used. These modes are as follows:  
The Intel 80x8x families: 8-, 16-, and 32-bit bus devices  
The Motorola 68xxx microprocessor family: 16- and 32-bit bus devices  
The system interface supports host-system memory addressing up to 32 bits (32-bit reach into the host-system  
memory). This allows greater flexibility in using/accessing host-system memory. System designers can  
customize the system interface to their particular bus by using one of the following:  
Programmable burst transfers or cycle-steal DMA operations  
Optional parity protection  
These features are implemented in hardware to reduce system overhead, facilitate automatic rearbitration of  
the bus after a burst, or repeat a cycle when errors occur (parity or bus). Bus retries are also supported.  
The system-interface hardware also includes features to enhance the integrity of the TI380C25 and the data.  
These features include the following:  
Always internally maintain odd-byte parity regardless of parity being disabled  
Monitor for the presence of a clock failure  
Can switch SIF speeds from 2 MHz to 33 MHz  
On every cycle, the system interface compares all the system clocks to a reference clock. If any of the clocks  
become invalid, the TI380C25 enters the slow-clock mode, which prevents latch-up of the TI380C25. If the  
SBCLK is invalid, any DMA cycle is terminated immediately; otherwise, the DMA cycle is completed and the  
TI380C25 is placed in slow-clock mode.  
16  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
system interface (SIF) (continued)  
When the TI380C25 enters the slow-clock mode, the clock that failed is replaced by a slow free-running clock  
and the device is placed into a low-power reset state. When the failed clock(s) return to valid operation, the  
TI380C25 must be reinitialized.  
For DMA with a 16-MHz clock, a continuous transfer rate of 64 megabits per second (8 Mbps) can be obtained.  
For DMA with a 25-MHz clock, a continuous transfer rate of 96 megabits per second (12 Mbps) can be obtained.  
For DMA with a 33-MHz clock, a continuous transfer rate of 128 megabits per second (16 Mbps) can be  
obtained. For 8-bit and 16-bit pseudo-DMA, the following data rates can be obtained:  
LOCAL BUS SPEED  
4 MHz  
8-BIT PDMA  
48 Mbps  
16-BIT PDMA  
64 Mbps  
6 MHz  
72 Mbps  
96 Mbps  
Since the main purpose of DIO is for downloading and initialization, the DIO transfer rate is not a significant  
issue.  
memory interface (MIF)  
The MIF performs the memory management to allow the TI380C25 to address 2M bytes in local memory.  
Hardware in the MIF allows the TI380C25 to be directly connected to DRAMs without additional circuitry. This  
glueless-DRAM connection includes the DRAM refresh controller. The MIF also handles all internal bus  
arbitration between these blocks. When required, the MIF then arbitrates for the external bus.  
The MIF is responsible for the memory mapping of the CPU of a task. The memory maps of DRAMs, EPROMs,  
burned-in addresses (BIA), and external devices are appropriately addressed when required by the system  
interface, protocol handler, or for a DMA transfer.  
The memory interface is capable of a 64-Mbps continuous transfer rate when using a 4-MHz local bus (64-MHz  
device crystal) and a 96-Mbps continuous transfer rate when using a 6-MHz local bus.  
protocol handler (PH)  
The PH performs the hardware-based real-time protocol functions for a token-ring LAN. Network type is  
determined by TEST0TEST2. Token-ring network is determined by software and can be either 16 Mbps or  
4 Mbps. These speeds are not fixed by the hardware but by the software.  
The PH converts the parallel-transmit data to serial-network data of the appropriate coding and converts the  
received serial data to parallel data. The PH data-management state machines direct the  
transmission / reception of data to / from local memory through the MIF. The PH buffer-management state  
machines automatically oversee this process, directly sending / receiving linked lists of frames without CPU  
intervention.  
The protocol handler contains many state machines that provide the following features:  
Transmit and receive frames  
Capture tokens  
Provide token-priority controls  
Manage the TI380C25 buffer memory  
Provide frame-address recognition (group, specific, functional, and multicast)  
Provide internal parity protection  
Control and verify the PHY-layer circuitry-interface signals  
Integrity of the transmitted and received data is assured by cyclic redundancy checks (CRC), detection of  
network data violations, and parity on internal data paths. All data paths and registers are optionally parity  
protected to assure functional integrity.  
17  
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TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
adapter-support function (ASF)  
The ASF performs support functions not contained in the other blocks. The support functions are:  
The TI380C25 base timer  
Identification, management, and service of internal and external interrupts  
Test-pin mode control, including the unit-in-place mode for board testing  
Illegal state check (checks for illegal states such as parity and illegal opcodes)  
clock generator (CG)  
The CG performs the generation of all the internal clocks required by the other functional blocks, including the  
local memory-bus clocks (MBCLK1, MBCLK2). The CG also generates the reference timer used to sample all  
inputclocks(SBCLK, OSCIN, RCLK, andPXTALIN). Ifnotransitionisdetectedwithintheperiodofthereference  
timer on any input clock signal, the CG places the TI380C25 into slow-clock mode. The frequency of the  
reference timer is in the range of 10 kHz100 kHz.  
user-accessible hardware registers and TI380C25 internal pointers  
The following tables show how to access internal data via pointers and how to address the registers in the host  
interface. The SIFACL register, which directly controls device operation, is described in detail. The  
adapter-internal pointers table on the following page is defined only after TI380C25 initialization and until the  
OPEN command is issued. These pointers are defined by the TI380C25 software (microcode), and this table  
describes the release 2.x of the TI380C25 software.  
18  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Adapter-Internal Pointers for Token Ring  
ADDRESS  
DESCRIPTION  
Pointer to software raw microcode level in chapter 0  
>00.FFF8  
>00.FFFA  
Pointer to starting location of copyright notices. Copyright notices are separated by a >0A character and  
terminated by a >00 character in chapter 0.  
>01.0A00  
>01.0A02  
>01.0A04  
Pointer to burned-in address in chapter 1  
Pointer to software level in chapter 1  
Pointer to TI380C25 addresses in chapter 1:  
Pointer + 0 node address  
Pointer + 6 group address  
Pointer + 10 functional address  
>01.0A06  
Pointer to TI380C25 parameters in chapter 1:  
Pointer + 0 physical-drop number  
Pointer + 4 upstream neighbor address  
Pointer + 10 upstream physical-drop number  
Pointer + 14 last ring-poll address  
Pointer + 20 reserved  
Pointer + 22 transmit access priority  
Pointer + 24 source class authorization  
Pointer + 26 last attention code  
Pointer + 28 source address of the last received frame  
Pointer + 34 last beacon type  
Pointer + 36 last major vector  
Pointer + 38 ring status  
Pointer + 40 soft-error timer value  
Pointer + 42 ring-interface error counter  
Pointer + 44 local ring number  
Pointer + 46 monitor error code  
Pointer + 48 last beacon-transmit type  
Pointer + 50 last beacon-receive type  
Pointer + 52 last MAC-frame correlator  
Pointer + 54 last beaconing-station UNA  
Pointer + 60 reserved  
Pointer + 64 last beaconing-station physical-drop number  
>01.0A08  
>01.0A0A  
Pointer to MAC buffer (a special buffer used by the software to transmit adapter-generated MAC frames) in chapter 1  
Pointer to LLC counters in chapter 1:  
Pointer + 0 MAX_SAPs  
Pointer + 1 open SAPs  
Pointer + 2 MAX_STATIONs  
Pointer + 3 open stations  
Pointer + 4 available stations  
Pointer + 5 reserved  
>01.0A0C  
>01.0A0E  
Pointer to 4-/16-Mbps word flag. If zero, the adapter is set to run at 4 Mbps. If nonzero, the adapter is set to run at 16 Mbps.  
Pointer to total TI380C25 RAM found in 1K bytes in RAM allocation test in chapter 1.  
This table describes the pointers for release 2.x of the TI380C25 software.  
This address valid only for microcode release 2.x  
19  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
User-Access Hardware Registers  
80x8x 16-BIT MODE: (SI / M = 1, S8 / SHALT = 0)  
NORMAL MODE  
SBHE = 0  
PSEUDO-DMA MODE ACTIVE  
SBHE = 0  
WORD TRANSFERS  
SRS2 = 0  
SRS2 = 0  
SBHE = 0  
BYTE TRANSFERS  
SBHE = 1  
SRS2 = 0  
SBHE = 0  
SRS2 = 1  
SBHE = 1  
SRS2 = 0  
SRS2 = 1  
SRSX  
SRS0  
SRS1  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
SIFDAT MSB  
SIFDAT LSB  
SIFDAT / INC LSB  
SIFADR LSB  
SIFSTS  
SIFACL LSB  
SIFADR LSB  
SIFADX LSB  
DMALEN LSB  
SDMADAT MSB  
DMALEN MSB  
SDMAADR MSB  
SDMAADX MSB  
SIFACL MSB  
SIFADR MSB  
SIFADX MSB  
DMALEN MSB  
SDMADAT LSB  
DMALEN LSB  
SDMAADR LSB  
SDMAADX LSB  
SIFACL LSB  
SIFADR LSB  
SIFADX LSB  
DMALEN LSB  
SIFDAT / INC MSB  
SIFADR MSB  
SIFCMD  
SIFACL MSB  
SIFADR MSB  
SIFADX MSB  
DMALEN MSB  
SBHE = 1 and SRS2 = 1 are not defined  
80x8x 8-BIT MODE: (SI / M = 1, S8/SHALT = 1)  
NORMAL MODE  
SBHE = X  
PSEUDO-DMA MODE ACTIVE  
SBHE = X  
SRSX  
SRS0  
SRS1  
SRS2  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
SIFDAT LSB  
SIFDAT MSB  
SIFDAT/INC LSB  
SIFDAT/INC MSB  
SIFADR LSB  
SIFADR MSB  
SIFSTS  
SDMADAT LSB  
SDMADAT MSB  
DMALEN LSB  
DMALEN MSB  
SDMAADR LSB  
SDMAADR MSB  
SDMAADX LSB  
SDMAADX MSB  
SIFACL LSB  
SIFCMD  
SIFACL LSB  
SIFACL MSB  
SIFADR LSB  
SIFADR MSB  
SIFADX LSB  
SIFADX MSB  
DMALEN LSB  
DMALEN MSB  
SIFACL MSB  
SIFADR LSB  
SIFADR MSB  
SIFADX LSB  
SIFADX MSB  
DMALEN LSB  
DMALEN MSB  
68xxx MODE: (SI/M = 0)  
NORMAL MODE  
PSEUDO-DMA MODE ACTIVE  
SUDS = 0  
WORD TRANSFERS  
SUDS = 0  
SLDS = 0  
SLDS = 0  
SUDS = 0  
SLDS = 1  
SUDS = 1  
SLDS = 0  
SUDS = 0  
SLDS = 1  
SUDS = 1  
SLDS = 0  
BYTE TRANSFERS  
SRSX  
SRS0  
SRS1  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
SIFDAT MSB  
SIFDAT/INC MSB  
SIFADR MSB  
SIFCMD  
SIFACL MSB  
SIFADR MSB  
SIFADX MSB  
DMALEN MSB  
SIFDAT LSB  
SIFDAT/INC LSB  
SIFADR LSB  
SIFSTS  
SIFACL LSB  
SIFADR LSB  
SIFADX LSB  
DMALEN LSB  
SDMADAT MSB  
DMALEN MSB  
SDMAADR MSB  
SDMAADX MSB  
SIFACL MSB  
SIFADR MSB  
SIFADX MSB  
DMALEN MSB  
SDMADAT LSB  
DMALEN LSB  
SDMAADR LSB  
SDMAADX LSB  
SIFACL LSB  
SIFADR LSB  
SIFADX LSB  
DMALEN LSB  
68xxx mode is always 16 bit.  
20  
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TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SIF adapter-control register (SIFACL)  
The SIFACL register allows the host processor to control and to some extent reconfigure the TI380C25 under  
software control.  
SIFACL Register  
Bit #  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
T
E
S
T
0
T
E
S
T
1
T
E
S
T
2
NSEL  
OUT0  
NSEL  
OUT1  
SWHLDA SWDDIR SWHRQ PSDMAEN ARESET CPHALT BOOT  
LBP  
SINTEN  
PEN  
RW  
–0  
R
R
R
RP 0  
R u  
R 0  
RS 0  
RW 0  
RP b  
RP b  
RW 1  
RP–p  
RP– 0  
RP–1  
Legend:  
R
W
P
S
–n  
b
=
=
=
=
=
=
=
=
Read  
Write  
Write during ARESET = 1 only  
Set only  
Value after reset  
Value on BTSTRP  
Value on PRTYEN  
Indeterminate  
p
u
Bits 02:  
Value on TEST0 and TEST2 pins  
These bits are read only and always reflect the value on the corresponding device pins. This  
allows the host S/W to determine speed configuration. If the network speed and type are  
software configurable, these bits can be used to determine which configurations are supported  
by the network hardware.  
TEST0 TEST1 TEST2 Description  
L
H
X
NC  
NC  
X
H
H
L
16-Mbps token ring  
4-Mbps token ring  
Reserved  
Bit 3:  
Bit 4:  
Reserved. Read data is indeterminate.  
SWHLDA — Software Hold Acknowledge  
This bit allows the function of SHLDA / SBGR to be emulated from software control for  
pseudo-DMA mode.  
PSDMAEN  
SWHLDA  
SWHRQ  
RESULT  
0
X
0
0
1
X
0
1
X
SWHLDA value in the SIFACL register cannot be set to a one.  
No pseudo-DMA request pending  
1
1
Indicates a pseudo-DMA request interrupt  
Pseudo-DMA process in progress  
1
The value on SHLDA / SBGR is ignored.  
21  
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TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Bit 5:  
SWDDIR — Current SDDIR Signal Value  
This bit contains the current value of the pseudo-DMA direction. This enables the host to easily  
determine the direction of DMA transfers, which allows system DMA to be controlled by system  
software.  
0
1
=
=
Pseudo DMA from host system to TI380C25  
Pseudo DMA from TI380C25 to host system  
Bit 6:  
SWHRQ — Current SHRQ Signal Value  
This bit contains the current value on SHRQ/SBRQ when in Intel mode, and the inverse of the  
value on SHRQ/SBRQ when in Motorola mode. This enables the host to easily determine if a  
pseudo-DMA transfer is requested.  
INTEL MODE (SI/M = H)  
= System bus not requested  
= System bus requested  
MOTOROLA MODE (SI/M = L)  
System bus not requested  
System bus requested  
0
1
Bit 7:  
Bit 8:  
PSDMAEN — Pseudo-System-DMA Enable  
This bit enables pseudo-DMA operation.  
0
1
=
=
Normal bus-master DMA operation is possible.  
Pseudo-DMA operation selected. Operation dependent on the values of the SWHLDA  
and SWHRQ bits in the SIFACL register.  
ARESET — Adapter Reset  
This bit is a hardware reset of the TI380C25. This bit has the same effect as SRESET except  
that the DIO interface to the SIFACL register is maintained. This bit is set to 1 if a clock failure  
is detected (OSCIN, PXTALIN, RCLK, or SBCLK not valid).  
0
1
=
=
The TI380C25 operates normally.  
The TI380C25 is held in the reset condition.  
Bit 9:  
CPHALT — Communications-Processor Halt  
This bit controls the TI380C25 processor access to the internal TI380C25 buses. This prevents  
the TI380C25 from executing instructions before the microcode has been downloaded.  
0
1
=
=
The TI380C25 processor can access the internal TI380C25 buses.  
The TI380C25 processor is prevented from accessing the internal adapter buses.  
Bit 10:  
BOOT — Bootstrap CP Code  
This bit indicates whether the memory in chapters 0 and 31 of the local-memory space is RAM  
or ROM/PROM/EPROM. This bit controls the operation of MCAS and MROMEN.  
0
1
=
=
ROM/PROM/EPROM memory in chapters 0 and 31  
RAM memory in chapters 0 and 31  
22  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
Bit 11:  
LBP — Local-Bus Priority  
This bit controls the priority levels of devices on the local bus.  
0
1
=
=
No external devices (such as TI380FPA) are used with the TI380C25.  
An external device (such as TI380FPA) is used with the TI380C25. This allows the  
external bus master to operate at the necessary priorities on the local bus.  
If the system uses the TMS380SRA only, the bit must be set to 0. If the system uses both the  
TMS380SRA and the TI380FPA, the bit must be set to 1.  
Bit 12:  
SINTEN — System-Interrupt Enable  
This bit allows the host processor to enable or disable system-interrupt requests from the  
TI380C25. The system-interrupt request from the TI380C25 is on SINTR/SIRQ. The following  
equation shows how SINTR/SIRQ is driven. The table also explains the results of the states.  
SINTR/SIRQ = (PSDMAEN * SWHRQ * !SWHLDA) + (SINTEN * SYSTEM_INTERRUPT)  
SYSTEM  
INTERRUPT  
(SIFSTS  
PSDMAEN  
SWHRQ SWHLDA  
SINTEN  
RESULT  
REGISTER)  
1
1
1
1
1
1
0
X
X
X
1
1
0
X
X
X
1
Pseudo DMA is active.  
The TI380C25 generated a system interrupt for a pseudo DMA.  
Not a pseudo-DMA interrupt  
0
0
X
X
X
X
X
X
X
The TI380C25 generates a system interrupt.  
The TI380C25 does not generate a system interrupt.  
The TI380C25 cannot generate a system interrupt.  
0
0
0
X
The value on SHLDA / SBGR is ignored.  
Bit 13:  
PEN — Parity Enable  
This bit determines whether data transfers within the TI380C25 are checked for parity.  
0
1
=
=
Data transfers are not checked for parity.  
Data transfers are checked for correct odd parity.  
Bit 14 – 15: NSELOUT0, NSELOUT0 1 — Network-Selection Outputs  
The values in these bits control NSELOUT0 and NSELOUT1. These bits can be modified only  
while the ARESET bit is set.  
These bits can be used to software configure a TI380C25 as follows: NSELOUT0 should be  
connected to TEST0 (TEST1 should be left unconnected and TEST2 should be tied high).  
NSELOUT0 and NSELOUT1 are used to select network speed as shown below:  
NSELOUT0  
NSELOUT1  
SELECTION  
Reserved  
0
0
1
1
0
1
0
1
16-Mbps token ring  
Reserved  
4-Mbps token ring  
At power up, these bits are set corresponding to 16-Mbps token ring (NSELOUT1 = 1,  
NSELOUT0 = 0).  
23  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SIFACL control for pseudo-DMA operation  
Pseudo DMA is software controlled by the use of five bits in the SIFACL register. The logic model for the SIFACL  
register control of pseudo-DMA operation is shown in Figure 2.  
Internal  
Signals  
Motorola Mode  
Host  
Interface  
M
U
X
SINTR/SIRQ  
SYSTEM_INTERRUPT  
(SIFSTS register)  
M
U
X
SHRQ/SBRQ  
SHLDA/SBGR  
DMA  
Request  
M
U
X
DMA  
Grant  
SDDIR  
DMADIR  
. . .  
. . .  
. . .  
SWHLDA  
SWDDIR  
SWHRQ  
PSDMAEN SINTEN  
SIFACL Register  
Figure 2. Pseudo-DMA Logic Related to SIFACL Bits  
24  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
(see Note 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
DD  
Input voltage range, V (see Note 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 20 V  
I
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 2 V to 7 V  
Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.9 W  
Operating free-air temperature range, T  
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 8: Voltage values are with respect to V  
.
SS  
recommended operating conditions  
MIN  
4.75  
0
NOM  
MAX  
5.25  
0
UNIT  
V
V
V
Supply voltage  
5
0
DD  
Supply voltage (see Note 9)  
V
SS  
TTL-level signal  
OSCIN  
2
V
V
V
+0.3  
DD  
DD  
DD  
V
High-level input voltage  
2.4  
2.6  
0.3  
+0.3  
+0.3  
V
IH  
RCLK, PXTALIN, RCVR  
V
IL  
Low-level input voltage, TTL-level signal (see Note 10)  
High-level output current  
0.8  
400  
2
V
I
I
µA  
mA  
°C  
°C  
OH  
High-level output current (see Note 11)  
Operating free-air temperature  
OL  
T
A
0
70  
T
C
Operating case temperature  
100  
NOTES: 9. All V  
pins should be routed to minimize inductance to system ground.  
SS  
10. The algebraic convention, where the more negative (less positive) limit is designated as a minimum, is used for logic-voltage levels  
only.  
11. Output current of 2 mA is sufficient to drive five low-power Schottky TTL loads or ten advanced low-power Schottky TTL loads (worst  
case).  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
V
V
High-level output voltage, TTL-level signal (see Note 12)  
Low-level output voltage, TTL-level signal  
V
V
V
V
= MIN,  
= MIN,  
= MAX,  
= MAX,  
I
I
= MAX  
= MAX  
= 2.4 V  
= 0.4 V  
2.4  
OH  
DD  
DD  
DD  
DD  
OH  
0.6  
20  
V
OL  
OL  
V
V
O
I
O
High-impedance output current  
µA  
– 20  
± 20  
160  
O
I
I
I
Input current, any input or input / output  
Supply current  
V = V  
to V  
DD  
µA  
mA  
mA  
pF  
I
I
SS  
V
= MAX  
= 5 V  
DD  
SCM  
DD  
DD  
Supply current, slow-clock mode  
Input capacitance, any input  
V
3
C
C
f = 1 MHz,  
f = 1 MHz,  
Others at 0 V  
Others at 0 V  
15  
15  
i
Output capacitance, any output or input/output  
pF  
o
For conditions shown as MIN/MAX, use the appropriate value specified under the recommended operating conditions.  
NOTE 12: The following signals require an external pullup resistor: SRAS/SAS, SRDY/SDTACK, SRD/SUDS, SWR/SLDS,  
EXTINT0EXTINT3, and MBRQ.  
25  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
PARAMETER MEASUREMENT INFORMATION  
timing parameters  
The timing parameters for all the signals of the TI380C25 are shown in the following tables and are illustrated  
in the accompanying figures. The purpose of these figures and tables is to quantify the timing relationships  
among the various signals. The parameters are numbered for convenience.  
static signals  
The following table lists signals that are not allowed to change dynamically and therefore have no timing  
associated with them. They should be strapped high, low, or left unconnected as required.  
SIGNAL  
SI/M  
FUNCTION  
Host-processor select (Intel/Motorola)  
Reserved  
CLKDIV  
BTSTRP  
PRTYEN  
TEST0  
TEST1  
TEST2  
TEST3  
TEST4  
TEST5  
Default-bootstrap mode (RAM/ROM)  
Default-parity select (enabled/disabled)  
Test terminal indicates network type  
NC  
Test terminal indicates network type  
Test terminal for TI manufacturing test  
Test terminal for TI manufacturing test  
Test terminal for TI manufacturing test  
For unit-in-place test  
timing parameter symbology  
Some timing parameter symbols have been created in accordance with JEDEC Standard 100-A. In order to  
shorten the symbols, some of the signal names and other related terminology have been abbreviated as shown  
below:  
DR  
DRVR  
DRVR  
OSCIN  
SBCLK  
RS  
SRESET  
, V  
DRN  
OSC  
SCK  
VDD  
V
DDL DD  
Lower case subscripts are defined as follows:  
c
d
h
w
cycle time  
r
sk  
su  
t
rise time  
delay time  
skew  
hold time  
setup time  
transition time  
pulse duration (width)  
The following additional letters and phrases are defined as follows:  
H
L
High  
Low  
Valid  
Z
High impedance  
No longer high  
No longer low  
Falling edge  
Rising edge  
V
26  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
PARAMETER MEASUREMENT INFORMATION  
Outputs are driven to a minimum high-logic level of 2.4 V and to a maximum low-logic level of 0.6 V. These levels  
are compatible with TTL devices.  
Output transition times are specified as follows: For a high-to-low transition on either an input or output signal,  
the level at which the signal is said to be no longer high is 2 V and the level at which the signal is said to be low  
is 0.8 V. For a low-to-high transition, the level at which the signal is said to be no longer low is 0.8 V and the level  
at which the signal is said to be high is 2 V, as shown below.  
TheriseandfalltimesarenotspecifiedbutareassumedtobethoseofstandardTTLdevices, whicharetypically  
1.5 ns.  
2 V (high)  
0.8 V (low)  
test measurement  
The test-load circuit shown in Figure 3 represents the programmable load of the tester pin electronics that are  
used to verify timing parameters of TI380C25 output signals.  
Tester Pin  
Electronics  
I
OL  
Output  
Under  
Test  
V
LOAD  
C
T
I
OH  
Where: I  
I
=
=
=
2 mA, dc-level verification (all outputs)  
400 µA (all outputs)  
1.5 V, typical dc-level verification or  
0.7 V, typical timing verification  
65 pF, typical load-circuit capacitance  
OL  
OH  
LOAD  
V
C
=
T
Figure 3. Test-Load Circuit  
27  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
power up, SBCLK, OSCIN, MBCLK1, MBCLK2, SYNCIN, and SRESET timing  
NO.  
MIN  
NOM  
MAX  
1
UNIT  
ms  
ms  
ms  
ns  
100  
101  
102  
103  
104  
105  
106  
107  
t
t
t
t
t
t
t
t
)
Rise time, 1.2 V to minimum V -high level  
DD  
r(VDD  
†‡  
†‡  
Delay time, minimum V -highlevel to first valid SBCLK no longer high  
DD  
1
d(VDDH-SCKV)  
d(VDDH-OSCV)  
c(SCK)  
Delay time, minimum V -high level to first valid OSCIN high  
DD  
1
Cycle time, SBCLK (see Note 13)  
Pulse duration, SBCLK high  
Pulse duration, SBCLK low  
Transition time, SBCLK  
30.3  
13  
500  
500  
500  
2
ns  
w(SCKH)  
w(SCKL)  
13  
ns  
ns  
t(SCK)  
Cycle time, OSCIN (see Note 14)  
1/OSCIN  
ns  
c(OSC)  
OSCIN = 64 MHz  
5.5  
8
108  
109  
t
Pulse duration, OSCIN high (see Note 15)  
OSCIN = 48 MHz  
OSCIN = 32 MHz  
OSCIN = 64 MHz  
OSCIN = 48 MHz  
OSCIN = 32 MHz  
ns  
ns  
w(OSCH)  
w(OSCL)  
8
5.5  
8
t
Pulse duration, OSCIN low (see Note 15)  
Transition time, OSCIN  
8
110  
t
t
t
t
t
t
t
3
1
ns  
ms  
ms  
µs  
µs  
ns  
ns  
t(OSC)  
111  
117  
118  
119  
288  
289  
Delay time, OSCIN valid to MBCLK1 and MBCLK2 valid  
d(OSCV-CKV)  
h(VDDH-RSL)  
w(RSH)  
Hold time, SRESET low after V  
Pulse duration, SRESET high  
Pulse duration, SRESET low  
reaches minimum high level  
5
14  
14  
10  
10  
DD  
w(RSL)  
Setup time, DMA size to SRESET high (Intel mode only)  
Hold time, DMA size from SRESET high (Intel mode only)  
su(RST)  
h(RST)  
CLKDIV = H  
CLKDIV = L  
2t  
2t  
c(OSC)  
t
M
One-eighth of a local memory cycle  
ns  
c(OSC)  
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
If parameter 101 or 102 cannot be met, parameter 117 must be extended by the larger difference: real value of parameter 101 or 102 minus the  
max value listed.  
NOTES: 13. SBCLK can be any value between 2 MHz to 33 MHz. This data sheet describes the system interface (SIF) timing parameters for  
the case of SBCLK at 25 MHz and at 33 MHz.  
14. The value of OSCIN can be 64 MHz ±1%, 32 MHz ± 1%, or 48 MHz ± 1%. If OSCIN is used to generate PXTALIN, the OSCIN  
tolerance must be ±0.01%.  
15. This is to assure a ± 5% duty-cycle crystal, provided that OSCIN meets the recommended operating conditions for V and V  
.
IL  
IH  
28  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
100  
Minimum V -High Level  
DD  
V
DD  
103  
106  
106  
104  
101  
105  
SBCLK  
OSCIN  
107  
110  
102  
108  
110  
109  
MBCLK1  
MBCLK2  
111  
118  
117  
119  
SRESET  
288  
289  
S8/SHALT  
NOTE A: In order to represent the information in one illustration, nonactual phase and timebase characteristics  
are shown. Refer to specified parameters for precise information.  
Figure 4. Timing for Power Up, System Clocks, SYNCIN, and SRESET  
29  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
memory-bus timing: local-memory clocks, MAL, MROMEN, MBIAEN, NMI, MRESET, and ADDRESS  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
1
MIN  
4t  
MAX  
UNIT  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Period of MBCLK1 and MBCLK2  
M
2
Pulse duration, clock high  
2t 9  
M
3
Pulse duration, clock low  
2t 9  
M
4
Hold time, MBCLK2 low after MBCLK1 high  
t
M
t
M
t
M
t
M
t
M
–9  
–9  
–9  
–9  
–9  
5
Hold time, MBCLK1 high after MBCLK2 high  
6
Hold time, MBCLK2 high after MBCLK1 low  
7
Hold time, MBCLK1 low after MBCLK2 low  
8
Setup time, address/enable on MAX0, MAX2, and MROMEN before MBCLK1 no longer high  
Setup time, row address on MADL0MADL7, MAXPH, and MAXPL before MBCLK1 no longer high  
Setup time, address on MADH0MADH7 before MBCLK1 no longer high  
Setup time, MAL high before MBCLK1 no longer high  
Setup time, address on MAX0, MAX2, and MROMEN before MBCLK1 no longer low  
9
t
t
14  
14  
M
10  
11  
12  
M
13  
0.5t 9  
M
Setup time, column address on MADL0MADL7, MAXPH, and MAXPL before MBCLK1 no  
longer low  
13  
0.5t 9  
ns  
M
14  
Setup time, status on MADH0MADH7 before MBCLK1 no longer low  
Setup time, NMI valid before MBCLK1 low  
0.5t 9  
M
ns  
ns  
ns  
ns  
ns  
120  
121  
126  
129  
30  
0
Hold time, NMI valid after MBCLK1 low  
Delay time, MBCLK1 no longer low to MRESET valid  
Hold time, column address/status after MBCLK1 no longer low  
0
20  
t
M
–7  
Reference  
4 Periods  
8 Periods  
12 Periods  
16 Periods  
20 Periods  
OSCIN  
(when CLKDIV = 1)  
OSCIN  
(when CLKDIV = 0)  
OSCOUT  
MBCLK1  
MBCLK2  
MBCLK1 and MBCLK2 have no timing relationship to OSCOUT. MBCLK1 and MBCLK2 can start on any OSCIN rising edge, depending on when  
the memory cycle starts execution.  
Figure 5. Clock Waveforms After Clock Stabilization  
30  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
M8  
4
M1  
M2  
M3  
M4  
M5  
M6  
M7  
M8  
M1  
1
t
M
3
MBCLK1  
MBCLK2  
6
2
1
5
8
7
3
2
12  
MAX0,  
MAX2,  
MROMEN  
ADD/EN  
Address  
9
13  
Col  
14  
Status  
MAXPH,  
MAXPL,  
MADL0MADL7  
Row  
10  
11  
Address  
MADH0MADH7  
MAL  
129  
120  
121  
NMI  
Valid  
126  
Valid  
MRESET  
Figure 6. Memory-Bus Timing: Local-Memory Clocks, MAL, MROMEN, MBIAEN, NMI, MRESET, and AD  
DRESS  
31  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
memory-bus timing: clocks, MRAS, MCAS, and MAL to ADDRESS  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
MIN  
1.5t – 11.5  
MAX  
UNIT  
Setup time, row address on MADL0MADL7, MAXPH, and MAXPL before MRAS no longer  
high  
15  
ns  
M
16  
17  
18  
19  
Hold time, row address on MADL0MADL7, MAXPH, and MAXPL after MRAS no longer high  
Delay time, MRAS no longer high to MRAS no longer high in the next memory cycle  
Pulse duration, MRAS low  
t
6.5  
ns  
ns  
ns  
ns  
M
8t  
M
4.5t 5  
M
Pulse duration, MRAS high  
3.5t 5  
M
Setup time, column address (MADL0MADL7, MAXPH, and MAXPL) and status  
(MADH0MADH7) before MCAS no longer high  
20  
21  
22  
0.5t 9  
ns  
ns  
ns  
M
Hold time, column address (MADL0MADL7, MAXPH, and MAXPL) and status  
(MADH0MADH7) after MCAS low  
t
M
–5  
Hold time, column address (MADL0MADL7, MAXPH, and MAXPL) and status  
(MADH0MADH7) after MRAS no longer high  
2.5t 6.5  
M
23  
24  
25  
26  
27  
28  
29  
30  
31  
Pulse duration, MCAS low  
3t 9  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
M
Pulse duration, MCAS high, refresh cycle follows read or write cycle  
Hold time, row address on MAXL0MAXL7, MAXPH, and MAXPL after MAL low  
Setup time, row address on MAXL0MAXL7, MAXPH, and MAXPL before MAL no longer high  
Pulse duration, MAL high  
2t 9  
M
1.5t 9  
M
t
M
t
M
t
M
–9  
–9  
–9  
Setup time, address/enable on MAX0, MAX2, and MROMEN before MAL no longer high  
Hold time, address/enable of MAX0, MAX2, and MROMEN after MAL low  
Setup time, address on MADH0MADH7 before MAL no longer high  
Hold time, address on MADH0MADH7 after MAL low  
1.5t 9  
M
t
M
–9  
1.5t 9  
M
32  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
MAXPH,  
MAXPL,  
MADL0MADL7  
Column  
Row  
16  
Column  
Row  
26  
17  
22  
15  
19  
18  
MRAS  
21  
23  
24  
20  
MCAS  
MAL  
25  
27  
28  
29  
MAX0,  
MAX2,  
MROMEN  
ADD/EN  
Address  
Address  
21  
30  
31  
20  
Status  
22  
MADH0MADH7  
Address  
Status  
Figure 7. Memory-Bus Timing: Clocks, MRAS, MCAS, and MAL to ADDRESS  
33  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
memory-bus timing: read cycle  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
MIN  
MAX  
6t – 23  
UNIT  
32  
Access time, address/enable valid on MAX0, MAX2, and MROMEN to valid data/parity  
ns  
M
Access time, address valid on MAXPH, MAXPL, MADH0MADH7, and MADL0MADL7 to  
valid data/parity  
33  
ns  
6t 23  
M
35  
36  
Access time, MRAS low to valid data/parity  
4.5t 21.5  
ns  
ns  
M
Hold time, valid data/parity after MRAS no longer low  
0
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0MADH7 and  
MADL0MADL7 after MRAS high (see Note 16)  
37  
2t 10.5  
M
ns  
38  
39  
Access time, MCAS low to valid data/parity  
3t –23  
M
ns  
ns  
Hold time, valid data/parity after MCAS no longer low  
0
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0MADH7, and  
MADL0MADL7 after MCAS high (see Note 16)  
40  
2t –13  
M
ns  
ns  
ns  
41  
Delay time, MCAS no longer high to MOE low  
t +13  
M
Setup time, address/status in the high-impedance state on MAXPH, MAXPL,  
MADL0MADL7, and MADH0MADH7 before MOE no longer high  
42  
0
43  
44  
45  
46  
Access time, MOE low to valid data/parity  
Pulse duration, MOE low  
2t 20  
M
ns  
ns  
ns  
ns  
2t 9  
M
Delay time, MCAS low to MOE no longer low  
Hold time, valid data/parity in after MOE no longer low  
3t 9  
M
0
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0MADH7, and  
MADL0MADL7 after MOE high (see Note 16)  
47  
2t 15  
M
ns  
ns  
ns  
Setup time, address/status in the high-impedance state on MAXPH, MAXPL,  
MADL0MADL7, and MADH0MADH7, before MBEN no longer high  
48  
0
0
Setup time, address/status in the high-impedance state on MAXPH, MAXPL,  
MADL0MADL7, and MADH0MADH7 and before MBIAEN no longer high  
48a  
49  
Access time, MBEN low to valid data/parity  
Access time, MBIAEN low to valid data/parity  
Pulse duration, MBEN low  
2t 25  
ns  
ns  
ns  
ns  
ns  
ns  
M
49a  
50  
2t 25  
M
2t 9  
M
50a  
51  
Pulse duration, MBIAEN low  
2t 9  
M
Hold time, valid data/parity after MBEN no longer low  
Hold time, valid data/parity after MBIAEN no longer low  
0
0
51a  
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0MADH7, and  
MADL0MADL7 after MBEN high (see Note 16)  
52  
2t 15  
ns  
ns  
M
Hold time, address in the high-impedance state on MAXPH, MAXPL, MADH0MADH7, and  
MADL0MADL7 after MBIAEN high  
52a  
2t 15  
M
53  
54  
55  
Hold time, MDDIR high after MBEN high, read follows write cycle  
Setup time, MDDIR low before MBEN no longer high  
1.5t 12  
ns  
ns  
ns  
M
3t 5  
M
Hold time, MDDIR low after MBEN high, write follows read cycle  
3t 12  
M
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
NOTE 16: The data/parity that exists on the address lines will most likely reach the high-impedance state sometime later than the rising edge  
of MRAS, MCAS, MOE, or MBEN (between MIN and MAX of timing parameter 36) and will be a function of the memory being read.  
The MIN time given represents the time from the rising edge of MRAS, MCAS, MOE, or MBEN to the beginning of the next address,  
and does not represent the actual high-impedance period on the address bus.  
34  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
MAX0,  
MAX2,  
MROMEN  
Address/  
Enable  
Address  
Data/Parity  
32  
MAXPH, MAXPL,  
MADH0MADH7,  
MADL0MADL7  
Address/  
Status  
Address  
Address  
33  
36  
37  
35  
MRAS  
MCAS  
38  
39  
40  
43  
45  
41  
42  
46  
47  
44  
MOE  
49a  
48a  
51a  
52a  
50a  
MBIAEN  
49  
51  
52  
48  
50  
MBEN  
53  
54  
55  
MDDIR  
Figure 8. Memory-Bus Timing: Read Cycle  
35  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
memory-bus timing: write cycle  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
MIN  
MAX  
UNIT  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
58  
60  
63  
64  
65  
66  
67  
69  
70  
71  
72  
73  
Setup time, MW low before MRAS no longer low  
Setup time, MW low before MCAS no longer low  
Setup time, valid data/parity before MW no longer high  
Pulse duration, MW low  
t
M
1.5t 6.5  
M
5.1  
2.5t 9  
M
Hold time, data/parity out valid after MW high  
Setup time, address valid on MAX0, MAX2, and MROMEN before MW no longer low  
Hold time, MRAS low to MW no longer low  
0.5t 10.5  
M
7t –11.5  
M
5.5t 9  
M
Hold time, MCAS low to MW no longer low  
4t –11.5  
M
Setup time, MBEN low before MW no longer high  
Hold time, MBEN low after MW high  
1.5t 13.5  
M
0.5t 6.5  
M
Setup time, MDDIR high before MBEN no longer high  
Hold time, MDDIR high after MBEN high  
2t 9  
M
1.5t 12  
M
MAX0,  
MAX2,  
MROMEN  
Address/  
Enable  
Address  
MAXPH, MAXPL,  
MADH0MADH7,  
MADL0MADL7  
Address  
ADD/STS  
Data/Parity Out  
MRAS  
MCAS  
58  
60  
65  
63  
64  
MW  
69  
67  
66  
71  
70  
MBEN  
72  
73  
MDDIR  
Figure 9. Memory-Bus Timing: Write Cycle  
36  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
memory-bus timing: DRAM-refresh timing  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
15  
MIN  
1.5t 11.5  
MAX  
UNIT  
ns  
Setup time, row address on MADL0MADL7, MAXPH, and MAXPL before MRAS no longer high  
Hold time, row address on MADL0MADL7, MAXPH, and MAXPL after MRAS no longer high  
Pulse duration, MRAS low  
M
16  
t
M
6.5  
ns  
18  
4.5t 5  
ns  
M
19  
Pulse duration, MRAS high  
3.5t 5  
ns  
M
73a Setup time, MCAS low before MRAS no longer high  
73b Hold time, MCAS low after MRAS low  
1.5t –11.5  
ns  
M
4.5t – 6.5  
M
ns  
73c Setup time, MREF high before MCAS no longer high  
73d Hold time, MREF high after MCAS high  
14  
ns  
t
M
–9  
ns  
Refresh  
Address  
MADL0MADL7  
Address  
16  
15  
19  
18  
MRAS  
73a  
73b  
MCAS  
73c  
73d  
MREF  
Figure 10. Memory-Bus Timing: DRAM-Refresh Cycle  
XMATCH and XFAIL timing  
t
is the cycle time of one-eighth of a local-memory cycle (31.25 ns minimum for a 4-MHz local bus or  
M
20.83 ns minimum for a 6-MHz local bus).  
NO.  
MIN  
7t  
MAX  
UNIT  
ns  
127 Delay time, status bit 7 high to XMATCH and XFAIL recognized  
128 Pulse duration, XMATCH or XFAIL high  
M
50  
ns  
Status  
Bit 7  
MADH7  
127  
128  
XMATCH,  
XFAIL  
Figure 11. XMATCH and XFAIL Timing  
37  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
token ring: ring-interface timing  
NO.  
MIN  
TYP  
125  
MAX UNIT  
4Mbps  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
153  
Period of RCLK (see Note 17)  
16 Mbps  
31.25  
4 Mbps nominal: 62.5 ns  
16 Mbps nominal: 15.625 ns  
4 Mbps nominal: 62.5 ns  
16 Mbps nominal: 15.625 ns  
46  
15  
35  
8
154L Pulse duration, RCLK low  
154H Pulse duration, RCLK high  
155  
156  
Setup time, RCVR valid before rising edge (1.8 V) of RCLK at 16 Mbps  
Hold time, RCVR valid after rising edge (1.8 V) of RCLK at 16 Mbps  
10  
4
4 Mbps  
40  
8
158L Pulse duration, ring baud clock low  
158H Pulse duration, ring baud clock high  
16 Mbps  
4 Mbps  
40  
8
16 Mbps  
4 Mbps  
125  
165  
Period of OSCOUT and PXTALIN (see Note 17)  
Tolerance of PXTALIN input frequency (see Note 17)  
16 Mbps (for PXTALIN only)  
31.25  
± 0.01  
%
NOTE 17: This parameter is not tested but is required by the IEEE 802.5 specification.  
153  
154H  
RCLK  
RCVR  
154L  
156  
155  
Valid  
158H  
158L  
OSCOUT,  
PXTALIN  
1.5 V  
165  
Figure 12. Ring-Interface Timing  
38  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
token ring: transmitter timing  
NO.  
MIN MAX  
UNIT  
ns  
DelayfromDRVRrisingedge(1.8V)toDRVR falling edge (1 V)orDRVRfalling  
edge (1 V) to DRVR rising edge (1.8 V)  
159  
160  
161  
t
t
t
±2  
sk(DR)  
Delay from RCLK (or PXTALIN) falling edge (1 V) to DRVR rising edge (1.8 V) See Note 18  
ns  
d(DR)H  
Delay from RCLK (or PXTALIN) falling edge (1 V) to DRVR falling edge  
(1 V)  
See Note 18  
See Note 18  
ns  
d(DR)L  
Delay from RCLK (or PXTALIN) falling edge (1 V) to DRVR falling edge  
(1 V)  
162  
163  
t
t
ns  
ns  
d(DRN)H  
Delay from RCLK (or PXTALIN) falling edge (1 V) to DRVR rising edge (1.8 V) See Note 18  
(DRN)L  
td(DR)L td(DRN)H  
td(DR)H td(DRN)L  
DRVR / DRVR  
asymmetry  
164  
±1.5  
ns  
2
2
When in active-monitor mode, the clock source is PXTALIN; otherwise, the clock source is either RCLK or PXTALIN.  
NOTE 18: This parameter is not tested to a minimum or a maximum but is measured and used as a component required for parameter 164.  
2.6 V  
RCLK or PXTALIN  
DRVR  
1.5 V  
0.6 V  
2.4 V  
1.5 V  
0.6 V  
160  
161  
159  
159  
2.4 V  
1.5 V  
0.6 V  
DRVR  
162  
163  
Figure 13. Skew and Asymmetry From RCLK or PXTALIN to DRVR and DRVR  
39  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x DIO read-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
15  
MAX  
MIN  
15  
MAX  
255  
256  
Delay time, SRDY low to either SCS or SRD high  
Pulse duration, SRAS high  
ns  
ns  
30  
30  
Hold time, SAD in the high-impedance state after SRD low  
(see Note 19)  
259  
260  
261  
0
0
0
0
ns  
ns  
ns  
ns  
ns  
Setup time, SADH0SADH7, SADL0SADL7, SPH, and  
SPL valid before SRDY low  
Delay time, SRD or SCS high to SAD in the high-impedance  
state (see Note 19)  
35  
35  
Hold time, output data valid after SRD or SCS high  
(see Note 19)  
261a  
264  
0
0
Setup time, SRSX, SRS0SRS2, SCS, and SBHE valid to  
SRAS no longer high (see Note 20)  
30  
30  
Hold time, SRSX, SRS0SRS2, SCS, and SBHE valid after  
SRAS low  
265  
10  
15  
15  
10  
15  
15  
ns  
ns  
ns  
266a  
Setup time, SRAS high to SRD no longer high (see Note 20)  
Setup time, SRSX, SRS0SRS2 valid before SRD no longer  
high (see Note 19)  
267  
Hold time, SRSX, SRS0SRS2 valid after SRD no longer low  
(see Note 20)  
268  
0
0
ns  
Setup time, SRD, SWR, and SIACK high from previous cycle  
to SRD no longer high  
272a  
273a  
275  
t
t
t
t
ns  
ns  
ns  
c(SCK)  
c(SCK)  
Hold time, SRD, SWR, and SIACK high after SRD high  
c(SCK)  
0
c(SCK)  
0
Delay time, SRD and SWR, or SCS high to SRDY high  
(see Note 19)  
25  
25  
Delay time, SRD and SWR, high to SRDY in the  
high-impedance state  
279  
0
0
t
0
0
t
ns  
ns  
c(SCK)  
c(SCK)  
282a  
282R  
Delay time, SDBEN low to SRDY low in a read cycle  
t
t
/ 2 + 4  
t
t
/ 2 + 4  
c(SCK)  
c(SCK)  
Delay time, SRD low to SDBEN low (see TMS380 Second  
Generation Token-Ring User’s Guide, SPWU005, subsection  
3.4.1.1.1), provided previous cycle completed  
0
t
+ 3  
0
t
+ 3  
ns  
c(SCK)  
c(SCK)  
283R  
286  
Delay time, SRD high to SDBEN high (see Note 19)  
0
/ 2 + 4  
0
/ 2 + 4  
ns  
ns  
c(SCK)  
c(SCK)  
Pulse duration, SRD high between DIO accesses  
(see Note 19)  
t
t
c(SCK)  
c(SCK)  
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
It is the later of SRD and SWR or SCS low that indicates the start of the cycle.  
NOTES: 19. The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge  
cycles.  
20. In 80x8x mode, SRAS can be used to strobe the values of SBHE, SRSX, SRS0 – SRS2, and SCS. When used to do so, SRAS must  
meet parameter 266a, and SBHE, SRS0SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a  
and 264 are irrelevant and parameter 268 must be met.  
40  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS, SRSX,  
SRS0SRS2,  
SBHE  
Valid  
Valid  
264  
268  
265  
SRAS  
256  
266a  
267  
SIACK  
272a  
273a  
273a  
SWR  
SRD  
272a  
272a  
273a  
286  
High  
SDDIR  
279  
282R  
283R  
SDBEN  
275  
255  
282a  
Hi-Z  
Hi-Z  
Hi-Z  
SRDY  
261  
260  
261a  
259  
SADH0SADH7,  
SADL0SADL7,  
Hi-Z  
Output Data Valid  
§
SPH, SPL  
In 80x8x mode, SRAS can be used to strobe the values of SBHE, SRSX, SRS0SRS2, and SCS. When used to do so, SRAS must meet  
parameter 266a, and SBHE, SRS0SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a and 264 are  
irrelevant and parameter 268 must be met.  
§
When the TMS380C25 begins to drive SDBEN inactive, it has already latched the write data internally. Parameter 263 must be met to the input  
of the data buffers.  
In 8-bit 80x8x mode DIO reads, the SADH0SADH7 contain don’t care data.  
Figure 14. 80x8x DIO Read-Cycle Timing  
41  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x DIO write-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
15  
MAX  
MIN  
15  
MAX  
255  
256  
Delay time, SRDY low to either SCS or SWR high  
Pulse duration, SRAS high  
ns  
ns  
30  
30  
Setup time, SADH0SADH7, SADL0SADL7, SPH, and SPL  
valid before SCS or SWR no longer low  
262  
263  
264  
15  
15  
30  
15  
15  
30  
ns  
ns  
ns  
Hold time, SADH0SADH7, SADL0SADL7, SPH, and SPL  
valid after SCS or SWR high  
Setup time, SRSX, SRS0SRS2, SCS, and SBHE to SRAS no  
longer high (see Note 20)  
Hold time, SRSX, SRS0SRS2, SCS, and SBHE after SRAS  
low  
265  
10  
15  
15  
10  
15  
15  
ns  
ns  
ns  
266a  
Setup time, SRAS high to SWR no longer high (see Note 19)  
Setup time, SRSX, SRS0SRS2 before SWR no longer high  
(see Note 19)  
267  
Hold time, SRSX, SRS0SRS2 valid after SWR no longer low  
(see Note 20)  
268  
0
0
ns  
Setup time, SRD, SWR, and SIACK high from previous cycle to  
SWR no longer high  
272a  
273a  
t
t
t
t
ns  
ns  
c(SCK)  
c(SCK)  
Hold time, SRD, SWR, and SIACK high after SWR high  
c(SCK)  
c(SCK)  
Delay time, SRDY low in the first DIO access to the SIF register  
to SRDY low in the immediately following access to the SIF (see  
TMS380 Second-Generation Token Ring User’s Guide,  
SPWU005, subsection 3.4.1.1.1)  
276  
4000  
25  
4000  
25  
ns  
275  
Delay time, SWR or SCS high to SRDY high (see Note 19)  
Delay time, SWR high to SRDY in the high-impedance state  
Delay time, SWR low to SDDIR low (see Note 19)  
If SIF register is  
0
0
0
0
0
0
ns  
ns  
ns  
§
279  
t
t
c(SCK)  
c(SCK)  
280  
t
t
/ 2 + 4  
t
t
/ 2 + 4  
c(SCK)  
c(SCK)  
ready (no waiting  
required)  
0
0
/ 2 + 4  
0
0
/ 2 + 4  
c(SCK)  
c(SCK)  
Delay time, SDBEN low to SRDY low (see  
TMS380 Second Generation Token-Ring  
282b  
ns  
User’s Guide, SPWU005, subsection  
3.4.1.1.1)  
If SIF register is  
not ready (waiting  
required)  
4000  
4000  
282W Delay time, SDDIR low to SDBEN low  
283W Delay time, SCS or SWR high to SDBEN no longer low  
286 Pulse duration, SWR high between DIO accesses (see Note 19)  
0
0
t
t
/ 2 + 4  
/ 2 + 4  
0
0
t
t
/ 2 + 4  
/ 2 + 4  
ns  
ns  
ns  
c(SCK)  
c(SCK)  
c(SCK)  
c(SCK)  
t
t
c(SCK)  
c(SCK)  
§
It is the later of SRD and SWR or SCS low that indicates the start of the cycle.  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
NOTES: 19. The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge  
cycles.  
20. In 80x8x mode, SRAS can be used to strobe the values of SBHE, SRSX, SRS0SRS2, and SCS. When used to do so, SRAS must  
meet parameter 266a, and SBHE, SRS0SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a  
and 264 are irrelevant and parameter 268 must be met.  
42  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS, SRSX,  
SRS0SRS2,  
SBHE  
Valid  
264  
268  
265  
SRAS  
SIACK  
SWR  
256  
266a  
267  
273a  
272a  
273a  
286  
272a  
SRD  
273a  
272a  
280  
SDDIR  
282W  
283W  
SDBEN  
279  
276  
275  
255  
SRDY  
282b  
Hi-Z  
Hi-Z  
263  
262  
SADH0SADH7,  
SADL0SADL7,  
Hi-Z  
Data  
Hi-Z  
SPH, SPL  
When the TMS380C25 begins to drive SDBEN inactive, it has already latched the write data internally. Parameter 263 must be met to the input  
of the data buffers.  
In 8-bit 80x8x-mode DIO writes, the value placed on SADH0SADH7 is a don’t care.  
Figure 15. 80x8x DIO Write-Cycle Timing  
43  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x interrupt-acknowledge-cycle timing: first SIACK pulse  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
286  
287  
Pulse duration, SIACK high between DIO accesses (see Note 19)  
Pulse duration, SIACK low on first pulse of two pulses  
t
t
t
t
ns  
ns  
c(SCK)  
c(SCK)  
c(SCK)  
c(SCK)  
NOTE 19: The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt acknowledge cycles.  
SRD, SWR,  
SCS  
286  
287  
First  
Second  
SIACK  
Figure 16. 80x8x Interrupt-Acknowledge-Cycle Timing: First SIACK Pulse  
80x8x interrupt-acknowledge-cycle timing: second SIACK pulse  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
255  
Delay time, SRDY low to SCS high  
15  
15  
ns  
ns  
ns  
ns  
Hold time, SAD in the high-impedance state after SIACK low  
(see Note 19)  
259  
260  
261  
0
0
0
0
Setup time, output data valid before SRDY low  
Delay time, SIACK high to SAD in the high-impedance state  
(see Note 19)  
35  
35  
261a  
272a  
273a  
275  
Hold time, output data valid after SIACK high (see Note 19)  
Setup time, inactive data strobe high to SIACK no longer high  
Hold time, inactive data strobe high after SIACK high  
Delay time, SIACK high to SRDY high (see Note 19)  
0
0
ns  
ns  
ns  
ns  
t
t
t
t
c(SCK)  
c(SCK)  
c(SCK)  
0
c(SCK)  
0
25  
25  
Delay time, SRDY low in the first DIO access to the SIF register  
to SRDY low in the immediately following access to the SIF  
276  
4000  
4000  
ns  
279  
Delay time, SIACK high to SRDY in the high-impedance state  
Delay time, SDBEN low to SRDY low in a read cycle  
0
0
t
0
0
t
ns  
ns  
c(SCK)  
c(SCK)  
282a  
282R  
283R  
t
t
/ 2 + 4  
t
/ 2 + 4  
c(SCK)  
c(SCK)  
Delay time, SIACK low to SDBEN low (see TMS380 Second  
Generation Token-Ring User’s Guide, SPWU005, subsection  
3.4.1.1.1), provided previous cycle completed  
0
t
+ 3  
0
0
t
+ 3  
ns  
ns  
c(SCK)  
c(SCK)  
Delay time, SIACK high to SDBEN high (see Note 19)  
0
/ 2 + 4  
t
/ 2 + 4  
c(SCK)  
c(SCK)  
This specification is provided as an aid to board design. It is not assured during manufacturing.  
This specification has been characterized to meet stated value. It is not assured during manufacturing.  
NOTE 19: The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge cycles.  
44  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS, SRSX,  
SRS0SRS2,  
SBHE  
Only SCS needs to be inactive.  
All others are don’t care.  
SIACK  
SWR  
273a  
273a  
272a  
272a  
272a  
SRD  
273a  
High  
SDDIR  
279  
282R  
283R  
275  
SDBEN  
276  
282a  
255  
SRDY  
Hi-Z  
259  
Hi-Z  
261  
260  
261a  
SADH0SADH7,  
SADL0SADL7,  
Hi-Z  
Output Data Valid  
Hi-Z  
SPH, SPL  
SRDY is an active-low bus ready signal. It must be asserted before data output.  
In 8-bit 80x8x mode DIO writes, the value placed on SADH0SADH7 is a don’t care.  
Figure 17. 80x8x Interrupt-Acknowledge-Cycle Timing: Second SIACK Pulse  
45  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x-mode bus-arbitration timing, SIF takes control  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, asynchronous signal SBBSY and SHLDA before SBCLK no  
longer high to assure recognition on that cycle  
208a  
10  
10  
ns  
ns  
ns  
Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to  
assure recognition on that cycle  
208b  
10  
0
10  
0
Delay time, SBCLK low to SADH0SADH7, SADL0SADL7, SPH, and  
SPL valid  
212  
20  
20  
224a  
224c  
230  
Delay time, SBCLK low in cycle I2 to SOWN low  
20  
28  
20  
25  
15  
23  
15  
25  
ns  
ns  
ns  
ns  
Delay time, SBCLK low in cycle I2 to SDDIR low in DMA read  
Delay time, SBCLK high to SHRQ high  
241  
Delaytime, SBCLKhighinTXcycletoSRDand SWRhigh, busacquisition  
Hold time, SRD and SWR in the high-impedance state after SOWN low,  
bus acquisition  
241a  
t
t
ns  
c(SCK)15  
c(SCK)15  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
46  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
User Master  
Bus Exchange  
SIF Master  
(T4)  
I1  
I2  
TX  
SIF Inputs:  
SBCLK  
208a  
SBBSY,  
SHLDA  
208b  
230  
SIF Outputs:  
SHRQ  
241  
SRD, SWR  
SBHE  
241a  
212  
SADH0SADH7,  
SADL0SADL7,  
SPH, SPL  
Address  
224c  
Write  
SDDIR  
Read  
224a  
SOWN  
While the system interface DMA controls are active (i.e., SOWN is asserted), SCS is disabled.  
Figure 18. 80x8x-Mode Bus-Arbitration Timing, SIF Takes Control  
47  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x-mode DMA read-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, SADL0SADL7, SADH0SADH7,  
205  
206  
SPH, and SPL valid before SBCLK in T3 cycle no  
longer high  
10  
10  
ns  
Hold time, SADL0SADL7, SADH0SADH7, SPH,  
and SPL valid after SBCLK low in T4 cycle if  
parameters 207a and 207b not met  
10  
10  
ns  
Hold time, SADL0SADL7, SADH0SADH7, SPH,  
and SPL valid after SRD high  
207a  
207b  
0
0
0
0
ns  
ns  
Hold time, SADL0SADL7, SADH0SADH7, SPH,  
and SPL valid after SDBEN no longer low  
Setup time, asynchronous signal SRDY before  
SBCLK no longer high to assure recognition on this  
cycle  
208a  
10  
10  
10  
10  
ns  
Hold time, asynchronous signal SRDY after SBCLK  
low to assure recognition on this cycle  
208b  
212  
ns  
ns  
Delay time, SBCLK low to address valid  
20  
20  
20  
20  
15  
20  
Delay time, SBCLK low in T1 cycle to  
SADH0SADH7, SADL0SADL7, SPH, and SPL in  
the high-impedance state  
214  
ns  
216  
Delay time, SBCLK high to SALE or SXAL high  
Hold time, SALE or SXAL low after SRD high  
ns  
ns  
216a  
217  
0
0
0
0
Delay time, SBCLK high to SXAL low in the TX cycle  
or SALE low in the T1 cycle  
25  
25  
ns  
ns  
Hold time, SADH0SADH7, SADL0SADL7, SPH,  
and SPL valid after SALE or SXAL low  
218  
t
15  
t
/2 – 4  
t
15  
t
/2 – 4  
w(SCKH)  
c(SCK)  
w(SCKH)  
c(SCK)  
Delay time, SBCLK low in T4 cycle to SRD high  
(see Note 21)  
223R  
225R  
0
16  
0
11  
ns  
ns  
Delay time, SBCLK low in T4 cycle to SDBEN high  
16  
15  
11  
15  
Delay time, SADH0SADH7, SADL0SADL7,  
SPH, and SPL in the high-impedance state to SRD  
low  
226  
227R  
0
0
0
0
0
0
ns  
ns  
ns  
ns  
ns  
Delay time, SBCLK low in T2 cycle to SRD low  
Hold time, SADH0SADH7, SADL0SADL7, SPH,  
and SPL in the high-impedance state after SBCLK  
low in T1 cycle  
229  
231  
233  
Pulse duration, SRD low  
2t  
25  
2t  
25  
c(SCK)  
c(SCK)  
Setup time, SADH0SADH7, SADL0SADL7,  
SPH, and SPL valid before SALE, SXAL no longer  
high  
10  
10  
237R  
247  
Delay time, SBCLK high in the T2 cyle to SDBEN low  
16  
11  
ns  
ns  
Setup time, data valid before SRDY low if parameter  
208a not met  
0
0
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
NOTE 21: While the system-interface DMA controls are active (i.e., SOWN is asserted), SCS is disabled.  
48  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TWAIT  
V
T4  
TX  
T1  
T2  
T3  
T4  
T1  
SBCLK  
SRAS  
Hi-Z  
212  
SBHE  
Valid  
High  
SWR  
227R  
223R  
SRD  
218  
216  
217  
216  
217  
SXAL  
SALE  
226  
216a  
212  
233  
207a  
206  
214  
205  
229  
Address  
233  
218  
212  
SADH0–SADH7,  
SADL0–SADL7,  
Address  
218  
Data  
§
SPH, SPL  
247  
Extended  
Address  
207b  
225R  
208a  
SRDY  
208b  
237R  
SDBEN  
SDDIR  
Low  
§
In 8-bit 80x8x mode, SBHE/SRNW is a don’t care input during DIO and an inactive (high) output during DMA.  
Motorola-style bus slaves hold SDTACK active until the bus master deasserts SAS.  
In 8-bit 80x8x mode, the most significant byte of the address is maintained on SADH for T2, T3, and T4. The address is maintained according to parameter 21; i.e., held after T4 high.  
If parameter 208A is not met, valid data must be present before SRDY goes low.  
Figure 19. 80x8x-Mode DMA Read-Cycle Timing  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x-mode DMA write-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, asynchronous signal SRDY before  
208a  
SBCLK no longer high to assure recognition on that  
cycle  
10  
10  
ns  
Hold time, asynchronous signal SRDY after SBCLK  
low to assure recognition on that cycle  
208b  
212  
10  
10  
ns  
ns  
Delay time, SBCLK low to SADH0SADH7,  
SADL0SADL7, SPH, and SPL valid  
20  
20  
20  
20  
216  
Delay time, SBCLK high to SALE or SXAL high  
Hold time, SALE or SXAL low after SWR high  
ns  
ns  
216a  
0
0
0
0
Delay time, SBCLK high to SXAL low in the TX cycle  
or SALE low in the T1 cycle  
217  
218  
219  
25  
25  
ns  
ns  
ns  
Hold time, address valid after SALE, SXAL low  
t
15  
12  
t
/2 – 4  
t
15  
12  
t
/2 – 4  
w(SCKH)  
c(SCK)  
w(SCKH)  
c(SCK)  
Delay time, SBCLK low in T2 cycle to output data and  
parity valid  
29  
29  
Hold time, SADH0SADH7, SADL0SADL7, SPH,  
and SPL valid after SWR high  
221  
t
t
ns  
c(SCK)  
c(SCK)  
223W  
225W  
Delay time, SBCLK low to SWR high  
0
16  
16  
0
11  
11  
ns  
ns  
Delay time, SBCLK high in T4 cycle to SDBEN high  
Hold time, SDBEN low after SWR, SUDS, and SLDS  
high  
225WH  
227W  
t
/2 – 7  
t
/2 – 7  
ns  
ns  
c(SCK)  
c(SCK)  
Delay time, SBCLK low in T2 cycle to SWR low  
0
20  
16  
0
15  
11  
Setup time, SADH0SADH7, SADL0SADL7,  
SPH, and SPL valid before SALE, SXAL no longer  
high  
233  
10  
10  
ns  
ns  
237W  
Delay time, SBCLK high in T1 cycle to SDBEN low  
50  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TWAIT  
V
T4  
TX  
T1  
T2  
T3  
T4  
T1  
SBCLK  
212  
SBHE  
Valid  
High  
SRD  
223W  
227W  
SWR  
216  
217  
217  
SXAL  
216  
216a  
SALE  
212  
233  
218  
233  
SADL0–  
SADH7,  
SADH0–  
SADL7,  
221  
218  
212  
219  
Address  
Output Data  
SPH, SPL  
Extended Address  
208a  
SRDY  
225W  
237W  
208b  
225WH  
SDBEN  
SDDIR  
High  
In 8-bit 80x8x mode, SBHE/SRNW is a don’t care input during DIO and an inactive (high) output during DMA.  
In 8-bit 80x8x mode, the most significant byte of the address is maintained on SADH for T2, T3, and T4. The address is maintained according to parameter 21; i.e., held after T4 high.  
Figure 20. 80x8x-Mode DMA Write-Cycle Timing  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x-mode bus-arbitration timing, SIF returns control  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Delay time, SBCLK low in I1 cycle to SADH0SADH7, SADL0SADL7, SPL, SPH,  
SRD, and SWR in the high-impedance state  
220  
35  
35  
ns  
223b  
224b  
224d  
230  
Delay time, SBCLK low in I1 cycle to SBHE in the high-impedance state  
Delay time, SBCLK low in cycle I2 to SOWN high  
Delay time, SBCLK low in cycle I2 to SDDIR high  
Delay time, SBCLK high in cycle I1 to SHRQ low  
45  
20  
27  
20  
45  
15  
22  
15  
ns  
ns  
ns  
ns  
0
0
0
0
Setup time, SRD, SWR, and SBHE in the high-impedance state before SOWN no longer  
low  
240  
ns  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
SIF Master  
Bus Exchange  
User Master  
T3  
T4  
I1  
I2  
(T1)  
(T2)  
SBCLK  
SHLDA  
SIF Outputs:  
230  
SHRQ  
220  
240  
SRD, SWR  
Hi-Z  
223b  
SBHE  
SIF  
SIF  
Hi-Z  
Hi-Z  
240  
220  
SADH0SADH7,  
SADL0SADL7,  
SPH, SPL  
224d  
224b  
Write  
Read  
SDDIR  
SOWN  
In 80x8x mode, the system interface deasserts SHRQ on the rising edge of SBCLK following the T4 state of the last system bus transfer it  
controls. In68xxxmode, thesysteminterfacedeassertsSBRQontherisingedgeofSBCLKinstateT2ofthefirstsystembustransferitcontrols.  
While the system-interface DMA controls are active (i.e., SOWN is asserted), SCS is disabled.  
Figure 21. 80x8x-Mode Bus-Arbitration Timing, SIF Returns Control  
52  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
80x8x-mode bus-release timing  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, asynchronous input SBRLS low before SBCLK no longer high to assure  
recognition  
208a  
10  
10  
ns  
208b Hold time, asynchronous input SBRLS low after SBCLK low to assure recognition  
208c Hold time, SBRLS low after SOWN high  
10  
0
10  
0
ns  
ns  
T(W or 2)  
T3  
T4  
T1  
T2  
SBCLK  
208a  
208b  
SBRLS  
(see Note A)  
SOWN  
208c  
NOTES: A. The system interface ignores the assertion of SBRLS if it does not own the system bus. If it does own the bus, when it detects the  
assertion of SBRLS, it completes any internally started DMA cycle and relinquishes control of the bus. If no DMA transfer has  
internally started, the system interface releases the bus before starting another.  
B. If SBERR is asserted when the system interface controls the system bus, the current bus transfer is completed regardless of the  
value of SRDY. If the BERETRY register is nonzero, the cycle is retried. If the BERETRY register is zero, the system interface  
releases control of the system bus. The system interface ignores the assertion of SBERR if it is not performing a DMA bus cycle  
onthesystembus. WhenSBERRisproperlyassertedandBERETRYiszero, thesysteminterfacereleasesthebusuponcompletion  
of the current bus transfer and halts all further DMA on the system side. The error is synchronized to the local bus and DMA stops  
on the local sides. The value of the SDMAADR, SDMADDRX, and SDMALEN registers in the system interface are not defined after  
a system-bus error.  
C. In cycle-steal mode, state TX is present on every system bus transfer. In burst mode, state TX is present on the first bus transfer  
and whenever the increment of the DMA address register carries beyond the least significant 16 bits.  
D. SDTACK is not sampled to verify that it is deasserted.  
E. Unless otherwise specified, for all signals specified as a maximum delay from the end of an SBCLK transition to the signal valid,  
the signal is also specified to hold its previous value (including high impedance) until the start of that SBCLK transition.  
Figure 22. 80x8x-Mode Bus-Release Timing  
53  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx DIO read-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
255  
259  
Delay time, SDTACK low to either SCS, SUDS, or SLDS high  
15  
15  
ns  
ns  
Hold time, SAD in the high-impedance state after SUDS or SLDS  
low (see Note 19)  
0
0
0
0
Setup time, SADH0SADH7, SADL0SADL7, SPH, and SPL  
valid before SDTACK low  
260  
261  
ns  
ns  
Delay time, SCS, SUDS, or SLDS high to SADH0SADH7,  
SADL0SADL7, SPH, and SPL in the high-impedance state  
(see Note 19)  
35  
35  
Hold time, output data valid after SUDS or SLDS no longer low  
(see Note 19)  
261a  
267  
268  
272  
0
15  
0
0
15  
0
ns  
ns  
ns  
ns  
Setup time, register address before SUDS or SLDS no longer  
high (see Note 19)  
Hold time, register address valid after SUDS or SLDS no longer  
low (see Note 20)  
Setup time, SRNW before SUDS or SLDS no longer high  
(see Note 19)  
12  
12  
273  
Hold time, SRNW after SUDS or SLDS high  
0
0
ns  
ns  
273a  
Hold time, SIACK high after SUDS or SLDS high  
t
t
c(SCK)  
c(SCK)  
Delay time, SCS, SUDS, or SLDS high to SDTACK high  
(see Note 19)  
275  
0
25  
0
25  
ns  
ns  
Delaytime, SDTACKlow inthe first DIO access to the SIF register  
to SDTACK low in the immediately following access to the SIF  
276  
279  
4000  
4000  
Delay time, SUDS or SLDS high to SDTACK in the  
high-impedance state  
0
0
t
0
0
t
ns  
ns  
c(SCK)  
c(SCK)  
282a  
282R  
Delay time, SDBEN low to SDTACK low  
t
t
/2 + 4  
t
/2 + 4  
c(SCK)  
c(SCK)  
Delay time, SUDS or SLDS low to SDBEN low (see TMS380  
Second Generation Token-Ring User’s Guide, SPWU005,  
subsection 3.4.1.1.1) provided the previous cycle completed  
0
t
+ 3  
0
t
+ 3  
ns  
c(SCK)  
c(SCK)  
283R  
286  
Delay time, SUDS or SLDS high to SDBEN high (see Note 19)  
0
/2 + 4  
0
t
/2 + 4  
ns  
ns  
c(SCK)  
c(SCK)  
Pulse duration, SUDS or SLDS high between DIO accesses  
(see Note 19)  
t
t
c(SCK)  
c(SCK)  
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
NOTES: 19. The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt acknowledge  
cycles.  
20. In 80x8x mode, SRAS may be used to strobe the values of SBHE, SRSX, SRS0SRS2, and SCS. When used to do so, SRAS must  
meet parameter 266a, and SBHE, SRS0SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a  
and 264 are irrelevant and parameter 268 must be met.  
54  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS, SRSX,  
SRS0, SRS1  
Valid  
267  
268  
SIACK  
SRNW  
273a  
272  
273  
SUDS,  
SLDS  
286  
SDDIR  
High  
279  
282R  
283R  
SDBEN  
276  
282a  
275  
255  
SDTACK  
Hi-Z  
Hi-Z  
Hi-Z  
261  
259  
260  
261a  
SADH0SADH7,  
SADL0SADL7,  
SPH, SPL  
Hi-Z  
Output Data Valid  
SDTACK is an active-low bus ready signal. It must be asserted before data output.  
Figure 23. 68xxx DIO Read-Cycle Timing  
55  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx DIO write-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
15  
MAX  
MIN  
15  
MAX  
255  
262  
263  
Delay time, SDTACK low to either SCS, SUDS or SLDS high  
Setup time, write data valid before SUDS or SLDS no longer low  
Hold time, write data valid after SUDS or SLDS high  
ns  
ns  
ns  
15  
15  
15  
15  
Setup time, register address before SUDS or SLDS no longer  
high (see Note 19)  
267  
268  
272  
15  
0
15  
0
ns  
ns  
ns  
Hold time, register address valid after SUDS or SLDS no longer  
low (see Note 20)  
Setup time, SRNW before SUDS or SLDS no longer high  
(see Note 19)  
12  
12  
Setup time, inactive SUDS or SLDS high to active data strobe no  
longer high  
272a  
273  
t
t
t
t
ns  
ns  
ns  
c(SCK)  
c(SCK)  
Hold time, SRNW after SUDS or SLDS high  
0
0
Hold time, inactive SUDS or SLDS high after active data strobe  
high  
273a  
c(SCK)  
0
c(SCK)  
0
Delay time, SCS, SUDS or SLDS high to SDTACK high  
(see Note 19)  
275  
25  
25  
ns  
ns  
Delaytime, SDTACKlowinthefirstDIOaccesstotheSIFregister  
to SDTACK low in the immediately following access to the SIF  
276  
4000  
4000  
Delay time, SUDS or SLDS high to SDTACK in the  
high-impedance state  
§
279  
280  
0
0
t
0
0
t
ns  
ns  
c(SCK)  
c(SCK)  
Delay time, SUDS or SLDS low to SDDIR low (see Note 19)  
If SIF register is  
t
t
/2 + 4  
/2 + 4  
t
t
/2 + 4  
/2 + 4  
c(SCK)  
c(SCK)  
ready (no waiting  
required)  
0
0
0
0
c(SCK)  
c(SCK)  
Delay time, SDBEN low to SDTACK low  
(see TMS380 Second Generation Token-  
282b  
ns  
Ring User’s Guide, SPWU005, subsection  
3.4.1.1.1)  
If SIF register is  
not ready (waiting  
required)  
4000  
4000  
282W  
283W  
Delay time, SDDIR low to SDBEN low  
0
0
t
t
/2 + 4  
0
0
t
t
/2 + 4  
ns  
ns  
c(SCK)  
c(SCK)  
/2 + 4  
c(SCK)  
Delay time, SUDS or SLDS high to SDBEN no longer low  
/2 + 4  
c(SCK)  
Pulse duration, SUDS or SLDS high between DIO accesses  
(see Note 19)  
286  
t
t
ns  
c(SCK)  
c(SCK)  
§
It is the later of SRD and SWR or SCS low that indicates the start of the cycle.  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
NOTES: 19. The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge  
cycles.  
20. In 80x8x mode, SRAS may be used to strobe the values of SBHE, SRSX, SRS0SRS2, and SCS. When used to do so, SRAS must  
meet parameter 266a, and SBHE, SRS0SRS2, and SCS must meet parameter 264. If SRAS is strapped high, parameters 266a  
and 264 are irrelevant and parameter 268 must be met.  
56  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS SRSX,  
SRS0, SRS1  
Valid  
267  
272  
268  
SIACK  
273a  
273  
SRNW  
SUDS,  
286  
272a  
SLDS  
273a  
280  
SDDIR  
High  
282W  
283W  
SDBEN  
279  
276  
275  
255  
§
Hi-Z  
Hi-Z  
SDTACK  
263  
282b  
262  
SADH0SADH7,  
SADL0SADL7,  
SPH, SPL  
Hi-Z  
Data  
Hi-Z  
For 68xxx mode, skew between SLDS and SUDS must not exceed 10 ns. Provided this limitation is observed, all events referenced to a data  
strobe edge use the later occurring edge. Events defined by two data strobes edges, such as parameter 286, are measured between latest and  
earlier edges.  
§
When the TMS380C25 begins to drive SDBEN inactive, it has already latched the write data internally. Parameter 263 must be met to the input  
of the data buffers.  
SDTACK is an active-low bus ready signal. It must be asserted before data output.  
Figure 24. 68xxx DIO Write-Cycle Timing  
57  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx interrupt-acknowledge-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
255  
259  
260  
261  
Delay time, SDTACK low to either SCS or SUDS, or SIACK high  
15  
15  
ns  
ns  
ns  
ns  
Hold time, SAD in the high-impedance state after SIACK no  
longer high (see Note 19)  
0
0
0
0
Setup time, output data valid before SDTACK no longer high  
Delay time, SIACK high to SAD in the high-impedance state  
(see Note 19)  
35  
35  
Hold time, output data valid after SCS or SIACK no longer low  
(see Note 19)  
261a  
0
0
ns  
ns  
ns  
Setup time, register address before SIACK no longer high  
(see Note 19)  
§
267  
15  
15  
Setup time, inactive high SIACK to active data strobe no longer  
high  
272a  
t
t
t
t
c(SCK)  
c(SCK)  
273a  
275  
Hold time, inactive SRNW high after active data strobe high  
Delay time, SCS or SRNW high to SDTACK high (see Note 19)  
ns  
ns  
c(SCK)  
0
c(SCK)  
0
25  
25  
Delaytime,SDTACKlowinthefirstDIOaccessto theSIFregister  
to SDTACK low in the immediately following access to the SIF  
276  
0
4000  
0
4000  
ns  
279  
Delay time, SIACK high to SDTACK in the high-impedance state  
Delay time, SDBEN low to SDTACK low in a read cycle  
0
0
t
0
0
t
ns  
ns  
c(SCK)  
c(SCK)  
282a  
282R  
t
t
/2 + 4  
t
/2 + 4  
c(SCK)  
c(SCK)  
Delay time, SIACK low to SDBEN low (see TMS380 Second  
Generation Token-Ring User’s Guide, SPWU005, subsection  
3.4.1.1.1) provided the previous cycle completed  
0
t
+ 3  
0
t
+ 3  
ns  
c(SCK)  
c(SCK)  
283R  
286  
Delay time, SIACK high to SDBEN high (see Note 19)  
0
/2 + 4  
0
t
/2 + 4  
ns  
ns  
c(SCK)  
c(SCK)  
Pulseduration, SIACKhighbetweenDIOaccesses(seeNote19)  
t
t
c(SCK)  
c(SCK)  
§
This specification is provided as an aid to board design. It is not assured during manufacturing testing.  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
It is the later of SRD and SRD or SCS low that indicates the start of the cycle.  
NOTE 19: The inactive chip select is SIACK in DIO read and DIO write cycles, and SCS is the inactive chip select in interrupt-acknowledge cycles.  
58  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
SCS, SRSX,  
SRS0, SRS1,  
SBHE  
Only SCS needs to be Inactive.  
All others are don’t care.  
267  
SIACK  
SRNW  
286  
272a  
273a  
SLDS  
286  
High  
SDDIR  
279  
282R  
283R  
SDBEN  
275  
255  
276  
Hi-Z  
282a  
260  
Hi-Z  
SDTACK  
261  
259  
261a  
SADH0SADH7,  
SADL0SADL7,  
Hi-Z  
Output Data Valid  
Hi-Z  
SPH, SPL  
SDTACK is an active-low bus ready signal. It must be asserted before data output.  
Internal logic drives SDTACK high and verifies that it has reached a valid high level before making it a 3-state signal.  
Figure 25. 68xxx Interrupt-Acknowledge-Cycle Timing  
59  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx-mode bus-arbitration timing, SIF takes control  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, asynchronous input SBGR before SBCLK no longer high to  
assure recognition on this cycle  
208a  
10  
10  
ns  
ns  
Hold time, asynchronous input SBGR after SBCLK low to assure  
recognition on this cycle  
208b  
10  
10  
212  
Delay time, SBCLK low to address valid  
0
0
20  
20  
28  
20  
25  
0
0
20  
15  
23  
15  
25  
ns  
ns  
ns  
ns  
ns  
224a  
224c  
230  
Delay time, SBCLK low in cycle I2 to SOWN low (see Note 22)  
Delay time, SBCLK low in cycle I2 to SDDIR low in DMA read  
Delay time, SBCLK high to either SHRQ low or SBRQ high  
Delay time, SBCLK high in TX cycle to SUDS and SLDS high  
241  
Hold time, SUDS, SLDS, SRNW, and SAS in the high-impedance state  
after SOWN low, bus acquisition  
241a  
t
t
ns  
c(SCK)15  
c(SCK)15  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
NOTE 22: Motorola-style bus slaves hold SDTACK active until the bus master deasserts SAS.  
60  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
User Master  
Bus Exchange  
SIF Master  
T1  
(T4)  
I1  
I2  
TX  
T2  
SIF Inputs:  
SBCLK  
208b  
208a  
SBGR  
SBERR,  
SDTACK,  
SBBSY  
SIF Outputs:  
230  
230  
SBRQ  
208a  
208b  
241  
241  
SAS, SLDS,  
SUDS  
Output  
Input  
Read  
Write  
SRNW  
212  
SADH0–  
SADH7,  
SADL0–  
SADL7,  
Hi-Z  
SIF  
SPH, SPL  
224c  
224a  
Write  
Read  
SDDIR  
241a  
SOWN  
In 80x8x mode, the system interface deasserts SHRQ on the rising edge of SBCLK following the T4 state of the last system bus transfer it controls. In 68xxx mode, the system interface  
deasserts SBRQ on the rising edge of SBCLK in state T2 of the first system bus transfer it controls.  
While the system-interface DMA controls are active (i.e., SOWN is asserted), SCS is disabled.  
Figure 26. 68xxx-Mode Bus-Arbitration Timing, SIF Takes Control  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx-mode DMA read-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, input data valid before SBCLK in T3  
cycle no longer high  
205  
10  
10  
ns  
ns  
ns  
ns  
Hold time, input data valid after SBCLK low in T4  
cycle if parameters 207a and 207b not met  
206  
10  
0
10  
0
Holdtime, inputdatavalidafterdatastrobenolonger  
207a  
low  
Hold time, input data valid after SDBEN no longer  
207b  
low  
0
0
Setup time, asynchronous input SDTACK before  
208a  
SBCLK no longer high to assure recognition on this  
cycle  
10  
10  
10  
ns  
Hold time, asynchronous input SDTACK after  
SBCLK low to assure recognition on this cycle  
208b  
209  
10  
ns  
ns  
t
+
18  
t
+
18  
c(SCK)  
w(SCKL)  
c(SCK)  
w(SCKL)  
Pulse duration, SAS, SUDS, and SLDS high  
t
t
Delay time, SBCLK high in T2 cycle to SUDS and  
SLDS active  
210  
212  
16  
20  
20  
20  
11  
20  
15  
20  
ns  
ns  
ns  
ns  
ns  
Delay time, SBCLK low to address valid  
Delay time, SBCLK low in T2 cycle to SAD in the  
high-impedance state  
214  
216  
Delay time, SBCLK high to SALE or SXAL high  
Hold time, SALE or SXAL low after SUDS and SAS  
high  
216a  
217  
0
0
0
0
Delay time, SBCLK high to SXAL low in the TX cycle  
or SALE low in the T1 cycle  
25  
25  
ns  
218  
222  
Hold time, address valid after SALE, SXAL low  
Delay time, SBCLK high to SAS low  
t
15  
t
/2 – 4  
c(SCK)  
20  
t
15  
t
/2 – 4  
c(SCK)  
15  
ns  
ns  
w(SCKH)  
w(SCKH)  
Delay time, SBCLK low in T4 cycle to SUDS, SLDS,  
and SAS high (see Note 23)  
223R  
225R  
0
16  
16  
0
11  
11  
ns  
ns  
ns  
Delay time, SBCLK low in T4 cycle to SDBEN high  
Hold time, SAD in the high-impedance state after  
SBCLK low in T4 cycle  
229  
0
0
Setup time, address valid before SALE or SXAL no  
longer high  
233  
10  
10  
ns  
ns  
ns  
233a  
237R  
t
15  
t
15  
Setup time, address valid before SAS no longer high  
w(SCKL)  
w(SCKL)  
Delay time, SBCLK high in the T2 cycle to SDBEN  
low  
16  
11  
Setup time, data valid before SDTACK low if  
parameter 208a not met  
247  
0
0
ns  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
NOTE 23: While the system-interface DMA controls are active (i.e., SOWN is asserted), SCS is disabled.  
62  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TWAIT  
V
T4  
TX  
T1  
T2  
T3  
T4  
T1  
S1  
222  
210  
S2  
S3  
S4  
S5  
S6  
S7  
SBCLK  
SAS  
209  
209  
223R  
SUDS,  
SLDS  
218  
217  
High  
217  
216  
SRNW  
SXAL  
216  
218  
216a  
SALE  
229  
212  
233a  
212  
206  
205  
233  
233  
214  
207a  
SADL0SADH7,  
SADH0SADL7,  
SPH, SPL  
Address  
Data In  
Hi-Z  
Extended Address  
247  
207b  
208a  
§¶  
SDTACK  
208b  
SDDIR  
237R  
225R  
SDBEN  
On a read cycle, the read strobe remains active until the internal sample of incoming data is completed. Input data may be removed when either the read strobe or SDBEN becomes  
no longer active.  
§
If parameter 208a is not met, valid data must be present before SDTACK goes low.  
Motorola-style bus slaves hold SDTACK active until the bus master deasserts SAS.  
All V  
SS  
pins should be routed to minimize inductance to system ground.  
Figure 27. 68xxx-Mode DMA Read-Cycle Timing  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx-mode DMA write-cycle timing  
25-MHz OPERATION  
33-MHz OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Setup time, asynchronous input SDTACK before  
208a  
SBCLK no longer high to assure recognition on this  
cycle  
10  
10  
ns  
Holdtime, asynchronousinputSDTACKafterSBCLK  
low to assure recognition on this cycle  
208b  
209  
10  
10  
ns  
ns  
ns  
ns  
t
+
18  
t
+
c(SCK)  
w(SCKL)  
c(SCK)  
w(SCKL)  
Pulse duration, SAS, SUDS, and SLDS high  
t
t
t
t
18  
15  
Delay time, SBCLK high in T2 cycle to SUDS and  
SLDS active  
211  
25  
25  
Delay time, output data valid to SUDS and SLDS no  
longer high  
211a  
15  
w(SCKL)  
w(SCKL)  
212  
216  
Delay time, SBCLK low to address valid  
20  
20  
20  
20  
ns  
ns  
Delay time, SBCLK high to SALE or SXAL high  
Hold time, SALE or SXAL low after SUDS and SAS  
high  
216a  
0
0
0
0
ns  
Delay time, SBCLK high to SXAL low in the TX cycle  
or SALE low in the T1 cycle  
217  
218  
219  
25  
25  
ns  
ns  
ns  
Hold time, address valid after SALE, SXAL low  
t
15  
12  
t
/2 – 4  
t
15  
12  
t
/2 – 4  
w(SCKH)  
c(SCK)  
w(SCKH)  
c(SCK)  
Delay time, SBCLK low in T2 cycle to output data and  
parity valid  
29  
29  
Hold time, output data, parity valid after SUDS and  
SLDS high  
221  
t
t
ns  
ns  
ns  
c(SCK)  
c(SCK)  
222  
Delay time, SBCLK high to SAS low  
20  
16  
16  
15  
11  
11  
Delay time, SBCLK low to SUDS, SLDS, and SAS  
high  
223W  
225W  
0
0
Delay time, SBCLK high in T4 cycle to SDBEN high  
ns  
ns  
225WH Hold time, SDBEN low after SUDS and SLDS high  
t
/2 – 7  
t
/2 – 7  
c(SCK)  
c(SCK)  
Setup time, address valid before SALE or SXAL no  
longer high  
233  
10  
10  
ns  
233a  
t
15  
t
15  
ns  
ns  
Setup time, address valid before SAS no longer high  
Delay time, SBCLK high in T1 cycle to SDBEN low  
w(SCKL)  
w(SCKL)  
237W  
16  
11  
64  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TWAIT  
V
T4  
TX  
T1  
T2  
T3  
T4  
T1  
SBCLK  
SAS  
222  
211  
223W  
209  
233a  
SUDS,  
SLDS  
218  
216  
211a  
217  
SRNW  
Low  
217  
218  
SXAL  
SALE  
216  
216a  
212  
212  
233  
221  
233  
219  
SADL0SADH7,  
SADH0SADL7,  
SPL, SPH  
Address  
Output Data  
208a  
Extended Address  
†‡  
SDTACK  
208b  
225W  
225WH  
SDDIR  
237W  
SDBEN  
All V  
SS  
pins should be routed to minimize inductance to system ground.  
On a read cycle, the read strobe remains active until the internal sample of incoming data is completed. Input data can be removed when either the read strobe or SDBEN becomes  
no longer active.  
Figure 28. 68xxx-Mode DMA Write-Cycle Timing  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx-mode bus-arbitration timing, SIF returns control  
25-MHz  
25-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
Delay time, SBCLK low in I1 cycle to SAD, SPL, SPH, SUDS, and SLDS in the  
high-impedance state, bus release  
220  
35  
35  
ns  
223b  
224b  
224d  
230  
Delay time, SBCLK low in I1 cycle to SBHE/SRNW in the high-impedance state  
Delay time, SBCLK low in cycle I2 to SOWN high  
45  
20  
27  
20  
45  
15  
22  
15  
ns  
ns  
ns  
ns  
0
0
0
0
Delay time, SBCLK low in cycle I2 to SDDIR high  
Delay time, SBCLK high to either SHRQ low or SBRQ high  
Setup from, SUDS, SLDS, SRNW, and SAS control signals in the high-impedance state  
before SOWN no longer low  
240  
ns  
This specification has been characterized to meet stated value. It is not assured during manufacturing testing.  
66  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
SIF Master  
Bus Exchange  
I1  
User  
T1  
T2  
T3  
T4  
I2  
SIF Inputs:  
SBCLK  
SBGR  
SDTACK  
SIF Outputs:  
230  
SBRQ  
220  
240  
SAS, SUDS,  
SLDS  
240  
223b  
Read  
Hi-Z  
SRNW  
Write  
SIF  
220  
SADH0SADH7,  
SADL0SADL7,  
SPH, SPL  
Hi-Z  
224d  
224b  
Write  
Read  
SDDIR  
SOWN  
In 80x8x mode, the system interface deasserts SHRQ on the rising edge of SBCLK following the T4 state of the last system bus transfer it controls. In 68xxx mode, the system interface  
deasserts SBRQ on the rising edge of SBCLK in state T2 of the first system bus transfer it controls.  
Figure 29. 68xxx-Mode Bus-Arbitration Timing, SIF Returns Control  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
68xxx-mode bus-release and error timing  
25-MHz  
33-MHz  
OPERATION  
OPERATION  
NO.  
UNIT  
MIN  
MAX  
MIN  
MAX  
208a Setup time, asynchronous input before SBCLK no longer high to assure recognition  
10  
10  
ns  
ns  
Hold time, asynchronous input SBRLS, SOWN, or SBERR after SBCLK low to assure  
208b  
10  
10  
recognition  
208c Hold time, SBRLS low after SOWN high  
0
0
ns  
ns  
236  
Setup time, SBERR low before SDTACK no longer high if parameter 208a not met  
30  
30  
T(W or 2)  
208a  
T3  
T4  
T1  
T2  
SBCLK  
SBRLS  
208b  
(see Note A)  
208b  
SOWN  
208c  
208a  
SBERR  
(see Note B)  
236  
SDTACK  
NOTES: A. The system interface ignores the assertion of SBRLS if it does not own the system bus. If it does own the bus, when it detects the  
assertion of SBRLS, it completes any internally started DMA cycle and relinquishes control of the bus. If no DMA transfer has  
internally started, the system interface releases the bus before starting another.  
B. If SBERR is asserted when the system interface controls the system bus, the current bus transfer is completed regardless of the  
value of SDTACK. If the BERETRY register is nonzero, the cycle is retried. If the BERETRY register is zero, the system interface  
releases control of the system bus. The system interface ignores the assertion of SBERR if it is not performing a DMA bus cycle  
onthesystembus. WhenSBERRisproperlyassertedandBERETRYiszero, thesysteminterfacereleasesthebusuponcompletion  
of the current bus transfer and halts all further DMA on the system side. The error is synchronized to the local bus, and DMA stops  
on the local sides. The value of the SDMAADR, SDMADDRX, and SDMALEN registers in the system interface are not defined after  
a system-bus error.  
C. In cycle-steal mode, state TX is present on every system bus transfer. In burst mode, state TX is present on the first bus transfer  
and whenever the increment of the DMA address register carries beyond the least significant 16 bits.  
D. SDTACK is not sampled to verify that it is deasserted.  
E. Unless otherwise specified, for all signals specified as a maximum delay from the end of an SBCLK transition to the signal valid,  
the signal is also specified to hold its previous value (including high impedance) until the start of that SBCLK transition.  
Figure 30. 68xxx-Mode Bus-Release and Error Timing  
68  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
TH  
T1  
T1  
T(W or 2)  
T3  
T4  
SBCLK  
SDTACK  
SBERR  
SHALT  
Figure 31. 68xxx-Mode Bus Halt and Retry, Normal Completion With Delayed Start  
Only the relative placement of the edges to SBCLK falling edge is shown. Actual signal edge placement can vary from waveforms shown.  
T1  
T2  
T3  
T4  
TH  
TH  
T1  
B
E
SBCLK  
SDTACK  
SBERR  
SHALT  
SOWN  
Figure 32. 68xxx-Mode Bus Halt and Retry, Rerun Cycle With Delayed Start  
Only the relative placement of the edges to SBCLK falling edge is shown. Actual signal edge placement can vary from waveforms shown.  
69  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TI380C25  
TOKEN-RING COMMPROCESSOR  
SPWS012 – JANUARY 1995  
MECHANICAL DATA  
PGE (S-PQFP-G144)  
PLASTIC QUAD FLATPACK  
108  
73  
109  
72  
0,27  
0,17  
M
0,08  
0,50  
0,13 NOM  
144  
37  
1
36  
Gage Plane  
17,50 TYP  
20,20  
SQ  
19,80  
0,25  
0,05 MIN  
22,20  
SQ  
0°– 7°  
21,80  
0,75  
0,45  
1,45  
1,35  
Seating Plane  
0,08  
1,60 MAX  
4040147/B 10/94  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MO-136  
70  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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