TL082CMX_技术文档

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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ

ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

D

Low Power Consumption

D

High Input Impedance . . . JFET-Input Stage

Latch-Up-Free Operation

Wide Common-Mode and Differential

Voltage Ranges

High Slew Rate . . . 13 V/µs Typ

Common-Mode Input Voltage Range

Low Input Bias and Offset Currents

Output Short-Circuit Protection

Includes V

CC+

Low Total Harmonic

Distortion . . . 0.003% Typ

description/ordering information

The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously

developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates

well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature

high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset

adjustment and external compensation options are available within the TL08x family.

The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized

for operation from −40°C to 85°C. The Q-suffix devices are characterized for operation from −40°C to 125°C.

The M-suffix devices are characterized for operation over the full military temperature range of −55°C to 125°C.

ORDERING INFORMATION

V

max

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

IO

†

PACKAGE

T

J

AT 255C

Tube of 50

TL081CP

PDIP (P)

PDIP (N)

Tube of 50

TL082CP

TL084CN

Tube of 25

TL084CN

Tube of 75

TL081CD

TL081C

TL082C

TL084C

Reel of 2500

Tube of 75

TL081CDR

TL082CD

SOIC (D)

Reel of 2500

Tube of 50

TL082CDR

TL084CD

0°C to 70°C

15 mV

Reel of 2500

Reel of 2000

Tube of 150

Reel of 2000

Tube of 90

TL084CDR

TL081CPSR

TL082CPSR

TL084CNSR

TL082CPW

TL082CPWR

TL084CPW

TL084CPWR

T081

T082

TL084

SOP (PS)

SOP (NS)

T082

T084

TSSOP (PW)

Reel of 2000

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Copyright  2004, Texas Instruments Incorporated

ꢒ ꢙ ꢤ ꢜ ꢛꢧ ꢢꢡ ꢟꢠ ꢡꢛ ꢝꢤ ꢦꢘ ꢞꢙ ꢟ ꢟꢛ ꢔꢎ ꢁꢍ ꢐꢓ ꢋ ꢍꢮꢃꢯ ꢮꢯꢅ ꢞꢦꢦ ꢤꢞ ꢜ ꢞ ꢝꢣ ꢟꢣꢜ ꢠ ꢞ ꢜ ꢣ ꢟꢣ ꢠꢟꢣ ꢧ

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ꢟ ꢣ ꢠ ꢟꢘ ꢙꢭ ꢛꢚ ꢞ ꢦꢦ ꢤꢞ ꢜ ꢞ ꢝ ꢣ ꢟ ꢣ ꢜ ꢠ ꢨ

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ꢢ ꢙꢦ ꢣꢠꢠ ꢛ ꢟꢩꢣ ꢜ ꢫꢘ ꢠꢣ ꢙ ꢛꢟꢣ ꢧꢨ ꢒ ꢙ ꢞꢦ ꢦ ꢛ ꢟꢩꢣ ꢜ ꢤꢜ ꢛ ꢧꢢꢡ ꢟꢠ ꢅ ꢤꢜ ꢛ ꢧꢢꢡ ꢟꢘꢛ ꢙ

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1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

description/ordering information (continued)

ORDERING INFORMATION

V

max

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

IO

†

PACKAGE

T

J

AT 255C

Tube of 50

Tube of 25

Tube of 75

Reel of 2500

Tube of 75

Reel of 2500

Tube of 50

Reel of 2500

Reel of 2000

Tube of 50

Tube of 25

Tube of 75

Reel of 2500

Tube of 75

Reel of 2500

Tube of 50

Reel of 2500

Tube of 50

Tube of 25

Tube of 75

Reel of 2500

Tube of 75

Reel of 2500

Tube of 50

Reel of 2500

Reel of 2000

Tube of 50

Reel of 2500

Tube of 25

Reel of 55

TL081ACP

TL082ACP

TL084ACN

TL081ACD

TL081ACDR

TL082ACD

TL082ACDR

TL084ACD

TL084ACDR

TL082ACPSR

TL084ACNSR

TL081BCP

TL082BCP

TL084BCN

TL081BCD

TL081BCDR

TL082BCD

TL082BCDR

TL084BCD

TL084BCDR

TL081IP

TL081ACP

PDIP (P)

PDIP (N)

TL082ACP

TL084ACN

081AC

6 mV

SOIC (D)

082AC

TL084AC

SOP (PS)

SOP (NS)

T082A

0°C to 70°C

TL084A

TL081BCP

TL082BCP

TL084BCN

PDIP (P)

PDIP (N)

081BC

3 mV

SOIC (D)

082BC

TL084BC

TL081IP

TL082IP

TL081IN

PDIP (P)

PDIP (N)

TL082IP

TL084IN

TL081ID

TL081I

TL082I

TL081IDR

TL082ID

−40°C to 85°C

6 mV

SOIC (D)

TL082IDR

TL084ID

TL084I

Z082

TL084IDR

TL082IPWR

TL084QD

TSSOP (PW)

SOIC (D)

−40°C to 125°C

−55°C to 125°C

9 mV

6 mV

TL084QD

TL084QDR

TL084MJ

CDIP (J)

TL084MJ

TL084FK

LCCC (FK)

CDIP (JG)

LCCC (FK)

TL084FK

Tube of 50

Tube of 55

TL082MJG

TL082MFK

TL082MJG

TL082MFK

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ

ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

ꢊ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

TL084, TL084A, TL084B

D, J, N, NS, OR PW PACKAGE

(TOP VIEW)

TL081, TL081A, TL081B

D, P, OR PS PACKAGE

(TOP VIEW)

TL082, TL082A, TL082B

D, JG, P, PS, OR PW PACKAGE

(TOP VIEW)

OFFSET N1

IN−

NC

V

OUT

1OUT

1IN−

1IN+

V

CC+

1

2

3

4

8

7

6

5

1

2

3

4

8

7

6

5

1OUT

1IN−

1IN+

1

2

3

4

5

6

7

14

13

12

11

10

9

4OUT

4IN−

4IN+

2OUT

2IN−

2IN+

CC+

IN+

V

OFFSET N2

V

CC−

V

CC+

CC−

2IN+

2IN−

2OUT

3IN+

3IN−

3OUT

NC − No internal connection

8

TL084M . . . FK PACKAGE

(TOP VIEW)

TL082M . . . FK PACKAGE

(TOP VIEW)

3

2

1

20 19

18

3

2

1

20 19

18

NC

1IN−

NC

4IN+

NC

1IN+

4

5

6

7

8

4

5

6

7

8

2OUT

NC

17

16

15

14

17

16

15

14

V

−

V

CC

CC+

NC

2IN−

NC

1IN+

NC

3IN+

2IN+

9 10 11 12 13

NC − No internal connection

symbols

TL081

TL082 (EACH AMPLIFIER)

TL084 (EACH AMPLIFIER)

OFFSET N1

+

−

IN+

IN−

+

IN+

IN−

OUT

−

OFFSET N2

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

schematic (each amplifier)

V

CC+

IN+

IN−

64 Ω

OUT

128 Ω

64 Ω

C1

1080 Ω

V

CC−

OFFSET N1

OFFSET N2

TL081 Only

Component values shown are nominal.

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ

ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

TL08_C

TL08_AC

TL08_BC

TL08_I

TL084Q

TL08_M

UNIT

Supply voltage, V

(see Note 1)

− (see Note 1)

18

−18

18

−18

18

−18

18

−18

V

CC+

Supply voltage V

CC

Differential input voltage, V (see Note 2)

ID

30

Input voltage, V (see Notes 1 and 3)

I

15

Duration of output short circuit (see Note 4)

Continuous total power dissipation

Unlimited

See Dissipation Rating Table

Operating free-air temperature range, T

0 to 70

97

− 40 to 85 − 40 to 125 − 55 to 125

°C

A

D package (8-pin)

D package (14-pin)

N package (14-pin)

NS package (14-pin)

P package (8-pin)

PS package (8-pin)

PW package (8-pin)

PW package (14-pin)

97

86

76

86

76

80

Package thermal impedance, θ

(see Notes 5 and 6)

JA

°C/W

85

95

149

113

150

113

Operating virtual junction temperature

Case temperature for 60 seconds, T

150

260

°C

FK package

C

Lead temperature 1,6 mm (1/16 inch) from case

for 60 seconds

J or JG package

300

°C

Storage temperature range, T

stg

− 65 to 150 − 65 to 150 − 65 to 150 − 65 to 150

°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between V

2. Differential voltages are at IN+ with respect to IN−.

and V .

CC−

CC+

3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.

4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the

dissipation rating is not exceeded.

5. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable

JA

J

A

ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.

D

J

A

JA

J

6. The package thermal impedance is calculated in accordance with JESD 51-7.

DISSIPATION RATING TABLE

T

≤ 25°C

DERATING

FACTOR

DERATE

ABOVE T

T

= 70°C

T

= 85°C

T = 125°C

A

PACKAGE

POWER RATING

POWER RATING POWER RATING POWER RATING

A

D (14 pin)

680 mW

7.6 mW/°C

11.0 mW/°C

8.4 mW/°C

60°C

88°C

69°C

604 mW

680 mW

672 mW

490 mW

680 mW

546 mW

186 mW

273 mW

210 mW

FK

J

680 mW

JG

680 mW

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

6

•

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ

ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

ꢊ

ꢋ

SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

electrical characteristics, V

= 15 V (unless otherwise noted)

CC

TL081M, TL082M

TL084Q, TL084M

†

T

A

PARAMETER

UNIT

TEST CONDITIONS

MIN

TYP MAX

MIN

TYP MAX

25°C

3

6

9

3

9

V

Input offset voltage

V

= 0,

= 0

R

= 50 Ω

mV

IO

O

S

Full range

15

Temperature

coefficient of input

offset voltage

α

VIO

Full range

18

5

18

5

µV/°C

25°C

125°C

25°C

100

20

100

20

pA

nA

pA

nA

‡

Input offset current

I

V

= 0

IO

O

30

200

50

30

200

50

‡

Input bias current

IB

O

125°C

−12

to

15

− 12

to

15

Common-mode input

voltage range

V

25°C

11

V

ICR

R

= 10 kΩ

≥ 10 kΩ

≥ 2 kΩ

25°C

12

10

13.5

12

10

13.5

L

Maximum peak

output voltage swing

OM

Full range

12

Large-signal

differential voltage

amplification

V

=

10 V,

R

≥ 2 kΩ

25°C

25

15

200

25

15

200

O

L

A

VD

V/mV

V

Full range

B

Unity-gain bandwidth

Input resistance

25°C

3

MHz

1

12

r

10

Ω

i

Common-mode

rejection ratio

V

= V

ICR

min,

R

IC

O

CMRR

25°C

80

86

80

86

dB

= 0,

= 50 Ω

S

Supply-voltage

rejection ratio

V

=

15 V to 9 V,

= 50 Ω

CC

O

k

25°C

dB

SVR

= 0,

R

S

(∆V

/∆V )

CC

IO

Supply current

(per amplifier)

I

V

= 0,

No load

25°C

1.4

2.8

1.4

2.8

mA

dB

CC

O

V

/V

Crosstalk attenuation

A

VD

= 100

120

O1 O2

†

‡

All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in

Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.

operating characteristics, V

= 15 V, T = 25°C (unless otherwise noted)

A

CC

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

∗

V = 10 V,

I

R

= 2 kΩ,

C

= 100 pF, See Figure 1

= 100 pF,

8

13

L

SR

Slew rate at unity gain

V/µs

V = 10 V,

I

∗

5

See Figure 1

T

A

= − 55°C to 125°C,

t

Rise time

0.05

20

18

4

µs

%

r

V = 20 mV,

R

= 2 kΩ,

C

= 100 pF, See Figure 1

I

L

Overshoot factor

f = 1 kHz

nV/√Hz

µV

Equivalent input noise

voltage

V

R

= 20 Ω

= 20 Ω,

n

S

f = 10 Hz to 10 kHz

f = 1 kHz

Equivalent input noise

current

I

n

0.01

pA/√Hz

V rms = 6 V,

I

A

VD

= 1,

R

≤ 1 kΩ,

R ≥ 2 kΩ,

L

S

THD Total harmonic distortion

0.003

%

f = 1 kHz

∗On products compliant to MIL-PRF-38535, this parameter is not production tested.

7

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ꢋꢎ

ꢌꢓ

ꢕ

SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

operating characteristics, V

= 15 V, T = 25°C

A

CC

PARAMETER

TEST CONDITIONS

MIN

TYP

13

MAX

UNIT

V/µs

µs

SR

Slew rate at unity gain

Rise time

V = 10 V,

R

= 2 kΩ,

C

= 100 pF, See Figure 1

8

I

L

t

r

0.05

20

V = 20 mV,

I

R

= 2 kΩ,

C

= 100 pF, See Figure 1

Overshoot factor

%

f = 1 kHz

18

nV/√Hz

µV

V

Equivalent input noise voltage

Equivalent input noise current

R

= 20 Ω

= 20 Ω,

n

S

f = 10 Hz to 10 kHz

f = 1 kHz

4

I

n

0.01

pA/√Hz

S

V rms = 6 V,

I

A

VD

= 1,

R

≤ 1 kΩ,

R ≥ 2 kΩ,

L

S

THD Total harmonic distortion

0.003

%

f = 1 kHz

PARAMETER MEASUREMENT INFORMATION

10 kΩ

−

+

1 kΩ

OUT

−

+

V

I

V

I

OUT

= 100 pF

C

= 100 pF

R

= 2 kΩ

L

C

R

L

Figure 1

Figure 2

100 kΩ

TL081

−

IN−

IN+

C2

OUT

+

N2

C1 500 pF

N1

−

100 kΩ

IN−

N1

OUT

+

1.5 kΩ

CC−

V

Figure 3

Figure 4

8

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ꢊ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

vs Frequency

5, 6, 7

vs Free-air temperature

vs Load resistance

vs Supply voltage

8

9

10

V

OM

Maximum peak output voltage

vs Free-air temperature

vs Frequency

11

12

Large-signal differential voltage amplification

A

VD

Differential voltage amplification

Total power dissipation

vs Frequency with feed-forward compensation

vs Free-air temperature

13

14

P

D

vs Free-air temperature

vs Supply voltage

15

16

I

Supply current

CC

Input bias current

vs Free-air temperature

vs Time

17

18

19

20

21

22

IB

Large-signal pulse response

Output voltage

V

vs Elapsed time

vs Free-air temperature

vs Frequency

O

CMRR

Common-mode rejection ratio

Equivalent input noise voltage

Total harmonic distortion

V

n

THD

vs Frequency

MAXIMUM PEAK OUTPUT VOLTAGE

vs

FREQUENCY

15

12.5

10

15

R

= 10 kΩ

= 25°C

V

=

15 V

L

CC

R

= 2 kΩ

= 25°C

L

T

A

T

A

See Figure 2

V

=

15 V

10 V

CC

See Figure 2

12.5

10

V

=

10 V

5 V

V

CC

7.5

5

7.5

5

V

CC

V

=

5 V

2.5

0

2.5

0

10 M

100

1 k

10 k

100 k

1 M

100

1 k

10 k

100 k

1 M

10 M

f − Frequency − Hz

Figure 5

Figure 6

9

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

TYPICAL CHARACTERISTICS

MAXIMUM PEAK OUTPUT VOLTAGE

vs

FREQUENCY

FREE-AIR TEMPERATURE

15

12.5

10

15

12.5

10

R

= 10 kW

L

V

=

15 V

CC

L

R = 2 kΩ

See Figure 2

T

A

= 25°C

R

= 2 kW

L

T

A

= −55°C

7.5

5

7.5

5

T

A

= 125°C

2.5

0

2.5

V

=

15 V

CC

See Figure 2

0

10 k

40 k 100 k

400 k 1 M

4 M 10 M

− 75 − 50 − 25

0

25

50

75 100 125

f − Frequency − Hz

T

A

− Free-Air Temperature − °C

Figure 7

Figure 8

MAXIMUM PEAK OUTPUT VOLTAGE

vs

SUPPLY VOLTAGE

LOAD RESISTANCE

15

R

T

= 10 kΩ

= 25°C

V

T

= 15 V

L

A

CC

= 25°C

A

12.5

10

See Figure 2

10

7.5

5

7.5

5

2.5

0

2.5

0

2

4

6

8

10

12

14

16

0

0.1

0.2

0.4 0.7

1

2

4

7

10

|V

CC

| − Supply Voltage − V

R

− Load Resistance − kΩ

L

Figure 9

Figure 10

†

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

10

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ꢊ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

TYPICAL CHARACTERISTICS

LARGE-SIGNAL

DIFFERENTIAL VOLTAGE AMPLIFICATION

vs

FREE-AIR TEMPERATURE

1000

700

400

200

100

70

40

20

10

7

4

2

1

V

=

15 V

10 V

= 2 kΩ

CC

=

O

R

L

−75 −50 −25

0

25

50

75 100 125

T

A

− Free-Air Temperature − °C

Figure 11

LARGE-SIGNAL

DIFFERENTIAL VOLTAGE AMPLIFICATION

vs

FREQUENCY

6

5

10

V

CC

= 5 V to 15 V

R

T

= 10 kΩ

= 25°C

L

A

10

4

10

0°

Differential Voltage

Amplification

(left scale)

3

45°

2

10

90°

Phase Shift

(right scale)

1

10

135°

180°

1

10

100

1 k

10 k 100 k

1 M 10 M

f − Frequency − Hz

Figure 12

†

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

11

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

TYPICAL CHARACTERISTICS

DIFFERENTIAL VOLTAGE AMPLIFICATION

TOTAL POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

vs

FREQUENCY WITH FEED-FORWARD COMPENSATION

6

250

225

200

175

150

125

100

75

10

V

= 15 V

CC

V

= 15 V

CC

C2 = 3 pF

= 25°C

No Signal

No Load

5

10

T

A

See Figure 3

4

TL084, TL085

3

10

TL082, TL083

2

TL081

50

25

0

10

1

−75 −50 −25

0

25

50

75 100 125

100

1 k

10 k

100 k

1 M

10 M

T

A

− Free-Air Temperature − °C

f − Frequency With Feed-Forward Compensation − Hz

Figure 13

Figure 14

SUPPLY CURRENT PER AMPLIFIER

SUPPLY CURRENT

vs

FREE-AIR TEMPERATURE

SUPPLY VOLTAGE

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

2.0

V

= 15 V

CC

T

= 25°C

A

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

No Signal

No Load

No Signal

No Load

−75 −50 −25

0

25

50

75 100 125

0

2

4

6

8

10

12

14

16

T

A

− Free-Air Temperature − °C

|V

CC

| − Supply Voltage − V

Figure 15

Figure 16

†

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

12

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ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

ꢊ

ꢋ

SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

TYPICAL CHARACTERISTICS

INPUT BIAS CURRENT

vs

VOLTAGE-FOLLOWER

FREE-AIR TEMPERATURE

LARGE-SIGNAL PULSE RESPONSE

6

4

100

10

V

R

C

= 15 V

CC

L

V

=

15 V

CC

= 2 kΩ

= 100 pF

= 25°C

T

A

Output

2

0

1

− 2

− 4

− 6

Input

0.1

0.01

− 50 − 25

0

25

50

75

100

125

0

0.5

1

1.5

2

2.5

3

3.5

T

A

− Free-Air Temperature − °C

t − Time − µs

Figure 17

Figure 18

OUTPUT VOLTAGE

vs

COMMON-MODE REJECTION RATIO

vs

ELAPSED TIME

FREE-AIR TEMPERATURE

28

89

V

CC

=

15 V

R

= 10 kΩ

L

24

20

16

12

8

88

87

86

85

84

83

V

R

C

= 15 V

CC

L

= 2 kΩ

= 100 pF

= 25°C

T

A

See Figure 1

4

0

− 4

0

0.2

0.4

0.6

0.8

1.0

1.2

− 75 − 50 − 25

0

25

50

75

100 125

t − Elapsed Time − µs

T

A

− Free-Air Temperature − °C

Figure 19

Figure 20

†

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

13

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ꢎ

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

†

TYPICAL CHARACTERISTICS

EQUIVALENT INPUT NOISE VOLTAGE

TOTAL HARMONIC DISTORTION

vs

FREQUENCY

50

40

30

20

10

0

1

V

A

=

= 10

= 20 Ω

= 25°C

15 V

V

=

= 1

15 V

CC

VD

CC

A

VD

I(RMS)

0.4

R

V

= 6 V

S

T

A

T

A

= 25°C

0.1

0.04

0.01

0.004

0.001

10

400

1 k

4 k 10 k

40 k 100 k

10

40 100

400 1 k

4 k 10 k

40 k 100 k

f − Frequency − Hz

Figure 21

Figure 22

†

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

APPLICATION INFORMATION

R

= 100 kΩ

F

V

−

CC+

15 V

−

TL081

R1

C3

R2

3.3 kΩ

Output

+

Input

Output

TL081

+

V

CC−

C

= 3.3 µF

1 kΩ

F

−15 V

3.3 kΩ

R1 = R2 = 2(R3) = 1.5 MΩ

R3

C1

C2

C3

C1 = C2 =

= 110 pF

= 1 kHz

9.1 kΩ

2

1

f =

f

=

o

2π R

C

F

2π R1 C1

Figure 23

Figure 24

14

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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ

ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ

ꢊ

ꢋ

SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

APPLICATION INFORMATION

V

CC+

1 MΩ

−

TL084

+

Output A

V

CC+

+

1 µF

TL084

V

CC+

−

Input

−

TL084

+

Output B

Output C

100 kΩ

100 µF

100 kΩ

V

CC+

100 kΩ

V

CC+

−

TL084

+

Figure 25. Audio-Distribution Amplifier

6 sin ωt

1N4148

− 15 V

18 kΩ

(see Note A)

18 pF

1 kΩ

18 pF

V

CC+

−

V

CC+

88.4 kΩ

1/2

−

TL082

1/2

+

6 cos ωt

TL082

88.4 kΩ

+

V

CC−

18 pF

1 kΩ

V

CC−

15 V

1N4148

18 kΩ

(see Note A)

88.4 kΩ

NOTE A: These resistor values may be adjusted for a symmetrical output.

Figure 26. 100-KHz Quadrature Oscillator

15

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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004

APPLICATION INFORMATION

16 kΩ

220 pF

43 kΩ

30 kΩ

43 kΩ

30 kΩ

V

CC+

43 kΩ

Input

220 pF

V

CC+

−

43 kΩ

−

1/4

−

1/4

TL084

1/4

TL084

Output

B

1/4

TL084

+

TL084

+

1.5 kΩ

V

CC−

V

CC−

V

CC−

V

CC−

Output A

Output B

2 kHz/div

Second-Order Bandpass Filter

= 100 kHz, Q = 30, GAIN = 4

2 kHz/div

Cascaded Bandpass Filter

f = 100 kHz, Q = 69, GAIN = 16

o

f

o

Figure 27. Positive-Feedback Bandpass Filter

16

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power.ti.com

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www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

LCCC

CDIP

LCCC

CDIP

SOIC

Drawing

5962-9851501Q2A

5962-9851501QPA

5962-9851503Q2A

5962-9851503QCA

TL081ACD

ACTIVE

FK

JG

FK

J

20

8

1

TBD

POST-PLATE N / A for Pkg Type

A42 SNPB N / A for Pkg Type

POST-PLATE N / A for Pkg Type

A42 SNPB N / A for Pkg Type

20

14

8

D

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081ACDE4

TL081ACDG4

TL081ACDR

ACTIVE

SOIC

D

8

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081ACDRE4

TL081ACDRG4

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081ACJG

TL081ACP

OBSOLETE

ACTIVE

CDIP

PDIP

JG

P

8

TBD

Call TI

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081ACPE4

TL081BCD

ACTIVE

PDIP

SOIC

PDIP

SOIC

P

D

P

D

8

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081BCDE4

TL081BCDG4

TL081BCDR

TL081BCDRE4

TL081BCDRG4

TL081BCP

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081BCPE4

TL081CD

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081CDE4

TL081CDG4

TL081CDR

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081CDRE4

TL081CDRG4

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

Orderable Device

TL081CP

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081CPE4

PDIP

SO

P

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081CPSR

TL081CPSRE4

PS

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081CPWLE

TL081ID

OBSOLETE TSSOP

PW

D

8

TBD

Call TI

ACTIVE

SOIC

PDIP

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081IDE4

TL081IDG4

TL081IDR

D

P

8

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL081IDRE4

TL081IDRG4

TL081IP

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081IPE4

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL081MFKB

TL081MJG

TL081MJGB

TL082ACD

OBSOLETE

ACTIVE

LCCC

CDIP

SOIC

FK

JG

D

20

8

TBD

Call TI

8

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082ACDE4

TL082ACDG4

TL082ACDR

TL082ACDRE4

TL082ACDRG4

TL082ACP

ACTIVE

SOIC

PDIP

SO

D

8

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

P

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL082ACPE4

TL082ACPSR

TL082ACPSRE4

TL082BCD

P

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

PS

D

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082BCDE4

D

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

no Sb/Br)

TL082BCDG4

TL082BCDR

TL082BCDRE4

TL082BCDRG4

TL082BCP

ACTIVE

SOIC

PDIP

SOIC

D

P

D

8

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL082BCPE4

TL082CD

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CDE4

TL082CDG4

TL082CDR

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CDRE4

TL082CDRG4

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CJG

TL082CP

OBSOLETE

ACTIVE

CDIP

PDIP

JG

P

8

TBD

Call TI

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL082CPE4

TL082CPSR

TL082CPSRG4

TL082CPW

ACTIVE

PDIP

SO

P

8

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

PS

PW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CPWE4

150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CPWLE

TL082CPWR

OBSOLETE TSSOP

PW

8

TBD

Call TI

ACTIVE

TSSOP

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082CPWRE4

TL082CPWRG4

TL082ID

PW

D

8

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082IDE4

SOIC

D

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082IDG4

SOIC

D

75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

Orderable Device

TL082IDR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

D

8

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082IDRE4

TL082IDRG4

SOIC

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082IJG

TL082IP

OBSOLETE

ACTIVE

CDIP

PDIP

JG

P

8

TBD

Call TI

50

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL082IPE4

TL082IPWR

TL082IPWRE4

ACTIVE

PDIP

P

8

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TSSOP

PW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL082MFK

TL082MFKB

TL082MJG

TL082MJGB

TL084ACD

OBSOLETE

ACTIVE

LCCC

CDIP

SOIC

FK

JG

D

20

8

TBD

Call TI

1

POST-PLATE N / A for Pkg Type

A42 SNPB

N / A for Pkg Type

8

14

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084ACDE4

TL084ACDG4

TL084ACDR

ACTIVE

SOIC

PDIP

SO

D

14

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084ACDRE4

TL084ACDRG4

TL084ACN

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

N

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL084ACNE4

TL084ACNSR

TL084ACNSRE4

TL084BCD

N

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

NS

D

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084BCDE4

TL084BCDG4

TL084BCDR

D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084BCDRE4

TL084BCDRG4

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

Orderable Device

TL084BCN

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL084BCNE4

TL084CD

PDIP

SOIC

N

D

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CDE4

TL084CDG4

TL084CDR

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CDRE4

TL084CDRG4

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CJ

TL084CN

OBSOLETE

ACTIVE

CDIP

PDIP

J

14

TBD

Call TI

N

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL084CNE4

ACTIVE

PDIP

N

14

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL084CNSLE

TL084CNSR

OBSOLETE

ACTIVE

SO

NS

14

TBD

Call TI

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CNSRG4

TL084CPW

ACTIVE

SO

NS

PW

14

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CPWE4

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CPWLE

TL084CPWR

OBSOLETE TSSOP

PW

14

TBD

Call TI

ACTIVE

TSSOP

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084CPWRE4

TL084ID

PW

D

14

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084IDE4

TL084IDG4

TL084IDR

D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084IDRE4

TL084IDRG4

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

D

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TL084IJ

TL084IN

OBSOLETE

ACTIVE

CDIP

PDIP

J

14

TBD

Call TI

N

25

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

TL084INE4

ACTIVE

PDIP

N

14

Pb-Free

CU NIPDAU N / A for Pkg Type

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2007

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

(RoHS)

TL084MFK

TL084MFKB

TL084MJ

ACTIVE

LCCC

CDIP

SOIC

FK

J

20

14

1

TBD

POST-PLATE N / A for Pkg Type

1

A42 SNPB

N / A for Pkg Type

TL084MJB

TL084QD

J

1

D

50

2500

CU NIPDAU Level-1-220C-UNLIM

TL084QDR

D

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 6

PACKAGE MATERIALS INFORMATION

www.ti.com

3-May-2007

TAPE AND REEL INFORMATION

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

3-May-2007

Device

Package Pins

Site

Reel

A0 (mm)

B0 (mm)

K0 (mm)

P1

W

Pin1

Diameter Width

(mm) (mm) Quadrant

(mm)

330

(mm)

12

16

12

16

12

16

12

16

0

TL081ACDR

TL081BCDR

TL081CDR

TL081CPSR

TL081IDR

D

8

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

6.4

8.2

6.4

8.2

6.4

8.2

7.0

6.4

7.0

6.5

8.2

6.5

8.2

7.0

6.5

5.2

6.6

5.2

6.6

5.2

6.6

3.6

5.2

3.6

9.0

10.5

9.0

10.5

5.6

9.0

2.1

2.5

2.1

2.5

2.1

2.5

1.6

2.1

1.6

2.1

2.5

2.1

2.5

1.6

2.1

8

12

16

12

16

12

16

12

16

12

16

Q1

D

8

PS

D

8

12

8

TL082ACDR

TL082ACPSR

TL082BCDR

TL082CDR

TL082CPSR

TL082CPWR

TL082IDR

D

8

D

8

PS

D

8

12

8

D

8

D

8

PS

PW

D

8

12

8

TL082IDR

D

8

TL082IPWR

TL084ACDR

TL084ACNSR

TL084BCDR

TL084CDR

TL084CNSR

TL084CPWR

TL084IDR

PW

D

8

14

8

D

8

NS

D

16

0

12

8

D

0

8

NS

PW

D

16

12

0

12

8

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

3-May-2007

TAPE AND REEL BOX INFORMATION

Device

Package

Pins

Site

Length (mm) Width (mm) Height (mm)

TL081ACDR

TL081BCDR

TL081CDR

TL081CPSR

TL081IDR

D

8

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

MLA

FMX

338.1

333.2

338.1

333.2

338.1

333.2

338.1

333.2

338.1

333.2

340.5

333.2

340.5

333.2

340.5

333.2

340.5

333.2

340.5

333.2

20.64

28.58

20.64

28.58

20.64

28.58

20.64

28.58

20.64

28.58

D

8

PS

D

8

TL082ACDR

TL082ACPSR

TL082BCDR

TL082CDR

TL082CPSR

TL082CPWR

TL082IDR

D

8

D

8

PS

D

8

D

8

D

8

PS

PW

D

8

TL082IDR

D

8

TL082IPWR

TL084ACDR

TL084ACNSR

TL084BCDR

TL084CDR

TL084CNSR

TL084CPWR

TL084IDR

PW

D

8

14

D

NS

D

NS

PW

D

Pack Materials-Page 3

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE

0.400 (10,16)

0.355 (9,00)

8

5

0.280 (7,11)

0.245 (6,22)

1

4

0.065 (1,65)

0.045 (1,14)

0.310 (7,87)

0.290 (7,37)

0.063 (1,60)

0.015 (0,38)

0.020 (0,51) MIN

0.200 (5,08) MAX

0.130 (3,30) MIN

Seating Plane

0.023 (0,58)

0.015 (0,38)

0°–15°

0.100 (2,54)

0.014 (0,36)

0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MPDI001A – JANUARY 1995 – REVISED JUNE 1999

P (R-PDIP-T8)

PLASTIC DUAL-IN-LINE

0.400 (10,60)

0.355 (9,02)

8

5

0.260 (6,60)

0.240 (6,10)

1

4

0.070 (1,78) MAX

0.325 (8,26)

0.300 (7,62)

0.020 (0,51) MIN

0.015 (0,38)

Gage Plane

0.200 (5,08) MAX

Seating Plane

0.010 (0,25) NOM

0.125 (3,18) MIN

0.100 (2,54)

0.021 (0,53)

0.430 (10,92)

MAX

0.010 (0,25)

M

0.015 (0,38)

4040082/D 05/98

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-001

For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153