TL2218-285_14 [TI]

EXCALIBUR CURRENT-MODE SCSI TERMINATOR;
TL2218-285_14
型号: TL2218-285_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

EXCALIBUR CURRENT-MODE SCSI TERMINATOR

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TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
PW PACKAGE  
(TOP VIEW)  
available features  
Fully Integrated 9-Channel SCSI  
Termination  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
TERMPWR  
NC  
TERMPWR  
DISABLE  
NC  
2
No External Components Required  
3
NC  
Maximum Allowed Current Applied at First  
High-Level Step  
4
D0  
D8  
5
D1  
D7  
6-pF Typical Power-Down Output  
Capacitance  
6
D2  
NC  
7
D3  
D6  
Wide V  
(Termination Voltage)  
term  
8
D4  
D5  
Operating Range, 3.5 V to 5.5 V  
TTL-Compatible Disable Feature  
Compatible With Active Negation  
Thermal Regulation  
9
NC  
NC  
10  
GND  
GND  
NC – No internal connection  
description  
The TL2218-285 is a current-mode 9-channel monolithic terminator specially designed for single-ended  
small-computer-systems-interface (SCSI) bus termination. A user-controlled disable function is provided to  
reduce standby power. No impedance-matching resistors or other external components are required for its  
operation as a complete terminator.  
The device operates over a wide termination-voltage (V  
) range of 3.5 V to 5.5 V, offering an extra 0.5 V of  
term  
operating range when compared to the minimum termination voltage of 4 V required by other integrated active  
terminators. The TL2218-285 functions as a current-sourcing terminator and supplies a constant output current  
of23mAintoeachassertedline. Whenalineisdeasserted, thedevicesensestherisingvoltagelevelandbegins  
to function as a voltage source, supplying a fixed output voltage of 2.85 V. The TL2218-285 features  
compatibility with active negation drivers and has a typical sink current capability of 20 mA.  
The TL2218-285 is able to ensure that maximum current is applied at the first high-level step. This performance  
means that the device should provide a first high-level step exceeding 2 V even at a 10-MHz rate. Therefore,  
noise margins are improved considerably above those provided by resistive terminators.  
A key difference between the TL2218-285 current-mode terminator and a Boulay terminator is that the  
TL2218-285 does not incorporate a low dropout regulator to set the output voltage to 2.85 V. In contrast with  
the Boulay termination concept, the accuracy of the 2.85 V is not critical with the current-mode method used  
in the TL2218-285 because this voltage does not determine the driver current. Therefore, the primary device  
specifications are not the same as with a voltage regulator but are more concerned with output current.  
The DISABLE terminal is TTL compatible and must be taken low to shut down the outputs. The device is  
normally active, even when DISABLE is left floating. In the disable mode, only the device startup circuits remain  
active, thereby reducing the supply current to just 500 µA. Output capacitance in the shutdown mode is typically  
6 pF.  
The TL2218-285 has on-board thermal regulation and current limiting, thus eliminating the need for external  
protection circuitry. A thermal regulation circuit that is designed to provide current limiting, rather than an actual  
thermal shutdown, is included in the individual channels of the TL2218-285. When a system fault occurs that  
leads to excessive power dissipation by the terminator, the thermal regulation circuit causes a reduction in the  
asserted-line output current sufficient to maintain operation. This feature allows the bus to remain active during  
a fault condition, which permits data transfer immediately upon removal of the fault. A terminator with thermal  
shutdown does not allow for data transfer until sufficient cooling has occurred. Another advantage offered by  
the TL2218-285 is a design that does not require costly laser trimming in the manufacturing process.  
The TL2218-285 is characterized for operation over the virtual junction temperature range of 0°C to 125°C.  
This symbol is not presently listed within EIA/JEDEC standards for letter symbols.  
Copyright 1995, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
8–1  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
AVAILABLE OPTIONS  
SURFACE MOUNT  
CHIP FORM  
(Y)  
T
J
(PW)  
0°C to 125°C  
TL2218-285PWLE  
TL2218-285Y  
The PW package is only available left-end taped and reeled.  
TL2218-285Y chip information  
This chip, when properly assembled, displays characteristics similar to the TL2218-285. Thermal compression  
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with  
conductive epoxy or a gold-silicon preform.  
BONDING PAD ASSIGNMENTS  
(20)  
(1)  
(19)  
1, 20  
TERMPWR  
Feedback  
19  
(17)  
(4)  
(5)  
Active  
Negation  
Clamp  
DISABLE  
V
ref  
4
D0  
(16)  
Thermal  
Regulation  
Common to All Channels  
161  
(6)  
CHIP THICKNESS: 11 MILS TYPICAL  
BONDING PADS: 4 × 4 MILS MINIMUM  
(14)  
(7)  
T max = 150°C  
J
TOLERANCES ARE ±10%.  
ALL DIMENSIONS ARE IN MILS.  
(13)  
(8)  
(10)(11)  
84  
8–2  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
functional block diagram (each channel)  
1, 20  
TERMPWR  
Feedback  
Active  
Negation  
Clamp  
19  
DISABLE  
V
ref  
4
D0  
Thermal  
Regulation  
Common to All Channels  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
(see Figures 1, 2, and 3)  
Continuous termination voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V  
Continuous output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V  
Continuous disable voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V  
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
Operating virtual junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C to 150°C  
stg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
DISSIPATION RATING TABLE  
POWER RATING  
AT  
T 25°C  
POWER RATING  
DERATING FACTOR  
ABOVE T = 25°C  
T = 70°C  
T = 85°C  
T = 125°C  
PACKAGE  
POWER RATING POWER RATING POWER RATING  
T
828 mW  
4032 mW  
2475 mW  
6.62 mW/°C  
32.2 mW/°C  
19.8 mW/°C  
530 mW  
2583 mW  
1584 mW  
430 mW  
2100 mW  
1287 mW  
166 mW  
812 mW  
495 mW  
A
PW  
T
C
T
L
R
is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (T ) relative to the device lead  
J
θJL  
temperature, the following calculations should be used: T = P x R  
the device lead temperature at the point of contact to the printed wiring board. R  
+ T , where P is the internal power dissipation of the device and T is  
J
D
θJL  
L
D
L
is 50.5°C/W.  
θJL  
8–3  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
FREE-AIR TEMPERATURE  
CASE TEMPERATURE  
DISSIPATION DERATING CURVE  
DISSIPATION DERATING CURVE  
2400  
2200  
2000  
1800  
1600  
1400  
1200  
1000  
800  
4800  
4400  
4000  
3600  
3200  
2800  
2400  
2000  
1600  
1200  
800  
600  
R
= 31°C/W  
θJC  
400  
200  
400  
R
= 151°C/W  
θJA  
0
0
25  
50  
75  
100  
125  
150  
25  
50  
75  
100  
125  
150  
T
A
– Free-Air Temperature – °C  
T
C
– Case Temperature – °C  
Figure 1  
Figure 2  
LEAD TEMPERATURE  
DISSIPATION DERATING CURVE  
4800  
4400  
4000  
3600  
3200  
2800  
2400  
2000  
1600  
1200  
800  
R
= 50.5°C/W  
θJL  
400  
0
25  
50  
75  
100  
125  
150  
T
L
– Lead Temperature – °C  
Figure 3  
R
is the thermal resistance between the junction and device lead. To determine the virtual junction temperature (T ) relative to the device lead  
J
θJL  
temperature, the following calculations should be used: T = P x R  
the device lead temperature at the point of contact to the printed wiring board. R  
+ T , where P is the internal power dissipation of the device, and T is  
J
D
θJL  
L
D
L
is 50.5°C/W.  
θJL  
8–4  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
recommended operating conditions  
MIN  
3.5  
2
MAX  
UNIT  
V
Termination voltage  
5.5  
High-level disable input voltage, V  
V
term  
0.8  
V
IH  
Low-level disable input voltage, V  
IL  
Operating virtual junction temperature, T  
0
V
0
125  
°C  
J
electrical characteristics, V  
= 4.75 V, V = 0.5 V, T = 25°C  
O J  
term  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
2.85  
9
MAX  
UNIT  
Output high voltage  
TERMPWR supply current  
Output current  
2.5  
V
All data lines open  
All data lines = 0.5 V  
DISABLE = 0 V  
mA  
228  
500  
23  
µA  
20.5  
24  
1
mA  
DISABLE = 4.75 V  
DISABLE = 0 V  
DISABLE = 0 V  
Disable input current (see Note 1)  
µA  
600  
Output leakage current  
100  
6
nA  
pF  
Output capacitance, device disabled  
Termination sink current, total  
V
V
= 0 V,  
= 4 V  
1 MHz  
O
20  
mA  
O
NOTE 1: When DISABLE is open or high, the terminator is active.  
8–5  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
THERMAL INFORMATION  
The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an  
increasingly difficult problem in the area of thermal dissipation. In order to provide the systems designer with a better  
approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead  
thermal resistance (R ) is provided along with the more typical values of junction-to-ambient and junction-to-case  
θJL  
θJA  
thermal resistances, R  
and R  
.
θJC  
R
is used to calculate the device junction temperature rise measured from the leads of the unit. Consequently, the  
θJL  
junction temperature is dependent upon the board temperature at the leads, R , and the internal power dissipation  
of the device. The board temperature is contingent upon several variables, including device packing density,  
θJL  
thickness, material, area, and number of interconnects. The R  
value depends on the number of leads connecting  
θJL  
to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level  
at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself,  
the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device  
can be calculated using the equation T = (P × R ) + T where T = junction temperature, P = power dissipation,  
J
D
θJL  
L
L
J
D
R
= junction-to-lead thermal resistance, and T = board temperature at the leads of the unit.  
θJL  
The values of thermal resistance for the TL2218-285 PW are as follows:  
Thermal Resistance  
Typical Junction Rise  
151°C/W  
R
R
θJA  
31 °C/W  
θJC  
R
50.5°C/W  
θJL  
TYPICAL CHARACTERISTICS  
Table of Graphs  
FIGURE  
I
Output current vs Input voltage  
4
5
6
7
O
V
Output voltage vs Input voltage  
O
I
O
Output current vs Junction temperature  
Output voltage vs Junction temperature  
V
O
8–6  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TL2218-285, TL2218-285Y  
EXCALIBUR CURRENT-MODE SCSI TERMINATOR  
SLVS072C – DECEMBER 1992 – REVISED OCTOBER 1995  
TYPICAL CHARACTERISTICS  
OUTPUT CURRENT  
vs  
OUTPUT VOLTAGE  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
24  
22  
20  
4
3
2
T
J
= 25°C  
T
J
= 25°C  
18  
16  
14  
1
0
3
3.5  
4
4.5  
5
5.5  
3
3.5  
4
4.5  
5
5.5  
V – Input Voltage – V  
I
V – Input Voltage – V  
I
Figure 4  
Figure 5  
OUTPUT CURRENT  
vs  
OUTPUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
4
25  
20  
15  
10  
V
T
A
= 4.75 V  
J
V
= 4.75 V  
J
term  
= T  
term  
T = T  
A
3.5  
3
2.5  
2
5
0
25  
50  
75  
100  
125  
0
25  
T
50  
75  
100  
125  
T
J
– Junction Temperature – °C  
– Junction Temperature – °C  
J
Figure 6  
Figure 7  
8–7  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
8–8  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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